208282 ⎘
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group , e.g. alloys in different semiconductor regions, e.g. heterojunctions
Semiconductor device including fin shaped structure including silicon germanium layer
#1802Silicon germanium fin immune to epitaxy defect
#1803Semiconductor device including an epitaxy region
#1804Gate structure of field effect transistor with footing
#1805Field effect transistor structure with abrupt source/drain junctions
#1806Nanowire device with reduced parasitics
#1807STRUCTURE AND METHOD FOR SiGe FIN FORMATION IN A SEMICONDUCTOR DEVICE
#1808Formation method of semiconductor device structure
#1809Non-silicon device heterolayers on patterned silicon substrate for CMOS by combination of selective and conformal epitaxy
#1810Non-planar transistor
#1811FinFETs with strained well regions
#1812Methods for forming semiconductor device structures
#1813Semiconductor devices with source/drain stress liner
#1814Junction butting structure using nonuniform trench shape
#1815Channel replacement and bimodal doping scheme for bulk finFet threshold voltage modulation with reduced performance penalty
#1816High mobility transport layer structures for rhombohedral Si/Ge/SiGe devices
#1817Superlattice lateral bipolar junction transistor
#1818Strain compensation in transistors
#1819Silicon-on-nothing transistor semiconductor structure with channel epitaxial silicon region
#1820Enhanced channel strain to reduce contact resistance in NMOS FET devices
#1821Method and device for reducing FinFET self-heating effect
#1822Semiconductor device
#1823Silicon germanium alloy fins with reduced defects
#1824Source and drain stressors with recessed top surfaces
#1825Silicon germanium alloy fins with reduced defects
#1826Tall strained high percentage silicon germanium fins for CMOS
#1827FINFET CMOS with Si NFET and SiGe PFET
#1828FinFET CMOS with Si NFET and SiGe PFET
#1829Semiconductor device and method for fabricating the same
#1830Method for reducing loss of silicon cap layer over SiGe source/drain in a CMOS device
#1831Semiconductor devices having high-quality epitaxial layer and methods of manufacturing the same
#1832Semiconductor device including fin structure with two channel layers and manufacturing method thereof
#1833Semiconductor device and manufacturing method thereof
#1834Methods for fabricating semiconductor devices having fin-shaped patterns by selectively removing oxidized portions of the fin-shaped patterns
#1835Gate spacer and methods of forming
#1836Field effect transistor and semiconductor device including the same
#1837Semiconductor device having germanium active layer with underlying diffusion barrier layer
#1838Multi bit capacitorless DRAM and manufacturing method thereof
#1839Semiconductor device having fin-type patterns
#1840Ge/SiGe-channel and III-V-channel transistors on the same die
#1841Semiconductor device and manufacturing method thereof
#1842FinFET with epitaxial source and drain regions and dielectric isolated channel region
#1843Method for forming semiconductor structure with epitaxial growth structure
#1844Semiconductor device including a strain relief buffer
#1845FETS and methods of forming FETS
#1846Methods of forming silicon germanium tin films and structures and devices including the films
#1847Method for fabricating a strained structure and structure formed
#1848Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions
#1849Semiconductor device
#1850Semiconductor devices with layers commonly contacting fins and methods of manufacturing the same
#1851Dual channel material for finFET for high performance CMOS
#1852Dual channel material for finFET for high performance CMOS
#1853Stacked nanowire semiconductor device
#1854Semiconductor device
#1855FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF
#1856FinFET with merged, epitaxial source/drain regions
#1857Semiconductor device having an oxygen diffusion barrier
#1858SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
#1859Source/drain regions for fin field effect transistors and methods of forming same
#1860Semiconductor device and manufacturing method thereof
#1861Semiconductor device with low band-to-band tunneling
#1862Tunneling field effect transistors (TFETs) for CMOS architectures and approaches to fabricating N-type and P-type TFETs
#1863FinFet spacer etch with no fin recess and no gate-spacer pull-down
#1864Semiconductor device
#1865Semiconductor device with low band-to-band tunneling
#1866Silicon and silicon germanium nanowire structures
#1867Fin sculpting and cladding during replacement gate process for transistor channel applications
#1868Semiconductor device and manufacturing method thereof
#1869Semiconductor structure and fabricating method thereof
#1870Semiconductor devices having multiple gate structures and methods of manufacturing such devices
#1871Semiconductor structure and manufacturing method thereof
#1872Semiconductor device having metallic source and drain regions
#1873Retaining strain in finFET devices
#1874Semiconductor device and fabricating method of a gate with an epitaxial layer
#1875Semiconductor device and fabrication method for forming the same
#1876Fin field effect transistor complementary metal oxide semiconductor with dual strained channels with solid phase doping
#1877Method of making a graphene base transistor with reduced collector area
#1878Tunnel field effect transistors
#1879Germanium tin channel transistors
#1880GE and III-V channel semiconductor devices having maximized compliance and free surface relaxation
#1881Method and apparatus providing improved thermal conductivity of strain relaxed buffer
#1882Three-dimensional semiconductor memory devices including a vertical channel
#1883Structure and method for compressively strained silicon germanium fins for pFET devices and tensily strained silicon fins for nFET devices
#1884Semiconductor structures and fabrication methods thereof
#1885Semiconductor device having a stacked fin structure and manufacturing method thereof
#1886COMPACT MEMORY STRUCTURE INCLUDING TUNNELING DIODE
#1887Semiconductor structure and manufacturing method thereof
#1888Semiconductor device and fabrication method thereof
#1889Semiconductor device and method of fabricating the same
#1890Epitaxial structure of semiconductor device and manufacturing method thereof
#1891Source/drain FinFET channel stressor structure
#1892Conductor including nano-patterned substrate and method of manufacturing the conductor
#1893Semiconductor liner of semiconductor device
#1894Semiconductor device and method of fabricating the same
#1895Semiconductor device and method of fabricating the same
#1896Contact resistance reduction technique
#1897Logic semiconductor devices
#1898Semiconductor structure with enhanced contact and method of manufacture the same
#1899Source/drain structure of a fin field effect transistor (FinFET)
#1900SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE CAPABLE OF REDUCING A LEAKAGE CURRENT
#1901Semiconductor devices including insulating materials in fins
#1902Method of fabricating semiconductor device
#1903Method of evaluating semiconductor device and apparatus for evaluating semiconductor device
#1904Semiconductor device including dual-layer source/drain region
#1905METHOD AND APPARATUS FOR SOURCE-DRAIN JUNCTION FORMATION IN A FINFET WITH IN-SITU DOPING
#1906Forming replacement low-K spacer in tight pitch fin field effect transistors
#1907Semiconductor device and method for fabricating the same
#1908FinFET semiconductor device with germanium diffusion over silicon fins
#1909Semiconductor device including dual-layer source/drain region
#1910Forming replacement low-K spacer in tight pitch fin field effect transistors
#1911Semiconductor device and method for fabricating the same
#1912Semiconductor device
#1913Semiconductor structure and manufacturing method thereof
#1914Field effect transistors and methods of forming same
#1915Hybrid substrate engineering in CMOS finFET integration for mobility improvement
#1916Semiconductor devices and methods of forming the same
#1917Semiconductor structure and fabricating method thereof
#1918Semiconductor devices including source/drain regions having multiple epitaxial patterns
#1919Semiconductor devices having source/drain regions with strain-inducing layers and methods of manufacturing such semiconductor devices
#1920Tensile strained high percentage silicon germanium alloy FinFETs
#1921Multiple gate field effect transistors having oxygen-scavenged gate stack
#1922Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction
#1923Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction
#1924Highly scaled tunnel FET with tight pitch and method to fabricate same
#1925Method of fabricating a MOSFET with an undoped channel
#1926Gap fill self planarization on post EPI
#1927Semiconductor device with reduced poly spacing effect
#1928Semiconductor devices including a dummy gate structure on a fin
#1929Structure and formation method of semiconductor device structure
#1930Highly scaled tunnel FET with tight pitch and method to fabricate same
#1931Test structure, fabrication method, and test method
#1932Amplifiers including tunable tunnel field effect transistor pseudo resistors and related devices
#1933Semiconductor device and manufacturing method thereof
#1934Epitaxial and silicide layer formation at top and bottom surfaces of semiconductor fins
#1935FinFET device with vertical silicide on recessed source/drain epitaxy regions
#1936FET with local isolation layers on S/D trench sidewalls
#1937Dual-material mandrel for epitaxial crystal growth on silicon
#1938FinFET memory device
#1939Semiconductor device having first and second gate electrodes and method of manufacturing the same
#1940FinFET contact structure and method for forming the same
#1941Semiconductor device and manufacturing method thereof
#1942Structure and formation method of fin-like field effect transistor
#1943Asymmetric semiconductor device and method of forming same
#1944FETS and methods of forming FETs
#1945Method for causing tensile strain in a semiconductor film
#1946Embedded SiGe process for multi-threshold PMOS transistors
#1947FinFET device having a channel defined in a diamond-like shape semiconductor structure
#1948Semiconductor device including epitaxially formed buried channel region
#1949SEMICONDUCTOR DEVICE
#1950Semiconductor device structure with gate spacer having protruding bottom portion and method for forming the same
#1951Structure and formation method of fin-like field effect transistor
#1952Formation of nickel silicon and nickel germanium structure at staggered times
#1953Flat STI surface for gate oxide uniformity in Fin FET devices
#1954METHOD OF FORMING SEMICONDUCTOR DEVICE
#1955Semiconductor device including dual spacer and uniform epitaxial buffer interface of embedded SiGe source/drain
#1956Semiconductor device including epitaxially formed buried channel region
#1957Methods and systems for reducing dislocation defects in high concentration epitaxy processes
#1958Semiconductor devices
#1959Substrate resistor and method of making same
#1960Semiconductor device including epitaxially formed buried channel region
#1961Method for fabricating semiconductor device
#1962Fin liner integration under aggressive pitch
#1963Co-integration of tensile silicon and compressive silicon germanium
#1964Non-planar quantum well device having interfacial layer and method of forming same
#1965Strained finFET device fabrication
#1966Semiconductor device and manufacturing method thereof
#1967P-tunneling field effect transistor device with pocket
#1968Confined epitaxial regions for semiconductor devices and methods of fabricating semiconductor devices having confined epitaxial regions
#1969Strained finFET device fabrication
#1970Semiconductor structures having increased channel strain using fin release in gate regions
#1971Integrated structures containing vertically-stacked memory cells
#1972Fully substrate-isolated FinFET transistor
#1973Strained FinFET device fabrication
#1974FinFET with source/drain structure and method of fabrication thereof
#1975Semiconductor structures having increased channel strain using fin release in gate regions
#1976Strained finFET device fabrication
#1977Internal spacers for nanowire transistors and method of fabrication thereof
#1978Semiconductor device including fin shaped structure and method for fabricating the same
#1979Hybrid substrate engineering in CMOS finFET integration for mobility improvement
#1980Fin-shaped field effect transistor
#1981Integrated circuit structure with substrate isolation and un-doped channel
#1982Method for fabricating semiconductor device
#1983Contact resistance reduction employing germanium overlayer pre-contact metalization
#1984Epitaxial and silicide layer formation at top and bottom surfaces of semiconductor fins
#1985Semiconductor structure with multilayer III-V heterostructures
#1986Semiconductor devices with germanium-rich active layers and doped transition layers
#1987Hybrid substrate engineering in CMOS finFET integration for mobility improvement
#1988Manufacturing method of semiconductor structure
#1989Method for forming semiconductor device structure
#1990Reduced local threshold voltage variation MOSFET using multiple layers of epi for improved device operation
#1991Method of making a semiconductor device using a dummy gate
#1992Method for fabricating substrate of semiconductor device including epitaxial layer and silicon layer having same crystalline orientation
#1993Semiconductor device and method of fabricating the same
#1994Gate-all-around nanowire device and method for manufacturing such a device
#1995Semiconductor fin isolation by a well trapping fin portion
#1996Semiconductor device including fin structures disposed over buffer structures and manufacturing method thereof
#1997Semiconductor device including fin having condensed channel region
#1998Fabricating method of a strained FET
#1999SEMICONDUCTOR DEVICE INCLUDING FIN HAVING CONDENSED CHANNEL REGION
#2000METHODS OF FORMING REPLACEMENT FINS COMPRISED OF MULTIPLE LAYERS OF DIFFERENT SEMICONDUCTOR MATERIALS
#2001Semiconductor device having embedded strain-inducing pattern and method of forming the same
#2002Bulk fin formation with vertical fin sidewall profile
#2003Integrated circuit having strained fins on bulk substrate and method to fabricate same
#2004Porous fin as compliant medium to form dislocation-free heteroepitaxial films
#2005Systems and methods for graphene mechanical oscillators with tunable frequencies
#2006Method of fabricating nanowire field effect transistor having a preplacement gate by using sacrificial etch layer
#2007FinFET having an oxide region in the source/drain region
#2008Dual-material mandrel for epitaxial crystal growth on silicon
#2009Semiconductor device with a reduced band gap zone
#2010FinFETs with multiple threshold voltages
#2011Methods of fabricating semiconductor devices
#2012Semiconductor device having a fin
#2013Integrated RF front end system
#2014Semiconductor devices having fin-type patterns and metal contacts and methods of manufacturing the same
#2015Semiconductor device having a necked semiconductor body and method of forming semiconductor bodies of varying width
#2016Semiconductor device and manufacturing method thereof
#2017Semiconductor device with fin and related methods
#2018Aspect ratio trapping (ART) for fabricating vertical semiconductor devices
#2019Techniques for integration of Ge-rich p-MOS source/drain contacts
#2020Germanium-based quantum well devices
#2021Method and structure for FinFET device
#2022Substrate contact land for an MOS transistor in an SOI substrate, in particular an FDSOI substrate
#2023Low defect relaxed SiGe/strained Si structures on implant anneal buffer/strain relaxed buffer layers with epitaxial rare earth oxide interlayers and methods to fabricate same
#2024Ambipolar synaptic devices
#2025Semiconductor device and manufacturing method thereof
#2026Multi-gate device and method of fabrication thereof
#2027Bipolar transistor having collector with doping spike
#2028Semiconductor devices
#2029Sandwich EPI channel for device enhancement
#2030FinFET devices and methods of forming
#2031Method of forming fin structure of semiconductor device
#2032Field effect transistors with strained channel features
#2033Semiconductor device
#2034Multiple gate field-effect transistors having oxygen-scavenged gate stack
#2035Fin field effect transistor
#2036Formation of strained fins in a finFET device
#2037Fabrication of silicon germanium-on-insulator finFET
#2038Strain compensation in transistors
#2039Pulsed laser anneal process for transistor with partial melt of a raised source-drain
#2040Low parasitic capacitance and resistance finFET device
#2041FinFETs with strained well regions
#2042Quantum well MOSFET channels having lattice mismatch with metal source/drains, and conformal regrowth source/drains
#2043Semiconductor devices and methods of manufacturing the same
#2044Method and apparatus providing improved thermal conductivity of strain relaxed buffer
#2045Formation method of semiconductor device structure with cap element
#2046Column IV transistors for PMOS integration
#2047SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#2048Methods of fabricating semiconductor devices
#2049Diodes and fabrication methods thereof
#2050Semiconductor device including strained finFET
#2051Formation of dislocation-free SiGe finFET using porous silicon
#2052Semiconductor device including fin structures and manufacturing method thereof
#2053Metal oxide semiconductor having epitaxial source drain regions and a method of manufacturing same using dummy gate process
#2054TUNNEL FIELD EFFECT TRANSISTORS HAVING LOW TURN-ON VOLTAGE
#2055Germanium dual-fin field effect transistor
#2056Germanium dual-fin field effect transistor
#2057Method for manufacturing a semiconductor device
#2058Semiconductor device including strained finFET
#2059Semiconductor device blocking leakage current and method of forming the same
#2060Semiconductor device including spacers having different dimensions
#2061Integrated Circuit On Corrugated Substrate
#2062Semiconductor device having stressor and method of manufacturing the same
#2063Germanium dual-fin field effect transistor
#2064SiGe FinFET with improved junction doping control
#2065Semiconductor device, method of manufacturing the same, and method of evaluating semiconductor device
#2066High mobility strained channels for fin-based NMOS transistors
#2067Methods for forming wrap around contact
#2068PROCESS FOR PRODUCING MOS TRANSISTORS HAVING A LARGER CHANNEL WIDTH FROM AN SOI AND IN PARTICULAR FDSOI SUBSTRATE, AND CORRESPONDING INTEGRATED CIRCUIT
#2069Aspect ratio for semiconductor on insulator
#2070SEMICONDUCTOR DEVICES INCLUDING VARIED DEPTH RECESSES FOR CONTACTS
#2071SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#2072Silicon-germanium fin formation
#2073Semiconductor device and method of fabricating the same
#2074Semiconductor devices having multiple gate structures and methods of manufacturing such devices
#2075Method for manufacturing semiconductor device using high speed epitaxial lift-off and template for III-V direct growth and semiconductor device manufactured using the same
#2076Semiconductor device including metal-2 dimensional material-semiconductor contact
#2077Structure and method for FINFET device
#2078Semiconductor devices having fins
#2079Preserving the seed layer on STI edge and improving the epitaxial growth
#2080Non-planar transistor and method of forming the same
#2081Semiconductor device including field effect transistors
#2082Method for improving transistor performance through reducing the salicide interface resistance
#2083Method for improving transistor performance through reducing the salicide interface resistance
#2084Tuning strain in semiconductor devices
#2085Nonvolatile memory device using two-dimensional material and method of manufacturing the same
#2086Semiconductor structure and manufacturing method thereof
#2087Horizontal gate all around and FinFET device isolation
#2088Dual nitride stressor for semiconductor device and method of manufacturing
#2089Method for manufacturing a CMOS device and associated device
#2090FinFET with constrained source-drain epitaxial region
#2091Reverse tone self-aligned contact
#2092Two-dimensional condensation for uniaxially strained semiconductor fins
#2093Nanowire and method of fabricating the same
#2094Silicon IMPATT diode
#2095Silicon germanium alloy fins with reduced defects
#2096Semiconductor device including fin structures and manufacturing method therof
#2097Source/drain structure and manufacturing the same
#2098Semiconductor device and method of forming the same
#2099SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2100N-type fin field-effect transistor and fabrication method thereof