Light emitting device comprising an electrode with perforation pattern

EDGE LED PACKAGE

UV- and heat-resistant optoelectronic semiconductor component

Light emitting device, light emitting device package and lighting system

LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM

LED PACKAGE AND METHOD FOR FABRICATING THE SAME

Housing for high-power LEDs

Vertical light emitting diode having an outwardly disposed electrode

Optocoupler devices

SMALL TYPE PHOTO-INTERRUPTER AND FABRICATION METHOD THEREOF

Smart card module with flip-chip-mounted semiconductor chip

Method of making substrate package with through holes for high speed I/O flex cable

Packaging device and base member for packaging

Semiconductor device

Semiconductor devices having redistribution structures and packages, and methods of forming the same

Dicing/die bonding film

Method of manufacturing a semiconductor device having a heat spreader

Packaged microdevices and methods for manufacturing packaged microdevices

Method of making a semiconductor chip assembly with a post/base/post heat spreader

Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer

Method and leadframe for packaging integrated circuits

Semiconductor memory device and manufacturing method thereof

GALLIUM NITRIDE BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE HAVING HIGH EMISSION EFFICIENCY AND METHOD OF MANUFACTURING THE SAME

Light emitting device including a sealing portion, and method of making the same

Method for making microstructures by converting porous silicon into porous metal or ceramics

Bonding structure of bonding wire

INTEGRATED ACOUSTIC HORN AND LEAD FRAME

LIGHT EMITTING APPARATUS AND DISPLAY APPARATUS HAVING THE SAME

ILLUMINATION ELEMENT HAVING A PLASTIC SUPPORT

LIGHT EMITTING DIODE PACKAGING METHOD WITH HIGH LIGHT EXTRACTION AND HEAT DISSIPATION USING A TRANSPARENT VERTICAL STAND STRUCTURE

Light emitting apparatus and light unit having the same

WHITE LED DEVICE

Package substrate, semiconductor package having the package substrate

Packages and Methods for Mitigating Plating Stub Effects

Lead pin and wiring substrate with lead pin, and method of manufacturing the same

Power semiconductor module

Indium compositions

Carbon nanotube-based structures and methods for removing heat from solid-state devices

Semiconductor light emitting device and backlight source, backlight source system, display device and electronic device using the same

Semiconductor device, manufacturing method thereof, and electronic apparatus

Inductor and electric power supply using it

Semiconductor apparatus and chip selection method thereof

Semiconductor apparatus and chip selection method thereof

Power semiconductor module and method for operating a power semiconductor module

Semiconductor device and power supply device

Light emitting apparatus, method for driving the light emitting apparatus, and display apparatus including the light emitting apparatus

Integrated circuit packaging system with core region and bond pad and method of manufacture thereof

Semiconductor device and method for manufacturing the same

Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Integrated chip carrier with compliant interconnects

Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Integrated (multilayer) circuits and process of producing the same

THERMO-MECHANICAL STRESS IN SEMICONDUCTOR WAFERS

Mechanisms for forming copper pillar bumps

Copper bump joint structures with improved crack resistance

PILLAR BUMP WITH BARRIER LAYER

Post passivation interconnect with oxidation prevention layer

Semiconductor die contact structure and method

Robust joint structure for flip-chip bonding

Semiconductor device and method of forming column interconnect structure to reduce wafer stress

Molded semiconductor package having a filler material

Microelectronic package and method of manufacturing same

Power module assembly with reduced inductance

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Power semiconductor package

Wafer integrated with permanent carrier and method therefor

SEMICONDUCTOR DEVICE AND ARRANGEMENT METHOD THEREOF

Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor

Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate

Crack resistant circuit under pad structure and method of manufacturing the same

METHOD FOR PROTECTING ENCAPSULATED SENSOR STRUCTURES USING STACK PACKAGING

Package configurations for low EMI circuits

Semiconductor chip assembly with post/base/post heat spreader

LED Lamp Package with Integral Driver

Semiconductor light-emiting device and method

Light-emitting diode package

Solid element device and method for manufacturing the same

LIGHT EMITTING DIODE PACKAGE HAVING LENS

Ultra high thermal performance packaging for optoelectronics devices

PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME

Group III nitride semiconductor device and method for manufacturing the same, group III nitride semiconductor light-emitting device and method for manufacturing the same, and lamp

MULTICHIP TYPE LED PACKAGE STRUCTURE FOR GENERATING LIGHT-EMITTING EFFECT SIMILAR TO CIRCLE SHAPE BY SINGLE WIRE OR DUAL WIRE BONDING METHOD ALTERNATIVELY

Light emitting device and image display device

Packaged semiconductor light emitting devices having multiple optical elements

Light-emitting device, method of manufacturing light-emitting device, and illumination device

Semiconductor component with optically active regions which provides high optical output power, and method for producing same

LED module with an LED semiconductor chip mounted on a silicon platform

Semiconductor package, method of evaluating same, and method of manufacturing same

Light emitting device including second conductive type semiconductor layer and method of manufacturing the light emitting device

Card-shaped data carrier

Automatic wire feeding method for wire bonders

Multilayer printed wiring board

Device mounting board and semiconductor module

Substrate anchor structure and method

SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES

Curable polysiloxane composition, and polysiloxane cured product, optical member, member for aerospace industry, semiconductor light-emitting device, illuminating device and image display device using the same

Method of manufacturing integrated circuit having stress tuning layer

Method of manufacturing the semiconductor device

Semiconductor device

Method of manufacturing semiconductor device and method of manufacturing electronic device

Via forming method and method of manufacturing multi-chip package using the same

Method of fabricating a package structure

Manufacturing method for semiconductor integrated device

Method for connecting a die assembly to a substrate in an integrated circuit

Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same

Method and apparatus for integrated-circuit battery devices

Apparatuses and methods for fabricating semiconductor packages

Optical signaling for a package-on-package stack

Nitride semiconductor laser device and method of manufacturing the same

Phosphor, method for preparing and using the same, light emitting device package, surface light source apparatus and lighting apparatus using red phosphor

Semiconductor device

High efficiency module

Microelectronic thermal interface

IMAGE SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Galvanic isolators and coil transducers

Microelectronic assemblies having compliant layers

Semiconductor package including flip chip controller at bottom of die stack

Integrated circuit package system with through semiconductor vias and method of manufacture thereof

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Thermo-compression bonded electrical interconnect structure

Hybrid package

Ball grid array substrate with insulating layer and semiconductor chip package

Semiconductor device mounted structure and its manufacturing method

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package and method for fabricating the same

Routing layer for mitigating stress in a semiconductor die

Method and apparatus for semiconductor device fabrication using a reconstituted wafer

Semiconductor device

Wirebond-less semiconductor package

Method of attaching an interconnection plate to a semiconductor die within a leadframe package

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Lead frame and intermediate product of semiconductor device

Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV

Semiconductor sensor for detecting a light radiation

Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same

Semiconductor chip, stack module, and memory card

Light emitting device, light emitting device package, and lighting system

Group-III nitride semiconductor light-emitting device, method for manufacturing the same, and lamp

Optical semiconductor device, method for manufacturing optical semiconductor device, and method for manufacturing optical semiconductor apparatus

Light emitting device package

Light emitting device, light emitting device package, and lighting system

Light emitting device and light emitting device package

Light emitting device package and lighting system

LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE

LIGHT EMITTING APPARATUS

Light emitting device, light emitting device package, and lighting system including the same

LED package structure

PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

Light emitting device, light emitting device package and lighting system

Light emitting device including an electrode on a textured surface, light emitting device package and lighting system

Nitride semiconductor light emitting device

Light emitting device and light emitting device package for improving a light emission efficency

HEAT-CONDUCTIVE NOISE SUPPRESSION SHEET

Method of making a connection component with hollow inserts

Bumping Electronic Components Using Transfer Substrates

Preventing UBM oxidation in bump formation processes

Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer

Method of manufacturing a lead frame with a nickel coating

INTEGRATED CIRCUIT PACKAGE HAVING A CASTELLATED HEATSPREADER

Fluorination pre-treatment of heat spreader attachment indium thermal interface material

IC card and booking-account system using the IC card

Stacked semiconductor package and method for manufacturing the same

Package structure of photodiode and forming method thereof

Semiconductor device fabrication method including formation of columnar electrodes having protrusion sections

Method for manufacturing package system incorporating flip-chip assembly

Package, in particular for MEMS devices and method of making same

Phosphor layer arrangement for use with light emitting diodes

Method for fabricating a light emitting diode package structure

Method for manufacturing and testing an integrated electronic circuit

Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device

Method and apparatus providing fine alignment of a structure relative to a support

Light emitting apparatus and lighting system

Semiconductor light emitting apparatus and light source apparatus using the same

Light source

Semiconductor light-emitting apparatus

Light emitting device, method of manufacturing the same, light emitting device package, and illumination system

Multiple Positioned Light Source to Achieve Uniform or Graded Illumination

Printed wiring board with built-in semiconductor element, and process for producing the same

PACKAGE STRUCTURE

Quantum infrared sensor and quantum infrared gas concentration meter using the same

Semiconductor integrated circuit device

Configuration context switcher

LIGHT-EMITTING DEVICE

Light emitting diode apparatus and manufacturing method thereof

Light-emitting apparatus and luminaire

Method and structure for bonding flip chip

MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Power semiconductor device and manufacturing method therefor

Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates

Semiconductor device and electronic apparatus equipped with the semiconductor device

Adhesive on wire stacked semiconductor package

Method for manufacturing a package-on-package type semiconductor device

SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE

Semiconductor package and method of manufacturing the same

Non-uniform alignment of wafer bumps with substrate solders

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF

Area reduction for die-scale surface mount package chips

Leadframe packages having enhanced ground-bond reliability

Area reduction for surface mount package chips

Integrated circuit packaging system with cavity and method of manufacture thereof

STACK-TYPE SOLID-STATE DRIVE

Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof

SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

Methods and devices for manufacturing cantilever leads in a semiconductor package

Multiple leadframe package

Apparatus and method configured to lower thermal stresses

PACKAGE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE

Area reduction for electrical diode chips

Area reduction for electrical diode chips

Semiconductor die with integrated electro-static discharge device

Semiconductor Device

Open cavity leadless surface mountable package for high power RF applications

Chip Lead Frame and Photoelectric Energy Transducing Module

METHOD FOR MANUFACTURING A SENSOR COMPONENT WITHOUT PASSIVATION, AND A SENSOR COMPONENT

Semiconductor chip assembly with post/base heat spreader with ESD protection layer

Light emitting diode package and method of fabricating the same

Light source

LED package structure and manufacturing process thereof

Light emitting diode assembly

Semiconductor light emitting devices with applied wavelength conversion materials and methods for forming the same

Optical designs for high-efficacy white-light emitting diodes

Light emitting apparatus

Semiconductor light-emitting device and method for fabricating the same

Semiconductor light-emitting device and method for fabricating the same

Semiconductor light-emitting device and method for fabricating the same

LIGHT EMITTING DIODE PACKAGE STRUCTURE

Single Encapsulant For A Plurality Of Light Sources

Packaging Structure of AC light-emitting diodes

MULTICHIP TYPE LED PACKAGE STRUCTURE FOR GENERATING LIGHT-EMITTING EFFECT SIMILAR TO CIRCLE SHAPE

Device having a plurality of light emitting structures bonded by adhesive layers and light emitting device package having the same

LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM

LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM

Pressure sensor and use thereof in a fluid tank

METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF

ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS

Back-illuminated type solid-state imaging device

Semiconductor device

Light emitting device, surface light source, liquid crystal display device, and method for manufacturing light emitting device

Illumination device

HYBRID CHIP-ON-HEATSINK DEVICE AND METHODS

THERMOSETTING DIE-BONDING FILM

Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate

Semiconductor element mounting board

THERMOSETTING DIE-BONDING FILM

SYSTEM AND METHOD FOR PREVENTING METAL CORROSION ON BOND PADS

STACKING SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Package-on-package system with via z-interconnections and method for manufacturing thereof

Semiconductor device and manufacturing method thereof

Electrical connection for multichip modules

Semiconductor structure, pad structure and protection structure

Reducing Device Mismatch by Adjusting Titanium Formation

Chip design with robust corner bumps

Semiconductor device

Designs and methods for conductive bumps

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device and information processing system including the same

Semiconductor device and method for manufacturing the same

Chip package and fabrication method thereof

Chip having a metal pillar structure

Semiconductor packages having passive elements mounted thereonto

Semiconductor package with integrated interference shielding and method of manufacture thereof

SYSTEM FOR SEPARATING A DICED SEMICONDUCTOR DIE FROM A DIE ATTACH TAPE

SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME

Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof

PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING SAME

Semiconductor package and process for fabricating same

Device including a semiconductor chip and a carrier and fabrication method

Overmolded semiconductor package with a wirebond cage for EMI shielding

Through silicon via (TSV) wire bond architecture

Back-illuminated type solid-state imaging device

Back-illuminated type solid-state imaging device

Solid state image capture device and method for manufacturing same

Semiconductor device

Back-illuminated type solid-state imaging device

Semiconductor device and structure

Method for producing group III nitride semiconductor light-emitting device, group III nitride semiconductor light-emitting device, and lamp

Wavelength converted light emitting diode with reduced emission of unconverted light

Package-integrated thin film LED

Light emitting diode device, light emitting apparatus and method of manufacturing light emitting diode device

Light emitting diode (LED) light source and manufacturing method for the same

Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product

Light Emitting Diode and Manufacturing Method Thereof

High voltage wire bond free LEDS

ARRAYS OF LIGHT EMITTING DEVICES

Phosphor and manufacturing method therefore, and light emission device using the phosphor

Illumination system comprising a radiation source and a fluorescent material

Method for realizing a dual interface IC card

OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing a semiconductor device having vertical MOSFET

Surface modification for handling wafer thinning process

Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

Circuit board interconnection system, connector assembly, circuit board and method for manufacturing a circuit board