212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE
#8702Thermal interface materials and methods for their preparation and use
#8703Stacked memory module and system
#8704Semiconductor device and snubber device having a SiC-MOSFET and a Zener diode
#8705LED lamp with light-diffusing end cap
#8706Power semiconductor device and power conversion device
#8707Cut-edge positioning type soldering structure and method for preventing pin deviation
#8708Electrical microfilament to circuit interface
#8709Method and system for innovative substrate/package design for a high performance integrated circuit chipset
#8710Circuit arrangement with shunt resistor
#8711Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#8712Semiconductor device and method of integrating balun and RF coupler on a common substrate
#8713Three-dimensional semiconductor integrated circuit
#8714Voltage Spike Protection for Power DMOS Devices
#8715Light emitting device having a molded body with a specific barycenter
#8716MOLDED BEAM FOR OPTOELECTRONIC SENSOR CHIP SUBSTRATE
#8717Integrated circuit packaging system with leadframe and method of manufacture thereof
#8718Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor module
#8719Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
#8720Semiconductor package having gap-filler injection-friendly structure
#8721Pop precursor with interposer for top package bond pad pitch compensation
#8722Chip stack with conductive column through electrically insulated semiconductor region
#8723Semiconductor package and method for making the same
#8724Semiconductor chip having staggered arrangement of bonding pads
#8725Packaged semiconductor device having improved locking properties
#8726Semiconductor device
#8727Electrode pad having a recessed portion
#8728Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device
#8729Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#8730Multi-chip stack package structure
#8731Multi-chip stack package structure
#8732Multi-chip stack package structure
#8733Semiconductor device
#8734Method of manufacturing an electronic device with a package locking system
#8735Tungsten stiffener for flexible substrate assembly
#8736Plasma treatment for semiconductor devices
#8737Semiconductor device and method of forming dam material around periphery of die to reduce warpage
#8738Semiconductor device, a method of manufacturing the same and an electronic device
#8739Etched surface mount islands in a leadframe package
#8740Lead frame and semiconductor package using the same
#8741Finger sensor including encapsulating layer over sensing area and related methods
#8742INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND METHOD OF MANUFACTURE THEREOF
#8743Three-dimensional stacked structure semiconductor device having through-silicon via and signaling method for the semiconductor device
#8744SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#8745Combined packaged power semiconductor device
#8746Power semiconductor device
#8747Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
#8748Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
#8749Light emitting device and lighting system having the same
#8750Light emitting device and lighting system having the same
#8751LED module having a platform with a central recession
#8752PACKAGED LEDS WITH PHOSPHOR FILMS, AND ASSOCIATED SYSTEMS AND METHODS
#8753Lighting emitting device package and method of fabricating the same including a plating layer at an outer circumference of the package body
#8754Lighting device comprising LEDs with phosphor layers
#8755Light emitting diode and light module having same
#8756Semiconductor light emitting device
#8757Light emitting device, light emitting device package, and lighting system
#8758LIGHT-EMITTING DEVICE AND LIGHTING APPARATUS
#8759LIGHT-EMITTING DEVICE AND LUMINARE
#8760SEMICONDUCTOR DEVICE
#8761Light emitting device, method for fabricating light emitting device, light emitting device package, and lighting system
#8762Circuit substrate and light emitting diode package
#8763Apparatus for Use Downhole Including Devices Having Heat Carrier Channels
#8764Method for testing a contact structure
#8765Method of manufacturing cooling fin and package substrate with cooling fin
#8766INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
#8767Wire-piercing light-emitting diode light strings
#8768LIGHT-EMITTING MODULE AND ILLUMINATION DEVICE
#8769Integrally formed single piece light emitting diode light wire
#8770Interposer-on-glass package structures
#8771Package substrate
#8772Thermally enhanced electronic package
#8773ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT
#8774Image sensor module and camera module
#8775Light-emitting device, print head and image forming apparatus
#8776Device for removing electromagnetic interference and semiconductor package including the same
#8777Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate
#8778Magnetic field current sensors
#8779Nitridosilicates co-doped with zirconium and hafnium
#8780Chip package structure
#8781Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad
#8782Semiconductor device having through substrate vias
#8783STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#8784Thermal interface material with support structure
#8785SEMICONDUCTOR APPARATUS
#8786Semiconductor integrated circuit device and method of manufacturing the same
#8787Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
#8788Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same
#8789STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD
#8790Copper bump structures having sidewall protection layers
#8791ELECTRICALLY CONNECTING ROUTES OF SEMICONDUCTOR CHIP PACKAGE CONSOLIDATED IN DIE-ATTACHMENT
#8792Package on package having improved thermal characteristics
#8793NO LEAD PACKAGE WITH HEAT SPREADER
#8794Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires
#8795Semiconductor device and manufacturing method thereof
#8796SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE, AND ELECTRONIC APPARATUS
#8797SEMICONDUCTOR CHIP WITH THROUGH ELECTRODES AND METHOD FOR MANUFACTURING THE SAME
#8798WAFER LEVEL DIODE PACKAGE STRUCTURE
#8799Semiconductor package
#8800Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate
#8801Wafer level processing method and structure to manufacture semiconductor chip
#8802SEMICONDUCTOR DEVICE, CAMERA MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#8803SEMICONDUCTOR SENSOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR SENSOR DEVICE, PACKAGE, METHOD OF MANUFACTURING PACKAGE, MODULE, METHOD OF MANUFACTURING MODULE, AND ELECTRONIC DEVICE
#8804Semiconductor arrangement with a solder resist layer
#8805Light emitting device and lighting system
#8806LIGHT EMITTING DEVICE PACKAGE USING QUANTUM DOT, ILLUMINATION APPARATUS AND DISPLAY APPARATUS
#8807Wire-piercing light-emitting diode lamps
#8808LED lamp
#8809Light emitting module and illumination apparatus
#8810Light emitting diode systems including optical display systems having a microdisplay
#8811Method of manufacturing mounting substrate
#8812Electromagnetic bandgap structure and printed circuit board
#8813MULTILAYER PRINTED WIRING BOARD
#8814Method of manufacturing a substrate strip with wiring
#8815Method for the miniaturizable contacting of insulated wires
#8816Method for manufacturing an oscillator device
#8817METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE BACK PROCESSING, AND RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE SHEET
#8818Through-silicon via structure and method for making the same
#8819Semiconductor device, and manufacturing method therefor
#8820Method of manufacturing semiconductor device
#8821Package for a light emitting diode and method for fabricating the same
#8822Method for producing a matrix of individual electronic components and matrix produced thereby
#8823Battery-operated wireless-communication apparatus and method
#8824Camera Module with Premolded Lens Housing and Method of Manufacture
#8825ILLUMINATING APPARATUS AND METHOD OF CONTROLLING ILLUMINATING APPARATUS
#8826Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
#8827Surface mountable device
#8828Nanostructure optoelectronic device with independently controllable junctions
#8829Touch-display crosstalk
#8830High-frequency module including a conductor with a slot therein and a conductive wire crossing over the slot and physically contacting the conductor
#8831LIGHT EMITTING DEVICE, LIGHTING SYSTEM, BACKLIGHT UNIT FOR DISPLAY DEVICE AND DISPLAY DEVICE
#8832Component having a through-contact
#8833Semiconductor Package
#8834Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
#8835Three dimensional interconnect structure and method thereof
#8836Stacked package
#8837Multi-chip package with pillar connection
#8838Semiconductor device
#8839CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD
#8840Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof
#8841Semiconductor Structure
#8842Integrated circuit apparatus, systems, and methods
#8843POWER SEMICONDUCTOR DEVICE
#8844Apparatus for thermally enhanced semiconductor package
#8845Integrated circuit package system with package stacking and method of manufacture thereof
#8846SEMICONDUCTOR DEVICE
#8847Pad configurations for an electronic package assembly
#8848Semiconductor device and production method thereof
#8849Semiconductor component and method of manufacture
#8850INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF
#8851Semiconductor module and semiconductor device
#8852Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#8853Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die
#8854Shielded stacked integrated circuit packaging system and method of manufacture thereof
#8855Integrated circuit packaging system with magnetic film and method of manufacture thereof
#8856Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure
#8857Semiconductor package with a conductive shielding member
#8858Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#8859SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#8860Semiconductor chip
#8861Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
#8862Sensor module and method for producing sensor modules
#8863Semiconductor device with stress relaxation during wire-bonding
#8864Three-dimensional semiconductor device structures and methods
#8865Semiconductor device
#8866Encapsulating sheet for optical semiconductor
#8867LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE LAMP, METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE
#8868Light emitting device having light extraction structure and method for manufacturing the same
#8869Semiconductor light emitting device
#8870Light emitting device and display
#8871Semiconductor light-receiving element and optical module
#8872AC switch having compound semiconductor MOSFETs
#8873Semiconductor device and integrated semiconductor device
#8874Nanostructure optoelectronic device having sidewall electrical contact
#8875Vacuum hermetic organic packaging carrier
#8876Method of manufacturing wiring board
#8877Light-emitting device, light emitting system including the same, and fabricating method thereof
#8878Manufacturing method of semiconductor device
#8879SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR ULTRATHIN CHIPS
#8880Semiconductor device and manufacturing method of the same
#8881Semiconductor package and method of forming the same
#8882Flip-chip GaN LED fabrication method
#8883Method of using white resin in an electronic device
#8884Light-emitting device, light-emitting system including the same, and fabricating method thereof
#8885Semiconductor wafer with electrically connected contact and test areas
#8886Integrated battery and IC
#8887Solder joints with enhanced electromigration resistance
#8888SEMICONDUCTOR DEVICE AND MICROPHONE
#8889Microphone
#88903D semiconductor device
#8891Apparatus for housing a light assembly
#8892Method for manufacturing a semiconductor component and structure therefor
#8893Grounded lid for micro-electronic assemblies
#8894Power module with current sensing
#8895Semiconductor package having a cooling fan and method of fabricating the same
#8896Light emitting device package, light source module, backlight unit, display apparatus, television set, and illumination apparatus
#8897Liquid discharge head and manufacturing method therefor
#8898Laminate constructs for micro-fluid ejection devices
#8899Reception circuit and signal reception method
#8900Inductive circuit arrangement
#8901SIGNAL TRANSMISSION SYSTEM AND SIGNAL TRANSMISSION METHOD
#8902Light emitting device
#8903Semiconductor device, substrate for producing semiconductor device and method of producing them
#8904DICING SHEET-ATTACHED FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE
#8905Microelectronic packages having cavities for receiving microelectronic elements
#8906Package stacking through rotation
#8907Semiconductor device with respective electrode pad rows and respective external electrodes electrically connected and arranged in the respective end portions of the substrate
#8908Multi-Chip Package
#8909Package systems having interposers
#8910Electronic device and method for connecting a die to a connection terminal
#8911Integrated circuit package system with embedded die superstructure and method of manufacture thereof
#8912Junction body, semiconductor module, and manufacturing method for junction body
#8913Chip package having a chip combined with a substrate via a copper pillar
#8914METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#8915Chip bump structure and method for forming the same
#8916Chip structure
#8917Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit
#8918Manufacturing method of semiconductor device, and mounting structure thereof
#8919INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF
#8920Strength of micro-bump joints
#8921Three dimensional stacked package structure
#8922Reliable metal bumps on top of I/O pads after removal of test probe marks
#8923Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
#8924SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH PROJECTING BUMPS OR BALLS
#8925LEAD FRAME, ELECTRONIC COMPONENT INCLUDING THE LEAD FRAME, AND MANUFACTURING METHOD THEREOF
#8926Method and system for forming a thin semiconductor device
#8927Integrated circuit packaging system with multiple row leads and method of manufacture thereof
#8928Semiconductor chip package including a lead frame
#8929Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
#8930Semiconductor device with substrate-side exposed device-side electrode and method of fabrication
#8931Semiconductor device and method of manufacturing the same
#8932Semiconductor module with electrical switching elements
#89333D inductor and transformer
#8934Method for manufacturing a semiconductor component that includes a common mode choke and structure
#8935Semiconductor light receiving device with an off-centered light receiving part
#8936Photodiode and photodiode array
#8937Detector module
#8938Light-emitting diode chip package body and method for manufacturing same
#8939CHIP SUBMOUNT, CHIP PACKAGE, AND FABRICATION METHOD THEREOF
#8940LED LEAD FRAME WITH WATER-REPELLENT LAYER
#8941Light emitting device and lighting apparatus
#8942LED ILLUMINATION DEVICE
#8943Light-emitting-device package and a method for producing the same
#8944LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE
#8945Light emitting device package
#8946LIGHT EMITTING DIODE PACKAGE
#8947Light emitting device, method for fabricating the light emitting device, light emitting device package, and lighting unit
#8948Improved Packaging for LED Combinations
#8949Power semiconductor device
#8950Light emitting device, light emitting device package, and lighting system
#8951Contactless IC label
#8952SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
#8953Sintering silver paste material and method for bonding semiconductor chip
#8954Wire bonding apparatus and method thereof
#8955RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
#8956Manufacturing method for semiconductor integrated device
#8957Sealing material for optical element and sealed optical element
#8958Method for fabricating chip elements provided with wire insertion grooves
#8959Method for manufacturing antenna and method for manufacturing semiconductor device
#8960METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE
#8961Method for fabricating heat dissipation package structure
#8962Semiconductor device including semiconductor elements mounted on base plate
#8963CONVEX DIE ATTACHMENT METHOD
#8964Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
#8965Method for device packaging
#8966ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#8967Optical coupler module having optical waveguide structure
#8968Optical package and related methods
#8969Wire-piercing light-emitting diode illumination assemblies
#8970Method of fabricating wiring board and method of fabricating semiconductor device
#8971CAMERA MODULE
#8972Millimetre-wave radio antenna module
#8973Semiconductor device
#8974Semiconductor module device and driving apparatus having the same
#8975Semiconductor module device and driving apparatus having the same
#8976Electrical connections for multichip modules
#8977Chip carrier
#8978Chip package and method for forming the same
#8979Method for producing chip packages, and chip package produced in this way
#8980Integrated circuit and method for fabricating the same
#8981Microelectronic assembly with joined bond elements having lowered inductance
#8982Bump structure and fabrication method thereof
#8983Substrate contact opening
#8984Integrated circuit packaging system with dual side connection and method of manufacture thereof
#8985Semiconductor apparatus and semiconductor apparatus unit
#8986Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#8987Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device
#8988Leadless package system having external contacts
#8989Leadless integrated circuit packaging system and method of manufacture thereof
#8990Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
#8991Integrated circuit packaging system with isolated pads and method of manufacture thereof
#8992Integrated circuit package system with offset stacked die
#8993Semiconductor apparatus and power supply circuit
#8994Image sensor and fabricating method thereof
#8995Semiconductor device, semiconductor unit, and power semiconductor device
#8996Method for manufacturing group III nitride semiconductor layer, method for manufacturing group III nitride semiconductor light-emitting device, and group III nitride semiconductor light-emitting device, and lamp
#8997Electronic device incorporating the white resin
#8998METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE
#8999Nitride LED with a schottky electrode penetrating a transparent electrode
#9000Thin-light emitting diode lamp, and method of manufacturing the same