208282 ⎘
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group , e.g. alloys in different semiconductor regions, e.g. heterojunctions
Fin field effect transistor (FinFET) device structure
#1502FORMING DEFECT-FREE RELAXED SiGe FINS
#1503Superlattice lateral bipolar junction transistor
#1504Nanolaminate structure, semiconductor device and method of forming nanolaminate structure
#1505Semiconductor device and method for fabricating the same
#1506Method for fabricating a local interconnect in a semiconductor device
#1507Forming a contact for a semiconductor device
#1508Self aligned top extension formation for vertical transistors
#1509Methods of simultaneously forming bottom and top spacers on a vertical transistor device
#1510Nanosheet transistors with sharp junctions
#1511Semiconductor device having fin-type patterns
#1512Formation of FinFET junction
#1513Approach to minimization of strain loss in strained fin field effect transistors
#1514Forming strained channel with germanium condensation
#1515Handle for semiconductor-on-diamond wafers and method of manufacture
#1516Approach to minimization of strain loss in strained fin field effect transistors
#1517Process for fabricating a field effect transistor having a coating gate
#1518IC unit and methond of manufacturing the same, and electronic device including the same
#1519Method for manufacturing a semiconductor device having a fin located on a substrate
#1520Transistor with an airgap for reduced base-emitter capacitance and method of forming the transistor
#1521FinFET with a semiconductor strip as a base
#1522FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth
#1523METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE
#1524Semiconductor device
#1525Semiconductor device, method of manufacturing the same and electronic device including the same
#1526Method for fabricating FinFet
#1527Semiconductor device, method of manufacturing the same and electronic device including the device
#1528FinFET device with abrupt junctions
#1529Semiconductor devices and methods of manufacturing semiconductor devices
#1530Fabrication of silicon germanium-on-insulator FinFET
#1531Multi-gate device and method of fabrication thereof
#1532Semiconductor device blocking leakage current and method of forming the same
#1533Tensile strained NFET and compressively strained PFET formed on strain relaxed buffer
#1534Semiconductor device and method for fabricating the same
#1535Semiconductor devices including active areas with increased contact area
#1536Semiconductor device and method of forming the semiconductor device
#1537Semiconductor device and manufacturing method thereof
#1538Forming a fin cut in a hardmask
#1539Polysilicon residue removal in nanosheet MOSFETs
#1540Method of manufacturing SOI lateral Si-emitter SiGe base HBT
#1541Method of junction control for lateral bipolar junction transistor
#1542Method of junction control for lateral bipolar junction transistor
#1543Methods of forming bottom and top source/drain regions on a vertical transistor device
#1544Semiconductor device with epitaxial source/drain
#1545FinFETs with strained well regions
#1546FETS and methods of forming FETS
#1547FinFET with reduced series total resistance
#1548Metal oxide semiconductor having epitaxial source drain regions and a method of manufacturing same using dummy gate process
#1549METHOD OF CONTACT FORMATION BETWEEN METAL AND SEMICONDUCTOR
#1550Epitaxial and silicide layer formation at top and bottom surfaces of semiconductor fins
#1551Asymmetric band gap junctions in narrow band gap MOSFET
#1552Structure and method for semiconductor device
#1553Techniques providing metal gate devices with multiple barrier layers
#1554Nonplanar device and strain-generating channel dielectric
#1555MOS devices having epitaxy regions with reduced facets
#1556Semiconductor device
#1557Method to induce strain in 3-D microfabricated structures
#1558Semiconductor device and manufacturing method thereof
#1559Semiconductor device including a fin structure
#1560Fabrication of integrated circuit structures for bipolar transistors
#1561Forming non-line-of-sight source drain extension in an NMOS FINFET using n-doped selective epitaxial growth
#1562Method of forming the gate electrode of field effect transistor
#1563Fabrication of fin field effect transistors for complementary metal oxide semiconductor devices including separate n-type and p-type source/drains using a single spacer deposition
#1564Leakage current suppression methods and related structures
#1565FETs and methods for forming the same
#1566Fabrication of semiconductor device
#1567Structure and method for integrated circuit
#1568Method for producing a doped semiconductor layer
#1569Semiconductor device structure with self-aligned capacitor device
#1570Substrate contact land for an MOS transistor in an SOI substrate, in particular an FDSOI substrate
#1571Method of forming source/drain contact
#1572Strained silicon complementary metal oxide semiconductor including a silicon containing tensile n-type fin field effect transistor and silicon containing compressive p-type fin field effect transistor formed using a dual relaxed substrate
#1573Reacted conductive gate electrodes and methods of making the same
#1574Fabrication of vertical fin transistor with multiple threshold voltages
#1575Fabrication of vertical fin transistor with multiple threshold voltages
#1576Fabrication of vertical fin transistor with multiple threshold voltages
#1577LDMOS transistor structures and integrated circuits including LDMOS transistor structures
#1578Semiconductor device and method for fabricating the same
#1579Field effect transistor contact with reduced contact resistance
#1580Tensile strained high percentage silicon germanium alloy FinFETS
#1581Method for fabricating transistor with thinned channel
#1582Structure and method for forming strained FinFET by cladding stressors
#1583Techniques for forming non-planar germanium quantum well devices
#1584Bipolar junction transistor (BJT) base conductor pullback
#1585Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts
#1586FINFETs with wrap-around silicide and method forming the same
#1587Semiconductor structure and fabricating method thereof
#1588Methods for manufacturing a fin-based semiconductor device including a metal gate diffusion break structure with a conformal dielectric layer
#1589Co-integration of self-aligned and non-self aligned heterojunction bipolar transistors
#1590Semiconductor device and method
#1591Integrated circuits having source/drain structure
#1592Forming a non-planar transistor having a quantum well channel
#1593Methods of forming IC products comprising a nano-sheet device and a transistor device having first and second replacement gate structures
#1594Methods of forming NMOS and PMOS finFET devices and the resulting product
#1595Isolation structure of semiconductor device
#1596Semiconductor device and manufacturing method thereof
#1597Semiconductor device with fin and related methods
#1598High acceptor level doping in silicon germanium
#1599Power semiconductor device
#1600Silicon-germanium Fin structure having silicon-rich outer surface
#1601Fabrication of silicon-germanium fin structure having silicon-rich outer surface
#1602FETS and methods of forming FETS
#1603Precleaning apparatus and substrate processing system
#1604Tunneling transistor and method of fabricating the same
#1605Method for reducing contact resistance in semiconductor structures
#1606Lateral bipolar junction transistor with controlled junction
#1607Semiconductor devices having 3D channels, and methods of fabricating semiconductor devices having 3D channels
#1608Semiconductor devices with depleted heterojunction current blocking regions
#1609Individually-tunable heat reflectors in an EPI-growth system
#1610Source and drain stressors with recessed top surfaces
#1611FinFETs with source/drain cladding
#1612Anti-fuse with reduced programming voltage
#1613Semiconductor structure with self-aligned wells and multiple channel materials
#1614Semiconductor device including optimized elastic strain buffer
#1615Method of manufacturing semiconductor device
#1616Tunneling field effect transistor
#1617Formation of dislocations in source and drain regions of FinFET devices
#1618Biosensor based on heterojunction bipolar transistor
#1619FORMING A SILICON BASED LAYER IN A TRENCH TO PREVENT CORNER ROUNDING
#1620FinFETs with strained well regions
#1621Semiconductor structure and method for semiconductor device fabrication with improved source drain epitaxy
#1622Asymmetric FET
#1623Selective germanium p-contact metalization through trench
#1624Method and structure for FinFET device
#1625Device for a FinFET
#1626DIODES AND FABRICATION METHODS THEREOF
#1627Precise junction placement in vertical semiconductor devices using etch stop layers
#1628Semiconductor device including Fin-PET and manufacturing method thereof
#1629Field-effect transistor and method of making the same
#1630Fabrication of integrated circuit structures for bipolor transistors
#1631Integration of strained silicon germanium PFET device and silicon NFET device for finFET structures
#1632Multigate metal-oxide semiconductor field effect transistor
#1633III-V compound semiconductor channel post replacement gate
#1634Strained silicon complementary metal oxide semiconductor including a silicon containing tensile N-type fin field effect transistor and silicon containing compressive P-type fin field effect transistor formed using a dual relaxed substrate
#1635Methods of forming a bipolar transistor having a collector with a doping spike
#1636Strained channel field effect transistor
#1637Methods for forming hybrid vertical transistors
#1638Semiconductor device having silicon-germanium source/drain regions with varying germanium concentrations
#1639Single electron transistor with self-aligned Coulomb blockade
#1640Embedded shape sige for strained channel transistors
#1641Semiconductor device structure with fin structure and method for forming the same
#1642Semiconductor devices including contact structures that partially overlap silicide layers
#1643Semiconductor device having contact plugs and method of forming the same
#1644Semiconductor device and manufacturing method therefor
#1645Semiconductor device structure and method for forming the same
#1646FinFETs with strained well regions
#1647Charge pump circuit with low reverse current and low peak current
#1648Bottom-up epitaxy growth on air-gap buffer
#1649Method for forming semiconductor structure
#1650Method to form strained channel in thin box SOI structures by elastic strain relaxation of the substrate
#1651FinFET structure and methods thereof
#1652Semiconductor device and method for fabricating the same
#1653Non-volatile memory and method for programming and reading a memory array having the same
#1654Semiconductor devices including a dummy gate structure on a fin
#1655Semiconductor device structure with gate stack and method for forming the same
#1656Flat STI surface for gate oxide uniformity in Fin FET devices
#1657Semiconductor device having tipless epitaxial source/drain regions
#1658SOI FinFET fins with recessed fins and epitaxy in source drain region
#1659Dummy dielectric fins for finFETs with silicon and silicon germanium channels
#1660Dummy dielectric fins for finFETs with silicon and silicon germanium channels
#1661Digital alloy vertical lamellae finfet with current flow in alloy layer direction
#1662MOSFETs with channels on nothing and methods for forming the same
#1663Semiconductor structure including a transistor having stress creating regions and method for the formation thereof
#1664Source/drain junction formation
#1665Process for fabricating a vertical-channel nanolayer transistor
#1666Manufacturing method of semiconductor device
#1667Devices and methods of forming self-aligned, uniform nano sheet spacers
#1668Structure and method for SRAM FinFET device having an oxide feature
#1669Semiconductor fabrication method including non-uniform cover layer
#1670Method for forming semiconductor structure having stress layers
#1671SOI WAFERS AND DEVICES WITH BURIED STRESSOR
#1672Method of manufacturing semiconductor device
#1673Semiconductor device and method for fabricating the same
#1674Ambipolar synaptic devices
#1675Semiconductor quantum dot device and method for forming a scalable linear array of quantum dots
#1676Method for manufacturing a bipolar junction transistor
#1677Source/drain recess volume trim for improved device performance and layout dependence
#1678Gate structure having designed profile
#1679Two-dimensional condensation for uniaxially strained semiconductor fins
#1680Methods, apparatus, and system for improved nanowire/nanosheet spacers
#1681Semiconductor device and method of manufacturing the same
#1682Logic semiconductor devices
#1683Etching method
#1684Strained structure of a semiconductor device
#1685SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#1686N-work function metal with crystal structure
#1687Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts
#1688Semiconductor device including a superlattice and replacement metal gate structure and related methods
#1689Lateral bipolar junction transistor with abrupt junction and compound buried oxide
#1690Lateral bipolar junction transistor with abrupt junction and compound buried oxide
#1691Sub 59 MV/decade SI CMOS compatible tunnel FET as footer transistor for power gating
#1692Methods of forming NMOS and PMOS FinFET devices and the resulting product
#1693Structure and method for FinFET device
#1694Directional deposition of protection layer
#1695Method of forming epitaxial buffer layer for finFET source and drain junction leakage reduction
#1696Semiconductor device including a field effect transistor and method for manufacturing the same
#1697Fabrication of vertical fin transistor with multiple threshold voltages
#1698Transistor having a monocrystalline connection
#1699Semiconductor devices with germanium-rich active layers and doped transition layers
#1700Semiconductor device and manufacturing method thereof
#1701Method and IC structure for increasing pitch between gates
#1702Extra gate device for nanosheet
#1703Transistors incorporating metal quantum dots into doped source and drain regions
#1704Passivated and faceted for fin field effect transistor
#1705FinFET with a semiconductor strip as a base
#1706Single process for liner and metal fill
#1707Semiconductor device having stressor layer
#1708Method for fabricating a semiconductor device having a first fin active pattern and a second fin active pattern
#1709Methods for fin thinning providing improved SCE and S/D EPI growth
#1710Semiconductor device and manufacturing method thereof
#1711Semiconductor device having a graphene layer, and method of manufacturing thereof
#1712SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
#1713Method for fabricating fin-shaped structure and bump made of different material
#1714Method for forming semiconductor device structure
#1715Semiconductor device and fabrication method therefor
#1716Nanosheet and nanowire devices having source/drain stressors and methods of manufacturing the same
#1717SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
#1718Transistor strain-inducing scheme
#1719Semiconductor device and method of fabricating the same
#1720Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a fin
#1721Semiconductor structure having insulator pillars and semiconductor material on substrate
#1722SEMICONDUCTOR DEVICE STRAIN RELAXATION BUFFER LAYER
#1723MOS devices having epitaxy regions with reduced facets
#1724Integrated circuit transistor structure with high germanium concentration SiGe stressor
#1725Compound semiconductor device
#1726Advanced wafer bonded heterojunction bipolar transistors and methods of manufacture of advanced wafer bonded heterojunction bipolar transistors
#1727Semiconductor device strain relaxation buffer layer
#1728Expitaxially regrown heterostructure nanowire lateral tunnel field effect transistor
#1729Directional deposition of protection layer
#1730Multi-gate device and method of fabrication thereof
#1731Semiconductor device and manufacturing method thereof
#1732Methods and structures to prevent sidewall defects during selective epitaxy
#1733Semiconductor structure with etched fin structure
#1734Fin field effect transistor (FinFET) device and method for forming the same
#1735Fin-type field effect transistor structure and manufacturing method thereof
#1736Sidewall image transfer nanosheet
#1737Method, apparatus and system for improved nanowire/nanosheet spacers
#1738Double aspect ratio trapping
#1739FinFET structure device
#1740Doping profile for strained source/drain region
#1741Airgap spacers
#1742Method for manufacturing transistor with SiCN/SiOCN multilayer spacer
#1743Semiconductor devices including field effect transistors and methods of forming the same
#1744Structure and method for semiconductor device
#1745Method to improve HCI performance for FinFET
#1746Methods of forming graphene contacts on source/drain regions of FinFET devices
#1747Semiconductor device and method for manufacturing the same
#1748Semiconductor device and method of manufacturing the same
#1749FIN WITH AN EPITAXIAL CLADDING LAYER
#1750Tunneling fin type field effect transistor with epitaxial source and drain regions
#1751Self-aligned heterojunction field effect transistor
#1752Device with diffusion blocking layer in source/drain region
#1753Ionic barristor
#1754FinFET devices having a material formed on reduced source/drain region
#1755Tensile strained nFET and compressively strained pFET formed on strain relaxed buffer
#1756Tensile strained nFET and compressively strained pFET formed on strain relaxed buffer
#1757III-V semiconductor CMOS FinFET device
#1758Vertical thyristor memory with minority carrier lifetime reduction
#1759Strain relaxed buffer layers with virtually defect free regions
#1760Enhanced dislocation stress transistor
#1761Strained silicon germanium fin with block source/drain epitaxy and improved overlay capacitance
#1762Method for semiconductor device fabrication with improved source drain proximity
#1763Field effect transistor contact with reduced contact resistance
#1764Method to improve device performance for FinFET
#1765Bipolar junction transistors with extrinsic device regions free of trench isolation
#1766Methods of manufacturing semiconductor devices by forming source/drain regions before gate electrode separation
#1767Semiconductor device and method of fabricating the same
#1768Method and structure for incorporating strain in nanosheet devices
#1769Transistor structures and fabrication methods thereof
#1770Low resistance source drain contact formation
#1771Decoupling capacitor on strain relaxation buffer layer
#1772Fin-double-gated junction field effect transistor
#1773Decoupling capacitor on strain relaxation buffer layer
#1774Semiconductor device with conductive pattern on insulating line pattern on spacer on field insulating film in trench between fin patterns
#1775Active regions with compatible dielectric layers
#1776Method for manufacturing a high-voltage FinFET device having LDMOS structure
#1777Superlattice materials and applications
#1778Method for fabricating a local interconnect in a semiconductor device
#1779MOS devices with ultra-high dielectric constants and methods of forming the same
#1780Manufacturing method of metal gate structure
#1781PMOS transistor and fabrication method thereof
#1782Semiconductor device having epitaxial layer with planar surface and protrusions
#1783Semiconductor device having asymmetric active region and method of forming the same
#1784Methods, apparatus and system for providing source-drain epitaxy layer with lateral over-growth suppression
#1785Fins for metal oxide semiconductor device structures
#1786Semiconductor device and manufacturing method thereof
#1787Semiconductor devices and methods of manufacturing the same
#1788Deep gate-all-around semiconductor device having germanium or group III-V active layer
#1789High selectivity nitride removal process based on selective polymer deposition
#1790Semiconductor device having NFET structure and method of fabricating the same
#1791Transistors having strained channel under gate in a recess
#1792High selectivity nitride removal process based on selective polymer deposition
#1793Growth of semiconductors on hetero-substrates using graphene as an interfacial layer
#1794V-shaped epitaxially formed semiconductor layer
#1795Semiconductor devices including protruding insulation portions between active fins
#1796Semiconductor device having field insulation layer between two fins
#1797Stacked nanowires with multi-threshold voltage solution for PFETS
#1798Electrostatic discharge protection structure and fabrication method thereof
#1799Extra gate device for nanosheet
#1800SEMICONDUCTOR DEVICE AND METHOD FOR FABRIACTING THE SAME