ClassID:

212006

H01L2924/0002 - page 122 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#36301
20050044520
2005-02-24

Method, system, and article of manufacture for implementing metal-fill with power or ground connection

#36302
20050044403
2005-02-24

Detection circuit for a smart card

#36303
20050043909
2005-02-24

Method for measuring integrated circuit processor power demand and associated system

#36304
20050042887
2005-02-24

Method of forming a diffusion barrier

#36305
20050042873
2005-02-24

Method and system to provide electroplanarization of a workpiece with a conducting material layer

#36306
20050042867
2005-02-24

Semiconductor device having electrical contact from opposite sides including a via with an end formed at a bottom surface of the diffusion region

#36307
20050042860
2005-02-24

Method for eliminating reaction between photoresist and OSG

#36308
20050042858
2005-02-24

Method of improving stability in low k barrier layers

#36309
20050042857
2005-02-24

Localized slots for stress relieve in copper

#36310
20050042854
2005-02-24

Method of enhancing the adhesion between photoresist layer and substrate and bumping process

#36311
20050042851
2005-02-24

Connector terminal device and its fabrication method

#36312
20050042835
2005-02-24

Metal-insulator-metal capacitor and method of fabricating same

#36313
20050042829
2005-02-24

Semiconductor memory device having low-resistance tungsten line and method of manufacturing the semiconductor memory device

#36314
20050042827
2005-02-24

Semiconductor integrated circuit device having capacitor element

#36315
20050042822
2005-02-24

Semiconductor integrated circuit device and process for manufacturing the same

#36316
20050042821
2005-02-24

Semiconductor circuit constructions

#36317
20050042818
2005-02-24

Analog capacitor in dual damascene process

#36318
20050042816
2005-02-24

Semiconductor device and method for manufacturing the same

#36319
20050042806
2005-02-24

Silicon on insulator device and layout method of the same

#36320
20050042780
2005-02-24

Integrated circuit identification

#36321
20050042743
2005-02-24

Porous UV-emitting semiconductor on porous substrate as sterilizing filter made by filtering suspended semiconductor particles

#36322
20050042549
2005-02-24

Semiconductor device and manufacturing method thereof

#36323
20050042082
2005-02-24

Centrifugal fan, cooling mechanism, and apparatus furnished with the cooling mechanism

#36324
20050041976
2005-02-24

Generating sets of tailored laser pulses

#36325
20050041508
2005-02-24

Current limiting antifuse programming path

#36326
20050041434
2005-02-24

Light source and vehicle lamp

#36327
20050041399
2005-02-24

Volumetrically efficient electronic circuit module

#36328
20050041397
2005-02-24

Thermoelectric cooling of low-noise amplifier transistors in wireless communications networks

#36329
20050041394
2005-02-24

Heatsink device

#36330
20050041358
2005-02-24

Electromagnetic noise reduction device

#36331
20050041070
2005-02-24

LDMOS and CMOS integrated circuit and method of making

#36332
20050040810
2005-02-24

System for and method of controlling a VLSI environment

#36333
20050040561
2005-02-24

Sealing material tablet method of manufacturing the tablet and electronic component device

#36334
20050040545
2005-02-24

Substrate provided with an alignment mark in a substantially transmissive process layer, mask for exposing said mark, device manufacturing method, and device manufactured thereby

#36335
20050040534
2005-02-24

Semiconductor devices and other electronic components including porous insulators created from “void” creating materials

#36336
20050040533
2005-02-24

Semiconductor devices including porous insulators

#36337
20050040532
2005-02-24

Dual damascene integration of ultra low dielectric constant porous materials

#36338
20050040531
2005-02-24

Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof

#36339
20050040511
2005-02-24

Back-to-back semiconductor device assemblies

#36340
20050040499
2005-02-24

Apparatus for forming silicon oxide film

#36341
20050040494
2005-02-24

Thin film resistor device and a method of manufacture therefor

#36342
20050040491
2005-02-24

Fuse structure

#36343
20050040488
2005-02-24

a-C:H ISFET device, manufacturing method, and testing methods and apparatus thereof

#36344
20050040487
2005-02-24

a-C:H ISFET device, manufacturing method, and testing methods and apparatus thereof

#36345
20050040471
2005-02-24

Spiral inductor formed in a semiconductor substrate

#36346
20050040452
2005-02-24

Semiconductor integrated circuit device having a conductive film which contains metal atoms bondable to a halogen element

#36347
20050040444
2005-02-24

Strained-channel Fin field effect transistor (FET) with a uniform channel thickness and separate gates

#36348
20050040443
2005-02-24

Wafer cleaning method and resulting wafer

#36349
20050040442
2005-02-24

Wafer Cleaning method and resulting wafer

#36350
20050040427
2005-02-24

Semiconductor light emitting device and method for manufacturing same

#36351
20050040421
2005-02-24

Light-emitting semiconductor device

#36352
20050040397
2005-02-24

Method and apparatus using an on-chip ring oscillator for chip identification

#36353
20050040243
2005-02-24

Contact smart cards having a document core, contactless smart cards including multi-layered structure, PET-based identification document, and methods of making same

#36354
20050039943
2005-02-24

Straight angle conductor and method of manufacturing the same

#36355
20050039890
2005-02-24

Heat dissipating device and method of making it

#36356
20050039888
2005-02-24

Two-phase cooling apparatus and method for automatic test equipment

#36357
20050039887
2005-02-24

Stacked low profile cooling system and method for making same

#36358
20050039885
2005-02-24

Method of manufacturing microchannel heat exchangers

#36359
20050039883
2005-02-24

High flux heat removal system using liquid ice

#36360
20050039882
2005-02-24

Cooling device for a chip and method for its production

#36361
20050039881
2005-02-24

Cooling assembly

#36362
20050039880
2005-02-24

COMPUTER COOLING APPARATUS

#36363
20050039879
2005-02-24

Heat transmission member and an electronics device using the member

#36364
20050039840
2005-02-24

Circuitized substrate and method of making same

#36365
20050039465
2005-02-24

Peltier temperature control system for electronic components

#36366
20050038755
2005-02-17

Method and apparatus for reducing optical emissions in an integrated circuit

#36367
20050038618
2005-02-17

Substrate inspecting device, coating/developing device and substrate inspecting method

#36368
20050037612
2005-02-17

Superconductor device and method of manufacturing the same

#36369
20050037611
2005-02-17

EMI and noise shielding for multi-metal layer high frequency integrated circuit processes

#36370
20050037606
2005-02-17

Insulative materials including voids and precursors thereof

#36371
20050037604
2005-02-17

Multilayer interconnect structure containing air gaps and method for making

#36372
20050037568
2005-02-17

Metal-insulator-metal capacitor

#36373
20050037544
2005-02-17

Method of forming a leadframe for a semiconductor package

#36374
20050037539
2005-02-17

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

#36375
20050037522
2005-02-17

Dummy fill for integrated circuits

#36376
20050037303
2005-02-17

Generation of electricity in a fireplace using thermoelectric module

#36377
20050037204
2005-02-17

Thermal interface and switch using carbon nanotube arrays

#36378
20050037104
2005-02-17

Mold and method of molding semiconductor devices

#36379
20050036529
2005-02-17

VCSEL settling fixture

#36380
20050036368
2005-02-17

Method for programming programmable eraseless memory

#36381
20050036289
2005-02-17

Heat dissipation device

#36382
20050036265
2005-02-17

Magnetically coupled device and electronic equipment employing same

#36383
20050035825
2005-02-17

Double-sided, edge-mounted stripline signal processing modules and modular network

#36384
20050035816
2005-02-17

Printed circuit board for a three-phase power device having embedded directional impedance control channels

#36385
20050035463
2005-02-17

Separating of optical integrated modules and structures formed thereby

#36386
20050035460
2005-02-17

Damascene structure at semiconductor substrate level

#36387
20050035459
2005-02-17

Semiconductor device having a multiple thickness interconnect

#36388
20050035458
2005-02-17

Metal film semiconductor device and a method for forming the same

#36389
20050035457
2005-02-17

Interconnecting structure with dummy vias

#36390
20050035456
2005-02-17

Integrated circuitry and a semiconductor processing method of forming a series of conductive lines

#36391
20050035454
2005-02-17

Semiconductor device including a layer having a β-crystal structure

#36392
20050035451
2005-02-17

Semiconductor chip with bumps and method for manufacturing the same

#36393
20050035442
2005-02-17

Electrically isolated and thermally conductive double-sided pre-packaged component

#36394
20050035441
2005-02-17

Integrated circuit stack with partially etched lead frames

#36395
20050035438
2005-02-17

Insulation sheet and apparatus utilizing the same

#36396
20050035437
2005-02-17

Package part and method of manufacturing the part

#36397
20050035433
2005-02-17

Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern

#36398
20050035430
2005-02-17

Rectifying charge storage element

#36399
20050035425
2005-02-17

Semiconductor device, method for forming silicon oxide film, and apparatus for forming silicon oxide film

#36400
20050035424
2005-02-17

Integrated circuit with a PN junction diode

#36401
20050035416
2005-02-17

Semiconductor device with improved protection from electrostatic discharge

#36402
20050035403
2005-02-17

System with meshed power and signal buses on cell array

#36403
20050035379
2005-02-17

Semiconductor device structured to prevent oxide damage during HDP CVD

#36404
20050035092
2005-02-17

Method of making a hybrid housing and hybrid housing

#36405
20050034885
2005-02-17

Three dimensional dynamically shielded high-Q BEOL metallization

#36406
20050034845
2005-02-17

Cooling device having fins arranged to funnel air

#36407
20050034745
2005-02-17

Processing a workpiece with ozone and a halogenated additive

#36408
20050034622
2005-02-17

Method for fabricating pattern, apparatus for fabricating pattern, conductive film wiring, method for fabricating device, electro-optical apparatus, and electronic apparatus

#36409
20050033705
2005-02-10

Decoy device in an integrated circuit

#36410
20050033467
2005-02-10

Dynamic metrology sampling methods, and system for performing same

#36411
20050032395
2005-02-10

Methods for forming porous insulator structures on semiconductor devices

#36412
20050032389
2005-02-10

Method for avoiding erosion of DRAM fuse sidewall

#36413
20050032358
2005-02-10

Method for forming metal interconnect in a carbon containing silicon oxide film

#36414
20050032357
2005-02-10

Dielectric materials and methods for integrated circuit applications

#36415
20050032351
2005-02-10

Chip structure and process for forming the same

#36416
20050032335
2005-02-10

Method to chemically remove metal impurities from polycide gate sidewalls

#36417
20050032333
2005-02-10

Wafer thinning using magnetic mirror plasma

#36418
20050032315
2005-02-10

Semiconductor device and method of manufacturing the same

#36419
20050032293
2005-02-10

Use of silyating agents

#36420
20050032284
2005-02-10

Localized biasing for silicon on insulator structures

#36421
20050032279
2005-02-10

Antifuse structures, methods, and applications

#36422
20050032275
2005-02-10

MOS semiconductor device

#36423
20050032274
2005-02-10

Methods for securing vertically mountable semiconductor devices in back-to back relation

#36424
20050032267
2005-02-10

Method of making RFID device

#36425
20050032264
2005-02-10

Method of manufacturing a semiconductor device with outline of cleave marking regions and alignment or registration features

#36426
20050032256
2005-02-10

Semiconductor device with porous interlayer insulating film

#36427
20050032203
2005-02-10

Custom electrodes for molecular memory and logic devices

#36428
20050031995
2005-02-10

Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same

#36429
20050031889
2005-02-10

Low-expansion unit, method of manufacturing the same and semiconductor provided with the same

#36430
20050030803
2005-02-10

High permeability layered films to reduce noise in high speed interconnects

#36431
20050030760
2005-02-10

Illumination arrangement with reduced depth for a vehicle headlight

#36432
20050030718
2005-02-10

Processor retention system and method

#36433
20050030713
2005-02-10

Cooling fan

#36434
20050030700
2005-02-10

Capacitor element, semiconductor integrated circuit and method of manufacturing those

#36435
20050030699
2005-02-10

Method for making shielded capacitor structure

#36436
20050030698
2005-02-10

Electronic unit integrated into a flexible polymer body

#36437
20050030688
2005-02-10

ESD protection circuit having a control circuit

#36438
20050030686
2005-02-10

Integrated circuit having a plurality of output drivers

#36439
20050030265
2005-02-10

Driving method of light emitting device and light emitting device

#36440
20050030108
2005-02-10

Integrated VCO having an improved tuning range over process and temperature variations

#36441
20050029677
2005-02-10

Under bump metallurgic layer

#36442
20050029671
2005-02-10

Semiconductor device with copper wirings having improved negative bias temperature instability (NBTI)

#36443
20050029669
2005-02-10

Semiconductor device and method for manufacturing the same

#36444
20050029668
2005-02-10

Apparatus and method for packaging circuits

#36445
20050029665
2005-02-10

Barrier-less integration with copper alloy

#36446
20050029663
2005-02-10

Polynorbornene foam insulation for integrated circuits

#36447
20050029660
2005-02-10

Adhesions of structures formed from materials of poor adhesion

#36448
20050029659
2005-02-10

Low resistance and reliable copper interconnects by variable doping

#36449
20050029654
2005-02-10

IC chip with nanowires

#36450
20050029653
2005-02-10

IC chip having a protective structure

#36451
20050029652
2005-02-10

Interposer with integral heat sink

#36452
20050029631
2005-02-10

Method of fabricating a semiconductor device having a photo-sensitive polyimide layer and a device fabricated in accordance with the method

#36453
20050029628
2005-02-10

Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same

#36454
20050029622
2005-02-10

Antifuse structure and method of use

#36455
20050029621
2005-02-10

Semiconductor device having fuse and its manufacture method

#36456
20050029620
2005-02-10

Semiconductor device

#36457
20050029609
2005-02-10

Techniques to create low K ILD for beol

#36458
20050029598
2005-02-10

Gate dielectric antifuse circuit to protect a high-voltage transistor

#36459
20050029596
2005-02-10

Method and apparatus for preventing microcircuit thermo-mechanical damage during an ESD event

#36460
20050029595
2005-02-10

Method and apparatus for preventing microcircuit dynamic thermo-mechanical damage during an ESD event

#36461
20050029594
2005-02-10

Thin layer semi-conductor structure comprising a heat distribution layer

#36462
20050029592
2005-02-10

Method and structure for buried circuits and devices

#36463
20050029587
2005-02-10

Method and apparatus for forming an integrated circuit electrode having a reduced contact area

#36464
20050029566
2005-02-10

Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer

#36465
20050029552
2005-02-10

Bow control in an electronic package

#36466
20050029540
2005-02-10

Multifinger-type electrostatic discharge protection element

#36467
20050029501
2005-02-10

Low k interconnect dielectric using surface transformation

#36468
20050028965
2005-02-10

Combined structure of a thermal chamber and a thermal tower

#36469
20050028359
2005-02-10

Method of manufacturing a thermal dissipation assembly

#36470
20050028130
2005-02-03

Customized mesh plane, method and computer program product for creating customized mesh planes within electronic packages

#36471
20050028126
2005-02-03

Integrated circuit structure and a design method thereof

#36472
20050028125
2005-02-03

Layout method for miniaturized memory array area

#36473
20050027476
2005-02-03

Method for detecting and monitoring defects

#36474
20050026428
2005-02-03

Method of manufacturing semiconductor device and semiconductor device manufactured using the same

#36475
20050026427
2005-02-03

Custom electrodes for molecular memory and logic devices

#36476
20050026420
2005-02-03

Method of manufacturing a semiconductor device using a polysilicon etching mask

#36477
20050026418
2005-02-03

Method of manufacturing semiconductor device

#36478
20050026413
2005-02-03

Bonding structure with pillar and cap

#36479
20050026397
2005-02-03

CRACK STOP FOR LOW K DIELECTRICS

#36480
20050026388
2005-02-03

Techniques to create low K ILD for BEOL

#36481
20050026351
2005-02-03

Packaging of electronic chips with air-bridge structures

#36482
20050026347
2005-02-03

Methods of forming semiconductor logic circuitry, and semiconductor logic circuit constructions

#36483
20050026339
2005-02-03

Methods of forming semiconductor circuitry

#36484
20050026336
2005-02-03

Current limiting antifuse programming path

#36485
20050026332
2005-02-03

Techniques for curvature control in power transistor devices

#36486
20050026329
2005-02-03

Semiconductor device for applying well bias and method of fabricating the same

#36487
20050025927
2005-02-03

Packaged component and manufacturing process thereof

#36488
20050024973
2005-02-03

Current limiting antifuse programming path

#36489
20050024953
2005-02-03

Double gate transistor arrangement for receiving electrical signals from living cells

#36490
20050024870
2005-02-03

LED light source assembly

#36491
20050024834
2005-02-03

Heatsinking electronic devices

#36492
20050024832
2005-02-03

Heat sink clip with pressing post

#36493
20050024831
2005-02-03

Flexible loop thermosyphon

#36494
20050024830
2005-02-03

Liquid-cooled heat sink assembly

#36495
20050024823
2005-02-03

Computer

#36496
20050024801
2005-02-03

Monolithic integratable circuit arrangement for protection against a transient voltage

#36497
20050024519
2005-02-03

Solid-state imaging device and method for manufacturing the same

#36498
20050024178
2005-02-03

Switchable inductance

#36499
20050024176
2005-02-03

Inductor device having improved quality factor

#36500
20050024104
2005-02-03

Signal transmission circuit, CMOS semiconductor device, and circuit board

#36501
20050024029
2005-02-03

Voltage regulator circuit of integrated circuit chip

#36502
20050023715
2005-02-03

Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same

#36503
20050023708
2005-02-03

Dissipative isolation frames for active microelectronic devices, and methods of making such dissipative isolation frames

#36504
20050023705
2005-02-03

Power grid layout techniques on integrated circuits

#36505
20050023701
2005-02-03

Semiconductor device having contact plug and buried conductive film therein

#36506
20050023699
2005-02-03

Selective electroless-plated copper metallization

#36507
20050023698
2005-02-03

Method for fabricating metal wiring

#36508
20050023696
2005-02-03

Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same

#36509
20050023693
2005-02-03

Reliable low-k interconnect structure with hybrid dielectric

#36510
20050023691
2005-02-03

Semiconductor device and manufacturing method thereof

#36511
20050023690
2005-02-03

Insulating tube

#36512
20050023689
2005-02-03

Chemical planarization performance for copper/low-k interconnect structures

#36513
20050023688
2005-02-03

Two step semiconductor manufacturing process for copper interconnects

#36514
20050023686
2005-02-03

Multilayer diffusion barrier for copper interconnections

#36515
20050023683
2005-02-03

Semiconductor package with improved ball land structure

#36516
20050023681
2005-02-03

Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device

#36517
20050023679
2005-02-03

Substrate with reinforced contact pad structure

#36518
20050023669
2005-02-03

Semiconductor wafer, semiconductor device, method for manufacturing the semiconductor device, circuit board, and electronic apparatus

#36519
20050023668
2005-02-03

Stacked memory and manufacturing method thereof

#36520
20050023656
2005-02-03

Vertical system integration

#36521
20050023653
2005-02-03

Integrated circuit device having reduced bow and method for making same

#36522
20050023650
2005-02-03

Capacitive techniques to reduce noise in high speed interconnections

#36523
20050023649
2005-02-03

Semiconductor chip with FIB protection

#36524
20050023648
2005-02-03

Semiconductor device and method of locating a predetermined point on the semiconductor device

#36525
20050023641
2005-02-03

Damascene resistor and method for measuring the width of same

#36526
20050023638
2005-02-03

Scalable high performance antifuse structure and process

#36527
20050023637
2005-02-03

Method for producing an antifuse structure and antifuse

#36528
20050023628
2005-02-03

Multilayer high k dielectric films and method of making the same

#36529
20050023621
2005-02-03

Electrostatic discharge protection devices having transistors with textured surfaces

#36530
20050023617
2005-02-03

Conductive lines buried in insulating areas

#36531
20050023594
2005-02-03

Pr2O3-based la-oxide gate dielectrics

#36532
20050023575
2005-02-03

EDS protection configuration and method for light emitting diodes

#36533
20050023568
2005-02-03

Semiconductor integrated circuit device

#36534
20050023566
2005-02-03

Semiconductor device incorporating an electrical contact to an internal conductive layer and method for making the same

#36535
20050023558
2005-02-03

Near hermetic packaging of gallium arsenide semiconductor devices and manufacturing method therefor

#36536
20050023545
2005-02-03

Light emitting devices with improved light extraction efficiency

#36537
20050023537
2005-02-03

LED lamps

#36538
20050023326
2005-02-03

Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device

#36539
20050022984
2005-02-03

Heat transfer device and method of making same

#36540
20050022978
2005-02-03

Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device

#36541
20050022977
2005-02-03

Counter-stream-mode oscillating-flow heat transport apparatus

#36542
20050022976
2005-02-03

Heat transfer device and method of making same

#36543
20050022975
2005-02-03

Brazed wick for a heat transfer device

#36544
20050022973
2005-02-03

Heat dissipation assembly with retaining device

#36545
20050022972
2005-02-03

Heat sink element coupling structure

#36546
20050022971
2005-02-03

Thermal interface material

#36547
20050022970
2005-02-03

Wrap around heat sink apparatus and method

#36548
20050022969
2005-02-03

Heat sink structure with flexible heat dissipation pad

#36549
20050022745
2005-02-03

Electroless plating method, electroless plating device, and production method and production device of semiconductor device

#36550
20050022148
2005-01-27

Semiconductor device layout method, a computer program, and a semiconductor device manufacture method

#36551
20050021993
2005-01-27

Semiconductor device card methods of initializing checking the authenticity and the identity thereof

#36552
20050021272
2005-01-27

Method and apparatus for performing metrology dispatching based upon fault detection

#36553
20050020748
2005-01-27

Elastomer formed product

#36554
20050020702
2005-01-27

Organic compositions

#36555
20050020054
2005-01-27

Formation of a contact in a device, and the device including the contact

#36556
20050020050
2005-01-27

Bumping process

#36557
20050020047
2005-01-27

Methods of forming conductive structures including titanium-tungsten base layers and related structures

#36558
20050020014
2005-01-27

Etch stop layer in poly-metal structures

#36559
20050020007
2005-01-27

Semiconductor element and method for its production

#36560
20050019999
2005-01-27

Semiconductor chip having multiple functional blocks integrated in a single chip and method for fabricating the same

#36561
20050019991
2005-01-27

Method of manufacturing semiconductor device having thin film SOI structure

#36562
20050019989
2005-01-27

Method for making a module comprising at least an electronic component

#36563
20050019983
2005-01-27

Method of manufacturing a stackable ball grid array

#36564
20050019582
2005-01-27

Smooth board and process for preparing a smooth board

#36565
20050019203
2005-01-27

Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate

#36566
20050018864
2005-01-27

Method of manufacturing a microphone

#36567
20050018823
2005-01-27

Methods and systems for enabling return to same position in a review of messages in a voice mail system using tag or identifier stored in the voice mail system

#36568
20050018461
2005-01-27

Semiconductor integrated circuit device, method of testing semiconductor integrated circuit device and method of manufacturing semiconductor integrated circuit device

#36569
20050018407
2005-01-27

Stack up assembly

#36570
20050018406
2005-01-27

Stack up assembly

#36571
20050018405
2005-01-27

Electronic apparatus

#36572
20050018404
2005-01-27

Heat sink assembly for integrated circuits having a slidable contact capability with a mounting member portion of an electronic equipment chassis

#36573
20050018401
2005-01-27

Device for cooling memory modules

#36574
20050018380
2005-01-27

Capacitor with enhanced performance and method of manufacture

#36575
20050018379
2005-01-27

Ceramic substrate

#36576
20050017837
2005-01-27

Integrated transformer

#36577
20050017836
2005-01-27

Inductors having interconnect and inductor portions to provide combined magnetic fields

#36578
20050017791
2005-01-27

Metal-poly integrated capacitor structure

#36579
20050017752
2005-01-27

Semiconductor integrated circuit and methods for protecting the circuit from reverse engineering

#36580
20050017621
2005-01-27

White light LED with multicolor light-emitting layers of macroscopic structure widths, arranged on a light diffusing glass

#36581
20050017370
2005-01-27

Memory device having a semiconducting polymer film

#36582
20050017369
2005-01-27

Interposer

#36583
20050017363
2005-01-27

Semiconductor device with anchor type seal ring

#36584
20050017362
2005-01-27

Low gate resistance layout procedure for RF transistor devices

#36585
20050017360
2005-01-27

Semiconductor device

#36586
20050017354
2005-01-27

Arrangement for reducing stress in substrate-based chip packages

#36587
20050017351
2005-01-27

Silicon on diamond wafers and devices

#36588
20050017337
2005-01-27

Stacking apparatus for integrated circuit assembly

#36589
20050017327
2005-01-27

High permeability composite films to reduce noise in high speed interconnects

#36590
20050017326
2005-01-27

Method of dividing a semiconductor wafer utilizing a laser dicing technique

#36591
20050017324
2005-01-27

Multilayer analog interconnecting line layout for a mixed-signal integrated circuit

#36592
20050017321
2005-01-27

Layout of dummy and active cells forming capacitor array in integrated circuit

#36593
20050017306
2005-01-27

Semiconductor integrated circuit

#36594
20050017304
2005-01-27

Field effect transistor and method of manufacturing the same

#36595
20050017299
2005-01-27

Power MOSFET

#36596
20050017298
2005-01-27

Shielding structure for use in a metal-oxide-semiconductor device

#36597
20050017296
2005-01-27

Power mosfet having conductor plug structured contacts

#36598
20050017295
2005-01-27

Method of fabricating a semiconductor device having a buried and enlarged contact hole

#36599
20050017292
2005-01-27

Super-junction semiconductor device and method of manufacturing the same

#36600
20050017291
2005-01-27

Semiconductor structure having thick stabilization layer