Electronic apparatus, method of making the same, and transceiving device

Electroluminescent devices with color adjustment based on current crowding

Phosphor and light emitting device

Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package

Chip-to-chip multi-signaling communication system with common conductive layer

Method of producing a chip package, and chip package

LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD

Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package

Semiconductor device and method of manufacturing the same

Microelectronic assemblies having compliancy and methods therefor

Semiconductor device for semiconductor package having through silicon vias of different heights

Semiconductor packages and methods of fabricating the same

Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same

Under-bump metallization (UBM) structure and method of forming the same

Conductive pillar structure

Semiconductor device

SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR PACKAGE

Semiconductor device

Chip package structure and chip packaging method

Leadframe package structure and manufacturing method thereof

Mixed wire semiconductor lead frame package

Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die

SEMICONDUCTOR DEVICE, METHOD FOR FORMING THE SAME, AND DATA PROCESSING SYSTEM

Light emitting device

Light emitting device

Submount and manufacturing method thereof

LIGHT REFLECTING SUBSTRATE AND PROCESS FOR MANUFACTURE THEREOF

Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump

Light emitting device and method of manufacture

Radiation-emitting optical component

Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same

LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PHOSPHOR AND LIGHT EMITTING DEVICE

Light-emitting device

Light emitting device having a pluralilty of light emitting cells and package mounting the same

Semiconductor device with interposer and method manufacturing same

Smart integrated semiconductor light emitting system including nitride based light emitting diodes (LED) and application specific integrated circuits (ASIC)

Bonding apparatus and bonding method

Bonding apparatus

PACKAGE STRUCTURE OF CONCENTRATED PHOTOVOLTAIC CELL AND FABRICATION METHOD THEREOF

Adhesive bonding composition and method of use

Semiconductor device and the method of manufacturing the same

Method and system for forming conductive bumping with copper interconnection

Thermal compressive bond head

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Method for manufacturing semiconductor package

Method of fabricating stacked chips in a semiconductor package

Semiconductor multi-project or multi-product wafer process

Opto-electronic assembly for a line card

Optical assembly for a WDM receiver or transmitter

Optical transmitter with flip-chip mounted laser or integrated arrayed waveguide grating wavelenth division multiplexer

Microphone package with embedded ASIC

Light-emitting apparatus

LED Apparatus

Printed Circuit Board For Board-On-Chip Package, Board-On-Chip Package Including The Same, And Method Of Fabricating The Board-On-Chip Package

PACKAGE SUBSTRATE

Semiconductor device comprising thin-film terminal with deformed portion

Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same

Layered chip package and method of manufacturing same

Package systems having a eutectic bonding material and manufacturing methods thereof

Package systems having an opening in a substrate thereof and manufacturing methods thereof

Semiconductor having chip stack, semiconductor system, and method of fabricating the semiconductor apparatus

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor assembly and semiconductor package including a solder channel

Method for manufacturing semiconductor device, and semiconductor device

STACKED SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE VIAS AND METHOD FOR MAKING THE SAME

CHIP STACKED STRUCTURE

Electronic component device, method of manufacturing the same and wiring substrate

Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE

IC PACKAGE

Semiconductor device including shielding layer and fabrication method thereof

Sensor and method of providing a sensor

Electronic component

Massively parallel interconnect fabric for complex semiconductor devices

Light emitting device and lighting system

Light emitting device package

LIGHT EMITTING DEVICE HAVING A DIELECTRIC LAYER AND A CONDUCTIVE LAYER IN A CAVITY

Light emitting device and light emitting device package

LED Device With A Light Extracting Rough Structure And Manufacturing Methods Thereof

Light emitting device

LED package, and mold and method of manufacturing the same

Group-III nitride compound semiconductor light-emitting device, method of manufacturing group-III nitride compound semiconductor light-emitting device, and lamp

Optoelectronic semiconductor body and method for the production thereof

Multiple configuration light emitting devices and methods

Package-on-package proximity sensor module

INFRARED ARRAY SENSOR

Closed loop temperature controlled circuit to improve device stability

ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER

Electronic Apparatus Manufacturing Method, Electronic Component, and Electronic Apparatus

Method for manufacturing ceramic multi-layered interconnection substrate

Integrated circuit combination of a target integrated circuit and a plurality of photovoltaic cells connected thereto using the top conductive layer

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Dimensionally decoupled ball limiting metalurgy

Creation of lead-free solder joint with intermetallics

Methods of forming a semiconductor package using a seed layer and semiconductor packages formed using the same

Semiconductor device having a simplified stack and method for manufacturing thereof

Flexible semiconductor package and method for fabricating the same

Method of manufacturing semiconductor device

Manufacturing method of semiconductor device

Semiconductor die package including low stress configuration

LIGHT EMITTING DIODE SEALING MEMBER AND METHOD FOR PRODUCING LIGHT EMITTING DIODE DEVICE

Flexible packaging for chip-on-chip and package-on-package technologies

Chip Capacitor Precursors

Hall sensor arrangement for the redundant measurement of a magnetic field

Phosphor and light emitting device

Resin composition for encapsulating semiconductor and semiconductor device

Off-chip VIAS in stacked chips

Semiconductor device packages stacked together having a redistribution layer

SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME

POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor module comprising an insert

Metal wiring structures for uniform current density in C4 balls

Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact pad

Apparatus and method for uniform metal plating

SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)

Electronic Package and Method of Making an Electronic Package

Thin flip chip package structure

Delamination resistant device package having raised bond surface and mold locking aperture

Semiconductor device having a pad and plurality of interconnects

ESD DEVICE AND METHOD

Sheet-molded chip-scale package

Solid-state imaging device, method for manufacturing the same, and electronic apparatus

Apparatus and method for microelectromechanical systems device packaging

Light-emitting device and lighting device provided with the same

Light emitting device

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device

Method of providing a phosphor with a precisely controlled element composition, a phosphor provided by the same, a phosphor, and a light emitting device comprising the said phosphor

Light emitting diode package structure and manufacturing method thereof

Light emitting diode package structure and manufacturing method thereof

Light emitting device package

LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Light emitting diode module

Light emitting diode, light emitting diode lamp, and lighting apparatus

Compositions for solution process, electronic devices fabricated using the same, and fabrication methods thereof

LED package

Light emitting diode and light emitting device package including the same

Transferring an antenna to an RFID inlay substrate

Method of Contacting a Semiconductor Substrate

Sensor device, motion sensor, and electronic device

Mass air flow measurement device

Assembly method for converting the precursors to capacitors

RADIO FREQUENCY POWER AMPLIFIER

Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof

Direct bonding method with reduction in overlay misalignment

Multilayered printed circuit board and method for manufacturing the same

Brace for wire bond

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

FLIP-CHIP BONDING METHOD TO REDUCE VOIDS IN UNDERFILL MATERIAL

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Manufacturing method of semiconductor device

Light-Emitting Diode Package Assembly

SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DEVICE

METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND MOLD FOR MOLDING RESIN

Bonding process and bonded structures

Backlight assembly having light emitting diode package and display apparatus having the same

Ceramic wavelength converter and LED light source containing same

PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT

Circuit device and method of manufacturing the same

MULTI-CHIP PACKAGE

Electronic module for vehicle

WHITE LIGHT EMITTING DIODE DEVICE, LIGHT EMITTING APPARATUS, AND LIQUID CRYSTAL DISPLAY DEVICE

Circuit device

Illumination system

Flexible underfill compositions for enhanced reliability

Set of resin compositions for preparing system-in-package type semiconductor device

SEMICONDUCTOR PACKAGE

Integrated circuit packaging system with warpage control and method of manufacture thereof

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer

Multi-layer TSV insulation and methods of fabricating the same

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element

Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same

Semiconductor structure and method for making same

Semiconductor device

Package for semiconductor device including guide rings and manufacturing method of the same

SEMICONDUCTOR DEVICE PROVIDED WITH REAR PROTECTIVE FILM ON OTHER SIDE OF SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device and manufacturing method of the same

Semiconductor apparatus and the method of manufacturing the same

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

Semiconductor power module and method of manufacturing the same

Semiconductor package including cap

Method and system for improving reliability of a semiconductor device

Circuit device having an improved heat dissipitation, and the method of manufacturing the same

Semiconductor device

Lead frame, semiconductor device, and method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE WITH EXPOSED PAD

Integrated circuit packaging system with interlock and method of manufacture thereof

Integrated circuit packaging system with lead encapsulation and method of manufacture thereof

Multi-chip semiconductor packages and assembly thereof

Thin flip chip package structure

Semiconductor device and manufacturing method therefor

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor chip package

Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer

Semiconductor package with integrated metal pillars and manufacturing methods thereof

INTERPOSER INCLUDING AIR GAP STRUCTURE, METHODS OF FORMING THE SAME, SEMICONDUCTOR DEVICE INCLUDING THE INTERPOSER, AND MULTI-CHIP PACKAGE INCLUDING THE INTERPOSER

Semiconductor device

Communication device

Semiconductor Package for Higher Power Transistors

LIGHT EMITTING DEVICE PACKAGE

LED PACKAGE STRUCTURE

Light emitting device package and method of manufacturing the same

Lead frame structure, a packaging structure and a lighting unit thereof

QUANTUM DOT-METAL OXIDE COMPLEX, METHOD OF PREPARING THE SAME, AND LIGHT-EMITTING DEVICE COMPRISING THE SAME

Phosphor sheet, light-emitting device having the phosphor sheet and method of manufacturing the same

Light emitting element housing package

LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

LED UNIT HAVING UNIFORM LIGHT EMISSION

LED unit having self-connecting leads

LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS USING THE SAME

Semiconductor module including a switch and non-central diode

Packaging structure

METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS

Conductive adhesive, and circuit board and electronic component module using the same

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

POLYMER CORE WIRE

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Microelectromechanical accelerometer with wireless transmission capabilities

Method of producing wiring substrate

DICING DIE BOND FILM, METHOD OF MANUFACTURING DICING DIE BOND FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Chip packaging method and structure thereof

Module with silicon-based layer

Stacked die assemblies including TSV die

Method of making a light emitting device having a molded encapsulant

Method for mounting luminescent device

Optical transmission apparatus having temperature control function

Illumination system and method of manufacturing multi-chip package structure for light emitting diodes

Multi-chip LED devices

LED illuminator module with high heat-dissipating efficiency and manufacturing method therefor

Integrated circuit with intra-chip clock interface and methods for use therewith

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Power conversion module

Solid-state imaging apparatus and camera using the same

Chip to dielectric waveguide interface for sub-millimeter wave communications link

SEMICONDUCTOR DEVICE

Apparatus and method for frequency generation

High frequency amplifier

DC-DC converter

Flexible distributed LED-based light source and method for making the same

LED light source utilizing magnetic attachment

Integrated LED and sensor device

Phosphor particle group and light emitting apparatus using the same

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

Green phosphors, methods of preparing the green phosphors, and white light-emitting devices including the green phosphors

Metal can impedance control structure

Device and method for manufacturing a device

Integrated circuit packaging system with die paddles and method of manufacture thereof

Semiconductor device having semiconductor member and mounting member

Stacked multi-die packages with impedance control

Stacked semiconductor device assembly

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE

Component having a via

Semiconductor device and method for manufacturing the same

Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist

SEMICONDUCTOR PACKAGES, ELECTRONIC DEVICES AND ELECTRONIC SYSTEMS EMPLOYING THE SAME

LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS

Method for depackaging prepackaged integrated circuit die and a product from the method

Ball grid array semiconductor package and method of manufacturing the same

VLSI Package for High Performance Integrated Circuit

Impedance controlled packages with metal sheet or 2-layer RDL

Semiconductor device and method of forming composite bump-on-lead interconnection

Method for fabricating a neo-layer using stud bumped bare die

Printed circuit board having hexagonally aligned bump pads for substrate of semiconductor package, and semiconductor package including the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Wire bond through-via structure and method

Integrated circuit packaging system with post and method of manufacture thereof

Multi-function and shielded 3D interconnects

Anti-tamper microchip package based on thermal nanofluids or fluids

Substrate bonding with metal germanium silicon material

SEMICONDUCTOR DEVICE

Semiconductor device package and method of making a semiconductor device package

Package substrate, module and electric/electronic devices using the same

Semiconductor device with parasitic bipolar transistor

Integrated power converter package with die stacking

Integrated circuit packaging system with stack interconnect and method of manufacture thereof

Integrated circuit packaging system with paddle molding and method of manufacture thereof

TSOP with impedance control

Transition from a chip to a waveguide port

Semiconductor device and method of forming conductive TSV with insulating annular ring

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR

Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Vertical discrete devices with trench contacts and associated methods of manufacturing

THERMALLY EFFICIENT PACKAGING FOR A PHOTONIC DEVICE

Photoelectric device

LED PACKAGE STRUCTURE

Light emitting component and manufacturing method thereof

Semiconductor light emitting devices with optical coatings and methods of making same

Close-packed array of light emitting devices

Light emitting device

High density multi-chip LED devices

Electronic device comprising a chip disposed on a pin

III nitride semiconductor substrate, epitaxial substrate, and semiconductor device