INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD

Interposer mounted wiring board and electronic component device

Drive circuit for switching device

White-light emitting device and preparation method and application of the same

Semiconductor integrated circuit and multi-chip module

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same

Vertically stackable dies having chip identifier structures

Integrated circuit with protective structure

Electronic assemblies including mechanically secured protruding bonding conductor joints

Connection for off-chip electrostatic discharge protection

Semiconductor device having a copper plug

PRE-PACKAGED STRUCTURE

Die stacking system and method

Semiconductor device

SEMICONDUCTOR DEVICE

Wafers including patterned back side layers thereon

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit chip and flip chip package having the integrated circuit chip

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

Bump structure, chip package structure including the same and method of manufacturing the same

Chip package and fabrication method thereof

Integrated circuit package system for stackable devices and method for manufacturing thereof

Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure

Integrated circuit packaging system with protective coating and method of manufacture thereof

Lead frame and method of manufacturing the same

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with shaped lead and method of manufacture thereof

Method of manufacturing a semiconductor component and structure

Semiconductor device

Light emitting device and method for manufacturing the same

Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump

Light emitting diode

Light-emitting diode structure

Polarized light emitting diode device and method for manufacturing the same

Carrying structure of semiconductor

Light emitter

Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation

Light emitting apparatus

Method and apparatus for manufacturing stacked-type semiconductor device

Multi-chip module for battery power control

Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings

Self locking and aligning clip structure for semiconductor die package

Low cost lead-free preplated leadframe having improved adhesion and solderability

Molded leadframe substrate semiconductor package

POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME

Wafer-level stack package

Manufacturing method of semiconductor device

Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package

Maintaining integrity of preloaded content in non-volatile memory during surface mounting

Power semiconductor module and method for operating a power semiconductor module

LED LIGHT SOURCE AND VEHICLE LIGHT

Pad layout structure of driver IC chip

Wiring board, semiconductor device, and method of manufacturing the same

Electronic component, board unit, and information-processing device

Component mounting structures for electronic devices

LOCAL INTEGRATION OF NON-LINEAR SHEET I INTEGRATED CIRCUIT PACKAGES FOR ESD/EOS PROTECTION

Electronic device

Semiconductor device and semiconductor memory tester

Stacked semiconductor device and method of connection test in the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die

ELECTRONIC DEVICE

Circuit board with oval micro via

SEMICONDUCTOR DEVICE

Method for manufacturing a semiconductor component

Semiconductor device with interface peeling preventing rewiring layer

Back side metallization with superior adhesion in high-performance semiconductor devices

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Flip chip interconnection with double post

Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

Semiconductor module, method of manufacturing semiconductor module, and mobile device

Semiconductor device and method of forming bump-on-lead interconnection

Apparatus and methods of forming an interconnect between a workpiece and substrate

Semiconductor device and method of forming flipchip interconnect structure

DEVICE MOUNTING BOARD, AND SEMICONDUCTOR MODULE

Semiconductor device with copper wire having different width portions

Semiconductor device and method of manufacturing the same

Semiconductor device with overlapped lead terminals

STACKED SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

Substrate with built-in semiconductor element, and method of fabricating substrate with built-in semiconductor element

Mechanical coupling in a multi-chip module using magnetic components

Thermally enhanced low parasitic power semiconductor package

RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors

SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND LEAD FRAME, COMPRISING A BENT CONTACT SECTION

Stacking devices at finished package level

Optoelectronic component and method for producing an optoelectronic component

MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AND ITS FABRICATION METHOD

Multiple die layout for facilitating the combining of an individual die into a single die

Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same

SENSOR SYSTEM AND METHOD FOR MANUFACTURING SAME

True CSP power MOSFET based on bottom-source LDMOS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor integrated circuit

LED module

Semiconductor light emitting device

LED multi-side light source bracket

Gas delivery system for reducing oxidation in wire bonding operations

Foil plating for semiconductor packaging

Production process for surface-mounting ceramic LED package, surface-mounting ceramic LED package produced by said production process, and mold for producing said package

Manufacturing method of semiconductor device

Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotor

Template and pattern forming method

Method of manufacturing semiconductor device

Fabrication method of semiconductor device having conductive bumps

Method for connecting integrated circuit chip to power and ground circuits

3D smart power module

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Method for fabricating stack structure of semiconductor packages

Fabrication method of semiconductor integrated circuit device

Method of fabricating a high-temperature compatible power semiconductor module

Semiconductor device and method for manufacturing the same

Mounting Fixture for LED Lighting Modules

Lighting device, light spreading plate and method for manufacturing the same

Multiple Positioned Light Source to Achieve Uniform or Graded Illumination

Multiple Positioned Light Source to Achieve Uniform or Graded Illumination

Method and apparatus for generating white light from solid state light emitting devices

Semiconductor device

Power semiconductor module for inverter circuit system

Projector

Semiconductor light emitting apparatus, method for manufacturing the same, and liquid crystal display apparatus using the same

Lighting device with defined spectral power distribution

Light emitting device

Light-emitting device.having a frame member surrounding light-emitting elements and illumination device utilizing light-emitting device

Distributed LED-based light source

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

Package-on-package type semiconductor package

Semiconductor device and adhesive sheet

Assembly of multi-chip modules using sacrificial features

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

Semiconductor package with semiconductor core structure and method of forming the same

Semiconductor device and method of manufacturing same

Wafer backside interconnect structure connected to TSVs

Strong interconnection post geometry

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof

Integration of SMD components in an IC housing

Semiconductor device and method of forming interposer with opening to contain semiconductor die

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Method for manufacturing packaging structure

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Integrated circuit packaging system with encapsulated via and method of manufacture thereof

LOW COST DIE PLACEMENT

Semiconductor device and manufacturing method of the same

Semiconductor package and method of manufacturing the semiconductor package

Integrated circuit packaging system with cap layer and method of manufacture thereof

Integrated circuit packaging system with circuitry stacking and method of manufacture thereof

Semiconductor chip attach configuration having improved thermal characteristics

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Thermally improved semiconductor QFN/SON package

Resin-sealed semiconductor device and method of manufacturing the same

Screened electrical device and a process for manufacturing the same

Semiconductor device having semiconductor chip within multilayer substrate

Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via

Semiconductor device including vertical transistor and horizontal transistor

Semiconductor light emitting element, method for manufacturing the same, and light emitting device

Photoelectric device, method of fabricating the same and packaging apparatus for the same

Method of manufacturing light emitting diode packaging lens and light emitting diode package

Light emitting device and light emitting device package

Semiconductor light emitting element, method for manufacturing semiconductor light emitting element, and lamp

Semiconductor nanoparticle-based materials

Method of attaching a solder ball and method of repairing a memory module

Printed circuit board having electromagnetic bandgap structure

Electromagnetic interference noise reduction board using electromagnetic bandgap structure

Printed circuit board having electromagnetic bandgap structure

Printed wiring board and method for manufacturing the same

METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE

Interconnection design method, recording medium containing program and manufacturing method of interconnection substrate

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump

LEAD FRAME AND METHOD OF FORMING SAME

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PRODUCTION EQUIPMENT

Method forming a semiconductor light emitting device with perforations formed within

Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part

Plastic electronic component package

Opto-electric hybrid module and method of manufacturing the same

Mounting member and semiconductor laser apparatus having the same

Robust FBEOL and UBM structure of C4 interconnects

Heat resistant substrate incorporated circuit wiring board

Stack-type semiconductor package and electronic system including the same

Automated fillet inspection system with closed loop feedback and methods of use

Projector with super luminescent diode

Camera module, method of focusing the same, and device for focusing the same

Camera module

STRUCTURE AND METHOD FOR COUPLING SIGNALS TO AND/OR FROM STACKED SEMICONDUCTOR DIES

Light-emitting device

Light emitting device and display

Integrated circuit packaging system with fan-in package and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Stacked-die package including substrate-ground coupling

Package structures

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

Through hole electrode substrate with different area weighted average crystal grain diameter of metal in the conductive part and semiconductor device using the through hole electrode substrate

Delamination resistance of stacked dies in die saw

Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof

Semiconductor device

Three-dimensionally integrated semicondutor device and method for manufacturing the same

Stacked die package for peripheral and center device pad layout device

Display device

Semiconductor package

Protection layer for preventing UBM layer from chemical attack and oxidation

Substrate and package with micro BGA configuration

Integrated circuit package and device

Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Double-side mountable MEMS package

Isolated stacked die semiconductor packages

SEMICONDUCTOR DEVICE PACKAGE WITH DOWN-SET LEADS

Folded lands and vias for multichip semiconductor packages

Leadframe and chip package

Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof

Method for manufacturing a microelectronic package comprising at least one microelectronic device

Semiconductor die containing lateral edge shapes and textures

Non-volatile memory with reduced mobile ion diffusion

Protected semiconductor device and method of manufacturing thereof

Electronic component

Device package substrate and method of manufacturing the same

Sensor array and a method of manufacturing the same

Metal oxide semiconductor field effect transistor integrating a capacitor

Semiconductor light-emitting element, method for manufacturing the semiconductor light-emitting element and lamp that uses the semiconductor light-emitting element

Light-emitting diode

Method of manufacturing group-III nitride semiconductor light-emitting device, and group-III nitride semiconductor light-emitting device, and lamp

LIGHT-EMITTING DIODE DEVICE AND FABRICATION METHOD THEREOF

Light emitting device

Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same

LED arrangement

Light-emitting device

LIGHT EMITTING DEVICE HAVING REMOTELY LOCATED LIGHT SCATTERING MATERIAL

Light-emitting diode and method for fabrication thereof

Optoelectronic subassembly with integral thermoelectric cooler driver

ELECTRONIC PAYMENT CARD MANUFACTURING PROCESS

Method for manufacturing semiconductor device and bonding apparatus

METHOD FOR MANUFACTURING ALUMINUM-CONTAINING NITRIDE INTERMEDIATE LAYER, METHOD FOR MANUFACTURING NITRIDE LAYER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR ELEMENT

Optimized power package for electrical device

Printed circuit board having electromagnetic bandgap structure

Laminated substrate for an integrated circuit BGA package and printed circuit boards

Method of manufacturing mounting structure and mounting structure

MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME

Method of manufacturing a printed wiring board

Stacked device remapping and repair

Semiconductor wafer coat layers and methods therefor

Method of integrating a MOSFET with a capacitor

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE

Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity

Manufacturing method of leadframe and semiconductor device

MEMS device package with vacuum cavity by two-step solder reflow method

Manufacture method for ZnO-based light emitting device

BONDING WIRE

Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device

Luminescent material and light-emitting device

Luminescent material and light-emitting device

Multi-chip assembly with optically coupled die

Lamp device comprising illuminates surrounded by solid particles comprising a particle number density gradient in a direction away from the illuminates

SEMICONDUCTOR DEVICE

Bonding metallurgy for three-dimensional interconnect

Solid-state imaging apparatus and digital camera

Semiconductor device and method of forming directional RF coupler with IPD for additional RF signal processing

RADIO FREQUENCY POWER AMPLIFIER

Light emitting device

THERMOSETTING DIE BONDING FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE

Semiconductor device and semiconductor package having the same

Semiconductor device and method of manufacturing the same

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

Die Package

Terminal face contact structure and method of making same

Semiconductor device and manufacturing method therefor

Semiconductor package having memory devices stacked on logic device

Structure, method and system for assessing bonding of electrodes in FCB packaging

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

Semiconductor Chip with Stair Arrangement Bump Structures

Impedance optimized chip system

Semiconductor package

Method of manufacturing semiconductor device and semiconductor device

Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging

Delamination resistant packaged die having support and shaped die having protruding lip on support

Ultra high speed signal transmission/reception interconnect

Acceleration sensor, semiconductor device and method of manufacturing semiconductor device

Metal-oxide-semiconductor chip and fabrication method thereof

Resin composition for optical semiconductor element housing package, and optical semiconductor light-emitting device obtained using the same

LED module comprising a dome-shaped color conversion layer

Light emitting device

Light emitting device, system and package

Light emitting device, light emitting device package and lighting system including the same

LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same

Low profile optoelectronic device package

LED WITH PHOSPHOR TILE AND OVERMOLDED PHOSPHOR IN LENS

Package carrier for effectively blocking optical signal transmission between light emitting device and light receiving device

Luminescent material and light-emitting device

Opto-isolator including a vertical cavity surface emitting laser

Compact optical proximity sensor with ball grid array and windowed substrate

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Electronic device submounts with thermally conductive vias and light emitting devices including the same

LAMINATION METHOD OF ADHESIVE TAPE AND LEAD FRAME

Method of calibrating a constant voltage supply for an ultrasonic transducer of a wire bonding machine

Method for manufacturing interposer

White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device