ClassID:

212006

H01L2924/0002 - page 117 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#34801
20050179044
2005-08-18

Method for producing a display unit

#34802
20050179043
2005-08-18

Apparatus for producing a display unit

#34803
20050179035
2005-08-18

Apparatus and method to access a plurality of pn-junctions with a limited number of pins

#34804
20050178846
2005-08-18

Data storage device incorporating a two-dimensional code

#34805
20050178820
2005-08-18

Microsystem enclosure and method of hermetic sealing

#34806
20050178533
2005-08-18

Liquid cooling system and an electronic apparatus having the same therein

#34807
20050178532
2005-08-18

Structure for expanding thermal conducting performance of heat sink

#34808
20050178531
2005-08-18

Fluid passage arrangement of a heat absorber for use in a liquid-cooling type cooling apparatus

#34809
20050178530
2005-08-18

Heat absorber and its fabrication

#34810
20050178529
2005-08-18

Cooling system or electronic apparatus, and electronic apparatus using the same

#34811
20050178527
2005-08-18

Heat dissipation device for electronic device

#34812
20050178526
2005-08-18

Liquid cooling system, and electronic apparatus having the same therein

#34813
20050178004
2005-08-18

Heat absorber and its fabrication

#34814
20050178001
2005-08-18

Semiconductor package assembly and method for electrically isolating modules

#34815
20050177811
2005-08-11

Method of setting process parameter and method of setting process parameter and/or design rule

#34816
20050176835
2005-08-11

Thermally conductive thermoplastic resin compositions

#34817
20050176255
2005-08-11

Electronic package repair process

#34818
20050176225
2005-08-11

Method of manufacturing electronic device capable of controlling threshold voltage and ion implanter controller and system that perform the method

#34819
20050176184
2005-08-11

Semiconductor device fabrication method

#34820
20050176181
2005-08-11

Method for edge sealing barrier films

#34821
20050176180
2005-08-11

Die encapsulation using a porous carrier

#34822
20050176174
2005-08-11

Method of making an integrated circuit

#34823
20050175938
2005-08-11

Integrated thin film capacitor/inductor/interconnect system and method

#34824
20050175838
2005-08-11

Thermal interface material

#34825
20050175773
2005-08-11

Metal/ceramic bonding member and method for producing same

#34826
20050174770
2005-08-11

Light display structures

#34827
20050174740
2005-08-11

Heat radiation structure of semiconductor element and heat sink

#34828
20050174739
2005-08-11

Heat sink mounting device

#34829
20050174553
2005-08-11

Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device

#34830
20050174522
2005-08-11

Liquid crystal display device, method for fabricating the same, and portable telephone using the same

#34831
20050174240
2005-08-11

Transponder label

#34832
20050173812
2005-08-11

Microsystem enclosure and method of hermetic sealing

#34833
20050173805
2005-08-11

Micro pin grid array with pin motion isolation

#34834
20050173804
2005-08-11

Interlayer dielectric film, and method for forming the same and interconnection

#34835
20050173803
2005-08-11

Interlayer adhesion promoter for low k materials

#34836
20050173802
2005-08-11

Semiconductor device having a dummy pattern

#34837
20050173794
2005-08-11

Connector assembly

#34838
20050173792
2005-08-11

Structure for isolating thermal interface material

#34839
20050173789
2005-08-11

Ultra-thin wafer level stack packaging method

#34840
20050173775
2005-08-11

Integrated circuit device and fabrication method therefor

#34841
20050173765
2005-08-11

Device for electrostatic discharge protection and circuit thereof

#34842
20050173734
2005-08-11

Semiconductor device and display comprising same

#34843
20050173727
2005-08-11

Method for forming an ESD protection circuit

#34844
20050173723
2005-08-11

Light-emitting diode structure and a method for manufacturing the light-emitting diode

#34845
20050173699
2005-08-11

Semiconductor memory element and its lifetime operation starting device

#34846
20050173532
2005-08-11

Semiconductor chip with coil antenna and communication system

#34847
20050173239
2005-08-11

End point detection for sputtering and resputtering

#34848
20050173105
2005-08-11

Protect cover for a radiator

#34849
20050173098
2005-08-11

Three dimensional vapor chamber

#34850
20050173097
2005-08-11

Liquid circulation type cooling system

#34851
20050173096
2005-08-11

Heat dissipating device

#34852
20050173094
2005-08-11

Particulate aluminum nitride and method for producing thereof

#34853
20050173024
2005-08-11

Semiconductor device configured for reducing post-fabrication damage

#34854
20050172983
2005-08-11

Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber

#34855
20050172256
2005-08-04

Mask set for measuring an overlapping error and method of measuring an overlapping error using the same

#34856
20050172254
2005-08-04

Method and apparatus for supporting designing of LSI, and computer product

#34857
20050170759
2005-08-04

Differential planarization

#34858
20050170658
2005-08-04

Methods for preparing ball grid array substrates via use of a laser

#34859
20050170647
2005-08-04

Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby

#34860
20050170645
2005-08-04

Metal plating using seed film

#34861
20050170641
2005-08-04

Multilayered wiring structure, method of forming buried wiring, semiconductor device, method of manufacturing semiconductor device, semiconductor mounted device, and method of manufacturing semiconductor mounted device

#34862
20050170635
2005-08-04

Semiconductor device and manufacturing method thereof

#34863
20050170632
2005-08-04

Methods of manufacturing multi-level metal lines in semiconductor devices

#34864
20050170627
2005-08-04

Interconnect apparatus, system, and method

#34865
20050170626
2005-08-04

Semiconductor device and method for fabricating the device

#34866
20050170615
2005-08-04

Method of manufacturing a semiconductor device having an alignment mark

#34867
20050170605
2005-08-04

Airdome enclosure for components

#34868
20050170583
2005-08-04

Methods of fabricating MIM capacitors of semiconductor devices

#34869
20050170562
2005-08-04

Insert molding electronic devices

#34870
20050170560
2005-08-04

Method of manufacturing an electronic device

#34871
20050169620
2005-08-04

Optical device

#34872
20050169569
2005-08-04

Methods of fabricating integrated optoelectronic devices

#34873
20050169328
2005-08-04

Magnetically controlled heat sink

#34874
20050168950
2005-08-04

Semiconductor cooling device and stack of semiconductor cooling devices

#34875
20050168949
2005-08-04

Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules

#34876
20050168946
2005-08-04

Heat-emitting element cooling apparatus

#34877
20050168940
2005-08-04

Controlling thermal, acoustic, and/or electromagnetic properties of a computing device

#34878
20050168939
2005-08-04

Electronic component cooling apparatus

#34879
20050168917
2005-08-04

Method for manufacturing ceramic multilayer substrate

#34880
20050168914
2005-08-04

Integrated capacitor

#34881
20050168319
2005-08-04

Semiconductor resistor

#34882
20050168316
2005-08-04

Encapsulation with oxide bond to borosilicate mixture

#34883
20050168301
2005-08-04

Double-sided, edge-mounted stripline signal processing modules and modular network

#34884
20050168238
2005-08-04

Power plane system of high-speed digital circuit for suppressing ground bounce noise

#34885
20050167857
2005-08-04

Semiconductor wafer and a method for manufacturing a semiconductor wafer

#34886
20050167848
2005-08-04

Flip chip in leaded molded package and method of manufacture thereof

#34887
20050167846
2005-08-04

Semiconductor device and method of manufacturing the same

#34888
20050167845
2005-08-04

Semiconductor device and method of manufacturing the same

#34889
20050167844
2005-08-04

Semiconductor device

#34890
20050167843
2005-08-04

Method of fabricating semiconductor device having multilayer wiring structure

#34891
20050167842
2005-08-04

Semiconductor device

#34892
20050167841
2005-08-04

Use of supercritical fluid for low effective dielectric constant metallization

#34893
20050167839
2005-08-04

Structure comprising amorphous carbon film and method of forming thereof

#34894
20050167838
2005-08-04

Device and methodology for reducing effective dielectric constant in semiconductor devices

#34895
20050167825
2005-08-04

Fuse corner pad for an integrated circuit

#34896
20050167824
2005-08-04

Integrated circuit with protective moat

#34897
20050167820
2005-08-04

Method of fabricating a device for cooling a hot spot in micro system

#34898
20050167812
2005-08-04

Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device

#34899
20050167797
2005-08-04

Structure package

#34900
20050167796
2005-08-04

Miniaturised surface mount optoelectronic component

#34901
20050167792
2005-08-04

Method for producing an integral ceramic circuit board

#34902
20050167788
2005-08-04

Semiconductor device and method of manufacturing same

#34903
20050167782
2005-08-04

Semiconductor device including a transistor and a capacitor having an aligned transistor and capacitive element

#34904
20050167776
2005-08-04

Vertical-type power metal oxide semiconductor device with excess current protective function

#34905
20050167757
2005-08-04

Semiconductor device in which occurence of slips is suppressed

#34906
20050167755
2005-08-04

Microcircuit fabrication and interconnection

#34907
20050167753
2005-08-04

Insulated gate bipolar transistor and electrostatic discharge cell protection utilizing insulated gate bipolar tansistors

#34908
20050167728
2005-08-04

Single-poly 2-transistor based fuse element

#34909
20050167718
2005-08-04

Semiconductor device and dram integrated circuit device

#34910
20050167717
2005-08-04

Semiconductor memory device and method for manufacturing the same

#34911
20050167714
2005-08-04

Wiring layer structure for ferroelectric capacitor

#34912
20050167702
2005-08-04

Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding

#34913
20050167701
2005-08-04

Method for fabrication of semiconductor device

#34914
20050167694
2005-08-04

Semiconductor device with enhanced breakdown voltage

#34915
20050167693
2005-08-04

Formation of Ohmic contacts in III-nitride light emitting devices

#34916
20050167680
2005-08-04

Light-emitting diode structure with electrostatic discharge protection

#34917
20050167668
2005-08-04

Nonvolatile semiconductor memory having a charge accumulation layer connected to a gate

#34918
20050167647
2005-08-04

Thermal interface material with carbon nanotubes

#34919
20050167646
2005-08-04

Nanosubstrate with conductive zone and method for its selective preparation

#34920
20050167604
2005-08-04

Radiation image sensor and making method of same

#34921
20050167400
2005-08-04

System and method for decapsulating an encapsulated object

#34922
20050167136
2005-08-04

Insert molding electronic devices

#34923
20050167086
2005-08-04

Brazed wick for a heat transfer device and method of making same

#34924
20050167085
2005-08-04

Graphite-based heat sinks and method and apparatus for the manufacture thereof

#34925
20050167084
2005-08-04

Method for manufacturing graphite-base heat sinks

#34926
20050167083
2005-08-04

Heat sink including redundant fan sinks

#34927
20050167082
2005-08-04

Heat sink-type cooling device for an integrated circuit

#34928
20050166839
2005-08-04

Coating device, and coating method using said device

#34929
20050165195
2005-07-28

Solid silane coupling agent composition, process for producing the same, and resin composition containing the same

#34930
20050164529
2005-07-28

High-power LGA socket

#34931
20050164505
2005-07-28

Land grid array membrane

#34932
20050164489
2005-07-28

Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material

#34933
20050164483
2005-07-28

Method of forming solder bump with reduced surface defects

#34934
20050164481
2005-07-28

Method and structure for reducing contact aspect ratios

#34935
20050164451
2005-07-28

Twin insulator charge storage device operation and its fabrication method

#34936
20050164432
2005-07-28

Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices

#34937
20050164430
2005-07-28

Semiconductor device having a fuse

#34938
20050164416
2005-07-28

Method for processing an integrated circuit

#34939
20050164412
2005-07-28

Custom electrodes for molecular memory and logic devices

#34940
20050163981
2005-07-28

Method for bonding ceramic to copper, without creating a bow in the copper

#34941
20050163615
2005-07-28

Redundant fan system in a turbo cooler assembly

#34942
20050162970
2005-07-28

Magnetic memory device and producing method thereof

#34943
20050162950
2005-07-28

Stacked layered type semiconductor memory device

#34944
20050162946
2005-07-28

Stacked layered type semiconductor memory device

#34945
20050162833
2005-07-28

Transpiration cooled heat sink and a self contained coolant supply for same

#34946
20050162827
2005-07-28

Heat-dissipating device

#34947
20050162826
2005-07-28

Cooling body

#34948
20050162790
2005-07-28

Electrostatic discharge protection circuit

#34949
20050162604
2005-07-28

Display device

#34950
20050162180
2005-07-28

Semiconductor testing device

#34951
20050162160
2005-07-28

Concept of compensating for piezo influences on integrated circuitry

#34952
20050162093
2005-07-28

Light tube and power supply circuit

#34953
20050161836
2005-07-28

Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment

#34954
20050161834
2005-07-28

Adhesion by plasma conditioning of semiconductor chip

#34955
20050161831
2005-07-28

Method of manufacturing semiconductor device having through hole with adhesion layer thereon

#34956
20050161828
2005-07-28

Method for making a semiconductor device having increased conductive material reliability

#34957
20050161827
2005-07-28

Concentration graded carbon doped oxide

#34958
20050161825
2005-07-28

Embedded wiring in copper damascene with void suppressing structure

#34959
20050161824
2005-07-28

Semiconductor device including fine dummy patterns

#34960
20050161822
2005-07-28

Integrated circuit device

#34961
20050161820
2005-07-28

Integrated circuit with conductive grid for power distribution

#34962
20050161817
2005-07-28

Technique for forming embedded metal lines having increased resistance against stress-induced material transport

#34963
20050161807
2005-07-28

I/C package/thermal-solution retention mechanism with spring effect

#34964
20050161804
2005-07-28

Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate

#34965
20050161800
2005-07-28

Semiconductor device socket and semiconductor device connecting method using anisotropic conductive sheet

#34966
20050161773
2005-07-28

Rare earth-oxides, rare earth nitrides, rare earth phosphides and ternary alloys with silicon

#34967
20050161766
2005-07-28

Semiconductor device and method for fabricating the same

#34968
20050161765
2005-07-28

High-density metal capacitor using dual-damascene copper interconnect

#34969
20050161762
2005-07-28

Buried power buss utilized as a ground strap for high current, high power semiconductor devices and a method for providing the same

#34970
20050161761
2005-07-28

Semiconductor device

#34971
20050161750
2005-07-28

Molybdenum-based electrode with carbon nanotube growth

#34972
20050161748
2005-07-28

Integrated circuit with reverse engineering protection

#34973
20050161743
2005-07-28

Electrostatic discharge input and power clamp circuit for high cutoff frequency technology radio frequency (RF) applications

#34974
20050161725
2005-07-28

Semiconductor component comprising an integrated latticed capacitance structure

#34975
20050161721
2005-07-28

Word lines for memory cells

#34976
20050161710
2005-07-28

Capacitor having tantalum oxynitride film and method for making same

#34977
20050161686
2005-07-28

Display device and display unit using the same

#34978
20050161672
2005-07-28

Active matrix display device with improved operating performance

#34979
20050161632
2005-07-28

Phase change thermal interface composition having induced bonding property

#34980
20050161253
2005-07-28

Tamper barrier for electronic device

#34981
20050161201
2005-07-28

Heat dissipation device

#34982
20050161199
2005-07-28

Heat-dissipating device

#34983
20050161198
2005-07-28

Heat transport device and electronic device

#34984
20050161197
2005-07-28

Portable augmented silent cooling docking station

#34985
20050161196
2005-07-28

Heat radiator for a CPU

#34986
20050161195
2005-07-28

System for reliably removing heat from a semiconductor junction

#34987
20050161126
2005-07-28

High-strength high-conductivity copper alloy

#34988
20050160752
2005-07-28

Apparatus and methodology for cooling of high power density devices by electrically conducting fluids

#34989
20050160592
2005-07-28

Mounting system for high-mass heatsinks

#34990
20050160568
2005-07-28

Support clip

#34991
20050160391
2005-07-21

Semiconductor integrated circuit having multi-level interconnection, CAD method and CAD tool for designing the semiconductor integrated circuit

#34992
20050159012
2005-07-21

Semiconductor interconnect structure

#34993
20050158991
2005-07-21

Metal plating using seed film

#34994
20050158989
2005-07-21

Method of forming wiring and method of manufacturing image display system by using the same

#34995
20050158985
2005-07-21

Copper recess process with application to selective capping and electroless plating

#34996
20050158984
2005-07-21

Method for manufacturing semiconductor device

#34997
20050158979
2005-07-21

Method of manufacturing semiconductor device

#34998
20050158966
2005-07-21

Method to avoid a laser marked area step height

#34999
20050158953
2005-07-21

Method for fabricating an NROM memory cell arrangement

#35000
20050158948
2005-07-21

Semiconductor device having self-aligned contact plug and method for fabricating the same

#35001
20050158939
2005-07-21

Method of fabricating isolated semiconductor devices in epi-less substrate

#35002
20050158919
2005-07-21

Semiconductor fuses and semiconductor devices containing the same

#35003
20050158914
2005-07-21

Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices

#35004
20050158912
2005-07-21

Low profile multi-IC chip package connector

#35005
20050158910
2005-07-21

Protective layer for use in packaging a semiconductor die and method for forming same

#35006
20050158893
2005-07-21

Using protective cups to fabricate light emitting semiconductor packages

#35007
20050158888
2005-07-21

System and method for product yield prediction

#35008
20050158527
2005-07-21

Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit

#35009
20050157571
2005-07-21

Power transistor cell and power transistor component with fusible link

#35010
20050157557
2005-07-21

Fabrication and assembly structures and methods for memory devices

#35011
20050157527
2005-07-21

Semiconductor memory device

#35012
20050157515
2005-07-21

Light emitting diode light source

#35013
20050157469
2005-07-21

Cooling arrangement for a printed circuit board with a heat-dissipating electronic element

#35014
20050157468
2005-07-21

Computer cooling system

#35015
20050157374
2005-07-21

Microelectromechanical device packages with integral heaters

#35016
20050157297
2005-07-21

Periodic patterns and technique to control misalignment between two layers

#35017
20050156819
2005-07-21

Substrate identification circuit and semiconductor device

#35018
20050156807
2005-07-21

Method and apparatus for the manufacture of a tag

#35019
20050156755
2005-07-21

Electromagnetically coupled interconnect system architecture

#35020
20050156700
2005-07-21

Integrated spiral inductor

#35021
20050156698
2005-07-21

Embedded toroidal inductors

#35022
20050156680
2005-07-21

Low noise oscillator

#35023
20050156589
2005-07-21

Semiconductor device and test method for the same

#35024
20050156584
2005-07-21

Ion sensitive field effect transistor (ISFET) sensor with improved gate configuration

#35025
20050156509
2005-07-21

Display device, camera, personal computer, and portable telephone

#35026
20050156335
2005-07-21

Marks and method for multi-layer alignment

#35027
20050156330
2005-07-21

Through-wafer contact to bonding pad

#35028
20050156329
2005-07-21

Semiconductor device by embedded package

#35029
20050156328
2005-07-21

Semiconductor device structures including protective layers formed from healable materials

#35030
20050156319
2005-07-21

Structure of stacked vias in multiple layer electrode device carriers

#35031
20050156315
2005-07-21

Thin films, structures having thin films, and methods of forming thin films

#35032
20050156313
2005-07-21

Inspection device and method for manufacturing the same, method for manufacturing electro-optic device and method for manufacturing semiconductor device

#35033
20050156307
2005-07-21

Multilayer printed circuit board including first and second signal traces and a first ground trace

#35034
20050156304
2005-07-21

LSI package provided with interface module

#35035
20050156302
2005-07-21

Wafer structure with discrete gettering material

#35036
20050156287
2005-07-21

Organic polymer film, method for producing the same and semiconductor device using the same

#35037
20050156285
2005-07-21

Low k and ultra low k SiCOH dielectric films and methods to form the same

#35038
20050156284
2005-07-21

Semiconductor component having a pn junction and a passivation layer applied on a surface

#35039
20050156281
2005-07-21

High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature

#35040
20050156278
2005-07-21

Metal-insulator-metal capacitor and method of fabrication

#35041
20050156275
2005-07-21

Protection circuit located under fuse window

#35042
20050156273
2005-07-21

Memory devices

#35043
20050156267
2005-07-21

Semiconductor device provided with temperature detection function

#35044
20050156265
2005-07-21

Lithography device for semiconductor circuit pattern generation

#35045
20050156258
2005-07-21

Method of forming silicide film having excellent thermal stability, semiconductor device and semiconductor memory device comprising silicide film formed of the same, and methods of manufacturing the semiconductor device and the semiconductor memory device

#35046
20050156251
2005-07-21

Semiconductor power module

#35047
20050156250
2005-07-21

Semiconductor device with parallel interconnects

#35048
20050156221
2005-07-21

Semiconductor device and method of manufacturing same

#35049
20050156220
2005-07-21

Semiconductor device and method of manufacturing the same

#35050
20050156211
2005-07-21

Semiconductor device and method for producing the same

#35051
20050156196
2005-07-21

Local interconnect for integrated circuit

#35052
20050156170
2005-07-21

Electro-optical device having a light-shielding film comprising alternating layers of silicide and nitrided silicide

#35053
20050156157
2005-07-21

Hierarchical assembly of interconnects for molecular electronics

#35054
20050156156
2005-07-21

Method of fabricating a non-floating body device with enhanced performance

#35055
20050156013
2005-07-21

Method of making high performance heat sinks

#35056
20050155957
2005-07-21

Method of forming an opening or cavity in a substrate for receiving an electronic component

#35057
20050155752
2005-07-21

Thermal interface and method of making the same

#35058
20050155751
2005-07-21

Heat-dissipating member and joined structure

#35059
20050155746
2005-07-21

Heat-pipe type heat-sink structure and its sealing method

#35060
20050155744
2005-07-21

Pump-free water-cooling system

#35061
20050155743
2005-07-21

Composite heat sink with metal base and graphite fins

#35062
20050155742
2005-07-21

Heat sink combining assembly

#35063
20050155706
2005-07-21

Electronic component mounting method and apparatus

#35064
20050155354
2005-07-21

Heat radiator

#35065
20050155004
2005-07-14

Simulation model for design of semiconductor device, thermal drain noise analysis method, simulation method, and simulation apparatus

#35066
20050153677
2005-07-14

System and method for on-chip filter tuning

#35067
20050153549
2005-07-14

Method of forming metal wiring for high voltage element

#35068
20050153545
2005-07-14

Methods of forming copper interconnections using electrochemical plating processes

#35069
20050153541
2005-07-14

Method of forming metal wiring in a semiconductor device

#35070
20050153510
2005-07-14

Etch stop layer in poly-metal structures

#35071
20050153505
2005-07-14

Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner

#35072
20050152773
2005-07-14

Liquid epoxy resin composition and semiconductor device

#35073
20050152634
2005-07-14

Optical device, method for fabricating optical device, cap component, and method for forming cap component

#35074
20050152184
2005-07-14

Circuit substrate

#35075
20050152146
2005-07-14

High efficiency solid-state light source and methods of use and manufacture

#35076
20050152119
2005-07-14

Locking device for heat dissipating device

#35077
20050152118
2005-07-14

Device to cool integrated circuit element and disk drive having the same

#35078
20050152117
2005-07-14

Stack up assembly

#35079
20050152115
2005-07-14

Thermal module

#35080
20050152113
2005-07-14

Motherboard testing mount

#35081
20050151777
2005-07-14

Integrated circuit with tamper detection circuit

#35082
20050151613
2005-07-14

Inductive device and method for producing the same

#35083
20050151269
2005-07-14

UBM for fine pitch solder ball and flip-chip packaging method using the same

#35084
20050151266
2005-07-14

Semiconductor device and method of manufacturing the same

#35085
20050151262
2005-07-14

Semiconductor integrated circuit device

#35086
20050151259
2005-07-14

Semiconductor device and manufacturing method thereof

#35087
20050151256
2005-07-14

Freestanding multilayer IC wiring structure

#35088
20050151249
2005-07-14

Chip-size package with an integrated passive component

#35089
20050151245
2005-07-14

Power supply component assembly on a printed circuit and method for obtaining same

#35090
20050151244
2005-07-14

Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon

#35091
20050151241
2005-07-14

Multilayer ceramic substrate with single via anchored pad and method of forming

#35092
20050151239
2005-07-14

Integrated circuit devices, edge seals therefor

#35093
20050151237
2005-07-14

Multi-chip assembly and method for driving the same

#35094
20050151233
2005-07-14

Conductive material compositions, apparatus, systems, and methods

#35095
20050151228
2005-07-14

Semiconductor chip and manufacturing method for the same, and semiconductor device

#35096
20050151224
2005-07-14

Semiconductor device and manufacturing method thereof

#35097
20050151223
2005-07-14

Tunable semiconductor diodes

#35098
20050151200
2005-07-14

Electrostatic discharge protection circuit with a diode string

#35099
20050151197
2005-07-14

Production method of flexible electronic device

#35100
20050151167
2005-07-14

Semiconductor apparatus and production method thereof suitable for electric power devices