PYROELECTRIC MATERIAL, RADIATION SENSOR, METHOD OF MAKING A RADIATION SENSOR, USE OF LITHIUM TANTALATE AND LITHIUM NiOBATE

ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS AND METHODS OF MAKING SAME

METHOD AND APPARATUS FOR LOADING SOLDER BALLS

Device package and methods for the fabrication thereof

Laser processing method

Interposer with microspring contacts

Interposer-embedded printed circuit board

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Printed wiring board

HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Soldering entities to a monolithic metallic sheet

Method for manufacturing a printed wiring board

Method of making a high frequency device package

NETWORK SYSTEM AND NODE

Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops

Silicone Composition for Producing Transparent Silicone Materials and Optical Devices

Amplifier circuit for a ranging transceiver

Semiconductor device including coupling conductive pattern

Connector assembly and method of manufacture

Method for reducing UBM undercut in metal bump structures

Copper bonding compatible bond pad structure and method

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding

Method for producing chip elements equipped with wire insertion grooves

Apparatus for restricting moisture ingress

Method of manufacture of integrated circuit packaging system with stacked integrated circuit

SEMICONDUCTOR DIE PACKAGE INCLUDING MULTIPLE DIES AND A COMMON NODE STRUCTURE

MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Semiconductor laser element, semiconductor laser device, and optical apparatus employing the same

SEMICONDUCTOR LASER ELEMENT, SEMICONDUCTOR LASER DEVICE, AND OPTICAL APPARATUS EMPLOYING THE SAME

Complex semiconductor device for use in mobile equipment

Light source apparatus having a solid light source element and a phosphor

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

Circuit board and semiconductor module including the same

Semiconductor component and method of manufacture

Electronic Device, Circuit Board Assembly, and Semiconductor Device

Monolithic microwave integrated circuit

Semiconductor package with integrated substrate thermal slug

Power supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides

Distributed coupler with first line on substrate and second line in package supporting substrate

Power amplifier circuit

Light-emitting diode (LED) module with light sensor configurations for optical feedback

Red light-emitting flourescent substance and light-emitting device employing the same

Silicon carbidonitride based phosphors and lighting devices using the same

Red light-emitting fluorescent substance and light-emitting device employing the same

SEMICONDUCTOR DEVICE AND SIGNAL TRANSMISSION METHOD

Seal apparatus and method of manufacturing the same

MOLDING APPARATUS AND MOLDING METHOD FOR PACKAGING SEMICONDUCTOR

Resin composition for encapsulating semiconductor and semiconductor device

Electronic packaging with a variable thickness mold cap

Integrated circuit packaging system with film encapsulation and method of manufacture thereof

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Semiconductor component and device provided with heat dissipation means

Chip assembly with a coreless substrate employing a patterned adhesive layer

Semiconductor device and manufacturing method thereof

Compliant printed circuit area array semiconductor device package

Methods for filling a contact hole in a chip package arrangement and chip package arrangements

Semiconductor package and method for manufacturing the same

STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Die structure, die arrangement and method of processing a die

SEMICONDUCTOR CHIP, STACKED CHIP SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND FABRICATING METHOD THEREOF

Embedded ball grid array substrate and manufacturing method thereof

Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGE

Method of manufacturing substrate for semiconductor element, and semiconductor device

Semiconductor device having metal posts non-overlapping with other devices and layout method of semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP

Semiconductor device having pad structure with stress buffer layer

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

Semiconductor chip with redundant thru-silicon-vias

Method for manufacturing electronic component, and electronic component

Semiconductor module and method for production thereof

3-D integrated semiconductor device comprising intermediate heat spreading capabilities

Semiconductor device having a pin mounted heat sink

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

POWER SEMICONDUCTOR MODULE HAVING SINTERED METAL CONNECTIONS, PREFERABLY SINTERED SILVER CONNECTIONS, AND PRODUCTION METHOD

Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Package structure for DC-DC converter

Power semiconductor chip package

Apparatus and method configured to lower thermal stresses

LED LEAD FRAME HAVING DIFFERENT MOUNTING SURFACES

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE

Semiconductor packages having increased input/output capacity and related methods

DICING DIE BOND FILM

Systems and methods for enabling ESD protection on 3-D stacked devices

Programmable anti-fuse wire bond pads

Through-substrate via waveguides

Liquid electrical interconnect and devices using same

Device for use as dual-sided sensor package

Power semiconductor package

Control device of semiconductor device

MANUFACTURING METHOD FOR POWER LED HEAD-DISSIPATING SUBSTRATE AND POWER LED PRODUCT AND THE PRODUCTS THEREOF

Light emitting device including support member and bonding member

Light emitting device and lighting instrument including the same

LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF LIGHT EMITTING DEVICE

Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants

LIGHT-EMITTING DIODE PACKAGE

Light emitting diode package having interconnection structures

Memory card package structure and method for fabricating the same

Method for manufacturing a printed wiring board

COOLING MECHANISM FOR STACKED DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Method for manufacturing flex-rigid wiring board

Method for manufacturing a stacked device conductive path connectivity

Semiconductor memory device

Electrical connection device

Method for manufacturing semiconductor optical device

Method of fabricating a semiconductor device having a resin with warpage compensated structures

Manufacturing method for semiconductor device carrier and semiconductor package using the same

Fabrication method of semiconductor integrated circuit device

Light emitting apparatus and light unit

Light emitting diode module having a ground lead

Light emitting device

LIGHT EMITTING DEVICE

High efficiency solid state lamp and bulb

Configurable, power supply voltage referenced single-ended signaling with ESD protection

LED light source unit for backlight of liquid crystal display, and liquid crystal display

Fluorescent substance and light-emitting device employing the same

Light emitting device

Light emitting device including first and second red phosphors and a green phosphor

RFIC chip mounting structure

Multi-chip package with offset die stacking

Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting

Layered chip package and method of manufacturing same

Compliant printed circuit wafer level semiconductor package

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Die edge contacts for semiconductor devices

SUBSTRATE FOR A MICROELECTRONIC PACKAGE AND METHOD OF FABRICATING THEREOF

Semiconductor device with pads of enhanced moisture blocking ability

Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers

Semiconductor device and manufacturing method of semiconductor device

Embedded package and method for manufacturing the same

SEMICONDUCTOR DEVICE

Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die

Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die

SEMICONDUCTOR PACKAGE

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Lead frame for semiconductor device

Semiconductor device and method of blowing fuse thereof

MEMS Sensor Package

Semiconductor device integrated with converter and package structure thereof

Bi-directional, reverse blocking battery switch

Optoelectronic module and method of producing an optoelectronic module

Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material

Light emitting device

LED CHIP MODULES, METHOD FOR PACKAGING THE LED CHIP MODULES, AND MOVING FIXTURE THEREOF

LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF

Light emitting device

Light emitting device

LED PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

Light emitting element

LEAD FRAME PACKAGE WITH MULTIPLE BENDS

Light emitting diode package

Light emitting device

LED package having an array of light emitting cells coupled in series

MULTI-CHIP PACKAGES

Luminous module for microcircuit device

Contacting means and method for contacting electrical components

Method of manufacturing semiconductor device and wire bonding apparatus

Self-filleting die attach paste

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING EXPOSING A DICING LINE ON A WAFER

Method for manufacturing semiconductor device

Leadless array plastic package with various IC packaging configurations

METHOD FOR MANUFACTURING CHIP PACKAGE

Method of manufacturing semiconductor device

Method for manufacturing semiconductor devices

Phosphor film, method of forming the same, and method of coating phosphor layer on LED chips

Method and apparatus providing fine alignment of a structure relative to a support

METHOD OF MANUFACTURING SEMICONDUCTOR LASER APPARATUS, SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS

Edge-emitting semiconductor laser

Wavelength conversion structure and light source apparatus

Process variation compensated multi-chip memory package

Lamp assembly having light source with luminance peak portion at one of the long sides of the light source

Illumination arrangement, multiple light module, luminaire and use thereof

Method for cooling a light emitting diode with liquid and light emitting diode package using the same

Electronic Component and Method of Manufacturing the Same

Stretchable electronic device

Leadframe package with integrated partial waveguide interface

Light-spreading device

Surface acoustic wave device, surface acoustic wave oscillator, and electronic apparatus

Semiconductor apparatus, inspection method thereof and electric device

Bond pad for semiconductor die

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

Semiconductor device and method for manufacturing the same

Substrate dicing technique for separating semiconductor dies with reduced area consumption

Semiconductor storage device and a method of manufacturing the semiconductor storage device

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE HAVING THROUGH-SILICON-VIA (TSV) CHIP EMBEDDED THEREIN AND FABRICATION METHOD THEREOF

Semiconductor package

Structures embedded within core material and methods of manufacturing thereof

Package structure

Semiconductor device and method for manufacturing thereof

SEMICONDUCTOR INTEGRATED CIRCUIT

BALL GRID ARRAY PACKAGE

Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package

Bump structure with underbump metallization structure and integrated redistribution layer

Semiconductor apparatus

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Stress reduction in chip packaging by using a low-temperature chip-package connection regime

Helical springs electrical connecting a plurality of packages

Pillar bumps and process for making same

Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die

Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method

Semiconductor die terminal

Semiconductor package structure and manufacturing process thereof

STACKABLE SEMICONDUCTOR DEVICE PACKAGES

Semiconductor device

Semiconductor package for forming a leadframe package

Singulation method for semiconductor package with plating on side of connectors

Semiconductor Device and Method of Forming Leadframe as Vertical Interconnect Structure Between Stacked Semiconductor Die

Hybrid multilayer substrate

Semiconductor device, method for manufacturing same, and semiconductor apparatus

Cylindrical embedded capacitors

Manufacturing method of semiconductor device, semiconductor substrate, and camera module

Thin-wafer current sensors

SENSOR APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE

MEMS device assembly and method of packaging same

Semiconductor device

Semiconductor device and method of manufacturing the same, and power supply apparatus

Light emitting device

Light emitting device, light emitting device package, and light unit

Method of manufacturing light emitting device that includes using atomic layer deposition to form protective film on reflective film

Light-emitting device and method for manufacturing light-emitting device

LED unit

Monolithic Multi-Junction Light Emitting Devices Including Multiple Groups of Light Emitting Diodes

Light-emitting device

LED CHIP PACKAGE STRUCTURE WITH A HIGH-EFFICIENCY HEAT-DISSIPATING SUBSTRATE AND METHOD FOR MAKING THE SAME

Structure of light-emitting diode (LED)

LED MODULE

Multi-dimensional solid state lighting device array system and associated methods and structures

ELECTRONIC ASSEMBLY

Intrinsically safe improved sensitivity NDIR gas sensor in a can

Infrared sensor and manufacturing method thereof

ELECTRONIC DEVICE

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

Wiring board and method of manufacturing a semiconductor device

High power module cooling system

APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS

Pressure sensor device, electronic apparatus, and method of mounting pressure sensor device

Method of manufacturing semiconductor package

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

Optical transceiver and packaging method thereof

Semiconductor optical modulation device

Authentication device, authentication method, and an information storage medium storing a program

SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS

Light-emitting module, light source device, liquid crystal display device, and method of manufacturing light-emitting module

Light emitting unit, light emitting module, and display device

Method of making a compliant printed circuit peripheral lead semiconductor package

Electronic package structure having side-wing parts outside of a package layer for dissipating heat and method for making the same

Electronic device, electronic apparatus, and electronic device manufacturing method

Switching circuits for extracting power from an electric power source and associated methods

Integrated Heat Conductive Light Emitting Diode (LED) White Light Source Module

Switching circuits for extracting power from an electric power source and associated methods

Switching circuits for extracting power from an electric power source and associated methods

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Semiconductor memory device and semiconductor memory card

Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)

Stacked semiconductor chip device with thermal management circuit board

Semiconductor device and electronic apparatus including the same

IMPLEMENTING MULTIPLE DIFFERENT TYPES OF DIES FOR MEMORY STACKING

Semiconductor device production method and semiconductor device

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

Mechanisms for forming copper pillar bumps using patterned anodes

Semiconductor power module

Leadframe, leadframe type package and lead lane

Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame

Electronic component having an authentication pattern

Nitride semiconductor wafer having a chamfered edge

FABRICATING METHOD AND STRUCTURE OF SUBMOUNT

PACKAGED DEVICE INCLUDING A WELL FOR CONTAINING A DIE

LED PACKAGE STRUCTURE

Light emitting device and manufacturing method thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

Light-emitting devices with substrate coated with optically denser material

High voltage low current surface emitting light emitting diode

Light emitting device

Printed wiring board and a method of manufacturing a printed wiring board

Composite polymer-metal electrical contacts

Device-embedded flexible printed circuit board and manufacturing method thereof

Electronic packaging apparatus and electronic packaging method

Apparatus and method for forming a wire loop

Feedback system for identifying movement and intensity of external force

Pressure sensor

Process for making conductive post with footing profile

Bundle of long thin carbon structures, manufacturing method therefor, and electronic device

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD FOR ENCAPSULATING SEMICONDUCTOR, AND SOLVENT-BORNE SEMICONDUCTOR ENCAPSULATING EPOXY RESIN COMPOSITION

Method of fabricating a semiconductor device package including a heat radiation plate

Panelized backside processing for thin semiconductors

Method for producing a semiconductor element

Light emitting device and the manufacture method thereof

Light emitting element, a light emitting device, a method of manufacturing a light emitting element and a method of manufacturing a light emitting device

TRANSFERRING ANTENNA STRUCTURES TO RFID COMPONENTS

RADIATION REFLECTION PLATE FOR LED