Stress-engineered interconnect packages with activator-assisted molds

Method for semiconductor leadframes in low volume and rapid turnaround

QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF

Tiled light sensing array

Semiconductor device including a magnetic sensor chip

MEMS package

Method for fabrication of a semiconductor device and structure

Image sensing device and packaging method thereof

Mount for a semiconductor light emitting device

Light emitting device package and method for fabricating the same

Light emitting diode with high electrostatic discharge and fabrication method thereof

Compound semiconductor light-emitting element and method of manufacturing the same, conductive translucent electrode for compound semiconductor light-emitting element, lamp, electronic device, and mechanical apparatus

Light emitting package and light emitting package array formed by coupled electrodes

Light emitting device and light emitting device package having the same

Manufacture of light emitting devices with phosphor wavelength conversion

Manufacture of light emitting devices with phosphor wavelength conversion

Manufacture of light emitting devices with phosphor wavelength conversion

Optoelectronic semiconductor chip

Light-emitting diode

Light emitting device

Light emitting device package and lighting apparatus using the same

Semiconductor device having surface protective films on bond pad

Semiconductor device

Method for growing zinc-oxide-based semiconductor device and method for manufacturing semiconductor light emitting device

Light emitting device and light emitting device package having the same

Arrangement for energy conditioning

Electronic component mounted structure

Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure

BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE

Substrate for electrical device

Bonding wire for semiconductor devices

ENERGY TRANSDUCING APPARATUS AND ENERGY TRANSDUCING EQUIPMENT

Bonding apparatus and wire bonding method

Thermal Spray For Solar Concentrator Fabrication

Process condition sensing wafer and data analysis system

Method for fabrication of a semiconductor device and structure

Semiconductor device with an improved solder joint

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Manufacturing method for electronic devices

Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method

LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE

Optical device with large thermal impedance

SEMICONDUCTOR LASER DEVICE AND DISPLAY

Heat sink and assembly or module unit

Light emitting device

ADHESIVE FILM

Semiconductor package, lead frame, and wiring board with the same

Stacked-chip packaging structure and fabrication method thereof

Semiconductor device and display apparatus

System-in packages

Elastic wave device and method for manufacturing the same

Light-emitting device and manufacturing method thereof

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

Lens support and wirebond protector

Circuit board having bypass pad

Multi chip semiconductor device

Semiconductor package

Method and core materials for semiconductor packaging

Semiconductor device

Semiconductor component and assumbly with projecting electrode

Semiconductor power module

Semiconductor die having a redistribution layer

WAFER CHIP SCALE PACKAGE WITH CENTER CONDUCTIVE MASS

3D integration structure and method using bonded metal planes

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COIN BONDED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

Semiconductor device

Semiconductor package and manufacturing method of the semiconductor package

Hardwired switch of die stack and operating method of hardwired switch

SUBSTRATE STRUCTURE FOR FLIP-CHIP INTERCONNECT DEVICE

Heat sink package

Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof

Stackable Package Having Embedded Interposer and Method for Making the Same

SUBSTRATE HAVING EMBEDDED SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED WITH THE SAME, AND METHODS OF MANUFACTURING OF THE SUBSTRATE AND PACKAGE

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

COPPER PLATE BONDING FOR HIGH PERFORMANCE SEMICONDUCTOR PACKAGING

Integrated circuit packaging system with leads and transposer and method of manufacture thereof

Semiconductor device

Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame

PHOTOSENSOR PACKAGE

Power MOSFET package

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

SILICONE LEADED CHIP CARRIER

Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal

Chip coated light emitting diode package and manufacturing method thereof

Light emitter

Oxynitride phosphor and production process thereof, and light-emitting device using oxynitride phosphor

ELEMENT MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME, CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME, AND MOBILE APPLIANCE ( as amended

Printed wiring board and electronic-component package

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

Method of making circuit board module

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOLING MEMBER AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE

Method and apparatus for mounting electric component

Wireless communication system

Method for fabricating QFN semiconductor package

Die down ball grid array packages and method for making same

Method of manufacturing a chip stack package

Fabrication method of semiconductor device

Connecting film, and joined structure and method for producing the same

Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof

SEMICONDUCTOR LASER DEVICE AND DISPLAY

Circuit device

Power semiconductor module including substrates spaced from each other

SYSTEMS AND METHODS FOR FABRICATING HIGH-DENSITY CAPACITORS

Antennas using chip-package interconnections for millimeter-wave wireless communication

Semiconductor chip and semiconductor device including the same

System and method for sensing voltage in medium-to-high voltage applications

Magnetic detection of back-side layer

Panelized backside processing for thin semiconductors

Circuit substrate and method for utilizing packaging of the circuit substrate

Semiconductor device

Integrated circuit including a gate and a metallic connecting line

Techniques for packaging multiple device components

Semiconductor device

Structure and method of forming a pad structure having enhanced reliability

Bump pad structure

Semiconductor structure

Stack structure with copper bumps

In-situ cavity integrated circuit package

Die Exposed Chip Package

Mold lock on heat spreader

SEMICONDUCTOR CHIP PACKAGE

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

Semiconductor Device Package Having Chip With Conductive Layer

QFN semiconductor package

QFN semiconductor package

LEAD FRAME FOR SEMICONDUCTOR DEVICE

High power ceramic on copper package

Discontinuous thin semiconductor wafer surface features

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE

Systems and methods for providing high-density capacitors

Semiconductor device driving bridge-connected power transistor

Photo detector

INTEGRATED SENSOR CHIP UNIT

Massively parallel interconnect fabric for complex semiconductor devices

TRANSPARENT MIRRORLESS LIGHT EMITTING DIODE

Light emitting diodes including optically matched substrates

Optical systems fabricated by printing-based assembly

Optoelectronic system

Molded housing used in force fit method

MULTILAYER PRINTED WIRING BOARD

Bonding wire for semiconductor device

Illumination device for use in endoscope

Semiconductor bond pad patterns and method of formation

Package with multiple dies

Methodology for processing a panel during semiconductor device fabrication

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Fabrication method of semiconductor integrated circuit device

Semiconductor memory device capable of optimizing signal transmission power and power initializing method thereof

IC card with terminals for direct access to internal components

Light emitting device package and method of fabricating the same

LED module and LED dot matrix display

POLARIZED WHITE LIGHT EMITTING DIODE

Method for manufacturing a rigid power module suited for high-voltage applications

Insulating sheet and method for producing it, and power module comprising the insulating sheet

Antenna sheet, transponder, and booklet

Manufacturing method of semiconductor integrated circuit device

LIGHTING DEVICE

Flexible thermal energy dissipating and light emitting diode mounting arrangement

Light fixture using doped semiconductor nanophosphor in a gas

Light emitting device

Piezoelectric device

Semiconductor device

Separate probe and bond regions of an integrated circuit

Injection molded soldering process and arrangement for three-dimensional structures

Semiconductor component with terminal contact surface

Electronic component for surface mounting

Plastic package and method of fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor device and method to manufacture thereof

Semiconductor chip package with stiffener frame and configured lid

Semiconductor device

Semiconductor device

Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same

System and method for multi-chip module die extraction and replacement

HIGH PIN DENSITY SEMICONDUCTOR SYSTEM-IN-A-PACKAGE

Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure

Wafer backside structures having copper pillars

Electronic components on trenched substrates and method of forming same

Germanium film optical device fabricated on a glass substrate

Shielding for a micro electro-mechanical device and method therefor

Light emitting device, package, and system

Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones

Light emitting apparatus and method for the same

Light emitting device, light emitting device package and lighting system including the same

Conversion LED

LED device and packaging method thereof

Semiconductor light emitting device substrate strips and packaged semiconductor light emitting devices

SOLID STATE LIGHTING DEVICE WITH AN INTEGRATED FAN

LOW THERMAL RESISTANCE AND ROBUST CHIP-SCALE-PACKAGE (CSP), STRUCTURE AND METHOD

Direct attach optical receiver module and method of testing

Semiconductor image sensor module and method of manufacturing the same

Method of forming an interconnect joint

Semiconductor package including power ball matrix and power ring having improved power integrity

Multilayer printed wiring board and mounting body using the same

Method of interconnecting electronic wafers

Silicone resin composition for optical semiconductor devices and an optical semiconductor device

CHIP PACKAGING METHOD

Thermally enhanced wafer level package

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Substrate for a microelectronic package and method of fabricating thereof

Methods of forming imager device with electric connections to electrical device

LED with substrate modifications for enhanced light extraction and method of making same

SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD

Wafer based optical chassis and associated methods

Photoelectric conversion module

Accessing memory cells in a memory circuit

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Sensor module

Wireless microactuator motor assembly for use in a hard disk drive suspension, and mechanical and electrical connections thereto

Vertical cavity surface emitting laser element, vertical cavity surface emitting laser array element, vertical cavity surface emitting laser device, light source device, and optical module

Universal inter-layer interconnect for multi-layer semiconductor stacks

SEMICONDUCTOR DEVICE

LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF

Light emitting device

Semiconductor packages and electronic systems including the same

Multi-chip stacked package

Chip identification using top metal layer

Integrated circuit package system with offset stacking and anti-flash structure

Microelectronic packages fabricated at the wafer level and methods therefor

Adaptive interconnect structure

High quality electrical contacts between integrated circuit chips

Semiconductor device

Dual Interconnection in Stacked Memory and Controller Module

Semiconductor package with multiple chips and substrate in metal cap

Semiconductor device and method of manufacturing semiconductor device

Leadframe

Power lead-on-chip ball grid array package

Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference

Semiconductor device and method for manufacturing metallic shielding plate

Semiconductor device, method of manufacturing the same, and silane coupling agent

Chip-on-board package

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Nitride semiconductor wafer

Semiconductor device including an inductor that is inductively coupled to another inductor

Optical semiconductor package sealing resin material

SUBSTRATE BASED LIGHT SOURCE PACKAGE WITH ELECTRICAL LEADS

Light emitting device package having a package body including a recess and lighting system including the same

Light emitting diode package

AC LED package structure

Light emitting device, light emitting device package, and lighting system including the same

Slim LED package

Lighting device

Semiconductor light-emitting device and method of fabricating the same

Semiconductor device and method of providing electrostatic discharge protection for integrated passive devices

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

Optical coupler having first and second terminal boards and first and second conversion elements

LIQUID ELECTRICAL INTERCONNECT AND DEVICES USING SAME

SOLDER PASTE COMPOSITION HAVING SOLDER POWDER, FLUX AND METALLIC POWDER

Apparatus and method for arranging magnetic solder balls

FLEXIBLE JOINT

SENSOR SYSTEM

Method for Mounting Flip Chip and Substrate Used Therein

Component mounting apparatus, component mounting head, and component mounting method

SIM ADAPTER AND SIM CARD

Backside process for a substrate

Semiconductor device and method for manufacturing the same

COMPONENT FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR PACKAGE

Carbon nanotubes for the selective transfer of heat from electronics

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

Method of fabricating stacked semiconductor structure

Method and system for providing a low-profile semiconductor assembly

Semiconductor die packages using thin dies and metal substrates

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

Wafer bonding of micro-electro mechanical systems to active circuitry

Light emitting apparatus and fabrication method thereof

Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor

Multi-chip packages providing reduced signal skew and related methods of operation

Power semiconductor module

Multi-wavelength semiconductor laser device

Interposer substrate including capacitor for adjusting phase of signal transmitted in same interposer substrate

Semiconductor chip package with undermount passive devices

ENHANCING ADHESION OF MOLDING MATERIALS WITH SUBSTRATES

PACKAGE STRUCTURE OF PRINTED CIRCUIT BOARD AND PACKAGE METHOD THEREOF

Semiconductor device

Electronic component module

Semiconductor device

Receive circuit for connectors with variable complex impedance

Electronic device including electronic part and wiring substrate

Device for emitting various colors

Device for emitting white-color light

Packaged electronic device having metal comprising self-healing die attach material

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

Three dimensional integrated circuit integration using dielectric bonding first and through via formation last

Semiconductor device and manufacturing method thereof

Dynamic pad size to reduce solder fatigue

IC package reducing wiring layers on substrate and its carrier

Semiconductor device and method of manufacturing the same

INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND SUBSTRATE PROCESSING METHOD

Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure

Semiconductor chip package

Electronic device package

Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby

Stacked chip package structure with leadframe having bus bar

Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof

Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof