ClassID:

212006

H01L2924/0002 - page 121 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#36001
20050070096
2005-03-31

Unidirectionally conductive materials for interconnection

#36002
20050070094
2005-03-31

Semiconductor device having multilayer interconnection structure and manufacturing method thereof

#36003
20050070092
2005-03-31

Method for creating electrical pathways for semiconductor device structures using laser machining processes

#36004
20050070090
2005-03-31

Method of forming metal pattern using selective electroplating process

#36005
20050070088
2005-03-31

Circuit structures and methods of forming circuit structures with minimal dielectric constant layers

#36006
20050070087
2005-03-31

Wafer-level thick film standing-wave clocking

#36007
20050070086
2005-03-31

Semiconductor device and method for fabricating the same

#36008
20050070084
2005-03-31

Substrate for pre-soldering material and fabrication method thereof

#36009
20050070083
2005-03-31

Wafer-level moat structures

#36010
20050070080
2005-03-31

Method of forming self-aligned contact pads of non-straight type semiconductor memory device

#36011
20050070074
2005-03-31

Method for dicing semiconductor wafer

#36012
20050070068
2005-03-31

Alignment mark forming method, substrate in which devices are formed, and liquid discharging head using substrate

#36013
20050070051
2005-03-31

Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrate

#36014
20050069815
2005-03-31

Processing method and semiconductor manufacturing method

#36015
20050069790
2005-03-31

Method for reducing an overlay error and measurement mark for carrying out the same

#36016
20050069715
2005-03-31

Epoxy compound, preparation method thereof, and use thereof

#36017
20050069432
2005-03-31

Electronic apparatus having pump unit

#36018
20050069410
2005-03-31

Volute inlet of fan

#36019
20050068742
2005-03-31

Clip for mounting heat sink to circuit board

#36020
20050068741
2005-03-31

System and method for mounting processor and heat transfer mechanism

#36021
20050068740
2005-03-31

Heat sink mounting and interface mechanism and method of assembling same

#36022
20050068738
2005-03-31

Display apparatus having heat transfer sheet

#36023
20050068735
2005-03-31

Module for solid state relay for engine cooling fan control

#36024
20050068730
2005-03-31

Heat dissipation method for microprocessors

#36025
20050068729
2005-03-31

Dual-fan heat dissipator

#36026
20050068727
2005-03-31

Heat dissipating structure of accelerated graphic port card

#36027
20050068726
2005-03-31

Electro-fluidic device and interconnect and related methods

#36028
20050068707
2005-03-31

Semiconductor device provided with overheat protection circuit and electronic circuit using the same

#36029
20050068705
2005-03-31

Overvoltage protection circuit of output MOS transistor

#36030
20050068486
2005-03-31

Double-sided LCD device comprising circuit boards and tape carrier packages

#36031
20050068146
2005-03-31

Variable inductor for integrated circuit and printed circuit board

#36032
20050067944
2005-03-31

Light emitting array with improved characteristics, optical writing unit, and image forming apparatus

#36033
20050067899
2005-03-31

Semiconductor device and method for producing the same

#36034
20050067722
2005-03-31

Semiconductor device which prevents peeling of low-permittivity film by using multilevel interconnection

#36035
20050067720
2005-03-31

Method of forming an encapsulation layer on a back side of a wafer

#36036
20050067718
2005-03-31

Transport balancing diffusion layer for rate limited scavenging systems

#36037
20050067716
2005-03-31

Group III nitride based flip-chip integrated circuit and method for fabricating

#36038
20050067713
2005-03-31

Semiconductor device and method of manufacturing semiconductor device

#36039
20050067710
2005-03-31

Define via in dual damascene process

#36040
20050067709
2005-03-31

Reinforced bond pad

#36041
20050067706
2005-03-31

Semiconductor device and production method thereof

#36042
20050067705
2005-03-31

Semiconductor device

#36043
20050067704
2005-03-31

Semiconductor device and method of manufacturing the same

#36044
20050067703
2005-03-31

Electronic member, method for making the same, and semiconductor device

#36045
20050067701
2005-03-31

Metal-insulator-metal capacitor and method of fabrication

#36046
20050067700
2005-03-31

Semiconductor device and method of manufacturing the same

#36047
20050067699
2005-03-31

Diffusion barrier layer for lead free package substrate

#36048
20050067693
2005-03-31

Semiconductor device and manufacturing method thereof

#36049
20050067692
2005-03-31

Integrating thermoelectric elements into wafer for heat extraction

#36050
20050067691
2005-03-31

Power delivery using an integrated heat spreader

#36051
20050067690
2005-03-31

Highly heat dissipative chip module and its substrate

#36052
20050067679
2005-03-31

Stitched micro-via to enhance adhesion and mechanical strength

#36053
20050067677
2005-03-31

Packaged integrated circuit providing trace access to high-speed leads

#36054
20050067673
2005-03-31

Adjustable self-aligned air gap dielectric for low capacitance wiring

#36055
20050067671
2005-03-31

Semiconductor device having fuse and capacitor at the same level and method of fabricating the same

#36056
20050067670
2005-03-31

Method and apparatus for using cobalt silicided polycrystalline silicon for a one time programmable non-volatile semiconductor memory

#36057
20050067669
2005-03-31

Fuse circuit and semiconductor device including the same

#36058
20050067666
2005-03-31

Device for electrical connection between two wafers and fabrication process of a microelectronic component comprising such a device

#36059
20050067640
2005-03-31

Imaging device and manufacturing method thereof

#36060
20050067636
2005-03-31

Submount for mounting semiconductor device

#36061
20050067633
2005-03-31

Microelectromechanical system and method for fabricating the same

#36062
20050067632
2005-03-31

Semiconductor device

#36063
20050067620
2005-03-31

Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers

#36064
20050067587
2005-03-31

Integrated circuit having radiation sensor arrangement

#36065
20050067388
2005-03-31

Methods of and laser systems for link processing using laser pulses with specially tailored power profiles

#36066
20050067189
2005-03-31

Soldering method and solder joint member

#36067
20050067179
2005-03-31

Hermetically sealed micro-device package with window

#36068
20050067152
2005-03-31

Heat dissipation device

#36069
20050067150
2005-03-31

Integratied liquid cooling system for electrical components

#36070
20050067149
2005-03-31

Heat-radiating fin set formed by combining a heat pipe and several heat-radiating fins

#36071
20050067145
2005-03-31

Liquid cooling module

#36072
20050067144
2005-03-31

Cooling device

#36073
20050067143
2005-03-31

Heat conductive seat with liquid

#36074
20050066523
2005-03-31

Method of making an interposer with contact structures

#36075
20050066487
2005-03-31

Heat sink clip

#36076
20050064727
2005-03-24

Method for fabricating semiconductor device with improved tolerance to wet cleaning process

#36077
20050064712
2005-03-24

Method of polishing a semiconductor substrate, post-CMP cleaning process, and method of cleaning residue from registration alignment markings

#36078
20050064707
2005-03-24

Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias

#36079
20050064694
2005-03-24

Method and system for packaging ball grid arrays

#36080
20050064689
2005-03-24

Method of manufacturing a multilayered doped conductor for a contact in an integrated circuit device

#36081
20050064676
2005-03-24

Method of forming alignment mark

#36082
20050064675
2005-03-24

Method of fabricating crystalline silicon and switching device using crystalline silicon

#36083
20050064660
2005-03-24

Methods of fabricating integrated circuit devices that utilize doped poly-SiGeconductive plugs as interconnects

#36084
20050064657
2005-03-24

Interdigital capacitor and method for adjusting the same

#36085
20050064635
2005-03-24

Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs

#36086
20050064626
2005-03-24

Connection components with anistropic conductive material interconnector

#36087
20050064624
2005-03-24

Method of manufacturing wafer level chip size package

#36088
20050064611
2005-03-24

Method of screening semiconductor device

#36089
20050064610
2005-03-24

Site-specific methodology for localization and analyzing junction defects in mosfet devices

#36090
20050064230
2005-03-24

Bulk high thermal conductivity feedstock and method of making thereof

#36091
20050064185
2005-03-24

System and process for producing nanowire composites and electronic substrates therefrom

#36092
20050064139
2005-03-24

Sheet material having metal points and method for the production thereof

#36093
20050064098
2005-03-24

Production of elemental films using a boron-containing reducing agent

#36094
20050064065
2005-03-24

Apparatus for molding a semiconductor wafer and process therefor

#36095
20050063822
2005-03-24

Airflow guiding structure for a heat dissipation fan

#36096
20050063580
2005-03-24

Method and system for positioning articles with respect to a processing tool

#36097
20050063432
2005-03-24

Communication semiconductor component

#36098
20050063161
2005-03-24

Heat sink and method for its production

#36099
20050063160
2005-03-24

Heat-dissipating plate module

#36100
20050063159
2005-03-24

Heat-dissipating fin module

#36101
20050063158
2005-03-24

Cooling device for electronic and electrical components

#36102
20050063134
2005-03-24

On-chip bypass capacitor and method of manufacturing the same

#36103
20050063127
2005-03-24

Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package

#36104
20050063112
2005-03-24

Semiconductor device and system

#36105
20050062871
2005-03-24

Solid-state imaging device and method for manufacturing the same

#36106
20050062575
2005-03-24

Integrated transformer

#36107
20050062396
2005-03-24

Multi-hooded pixel

#36108
20050062165
2005-03-24

Closed air gap interconnect structure

#36109
20050062161
2005-03-24

Conductor line stack having a top portion of a second layer that is smaller than the bottom portion

#36110
20050062159
2005-03-24

Semiconductor devices and methods of forming a barrier metal in semiconductor devices

#36111
20050062145
2005-03-24

Land pattern configuration

#36112
20050062137
2005-03-24

Vertically-stacked co-planar transmission line structure for IC design

#36113
20050062136
2005-03-24

Multilayer high k dielectric films and method of making the same

#36114
20050062130
2005-03-24

Semiconductor device and making thereof

#36115
20050062122
2005-03-24

Wafer-level packaging of optoelectronic devices

#36116
20050062107
2005-03-24

Semiconductor and method of manufacturing the same

#36117
20050062083
2005-03-24

Image sensor module

#36118
20050062063
2005-03-24

Semiconductor integrated circuit device and method of producing the same

#36119
20050062045
2005-03-24

Processes of forming stacked resistor constructions

#36120
20050062024
2005-03-24

Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof

#36121
20050061886
2005-03-24

Image processing and printing apparatus

#36122
20050061780
2005-03-24

Wiring repair apparatus

#36123
20050061485
2005-03-24

Heat exchanger

#36124
20050061482
2005-03-24

Integrated liquid cooling system for electrical components

#36125
20050061480
2005-03-24

Heat sinks and method of formation

#36126
20050061479
2005-03-24

Radiator with streamline airflow guiding structure

#36127
20050061478
2005-03-24

Circular heat sink assembly

#36128
20050061477
2005-03-24

Fan sink heat dissipation device

#36129
20050061476
2005-03-24

Heat sink with intermediate fan element

#36130
20050061474
2005-03-24

Method and apparatus for chip-cooling

#36131
20050061107
2005-03-24

Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom

#36132
20050060887
2005-03-24

Method for producing metal/ceramic bonding circuit board

#36133
20050059255
2005-03-17

Wafer processing techniques with enhanced alignment

#36134
20050059231
2005-03-17

Semiconductor device and method for fabricating the same

#36135
20050059206
2005-03-17

Integrated circuit devices having barrier layers between upper electrodes and dielectric layers and methods of fabricating the same

#36136
20050059204
2005-03-17

Double-sided etching technique for semiconductor structure with through-holes

#36137
20050059202
2005-03-17

Silicon on insulator device and layout method of the same

#36138
20050059194
2005-03-17

Method of forming double-gated silicon-on-insulator (SOI) transistors with corner rounding

#36139
20050059171
2005-03-17

Method of laser annealing to form an epitaxial growth layer

#36140
20050058543
2005-03-17

Centrifugal fan

#36141
20050058405
2005-03-17

Device for sending or receiving optical signals

#36142
20050057903
2005-03-17

Cooling structure for electronic element

#36143
20050057900
2005-03-17

Heat dissipating circulatory system with sputtering assembly

#36144
20050057899
2005-03-17

Compact electronics plenum

#36145
20050057897
2005-03-17

Heat dissipating device with heat conductive posts

#36146
20050057655
2005-03-17

Method for automated testing of the modulation transfer function in image sensors

#36147
20050057149
2005-03-17

Method for manufacturing display; electronic device and display element

#36148
20050056950
2005-03-17

Integrated circuit suitable for use in radio receivers

#36149
20050056941
2005-03-17

Method of fabricating a semiconductor device

#36150
20050056937
2005-03-17

Method of fabricating a connection device

#36151
20050056936
2005-03-17

Multi-layered metal routing technique

#36152
20050056934
2005-03-17

Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method

#36153
20050056932
2005-03-17

Semiconductor device, and wiring-layout design system for automatically designing wiring-layout in such semiconductor device

#36154
20050056923
2005-03-17

Apparatus and method for stacking integrated circuits

#36155
20050056915
2005-03-17

Film carrier tape for mounting electronic devices thereon

#36156
20050056913
2005-03-17

Stereolithographic method for forming insulative coatings for via holes in semiconductor devices

#36157
20050056912
2005-03-17

Semiconductor device

#36158
20050056911
2005-03-17

Semiconductor-on-insulator constructions

#36159
20050056902
2005-03-17

Solid state image pickup device and method of producing solid state image pickup device

#36160
20050056896
2005-03-17

Electrostatic discharge protection device with complementary dual drain implant

#36161
20050056894
2005-03-17

Semiconductor-on-insulator constructions

#36162
20050056878
2005-03-17

Method of manufacturing thin film capacitor

#36163
20050056860
2005-03-17

High frequency switch, two-band type high frequency switch, three-band type high frequency switch, and mobile communication equipment

#36164
20050056852
2005-03-17

Semiconductor device and method of manufacturing the same

#36165
20050056837
2005-03-17

Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof

#36166
20050056405
2005-03-17

Cooling apparatus and electronic equipment

#36167
20050056404
2005-03-17

Integrated liquid cooling system for electrical components

#36168
20050056403
2005-03-17

Thermosyphon and method for producing it

#36169
20050056401
2005-03-17

Cooling device and electrical equipment equipped with the cooling device

#36170
20050056400
2005-03-17

Heat pipe type heat dissipation device

#36171
20050056399
2005-03-17

Radiator including a heat sink and a fan

#36172
20050056398
2005-03-17

Stackable heat sink

#36173
20050056030
2005-03-17

Dynamic fluid sprayjet delivery system

#36174
20050055828
2005-03-17

Method for programming a routing layout design through one via layer

#36175
20050055827
2005-03-17

Mechanism for positioning a substrate of an image sensor

#36176
20050054196
2005-03-10

Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology

#36177
20050054195
2005-03-10

Semiconductor device and method for fabricating the same

#36178
20050054190
2005-03-10

Semiconductor device and method of manufacturing the same

#36179
20050054184
2005-03-10

Arrangement of microstructures

#36180
20050054165
2005-03-10

Atomic layer deposited ZrAlO dielectric layers including ZrAlO

#36181
20050054154
2005-03-10

Solder bump structure and method for forming the same

#36182
20050054152
2005-03-10

Symmetric inducting device for an integrated circuit having a ground shield

#36183
20050054151
2005-03-10

Symmetric inducting device for an integrated circuit having a ground shield

#36184
20050054139
2005-03-10

Enhanced electrically-aligned proximity communication

#36185
20050054127
2005-03-10

Method of manufacturing nitride semiconductor device including SiC substrate and apparatus for manufacturing nitride semiconductor device

#36186
20050054121
2005-03-10

Laser transfer article and method of making

#36187
20050052892
2005-03-10

Systems for programmable memory using silicided poly-silicon fuses

#36188
20050052878
2005-03-10

Light-emitting device arranged in the light distribution pattern for a vehicle

#36189
20050052848
2005-03-10

Liquid cooling system

#36190
20050052847
2005-03-10

Liquid cooling system

#36191
20050052568
2005-03-10

Digital image capturing module assembly and method of fabricating the same

#36192
20050052342
2005-03-10

Dual display device

#36193
20050052272
2005-03-10

Inductive component

#36194
20050052268
2005-03-10

Method for forming an inductor

#36195
20050052204
2005-03-10

Multiplexing of digital signals at multiple supply voltages in an integrated circuit

#36196
20050052196
2005-03-10

Active cooling to reduce leakage power

#36197
20050052191
2005-03-10

In situ determination of resistivity, mobility and dopant concentration profiles

#36198
20050051927
2005-03-10

Thermoplastic adhesive preform for heat sink attachment

#36199
20050051909
2005-03-10

Semiconductor device

#36200
20050051901
2005-03-10

Memory device with discrete layers of phase change memory material

#36201
20050051900
2005-03-10

Method for forming dielectric barrier layer in damascene structure

#36202
20050051899
2005-03-10

Semiconductor device and production method therefor

#36203
20050051896
2005-03-10

Arrangement for improving module reliability

#36204
20050051893
2005-03-10

SBGA design for low-k integrated circuits (IC)

#36205
20050051892
2005-03-10

Hermetic container and image display apparatus

#36206
20050051891
2005-03-10

Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it

#36207
20050051888
2005-03-10

Heat sink and display panel including heat sink

#36208
20050051879
2005-03-10

Plating tail design for IC packages

#36209
20050051874
2005-03-10

Power semiconductor device

#36210
20050051872
2005-03-10

Method of manufacturing an IC coil mounted in an information carrier

#36211
20050051871
2005-03-10

Symmetric inducting device for an integrated circuit having a ground shield

#36212
20050051869
2005-03-10

Semiconductor device

#36213
20050051868
2005-03-10

Method of closing an antifuse using laser energy

#36214
20050051865
2005-03-10

Control of air gap position in a dielectric layer

#36215
20050051864
2005-03-10

Control of air gap position in a dielectric layer

#36216
20050051848
2005-03-10

Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation

#36217
20050051841
2005-03-10

Stress-controlled dielectric integrated circuit

#36218
20050051838
2005-03-10

Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories

#36219
20050051815
2005-03-10

Short-channel Schottky-barrier MOSFET device and manufacturing method

#36220
20050051809
2005-03-10

Dummy fill for integrated circuits

#36221
20050051765
2005-03-10

Test structure for a single-sided buried strap DRAM memory cell array

#36222
20050051604
2005-03-10

Method and system for forming ball grid array ("BGA") packages

#36223
20050051512
2005-03-10

Method of forming multilayer diffusion barrier for copper interconnections

#36224
20050051352
2005-03-10

Semiconductor package, electronic circuit device, and mounting method of semiconductor device

#36225
20050051351
2005-03-10

Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identity of the semiconductor device

#36226
20050051307
2005-03-10

Integrated circuit heat pipe heat spreader with through mounting holes

#36227
20050051306
2005-03-10

Heat transfer apparatus

#36228
20050051304
2005-03-10

Heat transport device and electronic device

#36229
20050051303
2005-03-10

Heat transport device and electronic apparatus

#36230
20050051300
2005-03-10

Method for passive phase change thermal management

#36231
20050051298
2005-03-10

Cooler for cooling both sides of semiconductor device

#36232
20050051297
2005-03-10

Heat sink

#36233
20050051296
2005-03-10

Heat sink

#36234
20050050946
2005-03-10

Cleaning evaluation method for a substrate

#36235
20050050507
2005-03-03

Basic cell, edge cell, wiring shape, wiring method, and shield wiring structure

#36236
20050050505
2005-03-03

Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid

#36237
20050048782
2005-03-03

Method of fabricating a semiconductor device

#36238
20050048773
2005-03-03

Semiconductor process and composition for forming a barrier material overlying copper

#36239
20050048772
2005-03-03

Bond pad techniques for integrated circuits

#36240
20050048771
2005-03-03

Method for forming a hardmask employing multiple independently formed layers of a capping material to reduce pinholes

#36241
20050048770
2005-03-03

Process for manufacturing a wiring board having a via

#36242
20050048762
2005-03-03

Integrated circuit capacitor in multi-level metallization

#36243
20050048739
2005-03-03

Multifunctional metallic bonding

#36244
20050048726
2005-03-03

Method of manufacturing lateral MOSFET structure of an integrated circuit having separated device regions

#36245
20050048699
2005-03-03

Method and system for integrated circuit packaging

#36246
20050048681
2005-03-03

Light-emitting diode encapsulation material and manufacturing process

#36247
20050048676
2005-03-03

Method for producing an electronic component, especially a memory chip

#36248
20050048308
2005-03-03

Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof

#36249
20050048306
2005-03-03

Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board

#36250
20050047776
2005-03-03

Camera

#36251
20050047543
2005-03-03

Method and apparatus for personalization of semiconductor

#36252
20050047106
2005-03-03

Substrate reinforcing in an LGA package

#36253
20050047105
2005-03-03

Heat dissipation apparatus and method

#36254
20050047093
2005-03-03

Direct plugging CPU cooling fan

#36255
20050047092
2005-03-03

Method of assembly of a wedge thermal interface to allow expansion after assembly

#36256
20050047091
2005-03-03

Liquid cooling system and electronic apparatus using the same

#36257
20050047090
2005-03-03

Cooling device, electronic equipment device, and method of manufacturing cooling device

#36258
20050047089
2005-03-03

Ceramic heat sink with micro-pores structure

#36259
20050047088
2005-03-03

Heat dissipating device

#36260
20050047086
2005-03-03

Heat dissipation apparatus and method

#36261
20050047064
2005-03-03

High quality factor spiral inductor that utilizes active negative capacitance

#36262
20050047047
2005-03-03

Protection circuit for semiconductor device and semiconductor device including the same

#36263
20050046573
2005-03-03

Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith

#36264
20050046544
2005-03-03

Ball grid array resistor network having a ground plane

#36265
20050046435
2005-03-03

Method and apparatus for evaluating and adjusting microwave integrated circuit

#36266
20050046346
2005-03-03

Display device and method for manufacturing the same

#36267
20050046079
2005-03-03

Method for integrated circuit packaging

#36268
20050046038
2005-03-03

Multi-dice chip scale semiconductor components

#36269
20050046034
2005-03-03

Apparatus and method for high density multi-chip structures

#36270
20050046031
2005-03-03

Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal line

#36271
20050046028
2005-03-03

Semiconductor device and method for fabricating the same

#36272
20050046027
2005-03-03

Semiconductor device having a capping layer including cobalt and method of fabricating the same

#36273
20050046022
2005-03-03

Semiconductor devices integrated with wafer-level packaging

#36274
20050046014
2005-03-03

Isolating temperature sensitive components from heat sources in integrated circuits

#36275
20050046013
2005-03-03

Semiconductor integrated circuit

#36276
20050046009
2005-03-03

Multi-layer staggered power bus layout design

#36277
20050046004
2005-03-03

Method and system for integrated circuit packaging

#36278
20050045991
2005-03-03

Computer systems containing resistors which include doped silicon/germanium

#36279
20050045989
2005-03-03

Semiconductor device

#36280
20050045985
2005-03-03

High power radio frequency integrated circuit capable of impeding parasitic current loss

#36281
20050045975
2005-03-03

Solid state imaging device with inner lens and manufacture thereof

#36282
20050045974
2005-03-03

Die carrier with fluid chamber

#36283
20050045969
2005-03-03

Silicide/semiconductor structure and method of fabrication

#36284
20050045919
2005-03-03

Semiconductor device

#36285
20050045918
2005-03-03

Hybrid vertical twisted bitline architecture

#36286
20050045910
2005-03-03

Photodiode having voltage tunable spectral response

#36287
20050045897
2005-03-03

Light emitting apparatus

#36288
20050045879
2005-03-03

Integrated circuitry and method for manufacturing the same

#36289
20050045865
2005-03-03

Semiconductor device having a lower parasitic capacitance

#36290
20050045697
2005-03-03

Wafer-level chip scale package

#36291
20050045374
2005-03-03

Flexible circuit boards with tooling cutouts for optoelectronic modules

#36292
20050045372
2005-03-03

Heat spreading thermal interface structure

#36293
20050045371
2005-03-03

Circuit board

#36294
20050045313
2005-03-03

Heat sink

#36295
20050045311
2005-03-03

Heat dissipating device incorporating clip

#36296
20050045310
2005-03-03

Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit

#36297
20050045309
2005-03-03

Electronic apparatus

#36298
20050045308
2005-03-03

Planar heat pipe structure

#36299
20050045307
2005-03-03

Variable height thermal interface

#36300
20050044674
2005-03-03

Unlocking mechanism