Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof

Tape wiring substrate and tape package using the same

Chip package structure and package substrate

Contactless communication medium

Manufacturing method of lead frame substrate and semiconductor apparatus

Die package including multiple dies and lead orientation

Method for establishing and closing a trench of a semiconductor component

Chip package and fabrication method thereof

Semiconductor device having backside redistribution layers

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

Hot-melt sealing glass compositions and methods of making and using the same

Semiconductor device including a DC-DC converter having a metal plate

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Light emitting device, method of manufacturing light emitting device, light emitting device package, and lighting system

Light emitting diode package and method for forming the same

Wiring board for light-emitting element

Composite high reflectivity layer

Small size light emitting device and manufacturing method of the same

PACKAGE STRUCTURE OF PHOTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF

Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming

Optoelectronic component and package for an optoelectronic component

Light emitting device chip, light emitting device package

Side mountable semiconductor light emitting device packages and panels

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

Plating method, semiconductor device fabrication method and circuit board fabrication method

Contact equipment and circuit package

Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems

Encapsulant composition and method for fabricating encapsulant material

Flexible interposer for stacking semiconductor chips and connecting same to substrate

Microelectronic packages and methods therefor

Semiconductor package having buss-less substrate

Method for Fabricating Array-Molded Package-on-Package

Method of manufacturing semiconductor device

METHOD OF PACKAGING SEMICONDUCTOR DEVICE

Integrated getter area for wafer level encapsulated microelectromechanical systems

Method for forming micro-electro-mechanical system (MEMS) package

SEMICONDUCTOR LASER DEVICE

Side view surface mount LED

Power integrity circuits with EMI benefits

Integrated front-end passive equalizer and method thereof

Thermally Conductive Silicone Composition And Semiconductor Device

Method for manufacturing electronic device and electronic device

Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device

Electronic packages with fine particle wetting and non-wetting zones

Semiconductor device having elastic solder bump to prevent disconnection

PB-free solder bumps with improved mechanical properties

Semiconductor device

Die bonding a semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Wiring board, semiconductor device and method for manufacturing the same

Lead frame substrate and method of manufacturing the same, and semiconductor device

Lead frame substrate, manufacturing method thereof, and semiconductor apparatus

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof

Semiconductor chip package assembly with deflection-resistant leadfingers

Method and apparatus for directing molding compound flow and resulting semiconductor device packages

Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars

ISOLATOR AND METHOD OF MANUFACTURING THE SAME

Germanium film optical device

Semiconductor device and method of manufacturing the same

High voltage devices and methods of forming the high voltage devices

Image sensor having moisture absorption barrier layer, fabricating method thereof, and device comprising the image sensor

Method for manufacturing group III nitride semiconductor layer, method for manufacturing group III nitride semiconductor light-emitting device, and group III nitride semiconductor light-emitting device, and lamp

Method for manufacturing group III nitride semiconductor light emitting element, group III nitride semiconductor light emitting element and lamp

SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND INVERTED CAVITY IN BUMP

Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing the same

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Light emitting device and lighting system

OPTICAL SEMICONDUCTOR DEVICE

PHOSPHOR, PHOSPHOR MANUFACTURING METHOD, AND WHITE LIGHT EMITTING DEVICE

Reconfigurable radio-frequency front-end

Method for Soldering Contact Wires to Solar Cells

ELECTRICALLY-CONDUCTIVE FOAM EMI SHIELD

Flip-chip mounting method and bump formation method

Electronic device, electronic module, and methods for manufacturing the same

INTEGRATED DEVICE

MEMORY CARD AND MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS IN STACKED STRUCTURE

Curable organopolysiloxane composition and semiconductor device

Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film

Acrylic insulating adhesive

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Fabrication method of semiconductor package structure

Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip

Method of manufacturing semiconductor device

Multiple integrated circuit die package with thermal performance

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT

Flip chip package containing novel underfill materials

Semiconductor laser device, optical pickup device and semiconductor device

Semiconductor memory device having improved voltage transmission path and driving method thereof

Light emitting diode module and method for making the same

OPTOELECTRONIC DEVICE

Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof

SYSTEM-IN-PACKAGE HAVING EMBEDDED CIRCUIT BOARDS

Circuit board laminated module and electronic equipment

Semiconductor device and circuit board

Package structure

HEAT/ELECTRICITY DISCRETE METAL CORE-CHIP ON BOARD MODULE

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME, AND SENSOR DEVICE

Semiconductor device and method of manufacturing the same, and electronic apparatus

Dual-band antenna array and RF front-end for mm-wave imager and radar

VOLTAGE CONVERTER WITH INTEGRATED SCHOTTKY DEVICE AND SYSTEMS INCLUDING SAME

Semiconductor device and DC-to-DC converter

LIGHTING APPARATUS

Light emitting device, light emitting device package, and lighting system

Inductive relayed coupling circuit between substrates

Quad flat no lead (QFN) package

Dicing tape-integrated film for semiconductor back surface

Film for flip chip type semiconductor back surface

Integrated circuit packaging system having planar interconnect and method for manufacture thereof

SEMICONDUCTOR DEVICE

Circuit substrate and method

Semiconductor module

Semiconductor package and stack semiconductor package having the same

Semiconductor element and package having semiconductor element

PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS

Micro-bump structure

Semiconductor package having electrical connecting structures and fabrication method thereof

Semiconductor package

Semiconductor device and method for manufacturing the same

Semiconductor package having passive device and method for making the same

Heat sink and integrated circuit assembly using the same

Semiconductor package

PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME

RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE

Semiconductor package having chip using copper process

Self repairing IC package design

Stack package

Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs

Semiconductor device

Semiconductor package structure

INTERPOSER AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Circular shield of a circuit-substrate laminated module and electronic apparatus

Chip package

Semiconductor package and method for making the same

INTEGRATED PASSIVE DEVICE ASSEMBLY

ELECTRONIC COMPONENT

Image sensor packaging structure with black encapsulant

Image sensor packaging structure with predetermined focal length

Package structure having micro-electromechanical element and fabrication method thereof

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

Hermetic MEMS device and method for fabricating hermetic MEMS device and package structure of MEMS device

ELECTRICAL MODULE

Contacting a device with a conductor

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS

Light Emitting Device, Light Emitting Device Package And Lighting System

Light emitting device

Semiconductor package

Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof

LED module

Semiconductor light emitting device including bonding layer and semiconductor light emitting device package

Light emitting device, light emitting device package

Methods for packaging light emitting devices and related microelectronic devices

Light emitting device, light emitting device package and illumination system

Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof

Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof

Disguising test pads in a semiconductor package

Bonding apparatus

Dual substrate MEMS plate switch and method of manufacture

Multilayer wiring board having lands with tapered side surfaces

Circuit board and its wire bonding structure

Manufacturing method of semiconductor device

Overcoming laminate warpage and misalignment in flip-chip packages

Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts

Exposed mold

Method of manufacturing semiconductor device

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Method for manufacturing chips

Light emitting device and method of manufacture

Fabrication method for semiconductor device

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION

Power converter

Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit

Encapsulant profile for light emitting diodes

Light-emitting device, light source and method of manufacturing the same

LIGHT-EMITTING DEVICE

Light source for lighting

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

Base plate for use in a multi-chip module

Systems employing a stacked semiconductor package

Power converter

Surface mount spark gap

Lens array, light emitting diode head, exposure device, image forming apparatus, and image reading apparatus

Apparatus and method for embedding components in small-form-factor, system-on-packages

Integrated circuit with inductive bond wires

Radio frequency amplifier with effective decoupling

Temperature controlled attenuator

Temperature compensation attenuator

Variable attenuator having stacked transistors

High CRI adjustable color temperature lighting devices

Systems and methods for integrating LED displays and LED display controllers

Spherical light output LED lens and heat sink stem system

SEMICONDUCTOR DEVICE, AND RESIN COMPOSITION USED FOR SEMICONDUCTOR DEVICE

Microelectronic assembly with joined bond elements having lowered inductance

METALLIZATION LAYER STRUCTURE FOR FLIP CHIP PACKAGE

Hybrid integrated circuit device

Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process

Wafer level surface passivation of stackable integrated circuit chips

Semiconductor apparatus having a high-aspect penetrating electrode and manufacturing method thereof

Metal plugged substrates with no adhesive between metal and polyimide

Multiple surface finishes for microelectronic package substrates

Contact-based encapsulation

Lead frame land grid array with routing connector trace under unit

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE

Semiconductor device and method for fabricating the same

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Pre-soldered leadless package

Structures and methods to reduce maximum current density in a solder ball

Apparatus and method for embedding components in small-form-factor, system-on-packages

Window ball grid array (BGA) semiconductor packages

Integrated circuit package with embedded components

Semiconductor chip device with solder diffusion protection

Stackable circuit structures and methods of fabrication thereof

METHOD FOR STACKING DIE IN THIN, SMALL-OUTLINE PACKAGE

Module for Use in a Multi Package Assembly and a Method of Making the Module and the Multi Package Assembly

Integrated circuit packaging system with embedded interconnect and method of manufacture thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Leadframe circuit and method therefor

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit package system employing device stacking

Semiconductor device and manufacturing method of the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Package for light emitting device

Light emitting device and method of manufacture

Light emitting diode package and method of fabricating the same

Light emitting device

Light emitting device

Light emitting device

Light emitting device, light emitting device package and lighting system

Semiconductor device and manufacturing method thereof

Display device utilizing conductive adhesive to electrically connect IC substrate to non-display region and manufacturing method of the same

SEMICONDUCTOR LIGHT EMITTING DEVICE COMPRISING HIGH PERFORMANCE RESINS

Detection device, photodiode array, and method for manufacturing the same

Light emitting device, light emitting device package, method of manufacturing light emitting device and lighting system

Solder in cavity interconnection technology

Structure, electronic device, and method for fabricating a structure

Method for surface treatment of copper and copper

Boron nitride agglomerated powder and devices comprising the powder

Printed wiring board and method for manufacturing printed wiring board

Glass core substrate for integrated circuit devices and methods of making the same

GROUP III NITRIDE CRYSTAL AND METHOD FOR SURFACE TREATMENT THEREOF, GROUP III NITRIDE STACK AND MANUFACTURING METHOD THEREOF, AND GROUP III NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method and apparatus for pass/fail determination of bonding and bonding apparatus

Flow sensors having nanoscale coating for corrosion resistance

Matching circuit, wiring board, and transmitter, receiver, transceiver, and radar apparatus that have the matching circuit

Semiconductor device and communication method

Luminescence conversion LED

Packaging conductive structure and method for manufacturing the same

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

Semiconductor connection component

Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates

Semiconductor package with a support structure and fabrication method thereof

Optical module with enhanced robustness of temperature controlling device

Memory module and memory system

Illumination Device for Backlighting a Display, and a Display Comprising such an Illumination Device

External storage device and method of manufacturing external storage device

Integrated circuit and assembly therewith

ELECTROSTATIC PROTECTION DEVICE AND ELECTRONIC APPARATUS EQUIPPED THEREWITH

Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modules

Transition between a laminated PCB and a waveguide through a cavity in the laminated PCB

Impedance matching between a bare-die integrated circuit and a transmission line on a laminated PCB

DETECTION CIRCUITRY FOR DETECTING BONDING CONDITIONS ON BOND PADS

Lighting device with shaped remote phosphor

Single multi-facet light source LED bracket

Light emitting device and manufacturing method therefor

Resin composition for encapsulating optical semiconductor element and optical semiconductor device

Integrated circuit packaging system with bond wire pads and method of manufacture thereof

Multilayer wiring substrate mounted with electronic component and method for manufacturing the same

Semiconductor device having a microcomputer chip mounted over a memory chip

Integrated circuit packaging system with a stackable package and method of manufacture thereof

Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same

Semiconductor devices including voltage switchable materials for over-voltage protection

Ball grid array package enhanced with a thermal and electrical connector

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Semiconductor mounting substrate and method for manufacturing the same

Semiconductor device and method for manufacturing the same

High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same

Semiconductor device and manufacturing method thereof

Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps

Integrated circuit packaging system with interconnect and method of manufacture thereof

Chip assembly with chip-scale packaging

Integrated circuit packaging system with stacking interconnect and method of manufacture thereof

Integrated circuit packaging system with package stacking and method of manufacture thereof

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor die package including IC driver and bridge

Panel based lead frame packaging method and device

DAP GROUND BOND ENHANCEMENT

Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Leadframe for semiconductor package

Semiconductor device and manufacturing method thereof

Integrated circuit packaging system with shielded package and method of manufacture thereof

Flow sensor, method for manufacturing flow sensor and flow sensor module