CHIP ARRANGEMENTS

Stacked via structure

Thermal Management in Integrated Circuit Using Phononic Bandgap Structure

Bonding apparatus and method for using the same

Multi-chip package and method of providing die-to-die interconnects in same

Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold

Semiconductor components having conductive vias with aligned back side conductors

Packaging photon building blocks with top side connections and interconnect structure

Sawing underfill in packaging processes

Low warpage high density trench capacitor

Process for Making a Semiconductor System

INTEGRATED SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME

Semiconductor assemblies using edge stacking and methods of manufacturing the same

Semiconductor structure and manufacturing method thereof

Floating die package

Packaging of a semiconductor device with a plurality of leads

Chip package, method of forming a chip package and method of forming an electrical contact

Semiconductor device with sealed semiconductor chip

Reflector markers and systems and methods for identifying and locating them

Single-package wireless communication device

Sawing underfill in packaging processes

Pad design for reliability enhancement in packages

LED assembly with omnidirectional light field

Package-on-package assembly with wire bonds to encapsulation surface

Interconnect structure and method of forming same

Memory device comprising programmable command-and-address and/or data interfaces

Methods related to metallization of ceramic substrates for shielding applications

Stacking integrated circuits containing serializer and deserializer blocks using through

Package-on-package assembly with wire bond vias

Bump structure having a side recess and semiconductor structure including the same

Integrated circuit package pad and methods of forming

Switching device and electronic circuit

Light-emitting apparatus

Semiconductor image sensor module and method of manufacturing the same

Semiconductor device with transmissive layer and manufacturing method thereof

Optoelectronic device having conductor arrangement structures non-overlapped with heat dissipation pads

Leadframe leads having fully plated end faces

Sintering tool and method for sintering an electronic subassembly

Semiconductor device with a semiconductor chip connected in a flip chip manner

Semiconductor device

Method of manufacturing semiconductor devices, corresponding device and circuit

MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME

Method for interconnecting stacked semiconductor devices

Semiconductor devices comprising getter layers and methods of making and using the same

Lid structure and semiconductor device package including the same

Integrated circuit packages and methods of forming same

Stacked semiconductor device assembly in computer system

Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same

Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond

Semiconductor device assemblies including multiple stacks of different semiconductor dies

Thermal interface material having different thicknesses in packages

X-ray system, semiconductor package, and tray having X-ray absorption filter

Pad design for reliability enhancement in packages

Chip-on-film and display including the same

Method and device for controlling operation using temperature deviation in multi-chip package

Semiconductor package with layer structures, antenna layer and electronic component

Photonics fabrication process performance improvement

Light-emitting package

Manufacturing method of micro-LED display panel

Lead frame and method of fabricating the same

High voltage monolithic LED chip with improved reliability

Semiconductor device, manufacturing method thereof, and electronic apparatus

Semiconductor device and electronic apparatus

Multi-chip modules including stacked semiconductor dice

Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods

Package structure

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS OF MAKING

Electrically testable integrated circuit packaging

Amplifier module

Bond pad structure for bonding improvement

Multi-chip package and method of providing die-to-die interconnects in same

Stacked via structure

Semiconductor device having reduced bump height variation

Chip embedded integrated voltage regulator

Semiconductor package and fabricating method thereof

Package-on-package structure

Low cost package warpage solution

Semiconductor packages and methods of forming same

Through via structure and method

Chip on film package and display apparatus having ihe same

Wide injection range open circuit voltage decay system

Semiconductor device

Receiver optical module and process of assembling the same

Display apparatus and manufacturing method thereof

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

Thermal conductivity for integrated circuit packaging

Stress reduction apparatus and method

Memory devices with controllers under memory packages and associated systems and methods

Dual-sided radio-frequency package with overmold structure

Semiconductor package structure on a PCB and semiconductor module including the same

Multi-die memory device

Method for determining the resistance temperature characteristic of a ceramic glow plug

Packages with Si-substrate-free interposer and method forming same

Semiconductor devices and methods of making the same

Microelectronic devices with through-substrate interconnects and associated methods of manufacturing

Semiconductor package and method of fabricating the same

Contoured package-on-package joint

Package structure

Semiconductor package and manufacturing method of the same

Non-vertical through-via in package

Film for a package substrate

Magneto-resistive effect element

LED light bulb

Package-on-package (PoP) semiconductor package and electronic system including the same

Package structure and method of manufacturing the same

Chip package and manufacturing method thereof

Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units

Sensor package and manufacturing method thereof

Wafer level chip scale packaging intermediate structure apparatus and method

Light emitting device

Semiconductor structure and manufacturing method thereof

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY

Redistribution layer structures for integrated circuit package

Semiconductor arrangement having a circuit board with a patterned metallization layer

Integrated circuit package with pre-wetted contact sidewall surfaces

Illumination device

Semiconductor packages and methods of forming the same

Stacked semiconductor die assemblies with die support members and associated systems and methods

Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration

Radio frequency modules

Universal surface-mount semiconductor package

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Die stack assembly using an edge separation structure for connectivity through a die of the stack

Semiconductor device

Multi-die package with bridge layer

Isolator integrated circuits with package structure cavity and fabrication methods

Stacked integrated circuits with redistribution lines

Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring

Method for manufacturing semiconductor package structure

Methods related to shielded module having compression overmold

Semiconductor package having routable encapsulated conductive substrate and method

Smart packaging for improved medication regimen compliance

Manufacturing method of sensor chip package structure

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES

Package structure and manufacturing method thereof

Semiconductor package

Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops

Integrated circuit packaging

Semiconductor device and method for manufacturing the same

Manufacturable RGB laser diode source and system

Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES

Semiconductor device package and a method of manufacturing the same

Package-on-package structure

Semiconductor device and a method of manufacturing the same

Semiconductor chip package having optical interface

Apparatus related to conformal coating implemented with surface mount devices

Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages

Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device

Method for forming interconnect structure

Packages with through-vias having tapered ends

Gallium and nitrogen containing laser module configured for phosphor pumping

Semiconductor package having a high reliability

Semiconductor Package

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS

Semiconductor device using EMC wafer support system and fabricating method thereof

Semiconductor die package including a one-body clip

Optical module having multiple laser diode devices and a support member

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

Fault detection and isolation in generator modules

Semiconductor device having a junction portion contacting a Schottky metal

Three-dimensional package structure

Method and device for controlling operation using temperature deviation in multi-chip package

Semiconductor package and method for fabricating base for semiconductor package

Bonding pads with thermal pathways

Isolation cavities in semiconductor devices

Handler bonding and debonding for semiconductor dies

Reflector markers and systems and methods for identifying and locating them

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS

Semiconductor device package including embedded conductive elements

Package-on-package assembly with wire bonds to encapsulation surface

Radio-frequency isolation using backside cavities

INTEGRATED CIRCUIT CHIP PACKAGING

INTEGRATED CIRCUIT CHIP PACKAGING

DEVICES RELATED TO SHIELDED RADIO-FREQUENCY MODULES HAVING REDUCED AREA

Methods and modules related to shielded lead frame packages

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and process for fabricating the same

Semiconductor package device and method of manufacturing the same

Method of fastening and electroconductive connecting a chip module to a chip card

Semiconductor devices with package-level configurability

Semiconductor device and manufacturing method of the same

METHOD OF FABRICATING ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS

Fabrication method of semiconductor package with stacked semiconductor chips

Package on package structure and method for forming the same

Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof

Integrated circuit package assembly

Semiconductor device having stacked chips

Dummy structure of stacked and bonded semiconductor device

Semiconductor structure and manufacturing method thereof

Scalable semiconductor interposer integration

Method for fabricating carrier-free semiconductor package

Systems and methods for depopulating pins from contactor test sockets for packaged semiconductor devices

Post-passivation interconnect structure

Stacked semiconductor device

Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode

Manufacturing method of package structure

Electrode configuration for an optoelectronic device

Electronic device

Stacking integrated circuits containing serializer and deserializer blocks using through via

Semiconductor die connection system and method

Package structure and method of forming the same

Wire bond wires for interference shielding

Stacked semiconductor device assembly in computer system

Single-package wireless communication device

Stacked semiconductor die assemblies with support members and associated systems and methods

Mechanisms for forming bonding structures

Semiconductor device with a semiconductor chip connected in a flip chip manner

Methods of forming connector pad structures, interconnect structures, and structures thereof

Semiconductor package

Bonded structures for package and substrate

Semiconductor device and package assembly including the same

Electric power conversion apparatus

Light-emitting package

Alignment mark design for packages

Pad structure design in fan-out package

Package structure of a folding magnetic coupling isolator, leadframe component, and leadframe structure

Integrated circuit packages and methods for forming the same

MAGNETIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, BONDING STRUCTURE BETWEEN MAGNETIC SUBSTRATE AND INSULATING MATERIAL, AND CHIP COMPONENT HAVING THE BONDING STRUCTURE

Semiconductor device with optically-transmissive layer and manufacturing method thereof

Method of Manufacturing a Multi-Chip Semiconductor Power Device

Impedance controlled electrical interconnection employing meta-materials

Integrated circuit package pad and methods of forming

Multi-chip package and method of providing die-to-die interconnects in same

Semiconductor device with conductive shielding structure

Power semiconductor device and power conversion device

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor package having an isolation wall to reduce electromagnetic coupling

Plurality of lead frames electrically connected to inductor chip

Scheme for connector site spacing and resulting structures

Sensor module

DEVICES AND METHODS RELATED TO SINGULATED RADIO-FREQUENCY DEVICES

Apparatus for communication across a capacitively coupled channel

Method and structure of three-dimensional chip stacking

Integrated circuit structure having dies with connectors of different sizes

Bridge interconnection with layered interconnect structures

Packaging photon building blocks with top side connections and interconnect structure

Integrated circuit package including miniature antenna

Multi-die fine grain integrated voltage regulation

Dynamic random access memory (DRAM) mounts

Semiconductor package

Connecting techniques for stacked substrates

Connection structure for stacked substrates

Wire bonding between isolation capacitors for multichip modules

Die placement and coupling apparatus

Memory package including buffer, expansion memory module, and multi-module memory system

Semiconductor device assemblies including multiple shingled stacks of semiconductor dies

Substrate with embedded stacked through-silicon via die

Package with metal-insulator-metal capacitor and method of manufacturing the same

3D vertical FET with top and bottom gate contacts

Power module, power converter and manufacturing method of power module

Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer

Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices

Semiconductor device structure and method for forming the same

Integrated circuit packages and methods of forming same

Positional relationship among components of semiconductor device

Packaging structures with improved adhesion and strength

Inverted leads for packaged isolation devices

Method of manufacturing a semiconductor device

Semiconductor device packages, packaging methods, and packaged semiconductor devices

Stress reduction apparatus and method

Electric magnetic shielding structure in packages

Integrated fan-out packages with embedded heat dissipation structure

Thermal interface material layer and package-on-package device including the same

Planarization of semiconductor packages and structures resulting therefrom

Stray field suppression in magnetic sensor Wheatstone bridges

Semiconductor device with island and associated leads

Wireless communication with dielectric medium

Semiconductor device, manufacturing method thereof, and electronic apparatus

Memories and memory components with interconnected and redundant data interfaces

Power supply circuit and related methods for generating a power supply voltage in a semiconductor package

Display device

Wedge bonding tools, wedge bonding systems, and related methods

Hybrid bonding with uniform pattern density

Shielded electronic component package

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation

Packages with Si-substrate-free interposer and method forming same

Package-on-package semiconductor assemblies and methods of manufacturing the same

Chip on film package

Package-on-package structures and methods for forming the same

Integrated circuit structure

Semiconductor package

Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Semiconductor device and method of manufacture

Redistribution layer structures for integrated circuit package

Semiconductor device with lead terminals having portions thereof extending obliquely

QFN pin routing thru lead frame etching

CRYSTAL PACKAGING WITH CONDUCTIVE PILLARS

Integrated circuit package and methods of forming same

Method, apparatus and system to interconnect packaged integrated circuit dies

Semiconductor assemblies using edge stacking and methods of manufacturing the same

Packaging mechanisms for dies with different sizes of connectors

Low cost package warpage solution

Semiconductor package and method of manufacturing the semiconductor package

Stacked semiconductor package

Solution for reducing poor contact in InFO package

Semiconductor device and method for manufacturing the same

LED filament and led light bulb