Metal insulator metal capacitor

Semiconductor devices, methods of manufacture thereof, and capacitors

Sensor package with cooling feature and method of making same

Methods of manufacturing a semiconductor device with non-overlapping slits in-between memory blocks

Method for fabricating a multi-gate device

Semiconductor diode

Doubled substrate multi-junction light emitting diode array structure

Packages with thermal management features for reduced thermal crosstalk and methods of forming same

Semiconductor device for ESD protection

Semiconductor structure and method for forming the same

Integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of thermal expansion

Bi-layer hard mask for robust metallization profile

Surface pre-treatment for hard mask fabrication

Trench interconnect having reduced fringe capacitance

Electronic device and method for fabricating the same

Semiconductor device and method of manufacturing the same

Interconnect structure for semiconductor devices

Power semiconductor package with integrated heat spreader and partially etched conductive carrier

Carrier with hollow chamber and support structure therein

Carrier and a method for processing a carrier

Method of making a semiconductor device

Metal PVD-free conducting structures

Carrier and method of fabricating semiconductor device using the same

Trace structure for improved electrical signaling

Voltage droop mitigation in 3D chip system

Imprinted multi-level optical circuit structure

Through silicon via filling using an electrolyte with a dual state inhibitor

Conductive paste for forming conductive film for semiconductor devices, semiconductor device, and method for producing semiconductor device

Copolymer

Packaged RF power transistor device having next to each other a ground and a video lead for connecting a decoupling capacitor, RF power amplifier

Method to fabricate a substrate including a material disposed on the edge of one or more non through hole formed in the substrate

Method for producing a mechanically autonomous microelectronic device

Capacitive micromachined ultrasonic transducer and method of fabricating the same

Semiconductor module and driver device

Vision enhancement illuminators

Three-dimensional integrated circuit and method of transmitting data within a three-dimensional integrated circuit

Chip mode isolation and cross-talk reduction through buried metal layers and through-vias

Method of manufacturing light emitting device

Optoelectronic chip-on-board module

Light-emitting device

Semiconductor growth substrates and associated systems and methods for die singulation

Source/drain contacts for non-planar transistors

Semiconductor device having gate trench in JFET region

Semiconductor device

Solid-state imaging apparatus and method for manufacturing the solid-state imaging apparatus having sealing portion disposed in bonded members

Gated bipolar junction transistors, memory arrays, and methods of forming gated bipolar junction transistors

Semiconductor device

ESD protection device

Glass composition for protecting semiconductor junction, method of manufacturing semiconductor device and semiconductor device

Integrated semiconductor device and method for fabricating the same

Metallic interconnects products

Polysilicon fuse, semiconductor device having overlapping polysilicon fuse sections and method of severing polysilicon fuse

Stacked bit line dual word line nonvolatile memory

Anti-fuse of semiconductor device, semiconductor module and system each including the semiconductor device, and method for forming the anti-fuse

Interconnect structure and method for forming the same

Semiconductor devices having through-electrodes and methods for fabricating the same

Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium

Semiconductor device and method of manufacturing the same

Backplane for display device, and display device including the same

Method of forming capacitor structure

Methods and systems for detecting ESD events in cabled devices

Electronic apparatus, method of optimizing de-coupling capacitor and computer-readable recording medium

Touch screen assembly

Method for de-embedding a device-under-test

Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integration

Encapsulation structure comprising trenches partially filled with getter material

Semiconductor device and method for manufacturing the same

Antifuse of semiconductor device and method of fabricating the same

3D structure for advanced SRAM design to avoid half-selected issue

Anti-fuse array of semiconductor device and method for operating the same

LED base module and LED lighting device

High strength through-substrate vias

Heat-receiving device, cooling device, and electronic device

High quality factor inductive and capacitive circuit structure

Metrology method and apparatus, lithographic system, device manufacturing method and substrate

Method for manufacturing semiconductor device and alignment mark of semiconductor device

Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof

Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device

Electrically conductive laminate structures

Method for forming recess-free interconnect structure

High-resistive silicon substrate with a reduced radio frequency loss for a radio-frequency integrated passive device

Semiconductor arrangement with capacitor

Miniature passive structures, high frequency electrostatic discharge protection networks, and high frequency electrostatic discharge protection schemes

Semiconductor package with air gap

High density trench-based power MOSFETs with self-aligned active contacts and method for making such devices

Semiconductor devices

Fin capacitor employing sidewall image transfer

Light-emitting diode device

Vertical type AC-LED device and manufacturing method thereof

High speed differential wiring in glass ceramic MCMS

Method of producing heat conductive sheet

High speed differential wiring in glass ceramic MCMS

Production method of thermoelectric converter, production method of electronic device equipped with thermoelectric converter, and thermoelectric converter

Method and system for magnetic semiconductor solid state cooling

Methods for cell phasing and placement in dynamic array architecture and implementation of the same

Curable composition

Curable composition

Via in substrate with deposited layer

Methods for dry etching cobalt metal using fluorine radicals

Integrated circuit and interconnect, and method of fabricating same

Method for fabricating a semiconductor device having buried bit lines

Vias in porous substrates

Method of manufacturing semiconductor device substrate with crystal structure reformation regions

Method of fabricating semiconductor device

Vertical conductive connections in semiconductor substrates

Devices including, methods using, and compositions of reflowable getters

Buttoned soldering pad for use with fine-pitch hot bar soldering

Cooling apparatus with dynamic load adjustment

Heat receiving apparatus, cooling apparatus, and electronic apparatus

Light-emitting device including substrate having cavity, and method for fabricating the light-emitting device

Rolled-up transformer structure for a radiofrequency integrated circuit (RFIC)

Stacked semiconductor arrangement

Apparatuses including scalable drivers and methods

Method and apparatus for detection and identification of counterfeit and substandard electronics

Semicondutor device with through-silicon via-less deep wells

Semiconductor device having voids and method of forming same

Graphene and metal interconnects with reduced contact resistance

Semiconductor structure and semiconductor fabricating process for the same

Copper wire and dielectric with air gaps

Integrated circuits and methods for fabricating integrated circuits with improved contact structures

Nanoscale interconnects fabricated by electrical field directed assembly of nanoelements

Method of optical proximity correction for modifying line patterns and integrated circuits with line patterns modified by the same

Stacked chips electrically connected by a plurality of juncture portions

Semiconductor package and method of manufacturing the same

Semiconductor devices having through-electrodes and methods for fabricating the same

Metal fuse structure for improved programming capability

Thin beam deposited fuse

Air bridge structure having dielectric coating

Integrated circuit assembly with faraday cage

Inter-level connection for multi-layer structures

Curable composition

Optoelectronic semiconductor component with sapphire flip-chip

Semiconductor light source with a first and a second LED chip and a first and a second fluorescent substance

Display device and method for manufacturing the same

Method for integrating a light emitting device

Light emitting element and light emitting element array

Vertical multi-junction light emitting diode

Semiconductor devices with integrated Schottky diodes and methods of fabrication

Electroluminescence display device

Display device with separation member including steps

Organic light-emitting display device and method for manufacturing organic light-emitting display device

Semiconductor device and method of manufacturing the same

Electrical feedthrough for housing of active implantable medical device

Cooling apparatus with dynamic load adjustment

Peeling system

Workpiece processing method

Method for manufacturing light distribution member, and method for manufacturing light emitting device

Air gap formation by damascene process

Method of manufacturing a semiconductor device

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Methods of forming electrically conductive lines

Semiconductor device and a method of manufacturing the same

Hybrid light bulbs using combinations of remote phosphor LEDS and direct emitting LEDS

Semiconductor device

High voltage power chip module

Circuit board and heat dissipation device thereof

Connecting structure of cooling device, cooling device, and method for connecting cooling device

Vertical metal insulator metal capacitor

Electronic devices with floating metal rings

Decoupling arrangement

3D antenna for integrated circuits

Transistor and tunable inductance

Tunable guard ring for improved circuit isolation

Configurable vertical integration

Wafer-level underfill and over-molding

Semiconductor package having magnetic substance and related equipment

Interconnect structure and method of forming same

Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same

Apparatus and method of three dimensional conductive lines

Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/HSOsolution

Device having self-repair Cu barrier for solving barrier degradation due to Ru CMP

Method for manufacturing germamde interconnect structures and corresponding interconnect structures

Thermally conductive molding compound structure for heat dissipation in semiconductor packages

Semiconductor element housing package, semiconductor device, and mounting structure

Layer arrangement and a wafer level package comprising the layer arrangement

Semiconductor device with an overlay mark including segment regions surrounded by a pool region

Electronic fuse having an insulation layer

Near-infrared absorptive composition, near-infrared cut filter using near-infrared absorptive composition, method for manufacturing near-infrared cut filter, and camera module and method for manufacturing camera module

Disposable pillars for contact formation

Semiconductor device and method of making same

Device and structure and method for forming the same

Semiconductor device and selective heating thereof

Stack of horizontally extending and vertically overlapping features, methods of forming circuitry components, and methods of forming an array of memory cells

Light-emitting device, light-emitting device package, and light unit

Light emitting device with nanostructured phosphor

Strain tunable light emitting diodes with germanium P-I-N heterojunctions

Flexible circuit board for LED lighting fixtures

Semiconductor light-emitting device

LED lead frame for laminated LED circuits

Manufacturing method of thin film and metal line for display using the same, thin film transistor array panel, and method for manufacturing the same

Refrigeration apparatus

Curable resin composition and cured product thereof, encapsulating agent, and optical semiconductor device

Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes

Controlling the device performance by forming a stressed backside dielectric layer

Luminaire with LEDs and cylindrical lens

Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package

Heat-receiving device, cooling device, and electronic device

Array camera modules incorporating independently aligned lens stacks

Array cameras incorporating independently aligned lens stacks

Amplifier circuit with cross wiring of direct-current signals and microwave signals

Method and apparatus for authenticating a semiconductor die

Semiconductor device and method of fabricating the same

Semiconductor device

Silicon buried digit line access device and method of forming the same

Structure and method for forming interconnect structure

Differential MOSCAP device

Semiconductor device

Semiconductor device with an integrated heat sink array

Semiconductor device with heat sinks

Data storage device and methods of manufacturing the same

Semiconductor light emitting device

Power semiconductor device including a cooling material

Nitride semiconductor device and method for manufacturing same

Semiconductor devices and methods of formation thereof

Semiconductor device in which oxygen deficiency in semiconductor is reduced and method for manufacturing the same

Thin film transistor and display device having the same

Communication module

Method of manufacturing light emitting device including light emitting element and wavelength converting member

Method of producing heat conductive sheet

Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film

Temperature detecting circuit and temperature detecting apparatus using the same

Light emitting diode device and light emitting diode lamp

Light-emitting device including a semiconductor component and an optical element and method for manufacturing thereof

Lighting source using solid state emitter and phosphor materials

DC-DC converter assembly with an output inductor accommodating a power stage attached to a circuit board

Semiconductor device

Electric component

Cooling member with pressed pipe

Centrifugal fan with integrated thermal transfer unit

Device for electrically testing the interconnections of a microelectronic device

Protruding contact for integrated chip

Semiconductor substrate mitigating bridging

Integrated circuit structure with through-semiconductor via

Integrated circuit structure with metal cap and methods of fabrication

Bonding method using porosified surfaces for making stacked structures

In-situ formation of silicon and tantalum containing barrier

Semiconductor device having a corrosion-resistant metallization and method for manufacturing thereof

Method for processing wafer

Interconnects for semiconductor devices

Devices, systems and methods for manufacturing through-substrate vias and front-side structures

Semiconductor apparatus having through via capable of testing connectivity of through via

Semiconductor device including dummy conductive cells

Silicon-on-plastic semiconductor device and method of making the same

Semiconductor device and method of producing semiconductor device

Semiconductor device and method for producing same having multilayer wiring structure with contact hole having hydrophobic film formed on side surface of the contact hole

Enhanced hydrogen barrier encapsulation method for the control of hydrogen induced degradation of ferroelectric capacitors in an F-RAM process

Interconnection between inductor and metal-insulator-metal (MIM) capacitor

Toroid inductor in an integrated device

Inductive capacitive structure and method of making the same

Technique for fabrication of microelectronic capacitors and resistors

Semiconductor devices, methods of manufacturing thereof, and image sensor devices

Self-protected metal-oxide-semiconductor field-effect transistor

Three dimensional stacked nonvolatile semiconductor memory

Repairing monolithic stacked integrated circuits with a redundant layer and lithography process

Optoelectronic component and method for producing an optoelectronic component

Optoelectronic devices containing a converter carrier layer, and methods of producing an optoelectronic device containing a converter carrier layer

III-nitride light emitting device with a region including only ternary, quaternary, and/or quinary III-nitride layers

Flip-chip light emitting diode and fabrication method

Semiconductor light-emitting device and method of manufacturing the same

Die crack detector with integrated one-time programmable element

Semiconductor device and manufacturing method of the same

Thermal treatment of flash memories

Ceramic capacitors with improved lead designs

Temperature control system having adjacently-installed temperature equalizer and heat transfer fluid and application device thereof

Adjacently-installed temperature equalizer with single side heat transferring

Refrigeration apparatus

System and method for enhanced convection cooling of temperature-dependent power producing and power consuming electrical devices

Metrology through use of feed forward feed sideways and measurement cell re-use

Fabrication method of silicon carbide semiconductor element

Transfer-bonding method for light emitting devices

Easily deformable aggregate and method for manufacturing same, thermally conductive resin composition, thermally conductive member and method for manufacturing same, and thermally conductive adhesive sheet

Light source and illuminating device

Microwave component package

Unit for semiconductor device

Electronic device assemblies and vehicles employing dual phase change materials

Thinning in package using separation structure as stop

Self-aligned nano-structures

Reliable passivation layers for semiconductor devices

Self aligned contact formation

Method of forming hybrid diffusion barrier layer and semiconductor device thereof

Electro-migration enhancing method for self-forming barrier process in copper metalization

Mechanisms for forming protection layer on back side of wafer

3DIC packages with heat dissipation structures

Packages with thermal interface material on the sidewalls of stacked dies

Semiconductor chip with seal ring and sacrificial corner pattern

Method for thinning, metalizing, and dicing a semiconductor wafer, and semiconductor device made using the method

Semiconductor integrated device for display drive

Nearly buffer zone free layout methodology

Polysilicon resistor structure having modified oxide layer

Integrated circuit devices having through silicon via structures and methods of manufacturing the same

Semiconductor device with patterned ground shielding

Method of forming stacked trench contacts and structures formed thereby

Metal-insulator-metal capacitor structure

Light emitting diode

Light emitting diode

Optoelectronic module and method for producing an optoelectronic module

Method for producing interconnected optoelectronic components, and interconnected optoelectronic components

Electronic device with reduced non-device edge area

Organic light-emitting display apparatus

Integrated shield structure for mixed-signal integrated circuits