Semiconductor light-emitting device

Fabrication of optics wafer

Semiconductor device and method for forming the same

Three-dimensional semiconductor device

Fast programming antifuse and method of manufacture

Semiconductor device

Three dimensional stacking memory film structure

Alignment marks in non-STI isolation formation and methods of forming the same

Package-on-package devices and methods of manufacturing the same

Semiconductor device having a substrate and input and output electrode units

LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion

Optical bus in 3D integrated circuit stack

Interconnect arrangement with stress-reducing structure and method of fabricating the same

Integrated circuits having gate cap protection and methods of forming the same

Semiconductor device having a nanotube layer and method for forming

Method to reduce metal fuse thickness without extra mask

Toroid inductor in redistribution layers (RDL) of an integrated device

Method, structures and method of designing reduced delamination integrated circuits

Printed circuit board and stacked semiconductor device

Semiconductor device with webbing between leads

Semiconductor device having barrier metal layer

Semiconductor device having through-silicon via

Robust through-silicon-via structure

Carbon nanotube sheet, semiconductor device, method of manufacturing carbon nanotube sheet, and method of manufacturing semiconductor device

Liquid crystal display and method of fabricating the same

Chemical sensor package for highly pressured environment

Layer structure for mounting semiconductor device and fabrication method thereof

Stacked semiconductor structure and manufacturing method for the same

Singulation of semiconductor dies with contact metallization by electrical discharge machining

Semiconductor device with air gap and method for fabricating the same

Semiconductor device and method for making same

Pseudo-8-shaped inductor

Placing transistors in proximity to through-silicon vias

Structure and method to determine through silicon via build integrity

High-definition LED display screen and surface-mounted LED composite lamp with ultra-small point distance thereof

Process for producing a metal device housed in a closed housing within an integrated circuit, and corresponding integrated circuit

Heat-dissipating EMI/RFI shield

Integrated pipe heat exchanger

Integrated circuit and transmission and reception apparatus

Optoelectronic semiconductor component, conversion-medium lamina and method for producing a conversion-medium lamina

Light emitting device

III-V compound semiconductor-based-light-emitting diode device with embedded charge carrier barrier

Recessed contact to semiconductor nanowires

Handle for semiconductor-on-diamond wafers and method of manufacture

Semiconductor device with self-heat reducing layers

Moisture barrier capacitors in semiconductor components

Method of forming bus line designs for large-area OLED lighting

Semiconductor image pickup device

Optical devices, in particular computational cameras, and methods for manufacturing the same

High voltage double-diffused MOS (DMOS) device and method of manufacture

ESD clamp with a layout-alterable trigger voltage and a holding voltage above the supply voltage

Mark, method for forming same, and exposure apparatus

Semiconductor devices and methods of manufacture thereof

Semiconductor structure having an air-gap region and a method of manufacturing the same

Duplicate layering and routing

Semiconductor device and method for fabricating the same

Semiconductor device and method of manufacturing a semiconductor device

Method for manufacturing a semiconductor device

Semiconductor structure with inlaid capping layer and method of manufacturing the same

Nested through glass via transformer

Graphene interposer and method of manufacturing such an interposer

Stacked device detection and identification

Gas sensor package

Heat transfer device for high heat flux applications and related methods thereof

Method for fabricating a heat sink, and heat sink

Phosphor sheet

Micro-electro-mechanical-system device with guard ring and method for making same

Method and device for cooling a heat generating component

Commmonly submersed servers with velocity augmentation and partial recirculation in tank

Container for housing electronic component and electronic device

Power semiconductor module with asymmetrical lead spacing

Circuits having switches providing increased voltage swing uniformity

Light-emitting device having a plurality of contact parts

Optoelectronic semiconductor component

Aggregation of semiconductor devices and the method thereof

Light-emitting semiconductor chip

Thin-film semiconductor device, organic EL display device, and manufacturing methods thereof

3DIC seal ring structure and methods of forming same

Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor device

Butted contact shape to improve SRAM leakage current

N-channel and P-channel end-to-end finFET cell architecture with relaxed gate pitch

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Optoelectronic semiconductor chip

Method of fabricating bump structure and bump structure

Protection of an integrated circuit against attacks

Display device

Method for forming crack stop structure

Semiconductor device package with warpage control structure

Method to fabricate copper wiring structures and structures formed thereby

Methods of depositing cobalt manganese films

Trench multilevel contact to a 3D memory array and method of making thereof

Flexible lead frame connection for electronic interconnects

Systems and methods for coupling a semiconductor device of an automation device to a heat sink

Semiconductor device and method of fabricating the same

Integrated circuits including selectively deposited metal capping layers on copper lines and methods for fabricating the same

Self-aligned repairing process for barrier layer

Methods of forming semiconductor structures including tight pitch contacts and lines

Conductive layer routing

Producing method of encapsulating layer-covered semiconductor element and producing method of semiconductor device

Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the same

Nanostructures having low defect density and methods of forming thereof

Memory devices and methods for managing error regions

Method of test probe alignment control

Solid state sensor for metal ion detection and trapping in solution

Chassis and method for manufacturing chassis

Apparatus and methods for processing exfoliated graphite materials

Electronic component housing container and electronic device

Semiconductor package and method therefor

Electronic device

Method for assembling and encapsulating lithium microbatteries and microbatteries produced thereby

Encapsulation film

Electric conductive heat dissipation substrate

Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode

Light emitting diode having electrode pads

Semiconductor device with oxide semiconductor layer

Semiconductor device having an effective use of the conductive layer formed in the same process as one electrode

Power semiconductor device and method for fabricating the same

Superjunction structures for power devices

Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers

Light emitting device having plurality of light emitting elements and light reflective member

Semiconductor device

Method for manufacturing semiconductor device having antifuse with semiconductor and insulating films as intermediate layer

Semiconductor chip including digital logic circuit including at least six transistors with some transistors forming cross-coupled transistor configuration and associated methods

Semiconductor device having a high-K gate dielectric above an STI region

Semiconductor device with a multiple nanowire channel structure and methods of variably connecting such nanowires for current density modulation

Fin contacted electrostatic discharge (ESD) devices with improved heat distribution

Etch removal of current distribution layer for LED current confinement

Combination of TSV and back side wiring in 3D integration

Electronic control device

Metal fuse by topology

Semiconductor device and method of forming thereof

Semiconductor devices and methods of fabricating the same

Interconnect structure for semiconductor devices

Interconnect structure and method of forming the same

Three-dimensional electronic packages utilizing unpatterned adhesive layer

Lid design for heat dissipation enhancement of die package

Metal oxide semiconductor structure

Semiconductor device, method for manufacturing the same, and rinsing liquid

Semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device with air gap and method of fabricating the same

Metal thin film resistor and process

Interconnect structure and method for forming the same

Plasma etching method and semiconductor device manufacturing method

Electronic component, method for producing same, and sealing material paste used in same

One-time programmable memory devices using FinFET technology

Multilevel via placement with improved yield in dual damascene interconnection

Substrate, related device, and related manufacturing method

Aggregate board, light emitting device, and method for testing light emitting element

Photoelectric converting module

Device package and methods for the fabrication and testing thereof

Cooling device and electronic equipment

Jet impingement cooling apparatuses having non-uniform jet orifice sizes

Sheet-type heat pipe

Package for housing semiconductor element and semiconductor device

Panel with releasable core

Micro-electro-mechanical transducer having an optimized non-flat surface

Apparatus for mixed signal interface circuitry and associated methods

Micro-electro-mechanical transducer having an optimized non-flat surface

Method of fabricating white LED devices

Warm white LED with stacked wafers and fabrication method thereof

Sensor module and method of manufacturing the same

Process for forming a planar diode using one mask

E-fuse design for high-K metal-gate technology

Sandwich damascene resistor

Semiconductor memory device

Hard coating film and display device using the same

Multi-level contact to a 3D memory array and method of making

Multilevel contact to a 3D memory array and method of making thereof

Semiconductor structures including fluidic microchannels for cooling and related methods

Semiconductor device comprising an e-fuse and a FET

Semiconductor structure for electrostatic discharge protection

Semiconductor structure for electrostatic discharge protection

3DIC interconnect apparatus and method

Semiconductor package and semiconductor module

Display device and method for manufacturing the same

Substrate and method for labeling signal lines thereof

Alignment mark arrangement, semiconductor workpiece, and method for aligning a wafer

Methods of forming wiring structures

Metal-containing films as dielectric capping barrier for advanced interconnects

Cobalt based interconnects and methods of fabrication thereof

Techniques for forming interconnects in porous dielectric materials

Multilevel contact to a 3D memory array and method of making thereof

Locally raised epitaxy for improved contact by local silicon capping during trench silicide processings

3-D IC device with enhanced contact area

Semiconductor device and method for manufacturing semiconductor device

Method of controlling contact hole profile for metal fill-in

Method and apparatus of a three dimensional integrated circuit

Using materials with different etch rates to fill trenches in semiconductor devices

Semiconductor devices with inner via

Thickened stress relief and power distribution layer

Wiring layout having differently shaped vias

Method for forming through silicon via in N+ epitaxy wafers with reduced parasitic capacitance

Hybrid TSV and method for forming the same

Semiconductor device, manufacturing method for semiconductor device, and electronic device

Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures

Protective film material for laser processing and wafer processing method using the protective film material

Semiconductor wafers employing a fixed-coordinate metrology scheme and methods for fabricating integrated circuits using the same

Anti-fuse array of semiconductor device and method for forming the same

Fin-like field effect transistor (FinFET) based, metal-semiconductor alloy fuse device and method of manufacturing same

Interconnection structures in a semiconductor device and methods of manufacturing the same

Semiconductor substrate and fabrication method thereof

Integrated structure and method for fabricating the same

Cluster system for eliminating barrier overhang

Method of integrated circuit fabrication

Air-gap forming techniques for interconnect structures

Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures

Method of etching

Method for fabricating semiconductor device with paterned hard mask

Forming conductive portions in insulating materials matreials using an ion beam

Heat exchanging apparatus and method for transferring heat

Method and device for cooling a heat generating component

Liquid sealing material and electronic component using same

Micro-electro-mechanical transducer having an optimized non-flat surface

Manufacturing process for thermosiphon heat exchanger

Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor

Liquid cooling of rack-mounted electronic equipment

Modular cooling system

Element housing package and mounting structure body

Method for producing conductive tracks

Method of manufacturing an intermediate product for an interposer and intermediate product for an interposer

Heat sink and heat dissipation system

Housing for encasing a mobile computing device

Electric machine

Method for producing an optoelectronic component and method for patterning an organic, optoelectronic component

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

Wafer-level solid state transducer packaging transducers including separators and associated systems and methods

Substrate insert molding with deposited light-generating sources

Phosphor converted light emitting diode, a lamp and a luminaire

Method for manufacturing light emitting device using strip-shaped first resin members

Light emitting devices having light coupling layers

Shallow junction photodiode for detecting short wavelength light

Mechanisms for forming metal-insulator-metal (MIM) capacitor structure

Semiconductor device having electrode made of high work function material, method and apparatus for manufacturing the same

Semiconductor device having electrode made of high work function material and method of manufacturing the same

Methods and structures for forming microstrip transmission lines on thin silicon on insulator (SOI) wafers

Systems and methods for integrated multi-layer magnetic films

Thin film transistor array substrate, organic light-emitting display apparatus, and method of manufacturing the thin film transistor array substrate

Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods

Solid state image pickup device and method of producing solid state image pickup device

Method of manufacturing a semiconductor device

Thin film transistor array panel and method of manufacturing the same

Antifuse cell comprising program transistor and select transistor arranged on opposite sides of semiconductor layer

Self aligned active trench contact

Submount for LED device package

Manufacturing method of flexible device substrate

Integrated circuits having crack-stop structures and methods for fabricating the same

Ion sensitive field effect transistors with protection diodes and methods of their fabrication

Die or substrate marking using a laser

Semiconductor device with air gap

Chip package structure

Method of creating a maskless air gap in back end interconnections with double self-aligned vias

Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects

Semiconductor structure and method making the same

Method and layout of an integrated circuit

Finger metal oxide metal capacitor formed in a plurality of metal layers

Semiconductor device and manufacturing method thereof

Methods of protecting a dielectric mask layer and related semiconductor devices

Multiple depth vias in an integrated circuit

TSV without zero alignment marks

Cooling system for a computer and method for assembling the same

Semiconductor chip and electronic system including the same

Method for forming semiconductor package using carbon nano material in molding compound

Semiconductor devices and methods for manufacturing semiconductor devices

Semiconductor wafer and semiconductor die

Electronic component can package structure

Probe pad design to reduce saw defects

Metal on elongated contacts

Method of forming semiconductor device using remote plasma treatment

Method of forming integrated circuit with conductive line having line-ends

Rinsing solution to prevent TiN pattern collapse

Semiconductor device and fabrication method

UV sensor with nonvolatile memory using oxide semiconductor films

Integrated circuit package and method

Display module and system applications

Microlens array, image pickup element package, and method for manufacturing microlens array

Scintillator panel and radiation detector

Power amplifier device for a magnetic resonance device and magnetic resonance device

Reusable phase-change thermal interface structures

Light emitting apparatus having at least one reverse-biased light emitting diode

Method for producing an illuminant

Semiconductor manufacturing device and semiconductor manufacturing method

Semiconductor manufacturing device and semiconductor manufacturing method

Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials

Heat conductive sheet

MEMS device with release aperture

Manufacturing method of heat dissipation assembly

Heat dissipation structure

Power semiconductor device

Printed wiring board and method for manufacturing printed wiring board

Amplifier circuit with cross wiring of direct-current signals and microwave signals

System on a chip, apparatus and method for voltage ripple reduction on a power supply line of an integrated circuit device operable in at least two modes

Flyback quick start driving circuit and driving method

High-power semiconductor module

Light-emitting device and method for manufacturing the same

Strengthened LED package and method therefor

Inverse visible spectrum light and broad spectrum light source for enhanced vision

Solar cell and method for manufacturing with pre-amorphization implant to form emitter

Nitride-based transistors having structures for suppressing leakage current

Silicon carbide single-crystal substrate