208407 ⎘
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Types of semiconductor device ; Multistep manufacturing processes therefor; Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices; Thyristors Bidirectional thyristors
FORMING OF AN ELECTRONIC POWER COMPONENT
#2HIGH NOISE IMMUNITY TRIAC STRUCTURE
#3TRIAC DEVICE WITH HIGH COMMUTATING CAPABILITY
#4System and method for bi-directional trench power switches
#5Ruggedized symmetrically bidirectional bipolar power transistor
#6Thyristor, triac and transient-voltage-suppression diode manufacturing
#7Semiconductor device with bi-directional double-base trench power switches
#8Electrostatic discharge protection devices and methods for fabricating electrostatic discharge protection devices
#9Thyristor assembly
#10Silicon controlled rectifier and method for making the same
#11Silicon controlled rectifier and method for making the same
#12Ruggedized symmetrically bidirectional bipolar power transistor
#13Thyristor assembly
#14Thyristor, triac and transient-voltage-suppression diode manufacturing
#15Bi-directional breakdown silicon controlled rectifiers
#16Silicon-controlled-rectifier electrostatic protection structure and fabrication method thereof
#17One-way switch with a gate referenced to the main back side electrode
#18Semiconductor device and method of manufacturing the semiconductor device
#19Ruggedized symmetrically bidirectional bipolar power transistor
#20VERTICAL POWER COMPONENT
#21B-TRAN Geometry and Structure That Provides Both High Gain and High Current Density
#22Positive strike SCR, negative strike SCR, and a bidirectional ESD structure that utilizes the positive strike SCR and the negative strike SCR
#23Vertical power component
#24Bi-directional punch-through semiconductor device and manufacturing method thereof
#25Bidirectional MOS device and method for preparing the same
#26Vertical semiconductor power component capable of withstanding high voltage
#27Bidirectional Bipolar Transistor Structure with Field-Limiting Rings Formed by the Emitter Diffusion
#28Bi-directional punch-through semiconductor device and manufacturing method thereof
#29Bi-directional ESD protection device
#30Vertical power component
#31Insulated gate power device using a MOSFET for turning off
#32Cross-coupled thyristor SRAM semiconductor structures and methods of fabrication
#33High-voltage vertical power component
#34Cross-coupled thyristor SRAM semiconductor structures and methods of fabrication
#35Positive strike SCR, negative strike SCR, and a bidirectional ESD structure that utilizes the positive strike SCR and the negative strike SCR
#36High-voltage vertical power component
#37Bi-directional silicon controlled rectifier structure
#38Protection device and related fabrication methods
#39Protection device and related fabrication methods
#40Semiconductor device and method of manufacturing a semiconductor device
#41Junction-isolated blocking voltage structures with integrated protection structures
#42Vertical power component
#43Junction-isolated blocking voltage devices with integrated protection structures and methods of forming the same
#44Structures and techniques for using semiconductor body to construct SCR, DIAC, or TRIAC
#45Electrostatic discharge (ESD) silicon controlled rectifier (SCR) structure
#46Memory cells, memory arrays, methods of forming memory cells, and methods of forming a shared doped semiconductor region of a vertically oriented thyristor and a vertically oriented access transistor
#47High-voltage vertical power component
#48Apparatus and method for transient electrical overstress protection
#49Vertical power component
#50Memory cells, memory arrays, methods of forming memory cells, and methods of forming a shared doped semiconductor region of a vertically oriented thyristor and a vertically oriented access transistor
#51Apparatus and method for transient electrical overstress protection
#52Double-groove bidirectional vertical component
#53Electrostatic discharge (ESD) silicon controlled rectifier (SCR) structure
#54HF-controlled bidirectional switch
#55Semiconductor device and manufacturing method thereof
#56Structure and method for an electrostatic discharge (ESD) silicon controlled rectifier (SCR) structure