208282 ⎘
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group , e.g. alloys in different semiconductor regions, e.g. heterojunctions
MOS device with island region
#2402Method of making a graphene base transistor with reduced collector area
#2403Semiconductor devices
#2404Transistor device and fabrication method
#2405Method and apparatus for source-drain junction formation in a FinFET with in-situ doping
#2406Semiconductor device and method of fabricating the same
#2407Fin-type graphene device
#2408Method and structure for FinFET device
#2409Methods for high-k metal gate CMOS with SiC and SiGe source/drain regions
#2410Semiconductor structure with strained source and drain structures and method for forming the same
#2411Semiconductor device structure with gate spacer having protruding bottom portion and method for forming the same
#2412Isolation structure of semiconductor device
#2413Structure and method for SRAM FinfET device
#2414Device having EPI film in substrate trench
#2415Semiconductor devices including a stressor in a recess and methods of forming the same
#2416Enhanced dislocation stress transistor
#2417Non-planar gate all-around device and method of fabrication thereof
#2418Semiconductor device and method for fabricating the same
#2419Semiconductor structure and manufacturing method of the same
#2420Method to co-integrate oppositely strained semiconductor devices on a same substrate
#2421Semiconductor structure and fabricating method thereof
#2422Performance enhancement in transistors by providing an embedded strain-inducing semiconductor material on the basis of a seed layer
#2423Apparatus and method for forming semiconductor contacts
#2424Semiconductor device structure
#2425Leakage current suppression methods and related structures
#2426NATIVE PMOS DEVICE WITH LOW THRESHOLD VOLTAGE AND HIGH DRIVE CURRENT AND METHOD OF FABRICATING THE SAME
#2427High mobility strained channels for fin-based transistors
#2428Method for the formation of a FinFET device with epitaxially grown source-drain regions having a reduced leakage path
#2429Method of making a semiconductor device using spacers for source/drain confinement
#2430Semiconductor devices including a stressor in a recess and methods of forming the same
#2431FinFET semiconductor device with isolated fins made of alternative channel materials
#2432FinFET with a silicon germanium alloy channel and method of fabrication thereof
#2433Semiconductor device and fabrication method thereof
#2434Method of manufacturing semiconductor devices
#2435Germanium-based quantum well devices
#2436Semiconductor device structure and method for forming the same
#2437Borderless contact formation through metal-recess dual cap integration
#2438Growth of semiconductors on hetero-substrates using graphene as an interfacial layer
#2439Method for forming semiconductor device structure
#2440Substrate of semiconductor device including epitaxial layer and silicon layer having same crystalline orientation
#2441Lateral PiN diodes and schottky diodes
#2442SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#2443Fin-like field effect transistor (FinFET) device and method of manufacturing same
#2444Fin field-effect transistors and fabrication methods thereof
#2445Dual channel material for finFET for high performance CMOS
#2446Formation of nickel silicon and nickel germanium structure at staggered times
#2447Nanowire nanoelectromechanical field-effect transistors
#2448Semiconductor device and fabrication method therefor
#2449Metal-insensitive epitaxy formation
#2450Integrated circuits with diffusion barrier layers and processes for preparing integrated circuits including diffusion barrier layers
#2451THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND A SYSTEM HAVING THE SAME
#2452Finfet including improved epitaxial topology
#2453Two-dimensional condensation for uniaxially strained semiconductor fins
#2454Semiconductor devices and methods of fabricating the same
#2455Semiconductor devices with germanium-rich active layers and doped transition layers
#2456Semiconductor structure and manufacturing method thereof
#2457Structure and method for FinFET device
#2458Semiconductor device and fabrication method thereof
#2459Tunneling field effect transistor having a three-side source and fabrication method thereof
#2460Semiconductor device structure and method for forming the same
#2461Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a fin
#2462FinFET with constrained source-drain epitaxial region
#2463Raised metal semiconductor alloy for self-aligned middle-of-line contact
#2464Multi-gate devices with replaced-channels and methods for forming the same
#2465FinFET with dielectric isolation after gate module for improved source and drain region epitaxial growth
#2466Methods of forming stressed channel regions for a FinFET semiconductor device and the resulting device
#2467Strained channel of gate-all-around transistor
#2468Transistor design
#2469Semiconductor channel-stop layer and method of manufacturing the same
#2470Semiconductor device having silicon-germanium source/drain regions with varying germanium concentrations
#2471Methods of fabricating a semiconductor device
#2472Method of making a strained structure of a semiconductor device
#2473Silicide formation due to improved SiGe faceting
#2474Source/drain structures and methods of forming same
#2475Semiconductor devices having source/drain regions with strain-inducing layers and methods of manufacturing such semiconductor devices
#2476Nanowire field effect transistor device having a replacement gate
#2477FinFET device with abrupt junctions
#2478Method for forming a germanium channel layer for an NMOS transistor device, NMOS transistor device and CMOS device
#2479Method for providing an NMOS device and a PMOS device on a silicon substrate and silicon substrate comprising an NMOS device and a PMOS device
#2480FinFET device with dual-strained channels and method for manufacturing thereof
#2481MOS devices with thinned gate spacers and methods of thinning the gate spacers
#2482Semiconductor device and fabrication method thereof
#2483Semiconductor device having insulating pattern and method of forming the same
#2484Non-planar quantum well device having interfacial layer and method of forming same
#2485Methods of manufacturing semiconductor devices
#2486Semiconductor device and method for manufacturing the same
#2487Fin-based semiconductor device including a metal gate diffusion break structure with a conformal dielectric layer
#2488FinFET source-drain merged by silicide-based material
#2489Methods of manufacturing semiconductor devices by forming source/drain regions before gate electrode separation
#2490Semiconductor structure and manufacturing method thereof
#2491Methods of forming low defect replacement fins for a FinFET semiconductor device and the resulting devices
#2492FinFET with constrained source-drain epitaxial region
#2493Field effect transistor and method of fabricating the same
#2494Semiconductor structure and manufacturing method thereof
#2495Processes for fabricating FinFET structures with semiconductor compound portions formed in cavities and extending over sidewall spacers
#2496Fin spacer protected source and drain regions in FinFETs
#2497FinFETs with necking in the fins
#2498Stain compensation in transistors
#2499Method for fabricating a strained structure and structure formed
#2500Semiconductor devices including source/drain regions having multiple epitaxial patterns
#2501FinFETs with strained well regions
#2502Strained source and drain (SSD) structure and method for forming the same
#2503Semiconductor devices and fabrication method thereof
#2504Method for producing a microelectronic device
#2505Junction butting structure using nonuniform trench shape
#2506Fin-last FinFET and methods of forming same
#2507Structure and method for SRAM FinFET device
#2508Method of forming different voltage devices with high-k metal gate
#2509Integrated circuit structure and method with solid phase diffusion
#2510Semiconductor device and manufacturing method thereof
#2511CONSTRAINING EPITAXIAL GROWTH ON FINS OF A FINFET DEVICE
#2512Apparatus and method for multiple gate transistors
#2513Method and structure for protecting gates during epitaxial growth
#2514Multi-channel gate-all-around FET
#2515Three dimensional semiconductor device having lateral channel
#2516Methods and apparatus for training an artificial neural network for use in speech recognition
#2517FinFET and nanowire semiconductor devices with suspended channel regions and gate structures surrounding the suspended channel regions
#2518Device with engineered epitaxial region and methods of making same
#2519Structure and method for integrated circuit
#2520Graphene-metal bonding structure, method of manufacturing the same, and semiconductor device having the graphene-metal bonding structure
#2521SEMICONDUCTOR DEVICE
#2522P-FET with graded silicon-germanium channel
#2523Single-chip field effect transistor (FET) switch with silicon germanium (SiGe) power amplifier and methods of forming
#2524Self-aligned interconnect with protection layer
#2525Source/drain structure of semiconductor device
#2526SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2527Semiconductor liner of semiconductor device
#2528Constrained epitaxial source/drain regions on semiconductor-on-insulator finFET device
#2529Semiconductor arrangements and methods for manufacturing the same
#2530DEVICES AND METHODS OF FORMING BULK FINFETS WITH LATERAL SEG FOR SOURCE AND DRAIN ON DIELECTRICS
#2531Tucked active region without dummy poly for performance boost and variation reduction
#2532Semiconductor structure and fabrication method thereof
#2533Method for making a semiconductor device with sidewall spacers for confining epitaxial growth
#2534Deep gate-all-around semiconductor device having germanium or group III-V active layer
#2535Contact resistance optimization via EPI growth engineering
#2536Semiconductor device having strained fin structure and method of making the same
#2537Transistor with embedded stress-inducing layers
#2538Semiconductor structures and fabrication method thereof
#2539Metal oxide semiconductor having epitaxial source drain regions and a method of manufacturing same using dummy gate process
#2540Methods of increasing silicide to epi contact areas and the resulting devices
#2541Semiconductor devices and methods of fabricating the same
#2542Method for embedded diamond-shaped stress element
#2543Drain extended field effect transistors and methods of formation thereof
#2544Integrated RF front end system
#2545Passivation structure of fin field effect transistor
#2546Method and apparatus of forming an integrated circuit with a strained channel region
#2547Semiconductor device and method for manufacturing the same
#2548Methods of fabricating semiconductor fin structures
#2549Selective germanium P-contact metalization through trench
#2550Semiconductor device
#2551MULTI-HEIGHT MULTI-COMPOSITION SEMICONDUCTOR FINS
#2552Techniques providing metal gate devices with multiple barrier layers
#2553Integrate circuit with nanowires
#2554FinFET and method for manufacturing the same
#2555Fin field effect transistor (finFET) device including a set of merged fins formed adjacent a set of unmerged fins
#2556Semiconductor device structure having multi-layered insulating cap layers over metal gate
#2557Integrated electronic device and method for manufacturing thereof
#2558Structures and formation methods of finFET device
#2559Methods for introducing carbon to a semiconductor structure and structures formed thereby
#2560Semiconductor device and method of manufacturing the same
#2561Semiconductor device and method of manufacturing the same
#2562Methods for forming semiconductor regions in trenches
#2563Methods of forming defect-free SRB onto lattice-mismatched substrates and defect-free fins on insulators
#2564Semiconductor device and manufacturing method therefor
#2565Method of forming epitaxial buffer layer for finFET source and drain junction leakage reduction
#2566Forming alternative material fins with reduced defect density by performing an implantation/anneal defect generation process
#2567Structure and method for FinFET device
#2568Structure and method for FinFET device
#2569Self-aligned emitter-base-collector bipolar junction transistors with a single crystal raised extrinsic base
#2570Semiconductor devices utilizing partially doped stressor film portions
#2571Semiconductor device and method of fabricating the same
#2572Structure and method for SRAM FinFET device having an oxide feature
#2573Structure and method for FinFET device
#2574Semiconductor device
#2575Fabricating field effect transistor(s) with stressed channel region(s) and low-resistance source/drain regions
#2576FinFET device with high-k metal gate stack
#2577Semiconductor device having multiple active area layers and its formation thereof
#2578Method to induce strain in finFET channels from an adjacent region
#2579Method of fabricating a MOSFET with an undoped channel
#2580Base profile of self-aligned bipolar transistors for power amplifier applications
#2581Method for manufacturing fin structure
#2582Silicon and silicon germanium nanowire structures
#2583Method to co-integrate oppositely strained semiconductor devices on a same substrate
#2584Three-dimensional semiconductor memory devices including a vertical channel
#2585Method and structure for FinFET device
#2586BiCMOS integration using a shared SiGe layer
#2587Efficient fabrication of BiCMOS devices
#2588Low-cost complementary BiCMOS integration scheme
#2589Dual pocket approach in PFETs with embedded SI-GE source/drain
#2590Semiconductor device and fabrication method thereof
#2591Method of manufacturing MOSFET
#2592Defect-free relaxed covering layer on semiconductor substrate with lattice mismatch
#2593Methods of forming substantially self-aligned isolation regions on FinFET semiconductor devices and the resulting devices
#2594MOS devices with ultra-high dielectric constants and methods of forming the same
#2595Semiconductor device including field effect transistor
#2596Semiconductor devices and methods for manufacturing the same
#2597Method of forming well-controlled extension profile in MOSFET by silicon germanium based sacrificial layer
#2598Transistors having strained channel under gate in a recess
#2599SiGe FinFET with improved junction doping control
#2600Method for manufacturing a transistor device
#2601Semiconductor device and method for manufacturing same
#2602FinFET including tunable fin height and tunable fin width ratio
#2603FinFET semiconductor device having integrated SiGe fin
#2604Self-aligned contact process enabled by low temperature
#2605Semiconductor devices and methods of fabricating the same
#2606Semiconductor device with fin and related methods
#2607Semiconductor structure and method for manufacturing the same
#2608Direct tunnel barrier control gates in a two-dimensional electronic system
#2609Method of making semiconductor device
#2610Constrained epitaxial source/drain regions on semiconductor-on-insulator finFET device
#2611Combination FinFET and methods of forming same
#2612Bottle-neck recess in a semiconductor device
#2613Semiconductor device including at least one type of deep-level dopant
#2614Abrupt source/drain junction formation using a diffusion facilitation layer
#2615Abrupt source/drain junction formation using a diffusion facilitation layer
#2616Semiconductor device and method for fabricating the same
#2617Methods of forming low-defect strain-relaxed layers on lattice-mismatched substrates and related semiconductor structures and devices
#2618Compact memory structure including tunneling diode
#2619Semiconductor device and method of fabricating the same
#2620Recess and epitaxial layer to improve transistor performance
#2621Semiconductor process for modifying shape of recess
#2622FinFET structure and method for fabricating the same
#2623Method of forming semiconductor device having stressor
#2624Heterojunction bipolar transistors with intrinsic interlayers
#2625Integrated circuit having heterostructure FinFET with tunable device parameters and method to fabricate same
#2626Epitaxial channel
#2627Application of super lattice films on insulator to lateral bipolar transistors
#2628Semiconductor devices with core-shell structures
#2629FinFETs with strained well regions
#2630Sandwich epi channel for device enhancement
#2631Conformity control for metal gate stack
#2632N-work function metal with crystal structure
#2633Semiconductor devices and methods for manufacturing the same
#2634SEMICONDUCTOR DEVICE HAVING STRESSOR AND METHOD OF FABRICATING THE SAME
#2635Structure and method to make strained FinFET with improved junction capacitance and low leakage
#2636Methods for forming wrap around contact
#2637Semiconductor integrated circuit with dislocations
#2638Semiconductor structure and manufacturing method thereof
#2639Semiconductor devices and methods of manufacture thereof
#2640Semiconductor device and manufacturing method thereof
#2641FinFETs of different compositions formed on a same substrate
#2642Methods of forming alternative channel materials on a non-planar semiconductor device and the resulting device
#2643Multi-layer strained channel FinFET
#2644Transistor having a heterojunction and manufacturing method thereof
#2645Semiconductor transistor device with dopant profile
#2646Nanoscale structure with epitaxial film having a recessed bottom portion
#2647Blanket EPI super steep retrograde well formation without Si recess
#2648Field-effect semiconductor device
#2649Methods for forming semiconductor device structures
#2650Semiconductor arrangement with stress control and method of making
#2651Integrated circuit devices including FinFETs and methods of forming the same
#2652Reacted conductive gate electrodes and methods of making the same
#2653Ambipolar synaptic devices
#2654Ambipolar synaptic devices
#2655Method for fabricating semiconductor device, and semiconductor device made thereby
#2656Semiconductor device and formation thereof
#2657Semiconductor structures and methods for multi-level band gap energy of nanowire transistors to improve drive current
#2658Fin field effect transistor (FinFET) device and method for forming the same
#2659Semiconductor device and manufacturing method thereof
#2660Gate structure of field effect transistor with footing
#2661Reduced variation MOSFET using a drain-extension-last process
#2662Semiconductor device including groups of stacked nanowires and related methods
#2663Reverse tone self-aligned contact
#2664Ambipolar synaptic devices
#2665Semiconductor substructure having elevated strain material-sidewall interface and method of making the same
#2666Method of fabricating spacers in a strained semiconductor device
#2667Field effect transistor with heterostructure channel
#2668FinFET device with abrupt junctions
#2669Silicon on insulator device with partially recessed gate
#2670Formation of an asymmetric trench in a semiconductor substrate and a bipolar semiconductor device having an asymmetric trench isolation region
#2671Side gate assist in metal gate first process
#2672Integrated circuits with relaxed silicon / germanium fins
#2673Semiconductor device and method for manufacturing the same
#2674Semiconductor structure having contact plug and method of making the same
#2675Modulating germanium percentage in MOS devices
#2676Method of manufacturing a FinFET device using a sacrificial epitaxy region for improved fin merge and FinFET device formed by same
#2677Semiconductor device and method of manufacturing
#2678Strained FinFET and method for manufacturing the same
#2679Semiconductor device including spacers having different dimensions
#2680Source and drain doping profile control employing carbon-doped semiconductor material
#2681Semiconductor devices and methods of manufacturing the same
#26821T SRAM/DRAM
#26831T SRAM/DRAM
#2684High dose implantation for ultrathin semiconductor-on-insulator substrates
#2685Method of manufacturing a semiconductor device using source/drain epitaxial overgrowth for forming self-aligned contacts without spacer loss and a semiconductor device formed by same
#2686Semiconductor devices and methods of fabricating the same
#2687Semiconductor device including superlattice SiGe/Si fin structure
#2688Semiconductor device and fabrication method thereof
#2689Tuning strain in semiconductor devices
#2690Graphene heterostructure field effect transistors
#2691Aligned gate-all-around structure
#2692Epitaxial formation of source and drain regions
#2693ULTRATHIN BODY FULLY DEPLETED SILICON-ON-INSULATOR INTEGRATED CIRCUITS AND METHODS FOR FABRICATING SAME
#2694High-K metal gate process for lowering junction leakage and interface traps in NMOS transistor
#2695Semiconductor devices and methods of manufacturing the same
#2696Method of making a CMOS semiconductor device using a stressed silicon-on-insulator (SOI) wafer
#2697Body-tied, strained-channel multi-gate device and methods of manufacturing same
#2698Semiconductor device, related manufacturing method, and related electronic device
#2699Field effect transistor (FET) with self-aligned double gates on bulk silicon substrate, methods of forming, and related design structures
#2700Formation of a high aspect ratio trench in a semiconductor substrate and a bipolar semiconductor device having a high aspect ratio trench isolation region