Stacked chip package structure with leadframe having bus bar

Semiconductor element for package miniaturization

Integrated circuit package system with leaded package and method for manufacturing thereof

Panel, semiconductor device and method for the production thereof

SEMICONDUCTOR DEVICE HAVING AT LEAST ONE BUMP WITHOUT OVERLAPPING SPECIFIC PAD OR DIRECTLY CONTACTING SPECIFIC PAD

Semiconductor component having through wire interconnect (TWI) with compressed wire

SEMICONDUCTOR MODULE

Method of forming an inductor on a semiconductor wafer

Semiconductor device and method of forming high-frequency circuit structure and method thereof

Solid-state imaging device comprising through-electrode

MEMS device including a chip carrier

High breakdown voltage semiconductor device and high voltage integrated circuit

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

Anti-reflection structures for CMOS image sensors

Semiconductor chip pad structure and method for manufacturing the same

Light emitting apparatus

Light emtting device

LED and method of manufacturing the same

Light emitting element and fabricating method thereof

Light emitting device

PLCC package with a reflector cup surrounded by an encapsulant

White light-emitting diode package structure for simplifying package process and method for making the same

Light emitting device with high color rendering index and high luminescence efficiency

LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE USING THE SAME

Semiconductor integrated circuit device and method of manufacturing same

ELECTRONIC COMPONENT MOUNTING METHOD

Wiring substrate having columnar protruding part

Surface mounting chip carrier module

Metal wiring structures for uniform current density in C4 balls

Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink

Aluminum-Aluminum Nitride composite material, manufacturing method thereof and heat exchanger including the same

Active area bonding compatible high current structures

3D chip-stack with fuse-type through silicon via

Manufacturing method of semiconductor device with surface mounting terminals

Wafer level packaging method

THERMOSETTING DIE BONDING FILM

Semiconductor package and method of packaging semiconductor devices

Manufacturing method of semiconductor integrated circuit device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Remote chip attachment

Photodetection unit, photodetector, and x-ray computed tomography apparatus

Laser light source module

Light emitting module and thermal protection method

Package for multiple light emitting diodes

LIGHT EMITTING APPARATUS

Light fixture using near UV solid state device and remote semiconductor nanophosphors to produce white light

Circuit board and mounting structure

Widebody coil isolators

Exposed die pad package with power ring

Composite solder TIM for electronic package

Solid state drive, structure for supporting solid state drives and scalable information processing system including a plurality of solid state drives

Light-emitting device, surface light-emitting apparatus, display system

Camera and production method for a camera

Image sensor module having a semiconductor chip, a holder and a coupling member

Semiconductor device

Semiconductor device capable of switching operation modes

SEMICONDUCTOR DEVICE

Microelectronic packages and methods therefor

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electrode structure and its manufacturing method, and semiconductor module

Substrate and semiconductor device

Interconnection of IC Chips by Flex Circuit Superstructure

Assembling substrates that can form 3-D structures

PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Semiconductor device, manufacturing method thereof, and electronic device

Semiconductor device and method for manufacturing the same

Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer

SEMICONDUCTOR DEVICE

Stacked microfeature devices

SUBSTRATE AND SEMICONDUCTOR DEVICE

Stacked semiconductor package

Power semiconductor module comprising a connection device with internal contact spring connection elements

Semiconductor package and manufacturing method thereof

Supporting substrate before cutting, semiconductor device, and method of forming semiconductor device

Semiconductor device and method of forming the same

Stacked semiconductor package and method of manufacturing thereof

Staircase shaped stacked semiconductor package

Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof

Package-on-package interconnect stiffener

Relay board and semiconductor device having the relay board

Semiconductor die package and method for making the same

Pre-molded clip structure

Pre-molded clip structure

Semiconductor device and manufacturing method thereof

ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Manufacturing method of advanced quad flat non-leaded package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package to remove power noise using ground impedance

Fingerprint sensor chip package method and the package structure thereof

Semiconductor device and a method of manufacturing the same

Bumped, self-isolated GaN transistor chip with electrically isolated back surface

Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device

Vertical LED with current guiding structure

Semiconductor light-emitting device and manufacturing method of the same

LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

Light emitting device

Light emitting diode package and method of manufacturing the same

SUBSTRATE FOR AN LED SUBMOUNT, AND LED SUBMOUNT

Light receiving device and method of manufacturing light receiving device

BONDED HERMETIC FEED THROUGH FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE

Structures for improving current carrying capability of interconnects and methods of fabricating the same

3D-IC Verification Method

Heat Radiation Substrate and Illumination Module Substrate Having Hybrid Layer

Process for producing connector and connector produced by the same process

Semiconductor device having elastic solder bump to prevent disconnection

Semiconductor Manufacturing Method

Method of fabricating a two-sided die in a four-sided leadframe based package

Method of manufacturing a semiconductor device including plural semiconductor chips

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

Fabrication method of multi-chip stack structure

Manufacturing method of bottom substrate of package

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME

EPOXY RESIN COMPOSITION

Manufacturing method of opto-electric hybrid module and opto-electric hybrid module obtained thereby

Semiconductor optical communication module and manufacturing method thereof

MICROPHONE DEVICE

Magnetic storage device

Saturated yellow phosphor converted LED and blue converted red LED

Electronic board, method of manufacturing the same, and electronic device

Circuit board, mounting structure, and method for manufacturing circuit board

Multi-layer mesh wicks for heat pipes

CAMERA MODULE AND MOBILE TERMINAL UNIT

Electronic circuitry

RF POWER AMPLIFIER CIRCUIT UTILIZING BONDWIRES IN IMPEDANCE MATCHING

DC/DC converter package having separate logic and power ground terminals

Phosphor layer arrangement for use with light emitting diodes

Semiconductor package having underfill agent dispersion

Electronic device and method of manufacturing same

Semiconductor module

Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same

Three-dimensional semiconductor architecture

Semiconductor device

Semiconductor element, method for manufacturing the same, and mounting structure having the semiconductor element mounted thereon

Semiconductor device

Semiconductor device with pads overlapping wiring layers including dummy wiring

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

MULTI-DIE PACKAGE WITH IMPROVED HEAT DISSIPATION

SEMICONDUCTOR DEVICE AND IMAGING DEVICE USING THE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

Header structure of opto-electronic element and opto-electronic element using the same

SEMICONDUCTOR LIGHT-EMITTING DEVICE

Arrangement for dissipating thermal energy generated by a light emitting diode

Thermal Energy Dissipating Arrangement for a Light Emitting Diode

COOLING BLOCK ASSEMBLY AND LED INCLUDING THE COOLING BLOCK

LED package with increased feature sizes

Method for forming an LED lens structure and related structure

Light-emitting element mounting substrate, light-emitting element package, display device, and illumination device

Package structure of light emitting diode for backlight

High voltage low current surface emitting LED

Semiconductor device with I/O cell and external connection terminal and method of manufacturing the same

Semiconductor device, circuit substrate, electro-optic device and electronic appliance

Joining method and device produced by this method and joining unit

CARBON NANOTUBE CONTACT STRUCTURES FOR USE WITH SEMICONDUCTOR DIES AND OTHER ELECTRONIC DEVICES

Connection terminal, package using the same, and electronic apparatus

Wiring board and method of manufacturing the same

Step-down transition of a solder head in the injection molding soldering process

Electronic device comprising an integrated circuit and a capacitance element

Method of fabricating a semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method of the same

High frequency flip chip package process of polymer substrate and structure thereof

Method of handling a thin wafer

Method of making chip-on-lead package

Chip-size-package semiconductor chip and manufacturing method

Methods of fabricating a light-emitting device

Method for manufacturing hybrid image sensors

OPTOELECTRONIC WIRING BOARD INCLUDING OPTICAL WIRING AND ELECTRICAL WIRING AND METHOD OF MANUFACTURING OPTOELECTRONIC WIRING DEVICE USING THE SAME

Optical device with large thermal impedance

Stacked memory device including a pre-decoder/pre-driver sandwiched between a plurality of inter-decoders/inter-drivers

Light emitting device having semiconductor laser and fluorescent material and method for manufacturing the same

Integrated circuit chip using top post-passivation technology and bottom structure technology

Interconnect structure and a method of fabricating the same

Electronic apparatus produced using lead-free bonding material for soldering

Electronic device package, module, and electronic device

ELECTRONIC DEVICE

ELECTROLYTIC CAPACITOR AND METHOD OF MAKING THE SAME

Assembly of radiofrequency chips

Processes for Producing Thin-Film Sensors, Thin-Film Sensors and Thin-Film Sensor Modules

WHITE LIGHT EMITTING DIODE, WHITE LIGHT EMITTING APPARATUS, AND LINEAR ILLUMINATOR USING THE SAME

LED package and method for manufacturing such a LED package

NANOCOMPOSITES FOR OPTOELECTRONIC DEVICES

Method of joining electronic component and the electronic component

Assembly of electronic components

FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME

Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch

Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same

Stacked multichip package

Integrated circuit packaging system with package underfill and method of manufacture thereof

Integrated circuit package system with multiple device units and method for manufacturing thereof

Packaged microelectronic devices and associated systems

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor device having integral structure of contact pad and conductive line

Apparatus, system, and method for wireless connection in integrated circuit packages

METALLIC BONDING STRUCTURE FOR COPPER AND SOLDER

Chip packages

Through-hole contacts in a semiconductor device

Method of fabricating semiconductor device and the semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor package and method of forming

Chip having a bump and package having the same

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

Semiconductor device

Integrated circuit packaging system with heat spreader and method of manufacture thereof

Semiconductor device with hollow and throughhole and method of manufacturing same

Chip stack package and method of fabricating the same

Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof

Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor

Semiconductor package fabrication process and semiconductor package

Semiconductor device and method of manufacturing the same

Semiconductor packages and electronic systems including the same

Semiconductor chip mounting body, method of manufacturing semiconductor chip mounting body and electronic device

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof

Integrated circuit packaging system having dual sided connection and method of manufacture thereof

Integrated circuit packaging system with package stacking and method of manufacture thereof

Integrated circuit packaging system with stacked configuration and method of manufacture thereof

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of manufacturing same

Semiconductor device and manufacturing method therefor

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR AND METHOD OF MANUFACTURE THEREOF

Multichip discrete package

Lead frame and method for manufacturing circuit device using the same

Circuit device having funnel shaped lead and method for manufacturing the same

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Semiconductor device with first and second semiconductor substrates

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element

Semiconductor module and camera module mounting said semiconductor module

Multilayer wiring substrate having a castellation structure

Wafer level packaging using flip chip mounting

Method for manufacturing group III nitride semiconductor, method for manufacturing group III nitride semiconductor light-emitting device, group III nitride semiconductor light-emitting device, and lamp

Light emitting device

Light emitting device, light emitting device package and lighting system including the same

Light-emitting devices

Lighting device using high power LED with multiple lead

Light emitting diode package

Light emitting device package

Method of manufacturing LED lamp

LIGHT SOURCE

Light emitting device having a plurality of light emitting cells and package mounting the same

Semiconductor device with high density optical chips and manufacturing method thereof

Method of manufacturing semiconductor device, semiconductor device and semiconductor composite device

Group-III nitride compound semiconductor light-emitting device, method of manufacturing group-III nitride compound semiconductor light-emitting device, and lamp

Integrated circuit packaging system with interposer and method of manufacture thereof

SEMICONDUCTOR DEVICE

Microelectronic component support with reinforced structure

Electronic apparatus, power control device for controlling a heater, and method of controlling power control device

Multilayer printed wiring board

Sensor component

Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

Support structure for a sensor strip and sensor strip for mounting on said support structure

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Method for making a stacked package semiconductor module having packages stacked in a cavity in the module substrate

Film-like adhesive, adhesive sheet, and semiconductor device using same

Composite alloy bonding wire and manufacturing method thereof

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF

Multi-chip packages including extra memory chips to define additional logical packages and related devices

Semiconductor light emitting device

Semiconductor package

Load driving device

Power module

Light emitting device, light emitting system comprising the same, and method of fabricating thereof

LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Luminescent material, luminescent material complex and method of manufacturing the same, fluorescent labeling reagent and method of manufacturing the same, and light emitting element

Applications of smart polymer composites to integrated circuit packaging

Structure and Method for Thin Single or Multichip Semiconductor QFN Packages

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

IO cell with multiple IO ports and related techniques for layout area saving

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Metal-metal bonding of compliant interconnect

Barrier for through-silicon via

Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site

SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF

Semiconductor device and method of manufacturing the same

Thermal interface material with support structure

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING A PRINTED CIRCUIT BOARD

Semiconductor device and method for designing the same

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Structure and method for sealing cavity of micro-electro-mechanical device

Methods and systems for packaging integrated circuits

SEMICONDUCTOR DEVICE

Stack type semiconductor package apparatus

Semiconductor package

Integrated circuit packaging system with an interposer and method of manufacture thereof

Integrated circuit packaging system with layered packaging and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and wire bonding method

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing