212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
System with semiconductor components having encapsulated through wire interconnects (TWI)
#11702CONNECTION PAD STRUCTURE FOR AN ELECTRONIC COMPONENT
#11703Proximity Sensor with Ceramic Housing and Light Barrier
#11704Image sensor package structure with casing including a vent without sealing and in communication with package material
#11705OPTICAL ELEMENT PACKAGE, SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND LIGHTING DEVICE
#11706MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD
#11707RADIO FREQUENCY IDENTIFICATION DEVICE SUPPORT FOR HYBRID CARD AND ITS MANUFACTURING METHOD
#11708Thin foil semiconductor package
#11709Conductive ball mounting apparatus having a movable conductive ball container
#11710Mounting and connecting an antenna wire in a transponder
#11711ESD analysis device and ESD analysis program used for designing semiconductor device and method of designing semiconductor device
#11712Resin composition for semiconductor encapsulation and semiconductor device
#11713Toy building block with embedded integrated circuit
#11714Semiconductor package and method of manufacturing the same
#11715Process for making contact with and housing integrated circuits
#11716Method of manufacturing a semiconductor device
#11717Method for bonding of chips on wafers
#11718LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
#11719TEST CIRCUIT UNDER PAD
#11720Method for manufacturing light emitting diode assembly
#11721Light emitting device and a method for manufacturing the same
#11722Light-emitting diode light source apparatus
#11723HEAT DISSIPATING MODULE OF LIGHT EMITTING DIODE
#11724Multimode signaling on decoupled input/output and power channels
#11725FLEXIBLE CIRCUIT MODULE
#11726Electronic device including LTCC inductor
#11727Configuration context switcher with a clocked storage element
#11728Method of manufacturing a semiconductor device and a testing method of the same
#11729Multi-element LED lamp package
#11730Microelectronic substrate including embedded components and spacer layer and method of forming same
#11731Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus
#11732METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE
#11733Bonding pad for preventing pad peeling
#11734Semiconductor device
#11735Package structure and method for reducing dielectric layer delamination
#11736Low noise high thermal conductivity mixed signal package
#11737Semiconductor device
#11738Semiconductor packages and methods of fabricating the same
#11739High-bandwidth ramp-stack chip package
#11740Semiconductor packages including heat slugs
#11741Chip scale surface mounted semiconductor device package and process of manufacture
#11742PoP precursor with interposer for top package bond pad pitch compensation
#11743Method for packaging micromachined devices
#11744Electronic device, method of producing the same, and semiconductor device
#11745Component-incorporating wiring board
#11746Encapsulant cavity integrated circuit package system and method of fabrication thereof
#11747Light emitting device, and method and apparatus for manufacturing same
#11748SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
#11749Light emitting device package and method for fabricating the same
#11750Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same
#11751SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
#11752Light emitting diode component
#11753RFID tag
#11754Method for the low-temperature pressure sintering of electronic units to heat sinks
#11755FORMING GAS KIT DESIGN FOR COPPER BONDING
#11756Method for connecting a component with a substrate
#11757Method and apparatus for mounting electric component
#11758Bonding machine incorporating dual-track transfer mechanism
#11759Semiconductor device and data processor
#11760Semiconductor device
#11761MULTI-FUNCTIONAL COMMUNICATION MODULE
#11762Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus used in said method
#11763Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
#11764Manufacturing process for embedded semiconductor device
#11765Method for packaging semiconductor dies having through-silicon vias
#11766Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
#11767Stackable packages for three-dimensional packaging of semiconductor dice
#11768Semiconductor Device and Method of Forming Conductive TSV in Peripheral Region of Die Prior to Wafer Singulaton
#11769METHOD FOR FABRICATING FLIP CHIP GALLIUM NITRIDE LIGHT EMITTING DIODE
#11770Optical interconnect device and method for manufacturing the same
#11771Surface-emission unit and method for producing the same
#11772MULTI-CHIP PACKAGE STRUCTURE SUITABLE FOR MULTI-PROCESSOR SYSTEM HAVING MEMORY LINK ARCHITECTURE
#11773Providing in package power supplies for integrated circuits
#11774Semiconductor-on-insulator with back side connection
#11775Systems and methods for lowering interconnect capacitance through adjustment of relative signal levels
#11776Phosphor, method for manufacturing the same, and light emitting diode
#11777PLATING STRUCTURE AND METHOD FOR MANUFACTURING ELECTRIC MATERIAL
#11778Integrated circuit package system employing device stacking and method of manufacture thereof
#11779Electronic component used for wiring and method for manufacturing the same
#11780Semiconductor device and manufacturing method of the same
#11781Semiconductor device and method of manufacturing the same
#11782Post bump and method of forming the same
#11783METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT
#11784Packaged semiconductor chips
#11785HEAT SPREADER FOR SEMICONDUCTOR PACKAGE
#11786Semiconductor package having discrete components and system containing the package
#11787Power semiconductor module and method of manufacturing the same
#11788SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#11789Semiconductor device and method of fabrication
#11790IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods
#11791Method for producing a capping wafer for a sensor
#11792SEMICONDUCTOR DEVICE
#11793Semiconductor chip package
#11794Leadframe having delamination resistant die pad
#11795Semiconductor chip package
#11796Multi-Connect Lead
#11797Semiconductor device
#11798Semiconductor-on-insulator with back side support layer
#11799Wafer-level image sensor module, method of manufacturing the same and camera module
#11800Microelectromechanical semiconductor component with cavity structure and method for producing the same
#11801Semiconductor-on-insulator with back side heat dissipation
#11802Multi-die DC-DC buck power converter with efficient packaging
#11803LIGHT-EMITTING DIODE LIGHT BAR
#11804LED package with top and bottom electrodes
#11805Package for optical semiconductor device, optical semiconductor device using the package, and methods for producing same
#11806LIGHT EMITTING DEVICE
#11807LIGHT EMITTING DEVICE PACKAGE
#11808Solid state lighting component
#11809Electro-optical device and method for manufacturing the same
#11810Device Mounting Board
#11811Semiconductor device and method of manufacturing the same
#11812Bonding wire for semiconductor devices
#11813Copper alloy bonding wire for semiconductor device
#11814Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds
#11815Method for exposing and cleaning insulating coats from metal contact surfaces
#11816Semiconductor device having grooved leads to confine solder wicking
#11817SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE
#11818Near chip scale package integration process
#11819Dual side cooling integrated power device module and methods of manufacture
#11820METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#11821Light emitting diodes with smooth surface for reflective electrode
#11822Self-aligned wafer bonding
#11823Light emitting element module and manufacturing method thereof, and backlight apparatus
#11824Dual-level package
#11825Electronic circuit device
#11826White light emitting device
#11827Multilayer dielectric substrate and semiconductor package
#11828MULTI-CHIP SYSTEM
#11829Method and apparatus for interrogating electronic equipment components
#11830LED lamp
#11831RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
#11832System and method to reduce the bondwire/trace inductance
#11833Under land routing
#11834Method for aligning and bonding elements and a device comprising aligned and bonded elements
#11835Liner formation in 3DIC structures
#11836Structures and methods to improve lead-free C4 interconnect reliability
#11837Solder interconnect pads with current spreading layers
#11838Semiconductor device
#11839Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device
#11840Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other
#11841Semiconductor device and method of manufacturing semiconductor device
#11842Structure and method for forming pillar bump structure having sidewall protection
#11843Solder interconnect by addition of copper
#11844Simplified multichip packaging and package design
#11845Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
#11846NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES
#11847Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
#11848White LED lamp, backlight, light emitting device, display device and illumination device
#11849Light emitting device having heat generating color conversion members
#11850LED package structure with concave area for positioning heat-conducting substance and method for manufacturing the same
#11851Lighting device, display, and method for manufacturing the same
#11852LIGHT-EMITTING DEVICE
#11853Ribbon connecting electrical components
#11854Sensor package assembly having an unconstrained sense die
#11855Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
#11856METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
#11857SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING
#11858SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
#11859Flip chip MLP with folded heat sink
#11860LED package structure and manufacturing method, and LED array module
#11861LED chip package structure with an embedded ESD function and method for manufacturing the same
#11862Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing
#11863Semiconductor optical interconnection device and semiconductor optical interconnection method
#11864Manufacturing method for stacking memory circuits and for addressing a memory circuit, corresponding stacking and device
#11865Phosphor sheet, a diffusion plate, an illuminating device, and a display unit
#11866Transponder and booklet
#11867Directly injected forced convention cooling for electronics
#11868Method for direct connection of MMIC amplifiers to balanced antenna aperture
#11869Die-to-die electrical isolation in a semiconductor package
#11870Light emitting diode component
#11871Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump
#11872Compound semiconductor device and connectors
#11873Chip scale module package in BGA semiconductor package
#11874Semiconductor chip package and method for designing the same
#11875Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#11876Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element
#11877Semiconductor device and a method of manufacturing the same
#11878Stacked semiconductor device and fabrication method for same
#11879Semiconductor device mounted structure with an underfill sealing-bonding resin with voids
#11880Flip-chip module and method for the production thereof
#11881Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array Packaging
#11882Package structure
#11883Semiconductor device and manufacturing method of the same
#11884Semiconductor Chip Secured to Leadframe by Friction
#11885LEAD FRAME, AND ELECTRONIC PART USING THE SAME
#11886SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#11887Lead frame routed chip pads for semiconductor packages
#11888Leadframe, leadframe type package and lead lane
#11889Method of assembling a multi-component electronic package
#11890Semiconductor device and semiconductor device manufacturing method
#11891Power semiconductor devices having termination structures
#11892Power converter integrated circuit floor plan and package
#11893Method for producing group III nitride semiconductor light-emitting device
#11894Light emitting diode and method of manufacturing the same, and light emitting device and method of manufacturing the light emitting device
#11895Light emitting device
#11896Light-emitting device and manufacturing method thereof
#11897Method of preparing an oxynitride phosphor, oxynitride phosphor obtained using the method, and a white light-emitting device including the oxynitride phosphor
#11898LED PACKAGE STRUCTURE FOR FORMING A STUFFED CONVEX LENS TO ADJUST LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME
#11899Thin flat solid state light source module
#11900Phosphor, method for manufacturing the same, and light emitting diode
#11901Wire payout measurement and calibration techniques for a wire bonding machine
#11902Force sensor apparatus
#11903Engine blower
#11904Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages
#11905SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME
#11906Formation of TSV backside interconnects by modifying carrier wafers
#11907Manufacturing method of semiconductor device including Au bump on seed film
#11908Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same
#11909Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip
#11910Process for producing a semiconductor device
#11911Methods for producing an ultrathin semiconductor circuit
#11912Three-dimensional integrated circuits with protection layers
#11913Method of manufacturing semiconductor device
#11914Semiconductor device and method for producing the same
#11915Mold for forming a molding member and method of fabricating a molding member using the same
#11916Methods for multi-stage molding of integrated circuit package
#11917METHOD OF MANUFACTURING INTEGRATED SEMICONDUCTOR LASER DEVICE, INTEGRATED SEMICONDUCTOR LASER DEVICE AND OPTICAL APPARATUS
#11918POWER CONVERTER
#11919Light-emitting module
#11920High-speed transmission circuit board connection structure
#11921Multichip module, printed circuit board unit, and electronic apparatus
#11922Printed circuit board
#11923Electronic device
#11924Coil transducer isolator packages
#11925Linked semiconductor module unit and electronic circuit-integrated motor vehicle device using same
#11926Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
#11927Circuitized substrates utilizing smooth-sided conductive layers as part thereof
#11928Static eliminator, and microphone electretizing method and apparatus using static eliminator
#11929Optical module, integrated semiconductor optical device and manufacturing method thereof
#11930LED light source, its manufacturing method, and LED-based photolithography apparatus and method
#11931CAMERA MODULE
#11932Imaging apparatus
#11933Radio-frequency system in package including antenna
#11934Integrated power amplifier with load inductor located under IC die
#11935POWER CONVERTER FOR TRACTION CONTROL AND TRANSPORTATION SYSTEM
#11936Luminescent material
#11937MULTIPLE LAYER PHOSPHOR BEARING FILM
#11938Power module and vehicle-mounted inverter using the same
#11939Volume-based dispensing control method
#11940PACKAGE PROCESS AND PACKAGE STRUCTURE
#11941Layered chip package
#11942Stacked structures and methods of fabricating stacked structures
#11943SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
#11944Semiconductor device including two heat sinks and method of manufacturing the same
#11945MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#11946Semiconductor device bonding wire and wire bonding method
#11947Semiconductor device, semiconductor package and wiring structure
#119483-D semiconductor die structure with containing feature and method
#11949Semiconductor package and method of forming the same
#11950Near chip scale semiconductor packages
#11951Wiring board and semiconductor device using the wiring board
#11952ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF
#11953SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#11954High Density MIM Capacitor Embedded in a Substrate
#11955Package with heat transfer
#11956Semiconductor chip thermal interface structures
#11957Semiconductor package structure and package method thereof
#11958Package manufacturing method and semiconductor device
#11959Semiconductor device and method for manufacturing the same
#11960FLAT CHIP PACKAGE AND FABRICATION METHOD THEREOF
#11961Multi-chip package and method of providing die-to-die interconnects in same
#11962Semiconductor packaging structure having conductive gel to package semiconductor device
#11963Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
#11964IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE
#11965Semiconductor device with embedded interconnect pad
#11966Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#11967Integrated circuit package system using heat slug
#11968Electronic device having a molding compound including a composite material
#11969Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench In Substrate
#11970Electrical property altering, planar member with solder element in IC chip package
#11971Bond pad with integrated transient over-voltage protection
#11972Semiconductor chip
#11973Group III nitride semiconductor light emitting device and production method thereof, and lamp
#11974Light emitting diode package and method of manufacturing the same
#11975Optoelectronic component
#11976Light-emitting diode lamp with uniform resin coating
#11977LED PACKAGE STRUCTURE WITH EXTERNAL CUTTING CHAMFER AND METHOD FOR MANUFACTURING THE SAME
#11978LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
#11979Integrated Direct Conversion Detector Module
#11980Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components
#11981Compact millimeter wave packages with integrated antennas
#11982Compression-bonding apparatus
#11983METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF
#11984Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
#11985Semiconductor device and manufacturing method thereof
#11986Methods of operating electronic devices, and methods of providing electronic devices
#11987Power amplifier and signal transceiving system
#11988Fabrication method of semiconductor device having conductive bumps
#11989Circuit Device and Method of Manufacturing Thereof
#11990ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
#11991Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package
#11992Pressure-Sensitive Adhesive Tape
#11993Optical module
#11994White light-emitting lamp and illuminating device using the same
#11995Semiconductor device and power supply device using the same
#11996METHOD FOR MANUFACTURING LIGHT EMITTING APPARATUS, LIGHT EMITTING APPARATUS, AND MOUNTING BASE THEREOF
#11997Illuminating device and packaging method thereof
#11998Multilayer printed wiring board
#11999MEMORY CARD
#12000ELECTRONIC CIRCUIT DEVICE, PRODUCTION METHOD THEREOF, AND DISPLAY DEVICE