212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Semiconductor devices and methods of manufacturing the same
#3002Composite contact plug structure and method of making same
#3003Method for preparing film patterns
#3004Method and apparatus of a three dimensional integrated circuit
#3005Display module and system applications
#3006Optoelectronic semiconductor component and adaptive headlight for a motor vehicle
#3007Slip chip device and methods
#3008Image sensor for endoscopic use
#3009Inkjet system for printing a printed circuit board
#3010Semiconductor image sensor module and method of manufacturing the same
#3011Vehicular camera and lens assembly
#3012Compact laser device
#3013Socket contact techniques and configurations
#3014Luminescent ceramic for a light emitting device
#3015Contact structure of semiconductor device
#3016Method for manufacturing isolation structure integrated with semiconductor device
#3017Low temperature fabrication of lateral thin film varistor
#3018Method for making semiconductor device with stacked analog components in back end of line (BEOL) regions
#3019Organic light emitting diode array substrate, its manufacturing method, and display device
#3020Organic light-emitting diode display with bottom shields
#3021Light emitting diode
#3022Flexible display panel
#3023Semiconductor device and method of manufacturing the same
#3024Three-dimensional (3D) semiconductor device
#3025Non-volatile semiconductor memory device and manufacturing method thereof
#3026Integrated circuit structure with active and passive devices in different tiers
#3027Methods of making integrated circuit assembly with faraday cage and including a conductive ring
#3028Capping layer for improved deposition selectivity
#3029Copper etching integration scheme
#3030Inductor for semiconductor integrated circuit
#3031Tape for electronic devices with reinforced lead crack
#3032Onboard electronic device
#3033Disposable pillars for contact information
#3034Semiconductor device and semiconductor device fabrication method
#3035Tunable inductor arrangement, transceiver, method and computer program
#3036Array substrate, method of producing the same, and display apparatus
#3037Two piece aluminum heat sink
#3038Process for producing carbon nanotubes and method for forming wiring
#3039Conductive compositions and methods of using them
#3040Silicon nitride substrate and silicon nitride circuit board using the same
#3041System and method for cooling information handling resources
#3042Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
#3043Bonded body and power module substrate
#3044Light emitting diode
#3045Optoelectronic component and method for the production thereof
#3046Partial spacers for wafer-level fabricated modules
#3047Thin film transistor substrate
#3048Method of manufacturing semiconductor device and semiconductor device
#3049Method of forming MOSFET structure
#3050Preventing buried oxide gouging during planar and FinFET processing on SOI
#3051Array substrate comprising a power wire layer and manufacturing method thereof
#3052Semiconductor device
#3053Dual-series varactor EPI
#3054Semiconductor integrated circuit device
#3055Packages with stacked dies and methods of forming the same
#3056Semiconductor device
#3057On-chip semiconductor device having enhanced variability
#3058Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
#3059Semiconductor device with air gap and method for fabricating the same
#3060Semiconductor devices having staggered air gaps
#3061Systems and methods to enhance passivation integrity
#3062Interconnect structure having large self-aligned vias
#3063Semiconductor device and method for manufacturing the same
#3064Conformal low temperature hermetic dielectric diffusion barriers
#3065Semiconductor device including air gaps and method of fabricating the same
#3066LED die dispersal in displays and light panels with preserving neighboring relationship
#3067Media device enclosure system
#3068Planar cavity MEMS and related structures, methods of manufacture and design structures
#3069Heat exchange device based on a pulsating heat pipe
#3070Partially depopulated interconnection arrays for packaged semiconductor devices and printed circuit boards
#3071Method of manufacturing an alectronic circuit
#3072Top port multi-part surface mount silicon condenser microphone
#3073Semiconductor chip using logic circuitry including complementary FETs for reverse engineering protection
#3074LED module with high index lens
#3075Method of manufacturing thin-film transistor substrate
#3076Three-dimensional (3D) semiconductor devices and methods of fabricating 3D semiconductor devices
#3077Semiconductor arrangement and formation thereof
#3078Wafer with improved plating current distribution
#3079Semiconductor device
#3080Method for positioning a carrier with electronic components and electronic component produced with such method
#3081Reduced height M1 metal lines for local on-chip routing
#3082Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium
#3083Perforated contact electrode on vertical nanowire array
#3084Thermal interface material and method of making and using the same
#3085Heat exchanger for cooling electric element
#3086Arrangement with a power semiconductor module, having a DC-voltage busbar and a capacitor
#3087Digital camera with multiple pipeline signal processors
#3088Light emitting device including a metal substrate for high heat dissipation and increased light efficiency
#3089Light emitting device
#3090LIGHT EMITTING DIODE PACKAGE
#3091Optoelectronic device
#3092Semiconductor devices with shaped portions of elevated source/drain regions
#3093Gated diode in a press-fit housing and an alternator assembly having a gated diode arranged in a load path
#3094Flexible GAN light-emitting diodes
#3095Display device
#3096Anti-fuse of semiconductor device, semiconductor module and system each including the semiconductor device, and method for forming the anti-fuse
#3097Etchstop layers and capacitors
#3098Integrated circuit having a MOM capacitor and method of making same
#3099Wafer alignment methods in die sawing process
#3100Microelectronic devices with through-silicon vias and associated methods of manufacturing
#3101Power semiconductor device
#3102Apparatus comprising a functional component likely to be thermally overloaded during the operation thereof and a system for cooling the component
#3103Variable heat conductor
#3104Methods, apparatus, and systems for secure demand paging and other paging operations for processor devices
#3105Heat-radiating system
#3106Silicone gel composition and silicone gel cured product
#3107Method for joining metallic member and resin member to each other, manufacturing method for cooler, and cooler
#3108Adaptive clocking scheme
#3109On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures
#3110Light-emitting dies incorporating wavelength-conversion materials and related methods
#3111Method for producing an optoelectronic semiconductor chip, and optoelectronic semiconductor chip
#3112Optoelectronic semiconductor chip
#3113Display device with separation member including steps
#3114Pixel of a multi-stacked CMOS image sensor and method of manufacturing the same
#3115Stack of horizontally extending and vertically overlapping features, methods of forming circuitry components, and methods of forming an array of memory cells
#3116Light emitting device
#3117Special construct for continuous non-uniform RX FinFET standard cells
#3118Power FET with a resonant transistor gate
#3119Semiconductor device and layout method thereof
#3120Electric power converter and power module
#3121Optoelectronic semiconductor chip and optoelectronic component
#3122Semiconductor device and manufacturing method, and electronic apparatus
#3123Structure and method for a low-k dielectric with pillar-type air-gaps
#3124Electro-migration enhancing method for self-forming barrier process in copper mettalization
#3125Semiconductor device and method for manufacturing same
#3126Interconnect wires including relatively low resistivity cores
#3127Semiconductor device and fabricating process for the same
#3128Metal wiring of semiconductor device and method for manufacturing the same
#3129Methods of fabricating semiconductor devices including supporting patterns in gap regions between conductive patterns
#3130Semiconductor device and method of fabricating the same
#3131Semiconductor devices and methods of fabricating the same
#3132Tunable inductor arrangement, transceiver, method and computer program
#3133Distributed LC resonant tanks clock tree synthesis
#3134Polymer and composition including same, and adhesive composition
#3135Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate
#3136Thermal insulation sheet and method for producing same
#3137Structure for a heat transfer interface and method of manufacturing the same
#3138Chip package, package substrate and manufacturing method thereof
#3139Power semiconductor module arrangement
#3140Substrate structure and the process manufacturing the same
#3141Optically transmissive electronic device having an optically transmissive light emitting device to transmit optical signal to a second optically transmissive light receiving device through a first optically transmissive light receiving device
#3142Optical module for reducing crosstalk
#3143High-frequency semiconductor amplifier
#3144High-frequency semiconductor amplifier
#3145Semiconductor stack for converter with snubber capacitors
#3146Method of making current sensors
#3147Light-emitting device
#3148Display light sources with quantum dots
#3149Optoelectronic component and method of production thereof
#3150Method of producing a semiconductor body
#3151Method for producing optoelectronic devices comprising light-emitting diodes
#3152Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions
#3153Compound semiconductor device and method for manufacturing the same
#3154Semiconductor device
#3155Integrated inductor structure and method for manufacturing the same
#3156Display module
#3157Organic light emitting diode display
#3158Display device using semiconductor light emitting devices and method for manufacturing the same
#3159Solid-state imaging device, manufacturing method of solid-state imaging device, manufacturing method of semiconductor device, semiconductor device, and electronic device
#3160Display device and manufacturing method thereof
#3161Semiconductor memory device
#3162Semiconductor device having contact pads
#3163Radiation-emitting semiconductor chip and method of producing radiation-emitting semiconductor chips
#3164LED chip having ESD protection
#3165Semiconductor package including exposed connecting stubs
#3166Semiconductor device packages with improved thermal management and related methods
#3167Damascene re-distribution layer (RDL) in fan out split die application
#3168Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same
#3169Alignment marks in non-STI isolation formation and methods of forming the same
#3170Semiconductor packages and package modules using the same
#3171Semiconductor device, electronic component, and electronic device including memory cell comprising first transistor, second transistor and capacitor
#3172Semiconductor device and manufacturing method thereof
#3173Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks
#3174Chip-on-film package and display device including the same
#3175Lead frame
#3176Semiconductor device and structure
#3177Patterning approach for improved via landing profile
#3178Method of fabricating a semiconductor device with reduced leak paths
#3179Interconnect structure and manufacturing method thereof
#3180Intermediate layer for copper structuring and methods of formation thereof
#3181Plasma treatment on metal-oxide TFT
#3182Microelectronic chip with multiple contacts
#3183Device sandwich structured composite housing
#3184Packaged opto-electronic module
#3185Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
#3186Adhesive agent composition for multilayer semiconductor
#3187Curable resin composition, cured product thereof, and semiconductor device using the same
#3188Insert-moulded lead frame and method for the production thereof
#3189Method of manufacturing resin sealing module, and resin sealing module
#3190LED package for lamp of vehicle
#3191Semiconductor device with surge current protection
#3192Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance
#3193High-voltage solid-state transducers and associated systems and methods
#3194Manufacturing method of LED carrier
#3195Semiconductor device and method for manufacturing same
#3196Semiconductor device and method of forming vertical structure
#3197Implantation formed metal-insulator-semiconductor (MIS) contacts
#3198Implantation formed metal-insulator-semiconductor (MIS) contacts
#3199Methods for manufacturing integrated multi-layer magnetic films
#3200Electrical connection structure with via hole, array substrate and display device
#3201Non-volatile memory with silicided bit line contacts
#3202Convex shaped thin-film transistor device having elongated channel over insulating layer in a groove of a semiconductor substrate
#3203Semiconductor device for preventing field inversion
#3204Semiconductor device layout, memory device layout, and method of manufacturing semiconductor device
#32053D integrated circuit
#3206Device and method for generating identification key
#3207Device and method for generating identification key
#3208Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance
#3209System, method and apparatus to relieve stresses in a semiconductor wafer caused by uneven internal metallization layers
#3210Process substrate with crystal orientation mark, method of detecting crystal orientation, and reading device of crystal orientation mark
#3211Integrated circuit devices and methods
#3212Power amplifier package and method thereof
#3213Fishbone structure enhancing spacing with adjacent conductive line in power network
#3214Semiconductor device and method of manufacturing the same
#3215Flexible display and method of manufacturing the same
#3216Electronic package
#3217Isolation method for a stand alone high voltage laterally-diffused metal-oxide semiconductor (LDMOS) transistor
#3218Semiconductor device
#3219Lead frame, electronic control device using lead frame, and lead-frame mounting method
#3220Manufacturing method of semiconductor device and semiconductor device
#3221Semiconductor package structure and method for forming the same
#3222Cooler
#3223Dual-sided die packages
#3224Method for performing deep n-typed well-correlated (DNW-correlated) antenna rule check of integrated circuit and semiconductor structure complying with DNW-correlated antenna rule
#3225Etch damage and ESL free dual damascene metal interconnect
#3226Methods and structures for forming microstrip transmission lines on thin silicon carbide on insulator (SICOI) wafers
#3227Chip capacitor, circuit assembly, and electronic device
#3228Electro-static discharge and electric overstress protection strategy for micro-chip array on panel
#3229Visual feedback for inspection algorithms and filters
#3230Multi-layer circuit using metal layers as a moisture diffusion barrier for electrical performance
#3231Apparatuses and related methods for staggering power-up of a stack of semiconductor dies
#3232Tailoring air cooled heat exchanger geometry to achieve environmental protection
#3233Multi-stage sealing system for use in a motor vehicle control unit
#3234Digital cameras with direct luminance and chrominance detection
#3235Integrated circuit with shared electrode energy storage devices
#3236Optoelectronic element
#3237Structures incorporating and methods of forming metal lines including carbon
#3238Light emitting device
#3239Semiconductor optoelectronic device with an insulative protection layer and the manufacturing method thereof
#3240Semiconductor light emitting device and method of fabricating the same
#3241Integrated circuit devices having air-gap spacers above gate electrodes
#3242MOSFET having dual-gate cells with an integrated channel diode
#3243Semiconductor device and a method for manufacturing a semiconductor device
#3244Integrated circuit heat dissipation using nanostructures
#3245Semiconductor device having field plate structures and gate electrode structures between the field plate structures
#3246Concentric capacitor structure
#3247Method for preventing copper contamination in metal-insulator-metal (MIM) capacitors
#3248Solid-state imaging device and electronic apparatus
#32493DIC interconnect apparatus and method
#3250Imaging device, imaging apparatus, production apparatus and method, and semiconductor device
#3251Techniques to avoid or limit implant punch through in split gate flash memory devices
#3252Vertical memory devices and methods of manufacturing the same
#3253CMOS transistor, semiconductor device including the transistor, and semiconductor module including the device
#3254Semiconductor device and formation method thereof
#3255Inverted optical device
#3256LED packaging structure having stacked arrangement of protection element and LED chip
#3257Three dimensional integrated circuit
#3258Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
#3259Semiconductor system, device and structure
#3260Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same
#3261Methods and apparatus of packaging with interposers
#3262Dicing method for power transistors
#3263Semiconductor die and die cutting method
#3264Semiconductor device and manufacturing method thereof
#3265Semiconductor device with reduced via resistance
#3266Semiconductor device and semiconductor device manufacturing method using patterning and dry etching
#3267Size-filtered multimetal structures
#3268Dielectric thin film element, antifuse element, and method of producing dielectric thin film element
#3269Tank circuit structure and method of making the same
#3270Self-aligned repairing process for barrier layer
#3271Package carrier and manufacturing method thereof
#3272Semiconductor device, related manufacturing method, and related electronic device
#3273Integrated circuit heat dissipation using nanostructures
#3274Method for manufacturing semiconductor structure
#3275Backside processed semiconductor device
#3276Self-aligned via and plug patterning for back end of line (BEOL) interconnects
#3277Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same
#3278Metal deposition on substrates
#3279Method of operating an integrated switchable capacitive device
#3280Dynamic beam aperture control to reduce radiation dose using collimator
#3281Semiconductor package with PoP structure and refresh control method thereof
#3282Display panel and method of manufacturing the same
#3283Imaging device, manufacturing apparatus, manufacturing method, and electronic apparatus
#3284Method and system for heterogeneous substrate bonding for photonic integration
#3285Sensor package
#3286Unitary housing for electronic device
#3287Display device and electronic apparatus with antireflection function
#3288Light emitting diodes with enhanced thermal sinking and associated methods of operation
#3289White emitting light source and luminescent material
#3290Structure of a reflective electrode and an OHMIC layer of a light emitting device
#3291Cooling system for high performance solar concentrators
#3292Use of metal phosphorus in metallization of photovoltaic devices and method of fabricating same
#3293Methods and apparatus for glass removal in CMOS image sensors
#3294Optical glass
#3295Semiconductor memory device and method for manufacturing same
#3296Semiconductor device
#3297Semiconductor devices having silicide and methods of manufacturing the same
#3298Monolithic three-dimensional (3D) ICs with local inter-level interconnects
#3299Power gating for three dimensional integrated circuits (3DIC)
#3300Method of manufacturing semiconductor device