Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby

Semiconductor device and method of manufacturing the same

Method of forming a double-sided capacitor

Semiconductor component with integrated capacitance structure and method for fabrication thereof

Method of forming a capacitor that includes forming a bottom electrode in a strained silicon layer

Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components

Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof

Periodic patterns and technique to control misalignment

Method of correcting lithographic process and method of forming overlay mark

Biphenylaralkyl epoxy and phenolic resins

Photoelectric conversion module with cooling function

Semiconductor devices, capacitor antifuses, dynamic random access memories, and cell plate bias connection methods

Retaining heat sinks on printed circuit boards

Heat dissipating device having an arcuate outer surface

Thermal module with heat reservoir and method of applying the same on electronic products

Heat dissipation module of an interface card

Heat dissipation device

Heat dissipating arrangement

Cooling device capable of reducing thickness of electronic apparatus

Providing optical elements over emissive displays

Interdigitated capacitor and method for fabrication thereof

Measurement of integrated circuit interconnect process parameters

Method and system for integrated circuit packaging

Electronic device and method for manufacturing the same

Semiconductor device and method of producing the same

Method of forming a ceramic diffusion barrier layer

Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same

Electrical device with a plurality of thin-film device layers

Barrier for copper integrated circuits

Method for pattern metalization of substrates

Signal transmitting device with vias and solder balls

System for heat dissipation in semiconductor devices

Holiday Light String Devices

Semiconductor device having a fuse including an aluminum layer

Model-based insertion of irregular dummy features

Semiconductor device

Manufacturing method for SOI semiconductor device, and SOI semiconductor device

Strained-channel Fin field effect transistor (FET) with a uniform channel thickness and separate gates

Semiconductor device and method for manufacturing the same

Semiconductor substrate and method of fabricating semiconductor device

Electronic imaging device

Semiconductor light emitting devices including in-plane light emitting layers

Photonic crystal light emitting device

METHOD FOR END POINT DETECTION FOR CHEMICAL MECHANICAL POLISHING OF INTEGRATED CIRCUIT DEVICES

Flexible substrate, multilayer flexible substrate and process for producing the same

Substrate

Brazed wick for a heat transfer device and method of making same

Phase-change heat dissipating device and method for manufacturing it

Method of manufacturing a finned heat sink

Ebullition cooling device for heat generating component

Method for front end of line fabrication

Pressure sensor and related method

Placement and routing method to reduce Joule heating

Apparatus for providing controlled impedance in an electrical contact

Method for manufacturing tungsten/polysilicon word line structure in vertical DRAM

Method of manufacturing semiconductor device and semiconductor device

Method of dividing a wafer which has a low-k film formed on dicing lines

Method for edge sealing barrier films

Radiation-hardened transistor fabricated by modified CMOS process

Gate technology for strained surface channel and strained buried channel MOSFET devices

Method of forming metal pattern having low resistivity

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Semiconductor stacked die devices and methods of forming semiconductor stacked die devices

Method of forming compliant contact structures

Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning

Protection of the SiC surface by a GaN layer

Metal thin-film resistance element on an insulation film

Semiconductor integrated circuit

Method for generating an electrical contact with buried track conductors

Preferential ground and via exit structures for printed circuit boards

Locking device for heat dissipating device

Semiconductor module with heat sink and method thereof

Heat dissipation device with heat pipes

Heat dissipation device with heat pipes

Double-sided display device and method of fabricating the same

Semiconductor light emitting device, image display system and illumination device

Array substrate for liquid crystal display device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Reflective and transmissive mode monolithic millimeter wave array system and oscillator using same

Gain control methods and systems in an amplifier assembly

Power-rail ESD clamp circuit for mixed-voltage I/O buffer

Semiconductor integrated circuit

Fully integrated DC-to-DC regulator utilizing on-chip inductors with high frequency magnetic materials

Light emitting device and method of manufacturing the same

Double - sided display device and method of fabricating the same

Conductive through wafer vias

Semiconductor device

Solderable top metalization and passivation for source mounted package

Method and apparatus for a layered thermal management arrangement

Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance

Semiconductor device and manufacturing method thereof

Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber

Semiconductor integrated circuit

Inspection pattern, inspection method, and inspection system for detection of latent defect of multi-layer wiring structure

Laser crystallization apparatus and laser crystallization method

Analyte monitoring device and methods of use

Hybrid cooling system and method for cooling electronic devices

Heat dissipation module with heat pipes

Heat sink for an electronic power component

Cold plate and method of making the same

Heat sink and method of making the same

Heat dissipation module for CPU

Dual centrifugal fan structure and heat dissipation device having the fan structure

Laminated fin heat sink for electronic devices

Temperature detection method of semiconductor device and power conversion apparatus

RFID tag and method of manufacturing the same

Compound semiconductor formed from a heated portion of a layered structure including rare earth transition metal

Dummy fill for integrated circuits

Semiconductor device with improved stress migration resistance and manufacturing process therefor

Method to increase mechanical fracture robustness of porous low k dielectric materials

Method to make corner cross-grid structures in copper metallization

METHOD OF FABRICATING FILM CARRIER

Method for analyzing metal element on surface of wafer

Changing color LEDS

Apparatus and method for improving AC coupling on circuit boards

Heat dissipation module for a CPU

Heat sink retention assembly and related methods

Heat dissipation structure

Heat dissipating pin structure for mitigation of LED temperature rise

Power amplifier module for wireless communication devices

Current controlling circuit arrangement and associated method for reducing crosstalk

Electronic package for electrical machine

Anisotropic conductive sheet and manufacture thereof

Circuit component with bump formed over chip

Guard ring of a combination wafer or singulated die

Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing

Semiconductor structure implementing low-K dielectric materials and supporting stubs

Packaged semiconductor device

Semiconductor device with multilayer interconnection structure

Wafer scale die handling

Semiconductor component and micromechanical structure

Semiconductor assemblies

Semiconductor component

Flip-chip light emitting diode device without sub-mount

Light emitting diodes including barrier layers/sublayers

Chip card

X-ray alignment system for fabricating electronic chips

Removing photoresist from a workpiece using water and ozone and a photoresist penetrating additive

Capacitor and inductor scheme with e-fuse application

Method of fabricating film carrier

Electrical feedthrough assembly for a sealed housing

Method for producing ceramic multilayer substrate

Apparatus with selected fill gas

Radiator and method of manufacturing the same

Multi-layer overlay measurement and correction technique for IC manufacturing

Wireless no-touch testing of integrated circuits

Device and method or disabling electronic devices

Polyhedral oligomeric silsesquioxanes and metallized polyhedral oligomeric silsesquioxanes as coatings, composites and additives

Air gap interconnect structure and method of manufacture

Semiconductor device having a guard ring

Low capacitance wiring layout

Semiconductor device and wiring forming method in semiconductor device

Semiconductor fabrication using a collar

Method of forming a metal film for electrode

Methods for dicing wafer stacks to provide access to interior structures

Apparatus and method for measuring substrates

Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials

Methods for making microwave circuits including a ground plane

Structure and manufacturing process of localized shunt to reduce electromigration failure of copper dual damascene process

Magnetic tunneling junction antifuse device

Light-emitting diode arrangement comprising a reflector

Heat-dissipating module and structure thereof

Compact inductor with stacked via magnetic cores for integrated circuits

Reducing line to line capacitance using oriented dielectric films

Extended life electronic tags

Integrated circuit chip utilizing carbon nanotube composite interconnection vias

Semiconductor device and method of fabricating the same

Dual damascene intermediate structure and method of fabricating same

Carbonaceous composite heat spreader and associated methods

Portable electronic device

Process for producing a resin composition and electrophotographic fixing member

Redundant interconnect high current bipolar device and method of forming the device

Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same

Method for forming copper fuse links

High frequency passive element

Upper-layer metal power standard cell

Semiconductor device

Semiconductor device featuring multi-layered electrode structure

Semiconductor structure including vias

LDMOS transistor

Apparatus and methods for cooling semiconductor integrated circuit package structures

Encapsulated organic semiconductor device and method

Doped semiconductor nanocrystals

Cathodoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same

Seat for a heat radiator

Miniature fluid-cooled heat sink with integral heater

Compact radiator for an electronic device

Apparatus for transferring heat and method of manufacturing the same

Brazed wick for a heat transfer device

Fluidic apparatus and method for cooling a non-uniformly heated power device

Circulation structure of heat dissipation device

Silver powder and method for producing same

Manufacturing method of semiconductor device

Method for fabricating metallic interconnects on electronic components

Dual damascene interconnect structure with improved electro migration lifetimes

Very low effective dielectric constant interconnect structures and methods for fabricating the same

Methods and structures for metal interconnections in integrated circuits

Manufacturing method for semiconductor device and semiconductor device

Hexagonal array structure for ball grid array packages

Transfer material used for producing a wiring substrate

Method of forming alignment marks for semiconductor device fabrication

FIB exposure of alignment marks in MIM technology

Method of making the mould for encapsulating a leadframe package

Methods of forming semiconductor circuitry

Fabrication method of an ion sensitive field effect transistor

Method and structure for determining thermal cycle reliability

Thin laminate as embedded capacitance material in printed circuit boards

Method of manufacturing ceramic paste and ceramic multi-layer wiring substrate utilizing the same

Methods and materials for the reduction and control of moisture and oxygen in OLED devices

Power optimization for operation of optoelectronic device with thermoelectric cooler

Miniature silicon condenser microphone

Heat radiating apparatus of electronic component

Heat sink having compliant interface to span multiple components

Wafer stage with a magnet

Microelectromechanical device packages with integral heaters

Printhead controller integrated circuit

Integrated lens and chip assembly for a digital camera

Device monitor for RF and DC measurement

Wavelength converted semiconductor light emitting devices

Structures and methods for integration of ultralow-k dielectrics with improved reliability

Electronic device, method of manufacture of the same, and sputtering target

Seal ring design without stop layer punch through during via etch

Semiconductor device with improved thermal characteristics

Packaging of solid state devices

Circuit carrier

Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film

Semiconductor substrate

High performance system-on-chip using post passivation process

Semiconductor element, manufacturing method thereof, and high frequency integrated circuit using the semiconductor element

Solid-state image pick-up device and imaging system using the same

Power MOSFET and method for forming same using a self-aligned body implant

Semiconductor device including memory cell and anti-fuse element

Multiple ranging apparatus

Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabrication

Image processing method, image processing apparatus and semiconductor manufacturing method

Multi-layer circuit board with thermal diffusion and method of fabricating the same

System and method for providing cooling systems with heat exchangers

Heat radiating apparatus

Coolant tray of liquid based cooling device

Microchannel flat-plate heat pipe with parallel grooves for recycling coolant

Heat dissipation interface for semiconductor chip structures

Remedies to prevent cracking in a liquid system

Hotspot spray cooling

Heat sink

Fastening device for a radiator

Plasma processing method and plasma processing apparatus

Silver powder made of silver particles, each to which fine silver particles adhere and process of producing the same

Remedies to prevent cracking in a liquid system

Remedies to prevent cracking in a liquid system

Remedies to prevent cracking in a liquid system

Particulate alumina, method for producing particulate alumina and composition containing particulate alumina

Semiconductor device with fuse wires and connection wires

Microelectronic package comprising offset conductive posts on compliant layer

Electrical contacts for flexible displays

Process for preparing low dielectric constant material

Silicon carbide deposition for use as a low dielectric constant anti-reflective coating

Method of forming a semiconductor device having a Ti/TiN/Ti<002>/a1<111> laminate

Methods of providing ohmic contact

Method of forming wiring

Method for manufacturing mesa semiconductor device

Semiconductor structures and manufacturing methods

Integrated circuit inductane and the fabrication method thereof

Method for manufacturing a superjunction device with wide mesas

Method of manufacturing a superjunction device with conventional terminations

Methods for fabricating fuse programmable three dimensional integrated circuits

Method of manufacturing a transponder

Nanotube-containing composite bodies, and methods for making same

Methods and objects employing machine readable data

Illumination apparatus and image projection apparatus using the illumination apparatus

Lighting unit

Heatsink

Protection structure for thermal conducting medium of heat dissipation device

Heat dissipating device incorporating clip

Low thermal stress composite heat sink assembly

Heat dissipation structure

Electronic apparatus

Electronic apparatus having liquid cooling system therein

Liquid cooling system and electronic apparatus having the same therein

Redundant liquid cooling system and electronic apparatus having the same therein

Cooling unit and flow distributing element for use in such unit

Electrical apparatus and heat sink device thereof

Electrostatic discharge (ESD) protection device with simultaneous and distributed self-biasing for multi-finger turn-on

DIELECTRIC MULTILAYER FILTER AND ITS MANUFACTURING METHOD, AND SOLID-STATE IMAGING DEVICE

Assembly for aligning an optical system

Digital camera having functionally interconnected image processing elements

Electronic tag, system and method for selecting component

Semiconductor device including power MOS field-effect transistor and driver circuit driving thereof

Organic electroluminescent display device having two sealed EL display panels

Non-repeated and non-uniform width seal ring structure

Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide

Semiconductor device having copper damascene interconnection and fabricating method thereof

Multi-layer substrate module and wireless terminal device

Semiconductor device having multilayer structure and method for manufacturing thereof

Semiconductor device and manufacturing method thereof

Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness

Semiconductor device and a method of manufacture therefor

Buried guard ring and radiation hardened isolation structures and fabrication methods

Integrated semiconductor circuit having a logic and power metallization without intermetal dielectric

Semiconductor device and method of manufacturing the same

Highly doped III-nitride semiconductors