212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
#9902Light emitting device and light emitting device package
#9903Light emitting diode package and light unit having the same
#9904Light emitting device package including light emitting diode, and lighting system having the same
#9905Light emitting device, light emitting device package, and lighting system
#9906High-reflection submount for light-emitting diode package and fabrication method thereof
#9907LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE
#9908Light emitting device package and lighting system
#9909Light emitting device package and lighting system
#9910Light emitting device, method of manufacturing the same, light emitting device package and lighting system
#9911Light emitting diode with metal piles and multi-passivation layers and its manufacturing method
#9912MULTI-CHIP LED PACKAGE
#9913Light emitting device, light emitting device package, method of manufacturing light emitting device and lighting system
#9914Light emitting device, having protrusions from a conductive support member, lighting emitting device package, and lighting system
#9915III-nitride power device with solderable front metal
#9916Semiconductor chip with a bonding pad having contact and test areas
#9917Nitride semiconductor element and method for production thereof
#9918Light-emitting element with improved light extraction efficiency, light-emitting device including the same, and methods of fabricating light-emitting element and light-emitting device
#9919Light emitting device and light emitting device package
#9920Light emitting device, light emitting device package and lighting system having the same
#9921Light emitting device and method of manufacturing the same
#9922METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD
#9923METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#9924Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
#9925FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING
#9926APPARATUS AND METHOD FOR EVALUATING OPTICAL PROPERTIES OF LED AND METHOD FOR MANUFACTURING LED DEVICE
#9927Semiconductor device and a method of manufacturing the same
#9928Rule-based semiconductor die stacking and bonding within a multi-die package
#9929Semiconductor device and semiconductor module
#9930Memory dies, stacked memories, memory devices and methods
#9931Light emitting device, method for manufacturing the same, and backlight unit
#9932Embedded component substrate and manufacturing methods thereof
#9933Polymer matrices for polymer solder hybrid materials
#9934Socket, and test apparatus and method using the socket
#9935Current sensor including a sintered metal layer
#9936ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE
#9937Unique Package Structure
#9938Bonded structure with enhanced adhesion strength
#9939Semiconductor element and display device provided with the same
#9940Method for making semiconductor package
#9941Conductive pillar structure for semiconductor substrate and method of manufacture
#9942Electronic device package and method for fabricating the same
#9943Lead free solder interconnections for integrated circuits
#9944Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#9945SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE
#9946Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus
#9947Pillar structure having a non-planar surface for semiconductor devices
#9948Semiconductor device and semiconductor assembly with lead-free solder
#9949Solder interconnect with non-wettable sidewall pillars and methods of manufacture
#9950Manufacturing of a device including a semiconductor chip
#9951SEMICONDUCTOR PACKAGE
#9952Semiconductor package having improved heat spreading performance
#9953Stacked semiconductor package
#9954Systems and Methods Providing Arrangements of Vias
#9955Surface Preparation of Die for Improved Bonding Strength
#9956Semiconductor package
#9957Semiconductor package of a flipped MOSFET and its manufacturing method
#9958LEAD FRAME FOR SEMICONDUCTOR DIE
#9959Semiconductor device packages having stacking functionality and including interposer
#9960SEMICONDUCTOR DEVICE
#9961Electromigration immune through-substrate vias
#9962Stacked-die electronics package with planar and three-dimensional inductor elements
#9963Micromechanical system and method for manufacturing a micromechanical system
#9964Light emitting apparatus and lighting system
#9965LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE HAVING THE SAME
#9966Light emitting device and manufacturing method thereof
#9967Light emitting device and light emitting device package having the same
#9968Light emitting device and light emitting device package having the same
#9969LED module
#9970Multi-light emitting diode package
#9971Light-mixing type LED package structure for increasing color render index
#9972Light emitting device and light emitting device package
#9973Light emitting device and light emitting device package having the same
#9974Vertical LED chip package on TSV carrier
#9975Micro-fluidic injection molded solder (IMS)
#9976WIREBONDING PROCESS
#9977Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
#9978Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof
#9979Method to form solder deposits on substrates
#9980Semiconductor device
#9981Method of manufacturing layered chip package
#9982LED CHIP PACKAGE STRUCTURE IN ORDER TO PREVENT THE LIGHT-EMITTING EFFICIENCY OF FLUORESCENT POWDER FROM DECREASING DUE TO HIGH TEMPERATURE AND METHOD FOR MAKING THE SAME
#9983FLEXIBLE OPTOELECTRONIC INTERCONNECTION MODULE AND METHOD OF MANUFACTURING THE SAME
#9984Semiconductor light emitting device, composite light emitting device with arrangement of semiconductor light emitting devices, and planar light source using composite light emitting device
#9985Thermally conductive silicone composition and electronic device
#9986Pin module and chip on board type use device
#9987Electric component assembly
#9988SEMICONDUCTOR DEVICE
#9989Semiconductor device
#9990Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
#9991Interconnection tape providing a serial electrode pad connection in a semiconductor device
#9992Edge connect wafer level stacking
#9993Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material
#9994Power semiconductor device
#9995Integrated circuits having TSVs including metal gettering dielectric liners
#9996Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
#9997Multi-chip semiconductor device
#9998Solder bump interconnect
#9999Integrated circuit packaging system having dual sided connection and method of manufacture thereof
#10000Semiconductor module and portable apparatus provided with semiconductor module
#10001Recessed semiconductor substrates and associated techniques
#10002Protruding TSV tips for enhanced heat dissipation for IC devices
#10003Stress buffer structures in a mounting structure of a semiconductor device
#10004T-shaped post for semiconductor devices
#10005Package for housing semiconductor element and semiconductor device using the same
#10006Wireless Element With Antenna Formed On A Thin Film Substrate For Embedding into Semiconductor packages
#10007STACK PACKAGE
#10008Method of manufacturing a semiconductor device
#10009SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#10010High frequency flip chip package structure of polymer substrate
#10011Component stacking using pre-formed adhesive films
#10012GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME
#10013Semiconductor device and method of manufacturing the same
#10014TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
#10015Photoreceiving device
#10016MEMS package and method for the production thereof
#10017LED package and method for manufacturing same
#10018LED package
#10019LED package, method for manufacturing LED package, and packing member for LED package
#10020Semiconductor package structure
#10021LIGHT EMITTING DEVICE
#10022Semiconductor light emitting device package
#10023LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM
#10024Semiconductor lighting module package
#10025LED package and method for manufacturing the same
#10026LED assembly with a protective frame
#10027Light emitting device, light emitting device package, and light system
#10028Light emitting device including a plurality of GaN-based reflective layers
#10029LED housing system
#10030LED package
#10031White Light Apparatus and Method
#10032Light emitting device packages, systems and methods
#10033LED package structure housing a LED and a protective zener diode in respective cavities
#10034LED PACKAGE
#10035Arrangement having at least two light-emitting semiconductor components and method for the production of such an arrangement
#10036Wide angle oval light emitting diode package
#10037NITRIDE-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING NITRIDE-BASED SEMICONDUCTOR LIGHT EMITTING DEVICE, AND LIGHT EMITTING APPARATUS
#10038Light emitting device, light emitting device package, and lighting system
#10039Method and system for hermetically sealing packages for optics
#10040Light Emitting Device, Light Emitting Device Package
#10041Light emitting device having a lateral passivation layer
#10042Thermally stable oxynitride phosphor and light source comprising such a phosphor
#10043Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device
#10044Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same
#10045Electronic device and manufacturing method of the same
#10046Method of manufacturing a semiconductor device
#10047Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole
#10048Stress buffer layer for ferroelectric random access memory
#10049Array-molded package-on-package having redistribution lines
#10050Dual carrier for joining IC die or wafers to TSV wafers
#10051PACKAGE FOR SYNCHRONOUS RECTIFIER MODULE
#10052Optoelectronic device
#10053Illumination device with semiconductor light-emitting elements
#10054PHOSPHOR, PRODUCTION METHOD OF PHOSPHOR, PHOSPHOR-CONTAINING COMPOSITION, AND LIGHT EMITTING DEVICE
#10055LIGHT SOURCE MODULE
#10056ELECTRONIC CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
#10057High frequency semiconductor device
#10058SEMICONDUCTOR DEVICE AND POWER SUPPLY UNIT USING THE SAME
#10059TOP VIEW LIGHT EMITTING DEVICE PACKAGE AND FABRICATION METHOD THEREOF
#10060Light emitting device, and lighting system, image display using the same
#10061Interconnection structure
#10062Interconnection structure and its design method
#10063Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same
#10064ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
#10065Stacked package of semiconductor device
#10066Semiconductor device structures and electronic devices including same hybrid conductive vias
#10067Integrated circuit packaging system with conductive pillars and method of manufacture thereof
#10068Semiconductor device
#10069SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
#10070Etched recess package on package system
#10071Microelectromechanical systems embedded in a substrate
#10072MEMS MODULE PACKAGE
#10073Co-axial restraint for connectors within flip-chip packages
#10074Multi-tiered integrated circuit package
#10075Multi-chip package having frame interposer
#10076Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof
#10077Method of stacking flip-chip on wire-bonded chip
#10078Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
#10079Semiconductor device
#10080SEMICONDUCTOR DEVICE
#10081Method for encapsulating an MEMS component
#10082NON-DIRECT BOND COPPER ISOLATED LATERAL WIDE BAND GAP SEMICONDUCTOR DEVICE
#10083Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#10084LED package having a lead frame
#10085Nickel tin bonding system with barrier layer for semiconductor wafers and devices
#10086Electronic light emitting device and method for fabricating the same
#10087Light emitting device having vertical structure, package thereof and method for manufacturing the same
#10088Light emitting diode (LED) and method of manufacture
#10089Optoelectronic component
#10090LIGHT-EMITTING ARRANGEMENT
#10091Wireless chip and electronic device having wireless chip
#10092Semiconductor device module
#10093Method of making a mounted gallium nitride device
#10094Solid state light emitting device
#10095Phosphor, phosphor manufacturing method, and white light emitting device
#10096Method of manufacturing semiconductor device and wire bonding apparatus
#10097ELECTRONIC COMPONENT PACKAGE, METHOD FOR PRODUCING THE SAME AND INTERPOSER
#10098Sensor element and carrier element for manufacturing a sensor
#10099Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP
#10100PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR, AND PORTABLE DEVICE
#10101Stable Gold Bump Solder Connections
#10102Method of forming a semiconductor die
#10103Method for manufacturing semiconductor device
#10104Semiconductor device
#10105Fabrication method of package structure having MEMS element
#10106Light emitting device and method for manufacturing the same
#10107Optical device and method of manufacturing the same
#10108Chip packaging with metal frame pin grid array
#10109Silicone Leaded Chip Carrier
#10110SEMICONDUCTOR MEMORY DEVICE
#10111Signal transmission arrangement
#10112METHOD TO PRODUCE HOMOGENEOUS LIGHT OUTPUT BY SHAPING THE LIGHT CONVERSION MATERIAL IN MULTICHIP MODULE
#10113Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
#10114Stacked semiconductor package
#10115Backlight unit and display device using the same
#10116Red phosphor, method for producing red phosphor, white light source, illuminating device, and liquid crystal display device
#10117Signal isolators using micro-transformers
#10118Method for producing a speed sensor element
#10119LIGHTING APPARATUS
#10120Lighting device
#10121Oxynitride fluorescent material and light-emitting device
#10122LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME
#10123LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME
#10124Control apparatus-integrated dynamoelectric machine
#10125Method of forming a semiconductor die
#10126Semiconductor device and manufacturing method thereof
#10127Chip module
#10128Semiconductor device and a method of manufacturing the same
#10129Semiconductor integrated circuit
#10130Semiconductor device
#10131Post passivation interconnection schemes on top of the IC chips
#10132Bonded structure and manufacturing method for bonded structure
#10133Stacked semiconductor components having conductive interconnects
#10134SEMICONDUCTOR PACKAGE
#10135Semiconductor device having conductive pads and a method of manufacturing the same
#10136PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE
#10137Semiconductor packages including die and L-shaped lead and method of manufacture
#10138Integrated void fill for through silicon via
#101393D chip stack having encapsulated chip-in-chip
#10140Semiconductor device and manufacturing method thereof
#10141Dual die semiconductor package
#10142EMI shielding package structure and method for fabricating the same
#10143Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
#10144Package structure having MEMS element
#10145Infrared Sensor
#10146Semiconductor light emitting device with integrated electronic components
#10147Semiconductor chip assembly with post/base heat spreader and plated through-hole
#10148Circuit Board For LED
#10149Package structure and LED package structure
#10150LED package and fabrication method thereof
#10151Light emitting device having a plurality of light emitting cells and package mounting the same
#10152LED package having an array of light emitting cells coupled in series
#10153Light emitting device
#10154Light emitting device, light emitting device package, and lighting system
#10155Light emitting device, method of manufacturing the same, and light emitting device package
#10156Light emitting device package and light unit having the same
#10157Light emitting device, light emitting device package and illumination system for reducing dislocation in semiconductor layer
#10158LIGHT EMITTING APPARATUS AND LIGHTING SYSTEM
#10159Coated light emitting device and method for coating thereof
#10160Infrared sensor
#10161Light-emitting-diode chip comprising a sequence of GaN-based epitaxial layers which emit radiation and a method for producing the same
#10162Light emitting device, method of manufacturing the same, light emitting device package and lighting system
#10163Thermopile infrared sensor by monolithic silicon micromachining
#10164Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#10165ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#10166Arrangement for energy conditioning
#10167Module having a plurality of thermoelectric elements
#10168Method for producing a housing part for a semiconductor module
#10169Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump
#10170SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#10171Semiconductor device manufacturing method
#10172Method of manufacturing semiconductor device
#10173Method of manufacturing light-emitting device with fluorescent layer
#10174OPTICAL MODULE AND MANUFACTURING METHOD OF THE MODULE
#10175Circuit substrate and display device
#101764D device process and structure
#10177System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#10178System and method for integrated inductor
#10179High frequency amplifier
#10180Electronic devices and components for high efficiency power circuits
#10181Laser optical path detection
#10182Semiconductor device and power source device
#10183Modular LED light bulb
#10184Nitride phosphor, method of preparing the same, and white light-emitting device using the same
#10185MOLDING APPARATUS AND MOLDING METHOD
#10186WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCOTOR PACKAGE HAVING THE WIRING SUBSTRATE
#10187Dual Interconnection in Stacked Memory and Controller Module
#10188Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas
#10189Through-silicon via formed with a post passivation interconnect structure
#10190Grid array connection device and method
#10191Semiconductor device sealed in a resin section and method for manufacturing the same
#10192SEMICONDUCTOR DEVICE
#10193Attaching passive components to a semiconductor package
#10194Integrated Circuit Module and Multichip Circuit Module Comprising an Integrated Circuit Module of This Type
#10195Semiconductor device
#10196REAL TIME MONITORING OF INDIUM BUMP REFLOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY
#10197Semiconductor package and manufacturing method thereof and encapsulating method thereof
#10198Microelectronic devices
#10199Semiconductor package
#10200Semiconductor package with single sided substrate design and manufacturing methods thereof