212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Method for manufacturing an electronic device
#7502Electronic device package and packaging substrate for the same
#7503Integrated circuits and methods of forming the same with metal layer connection to through-semiconductor via
#7504Through silicon via device having low stress, thin film gaps and methods for forming the same
#7505Mitigating pattern collapse
#7506Semiconductor device and method of manufacturing the same
#7507Method of semiconductor integrated circuit fabrication
#7508Selective local metal cap layer formation for improved electromigration behavior
#7509Selective local metal cap layer formation for improved electromigration behavior
#7510Micro-electro mechanical system (MEMS) structures and methods of forming the same
#7511Mitigation of far-end crosstalk induced by routing and out-of-plane interconnects
#7512Method of modifying surfaces
#7513Integrated magnetic core inductors with interleaved windings
#7514Electrical fuse structure and method of formation
#7515Chip with through silicon via electrode and method of forming the same
#7516Solid-state imaging device and electronic apparatus
#7517Semiconductor integrated circuit
#7518Electroluminescence display device
#7519Light emitting device and its method of manufacture
#7520Display device
#7521Semiconductor test structures
#7522Organic light emitting diode, method for producing an organic light emitting diode and module comprising at least two organic light emitting diodes
#7523Component built-in board and method of manufacturing the same
#7524Method and apparatus for removing heat from electronic devices using synthetic jets
#7525Process for producing substrate for mounting element
#7526Laser diode package
#7527Integrated package insertion and loading mechanism (iPILM)
#7528Chip package and method for forming the same
#7529Graphene patterning method and patterning member
#7530Rapid conductive cooling using a secondary process plane
#7531String selection structure of three-dimensional semiconductor device
#7532Integrated power module packaging structure
#7533Active cooling debris bypass fin pack
#7534Integrated circuit common-mode filters with ESD protection and manufacturing method
#7535Backside redistribution layer patch antenna
#7536Inductor design with metal dummy features
#7537Diplexer design using through glass via technology
#7538Methods for characterizing shallow semiconductor junctions
#7539Detecting apparatus, wafer and electronic device
#7540Enforcement of semiconductor structure regularity for localized transistors and interconnect
#7541Semiconductor devices and methods of fabricating semiconductor devices
#7542Copper etching integration scheme
#7543Package structure and method for manufacturing thereof
#7544Semiconductor device
#7545Trench shielding structure for semiconductor device and method
#7546Semiconductor HEMT device with stoichiometric silicon nitride layer
#7547Optoelectronic semiconductor chip
#7548Thermal dissipater apparatus for use with electronic devices
#7549Compliant micro device transfer head
#7550Method and system for wafer level singulation
#7551Evaporative heat transfer system
#7552Termination design for high voltage device
#7553Socket type MEMS bonding
#7554Light-emitting device and method for manufacturing the same
#7555Integrated reflector and thermal spreader and thermal spray fabrication method
#7556Device for localizing hot spots with heat flow meters
#7557Electric component with an electrophoretically deposited film
#7558Masking substrates for application of protective coatings
#7559Electrostatic discharge protection device and chip component with the same
#7560Crosstalk suppression in wireless testing of semiconductor devices
#7561Embedded package in PCB build up
#7562Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor body
#7563Interconnection structures and fabrication method thereof
#7564Forming vias and trenches for self-aligned contacts in a semiconductor structure
#7565Dielectric posts in metal layers
#7566Local interconnect structure and fabrication method
#7567Airgap interconnect with hood layer and method of forming
#7568Forming interconnect structures using pre-ink-printed sheets
#7569Three dimensional semiconductor device including pads
#75703D stacking semiconductor device and manufacturing method thereof
#7571ESD protection device and method for producing the same
#7572Wafer-level packaging method of BSI image sensors having different cutting processes
#7573Power semiconductor device
#7574Optoelectronic component and method for producing an optoelectronic component
#7575Light emitting module
#7576Semiconductor light emitting device and method for manufacturing same
#7577Bonding transistor wafer to LED wafer to form active LED modules
#7578Measuring current and resistance using combined diodes/resistor structure to monitor integrated circuit manufacturing process variations
#7579Three dimensional stacked structure for chips
#7580Electrode substrate and planar optoelectronic device
#7581Removal of selected portions of protective coatings from substrates
#7582Carrier device, electrical device having a carrier device and method for producing same
#7583Cooling apparatuses having a jet orifice surface with alternating vapor guide channels
#7584Modular jet impingement cooling apparatuses with exchangeable jet plates
#7585Signal path and method of manufacturing a multiple-patterned semiconductor device
#7586Detecting TSV defects in 3D packaging
#7587Multiple manufacturing line qualification
#7588Systems and methods for semiconductor line scribe line centering
#7589Curable composition and cured article
#7590Method for tuning the effective work function of a gate structure in a semiconductor device
#7591Light emitting apparatus and manufacture method thereof
#7592Light emitting device with planar current block structure
#7593Measurement device and method for vapour deposition applications
#7594Lighting fixture
#7595Illuminating device and light module thereof
#7596Cooling electronic devices using flow sensors
#7597Through silicon via bidirectional repair circuit of semiconductor apparatus
#7598Semiconductor device and adjustment method of filter circuit
#7599Through silicon via repair circuit
#7600Signal path of a multiple-patterned semiconductor device
#7601Signal path of a multiple-patterned semiconductor device
#7602Three-dimensional semiconductor device
#7603Semiconductor device having sacrificial layer pattern with concave sidewalls and method fabricating the same
#7604Multi-die, high current wafer level package
#7605Methods of exposing conductive vias of semiconductor devices and associated structures
#7606Dual damascene structure with liner
#7607Cobalt based interconnects and methods of fabrication thereof
#7608High quality devices growth on pixelated patterned templates
#7609Phase changing on-chip thermal heat sink
#7610Resonant clocking for three-dimensional stacked devices
#7611Method and system for split threshold voltage programmable bitcells
#7612Complimentary metal-oxide-semiconductor (CMOS) with low contact resistivity and method of forming same
#7613ESD protection structure and semiconductor device comprising the same
#7614Signal path and method of manufacturing a multiple-patterned semiconductor device
#7615Light emitting element
#7616Light emitting device and manufacturing method thereof
#7617Light emitting device
#7618Light emitting device
#7619Light emitting element including first electrode with first connecting portion and first extending portion, and second electrode with second connecting portion and two second extending portions
#7620Electronic component
#7621Parasitic inductance reduction for multilayered board layout designs with semiconductor devices
#7622Thin-wafer current sensors
#7623Heat dissipating component for semiconductor element
#7624Substantially aligned boron nitride nano-element arrays
#7625Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
#7626Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device and including the quaternary phosphonium salt, and semiconductor device encapsulated with the epoxy resin composition
#7627Semiconductor devices having through-vias and methods for fabricating the same
#7628Methods and structure for carrier-less thin wafer handling
#7629Semiconductor device and method of manufacturing semiconductor device
#7630Method of thinning a wafer to provide a raised peripheral edge
#7631Method and system for heterogeneous substrate bonding for photonic integration
#7632Adjusting intensity of laser beam during laser operation on a semiconductor device
#7633Semiconductor apparatus, test method using the same and muti chips system
#7634Lighting device and light-emitting module
#7635Electronic device
#7636Printed electronics
#7637Methods of forming serpentine thermal interface material and structures formed thereby
#7638Camera hardware design for dynamic rearview mirror
#7639Split sub-pixel imaging chip with IR-pass filter coating applied on selected sub-pixels
#7640Package substrate with band stop filter and semiconductor package including the same
#7641Electrical characteristics of package substrates and semiconductor packages including the same
#7642Semiconductor integrated circuit with switch to select single or multiple chips
#7643Dielectric solder barrier for semiconductor devices
#7644Power layout for integrated circuits
#7645Semiconductor device including air gaps and method of fabricating the same
#7646Surface modified TSV structure and methods thereof
#7647Semiconductor devices comprising interconnect structures and methods of fabrication
#7648Barrier for through-silicon via
#7649Apparatuses and methods to enhance passivation and ILD reliability
#7650Semiconductor device integrating passive elements
#7651Varactor that applies bias voltage to two through wafer vias to determine capacitance of depletion region capacitor formed between the two through wafer vias
#7652Semiconductor image sensor module and method of manufacturing the same
#7653SOI wafer, manufacturing method therefor, and MEMS device
#7654Semiconductor device with plasma damage protecting elements
#7655Chip unit with protrusions for interlocking mechanism and method for manufacturing the same
#7656Light emitting device package
#7657Light emitting diode package
#7658Light emitting diode and method of fabricating the same
#7659Method for producing a plurality of optoelectronic semiconductor components in combination, semiconductor component produced in such a way, and use of said semiconductor component
#7660Resistor, display device, and electronic device
#7661Deposition of rutile films with very high dielectric constant
#7662Recessed contact to semiconductor nanowires
#7663Printed wiring board, printed circuit board, and method for manufacturing printed circuit board
#7664Thermal conductive stress relaxation structure
#7665Fabrication method of packaging substrate
#7666Placing transistors in proximity to through-silicon vias
#7667Silicone resin composition, silicone resin sheet, method for producing silicone resin sheet, and optical semiconductor device
#7668Substrate contact opening
#7669Sidewall-free CESL for enlarging ILD gap-fill window
#7670Chip comprising a fill structure
#7671Vertically oriented semiconductor device and shielding structure thereof
#7672Wafer level optical device
#7673Heat generation point detection method and heat generation point detection device
#7674Macro channel water-cooled heat-sink for diode-laser bars
#7675Electronic device with heat dissipation module
#7676Cooling of a volatile memory device to preserve data during power loss
#7677Apparatus and method to monitor die edge defects
#7678Optical system and method for measuring in patterned structures
#7679Bonding pad of array substrate, method for producing the same, array substrate, and liquid crystal display apparatus
#7680Light emitting diode module and light bar having the same
#7681Semiconductor integrated circuit device with independent power domains
#7682Semiconductor device
#7683Stacked via structure for metal fuse applications
#7684Light-emitting module with wavelength converters and light-absorbing substance
#7685Methods of forming configurable microchannels in package structures
#7686Functional film, environmentally sensitive electronic device package, and manufacturing methods thereof
#7687Semiconductor devices having fine patterns
#7688Method for fabricating interconnect structure
#7689Stack type semiconductor circuit with impedance calibration
#7690Semiconductor device having an identification mark
#7691Interconnect structure and forming method thereof
#7692Layer stack
#7693Methods and apparatus of packaging with interposers
#7694Graphene and metal interconnects
#7695Method and structures for heat dissipating interposers
#7696Semiconductor device
#7697Protecting layer in a semiconductor structure
#7698Wafer and a method of dicing a wafer
#7699Crack stop barrier and method of manufacturing thereof
#7700System and method for die to die stress improvement
#7701Semiconductor device
#7702Local interconnects compatible with replacement gate structures
#7703Semiconductor device and manufacturing method thereof
#7704Light emitting device and methods for forming the same
#7705Electronic chip and method of fabricating the same
#7706Systems and methods for integrating bootstrap circuit elements in power transistors and other devices
#7707GaN HEMTs and GaN diodes
#7708Semiconductor device and method for manufacturing a semiconductor device
#7709Foil composite card
#7710Planar cavity MEMS and related structures, methods of manufacture and design structures
#7711Electrical interconnect formed through buildup process
#7712Air duct and heat dissipation device having the same
#7713Thin heat pipe structure and manufacturing method thereof
#7714Manufacturing method of liquid-cooled jacket
#7715Implantable biomedical devices on bioresorbable substrates
#7716Polishing system and polishing method
#7717Methods of making an interposer structure with embedded capacitor structure
#7718Method for producing cell for light-emitting device and method for producing light-emitting device
#7719Manufacturing method for solar cell and solar cell manufacturing system
#7720Method for forming copper wiring
#7721Sprung washer and fixing device
#7722Power conversion apparatus
#7723Non-uniform substrate stackup
#7724Methods and apparatus for conformal shielding
#7725Cooling for electronic components
#7726Electronic component and fabrication process of this electronic component
#7727Ceramic antenna module and methods of manufacture thereof
#7728Wiring fault detection method, wiring fault detection apparatus, and method for manufacturing semiconductor substrate
#7729Method and apparatus for providing a passive color control scheme using blue and red emitters
#7730Semiconductor device with a multilayer wire
#7731Method and structures for via substrate repair and assembly
#7732Semiconductor devices having wiring with contact pads and dummy lines
#7733Metal conductor chemical mechanical polish
#7734Patterning transition metals in integrated circuits
#7735Methods of selectively removing a substrate material
#7736Patterning transition metals in integrated circuits
#7737Method for forming a three-dimensional structure of metal-insulator-metal type
#7738Single pattern high precision capacitor
#7739Through substrate features in semiconductor substrates
#7740Decoupling capacitor and method of making same
#7741Wrap-around trench contact structure and methods of fabrication
#7742Light emitting device having current blocking layer
#7743Stacked semiconductor chips including test circuitry
#7744Optoelectronic apparatus
#7745Tie bar resonance suppression
#7746Method of producing resonant patterns adapted to the implementation of RF passive functions
#7747Fluid heat exchange systems
#7748Storage devices, flash memories, and methods of operating storage devices
#7749Quadrature hybrid coupler, amplifier, and wireless communication device
#7750Crack stop structure and method for forming the same
#7751Hermetic wafer level packaging
#7752Power switching system for ESC with array of thermal control elements
#7753Fixtures for large area directional and isotropic solid state lighting panels
#7754Systems and methods for embedding devices in printed circuit board structures
#7755Phase change heat sink for transient thermal management
#7756Electronic component cooling hood and heat pipe
#7757Symmetrical hexagonal-based ball grid array pattern
#7758Conductive compositions and methods of using them
#7759Antenna using through-silicon via
#7760Transmission line for an integrated circuit package
#7761Structure and method for in-line defect non-contact tests
#7762Repairing method, repairing structure, and repairing system for disconnected defect
#7763Dual-damascene process to fabricate thick wire structure
#7764Far back end of the line stack encapsulation
#7765Techniques for enhancing dielectric breakdown performance
#7766Heat spreader with flexible tolerance mechanism
#7767Managing method of building material and wireless chip applied to the method
#7768Chip module, an insulation material and a method for fabricating a chip module
#7769Semiconductor device having fuse pattern
#7770Gas-diffusion barriers for MEMS encapsulation
#7771Contact plugs in SRAM cells and the method of forming the same
#7772Semiconductor structure having contact plug and method of making the same
#7773Accessing or interconnecting integrated circuits
#7774Electrostatic discharge protective device
#7775Lateral semiconductor light emitting diodes having large area contacts
#7776Layered product for fine pattern formation and method of manufacturing layered product for fine pattern formation
#7777Method and apparatus for fabricating phosphor-coated LED dies
#7778Test structure placement on a semiconductor wafer
#7779Image sensors for performing thermal reset, methods thereof, and devices including the same
#7780Method for ultrasonic bonding having at least one first and second ultrasonic transducer generating harmonic oscillation components
#7781Method and structure to improve the conductivity of narrow copper filled vias
#7782Method for forming a composite material, and heat sink
#7783Base with heat absorber and heat dissipating module having the base
#7784Manufacturing method of thin heat pipe
#7785Multi-point chemical mechanical polishing end point detection system and method of using
#7786Large area thin freestanding nitride layers and their use as circuit layers
#7787Resin composition for a surface treatment, and steel sheet coated with same
#7788Insulating paste, electronic device and method for forming insulator
#7789Data transfer across power domains
#7790Backlight assembly and display device including the same
#7791Ball grid array and land grid array having modified footprint
#7792Housing component
#7793Cooling heat-generating electronics
#7794ZR-based amorphous alloy
#7795Through silicon via repair circuit of semiconductor apparatus
#7796Light activated test connections
#7797Light-emitting device package
#7798Clock distribution network for 3D integrated circuit
#7799Semiconductor devices having guard ring structure and methods of manufacture thereof
#7800Semiconductor constructions and methods of forming semiconductor constructions