212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Integrated circuit with sensor and method of manufacturing such an integrated circuit
#3302Method of manufacturing semiconductor device
#3303Method and apparatus that processes an optoelectronic component
#3304Support structure for barrier layer of semiconductor device
#3305Stacked via structure for metal fuse applications
#3306Electronic device including a semiconductor memory unit that includes cell mats of a plurality of planes vertically stacked
#3307Stacked multilayer structure and manufacturing method thereof
#3308Semiconductor device structures comprising polycrystalline CVD diamond with improved near-substrate thermal conductivity
#3309Semiconductor device and manufacturing method thereof
#3310Self-aligned via interconnect structures
#3311Subtractive self-aligned via and plug patterning for back end of line (BEOL) interconnects
#3312Semiconductor device with reduced via resistance
#3313Semiconductor device with air gap and method of fabricating the same
#3314Interconnect structures incorporating air-gap spacers
#3315Micro device transfer head array
#3316Fuse element programming circuit and method
#3317Through-substrate optical coupling to photonics chips
#3318Apparatuses and methods for die seal crack detection
#3319Thermally conductive sheet
#3320Silicone resin composition for optical semiconductors
#3321Cold plate, forming in particular a structural part of an item of equipment having heat-generating components
#3322Method for producing ceramic circuit board
#3323Semiconductor device
#3324Warpage-preventing structure of substrate
#3325Device and method for determining the temperature of a heat sink
#3326Integrated circuit layout wiring for multi-core chips
#3327Semiconductor power module and power conversion apparatus using the same
#3328Integrated package insertion and loading mechanism (iPILM)
#3329Package, light-emitting device, and method for manufacturing the same
#3330Shaped phosphor to reduce repeated reflections
#3331Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same
#3332Light emitting device, light emitting device array and lighting apparatus including the same
#3333FinFET low resistivity contact formation method
#3334Radio frequency LDMOS device and a fabrication method therefor
#3335Semiconductor device having via hole coated in side surfaces with heat treated nitride metal and method to form the same
#3336Integrated circuits including magnetic tunnel junctions for magnetoresistive random-access memory and methods for fabricating the same
#3337Light-emitting device and method for manufacturing the same
#3338Image sensor
#3339Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects
#3340Analog circuit and semiconductor device
#3341LTPS TFT substrate structure and method of forming the same
#3342Metal on elongated contacts
#3343Dual-port SRAM devices and methods of manufacturing the same
#3344Super-self-aligned contacts and method for making the same
#3345Method of manufacturing semiconductor device
#3346Light emitting device
#3347Method for producing an optoelectronic semiconductor chip
#3348Light emitting device
#3349Display device using semiconductor light emitting device
#3350Semiconductor device and manufacturing method therefor
#3351Semiconductor device and method of manufacturing same
#3352Chip part having passive elements on a common substrate
#3353Multiple edge enabled patterning
#3354Method for forming identification marks on refractory material single crystal substrate, and refractory material single crystal substrate
#3355Contact structure and formation thereof
#3356Semiconductor structures with isolated ohmic trenches and stand-alone isolation trenches and related method
#3357Interconnect structure with misaligned metal lines coupled using different interconnect layer
#3358Semiconductor device with self-protecting fuse and method of fabricating the same
#3359Chip package having a laser stop structure
#3360Interconnection structure and manufacturing method thereof
#3361Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regions
#3362Package apparatus and manufacturing method thereof
#3363Functional panel, light-emitting panel, display panel, and sensor panel
#3364Feedthrough assemblies
#3365Electronic device
#3366Devices, systems and methods for manufacturing through-substrate vias and front-side structures
#3367Device without zero mark layer
#3368Cooler and semiconductor device having cooler
#3369Heat spreader with high heat flux and high thermal conductivity
#3370Semiconductor package with cantilever pads
#3371Self-limiting chemical vapor deposition and atomic layer deposition methods
#3372Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device
#3373Electrical switch and mounting assembly therefor
#3374Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects
#3375Physical unclonable interconnect function array
#3376Reducing defects and improving reliability of BEOL metal fill
#3377Systems and methods for producing flat surfaces in interconnect structures
#3378Method for forming metal-semiconductor alloy using hydrogen plasma
#3379Semiconductor memory device with a power gating circuit for reducing an instantaneous voltage drop
#3380Secure data entry device
#3381Detection system and detector array interconnect assemblies
#3382Flexible thermal ground plane and manufacturing the same
#3383LED module, LED illumination means, and LED lamp for the energy-efficient reproduction of white light
#3384Substrates for semiconductor devices
#3385Wafer level package for a MEMS sensor device and corresponding manufacturing process
#3386Socket loading element and associated techniques and configurations
#3387Vehicular camera and lens assembly and method of manufacturing same
#3388Electrostatic discharge power clamp with fail-safe design
#3389Optoelectronic semiconductor component
#3390Light output device and method of manufacture
#3391Cross-talk suppression in Geiger-mode avalanche photodiodes
#3392Semiconductor device
#3393Semiconductor structure and fabrication method thereof
#3394Semiconductor devices with cavities
#3395Trench metal-insulator-metal capacitor with oxygen gettering layer
#3396Flexible display device with gate-in-panel circuit
#3397Radiation detection apparatus, manufacturing method therefor, and radiation detection system
#3398Deformable electronic device and methods of providing and using deformable electronic device
#3399Non-volatile push-pull non-volatile memory cell having reduced operation disturb and process for manufacturing same
#3400Integrated circuit having spare circuit cells
#3401Semiconductor module and semiconductor device
#3402Array substrate of organic light-emitting diodes and method for packaging the same
#3403Non-contacting inductive interconnects
#3404Structure with air gap crack stop
#3405Discrete component backward traceability and semiconductor device forward traceability
#3406Electronic device and method for fabricating the same
#3407Microelectronic devices with multi-layer package surface conductors and methods of their fabrication
#3408Subtractive etch interconnects
#3409Semiconductor device
#3410Semiconductor devices having expanded recess for bit line contact
#3411Package stucture and method of fabricating the same
#3412Substrate core via structure
#3413Semiconductor device and method of making the same
#3414Ameliorated compound carrier board structure of flip-chip chip-scale package
#3415Semiconductor package structure
#3416Through substrate vias with improved connections
#3417Cooling device for a current converter module
#3418Compositions and methods for semiconductor processing and devices formed therefrom
#3419Crimping power module
#3420Self-aligned interconnection for integrated circuits
#3421Semiconductor device with multi-layer metallization
#3422Titanium tungsten liner used with copper interconnects
#3423Semiconductor structure and fabrication method thereof
#3424Protective tape and method for manufacturing a semiconductor device using the same
#3425Method of producing bonded body and method of producing power module substrate
#3426Making a flat no-lead package with exposed electroplated side lead surfaces
#3427Method for designing vehicle controller-only semiconductor based on die and vehicle controller-only semiconductor by the same
#3428LED module including flexible printed circuit board with adhesive layers and LED lighting fixture
#3429LED lead frame array for general illumination
#3430Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof
#3431Epoxy resin composition and electronic component device
#3432Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device
#3433Method for manufacturing caulked assembly
#3434Wiring board, electronic component device, and method for manufacturing those
#3435Controlled transformation of non-transient electronics
#3436Architecture for on-die interconnect
#3437DRAM-based reconfigurable logic
#3438Reconfigurable logic architecture
#3439Amplifiers with a short phase path, packaged RF devices for use therein, and methods of manufacture thereof
#3440LED flip chip structures with extended contact pads formed by sintering silver
#3441Semiconductor chip that emits polarized radiation
#3442LED lens design with more uniform color-over-angle emission
#3443Light emitting device and method of manufacturing light emitting device
#3444Light emitting device and light emitting device package
#3445Method, a semiconductor detector, and a detector arrangement, for the detection of sunlight
#3446Semiconductor device and manufacturing method thereof
#3447Method of fabricating semiconductor device
#3448Backside through vias in a bonded structure
#3449Method of forming contacts for a memory device
#3450Semiconductor integrated circuit device having a standard cell which includes a fin
#3451Moisture blocking structure and/or a guard ring, a semiconductor device including the same, and a method of manufacturing the same
#3452Semiconductor device with electro-static discharge protection device above semiconductor device area
#3453Semiconductor integrated circuit device
#3454Light-emitting device with electrode extending layer
#3455Light emitting device
#3456LED lamp using ultra-small LED electrode assembly
#3457Tunable OLED lighting source
#3458Bonding method using bonding material
#3459PECVD protective layers for semiconductor devices
#3460Wafer processing method
#3461IC with insulating trench and related methods
#3462Laminates of integrated electromagnetically shieldable thin inductors, capacitors, and semiconductor chips
#3463Method of marking a semiconductor package
#3464Conductive structure and manufacturing method thereof, and electronic device and manufacturing method thereof
#3465Semiconductor device and method for fabricating the same
#3466Semiconductor device and manufacturing method of the same
#3467Designed-based interconnect structure in semiconductor structure
#3468Semiconductor device and method for manufacturing the same
#3469Semiconductor package
#3470Interposer with lattice construction and embedded conductive metal structures
#3471Wiring board and semiconductor device
#3472Semiconductor package, module substrate and semiconductor package module having the same
#3473Power semiconductor package having reduced form factor and increased current carrying capability
#3474Power field-effect transistor (FET), pre-driver, controller, and sense resistor integration for multi-phase power applications
#3475Land structure for semiconductor package and method therefor
#3476Insulating sheet and manufacturing method for same
#3477Circuit device and method of manufacturing a circuit device for controlling a transmission of a vehicle
#3478Semiconductor devices and methods for backside photo alignment
#3479Method for forming electroless metal through via
#3480Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applications
#3481Method of fabricating semiconductor device
#3482Stiffener tape for electronic assembly
#3483Method of positioning cutting member to semiconductor chip with grooves
#3484Power semiconductor module
#3485Synthetic jet delivering controlled flow to sensor system
#3486Screening of electronic components for detection of counterfeit articles using automated inspection system
#3487Light emitting device with phosphors
#3488Electrolyte, method of forming a copper layer and method of forming a chip
#3489Composite material part having a thermally and electrically conductive portion, and a method of fabricating such a part
#3490Protective film forming film, sheet for forming protective film, and inspection method
#3491Bonded body and power module substrate
#3492Heat sink
#3493Power module and method for manufacturing the same
#3494System for effectively transfering heat from electronic devices and method for forming the same
#3495Modular printed circuit board electrical integrity and uses
#3496Semiconductor device, manufacturing method of the same, and mobile phone
#3497Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof
#3498Surface acoustic wave device and manufacturing method therefor
#3499Wafer-level light emitting diode package and method of fabricating the same
#3500Light emitting device with improved extraction efficiency
#3501Semiconductor devices including an etch stop pattern and a sacrificial pattern with coplanar upper surfaces and a gate and a gap fill pattern with coplanar upper surfaces
#3502Semiconductor device
#3503Semiconductor device and method for forming the same
#3504Semiconductor device with low-K gate cap and self-aligned contact
#3505Semiconductor devices and methods for manufacturing the same
#3506Array substrate, display panel and display apparatus
#3507Photoelectric conversion device, method for manufacturing photoelectric conversion device, and electronic apparatus
#3508Semiconductor device, method for manufacturing the same, and electronic device
#3509Three-dimensional semiconductor memory device
#3510Three-dimensional semiconductor memory devices
#3511Three-dimensional memory structure having a back gate electrode
#3512Static random access memory (SRAM) bit cells with wordline landing pads split across boundary edges of the SRAM bit cells
#3513Static random access memory (SRAM) bit cells with wordlines on separate metal layers for increased performance, and related methods
#3514Semiconductor apparatus
#3515Optical sensor package and optical sensor assembly
#3516Monolithic stacked integrated circuits with a redundant layer for repairing defects
#3517Activating reactions in integrated circuits through electrical discharge
#3518Semiconductor device
#3519Optimized wires for resistance or electromigration
#3520Semiconductor device and fabrication method for the same
#3521Method for forming an electrical contact
#3522Interconnect structures with fully aligned vias
#3523Semiconductor device and manufacturing method thereof
#3524Semiconductor structure and fabrication method thereof
#3525Semiconductor device with an interconnection structure having interconnections with an interconnection density that decreases moving away from a cell semiconductor pattern
#3526Interposer with extruded feed-through vias
#3527Ceramic circuit board and electronic device
#3528Semiconductor device
#3529Laminate substrates having radial cut metallic planes
#3530Generating a wafer inspection process using bit failures and virtual inspection
#3531Semiconductor structure and fabrication method thereof
#3532Wafer processing method
#3533Self-aligned via interconnect structures
#3534Semiconductor device and method of manufacturing the same
#3535Method for manufacturing laminate, method for manufacturing sealed substrate laminate, sealed substrate laminate, and sealed substrate
#3536Manufacturing method of semiconductor package
#3537Gate electrodes with notches and methods for forming the same
#3538Superposed structure 3D orthogonal through substrate inductor
#3539Semiconductor apparatus including multichip package
#3540Reconfigurable power distribution system for three-dimensional integrated circuits
#3541Integrated circuit device comprising environment-hardened die and less-environment-hardened die
#3542Defect inspection method and defect inspection device
#3543Metal-based microchannel heat exchangers made by molding replication and assembly
#3544Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
#3545Light emitting arrangement with adapted output spectrum
#3546Thermal interface materials including thermally reversible gels
#3547Pin fin forming method
#3548Customized module lid
#3549Circuit board comprising an insulating diamond material
#3550Multilayer ceramic substrate and manufacturing thereof
#3551Heat dissipating structure
#3552Thermal energy storage with a phase-change material in a non-metal container
#3553Integrated circuit and layered circuit provided therewith
#3554Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system
#3555ESD protection circuit with stacked ESD cells having parallel active shunt
#3556Surface-textured encapsulations for use with light emitting diodes
#3557Light-emitting device and manufacturing method thereof
#3558Method of manufacturing a device by locally heating one or more metalization layers and by means of selective etching
#3559Passivated and faceted fin field effect transistor
#3560Self-aligned contacts
#3561Image sensor with tolerance optimizing interconnects
#3562Array of conductive lines individually extending transversally across and elevationally over a mid-portion of individual active area regions
#3563Semiconductor component including a short-circuit structure
#3564Light emitting diode device and light emitting device using the same
#3565Semiconductor chip
#3566X-ray obscuration film and related techniques
#3567Semiconductor device and method for manufacturing semiconductor device
#3568Different scaling ratio in FEOL/ MOL/ BEOL
#3569Opening fill process and structure formed thereby
#3570Metal-insulator-metal on-die capacitor with partial vias
#3571Through-substrate structure and method for fabricating the same
#3572Package for high-power semiconductor devices
#3573Void monitoring device for measurement of wafer temperature variations
#3574Method of making interconnect structure
#3575Contact module for optimizing emitter and contact resistance
#3576Interconnection structure including air gap, semiconductor device including air gap, and method of manufacturing the same
#3577Deposited material and method of formation
#3578Display device having improved electrostatic discharge protection
#3579Liquid crystal display device, semiconductor device, and electronic appliance
#3580Test circuit and method for controlling test circuit
#3581Semiconductor device and method of testing semiconductor device
#3582Molecular receptor-based chemical field-effect transistor (CHEMFET) devices, systems, and methods for in-situ nitrate monitoring in field soils
#3583Information carrying card comprising a cross-linked polymer composition, and method of making the same
#3584Thermosetting resin composition containing polymer having specific terminal structure
#3585Analyte monitoring device and methods of use
#3586Method of manufacturing heat conductive sheet, heat conductive sheet, and heat dissipation member
#3587Heat dissipation device
#3588High power W-band/F-band Schottky diode based frequency multipliers
#3589Linear row array integrated power combiner for RF power amplifiers
#3590Composition for encapsulation film, encapsulation film, and electronic device comprising the same
#3591Light emitting diode (LED) components including LED dies that are directly attached to lead frames
#3592Light emitting diode constructions and methods for making the same
#3593Light-source device and light-emitting device
#3594Compact emitter for warm dimming and color tunable lamp
#3595Wafer-level packaging method of BSI image sensors having different cutting processes
#3596Process for transferring circuit layer
#3597TFT substrates and the manufacturing method thereof
#3598Semiconductor device and method of manufacturing the same
#3599Switching element, semiconductor device, and semiconductor device manufacturing method
#3600Circuit configuration and manufacturing processes for vertical transient voltage suppressor (TVS) and EMI filter