Metal density distribution for double pattern lithography

Semiconductor device

Semiconductor device including two groove-shaped patterns that include two bent portions

Semiconductor device including two groove-shaped patterns

Power semiconductor housing with contact mechanism

Seal ring structure with metal-insulator-metal capacitor

Stackable high-density metal-oxide-metal capacitor with minimum top plate parasitic capacitance

Fabrication method for MIM capacitor

Electrode manufacturing method, fuse device and manufacturing method therefor

Integrated circuit having improved radiation immunity

Semiconductor device comprising a semiconductor element having two electrodes

Display device and manufacturing method thereof

Light emitting device and light emitting device package thereof

LED arrray including light-guiding structure

Semiconductor device components and methods

Semiconductor light emitting device

Photoelectric conversion device

Evaporation-assisted heat dissipation apparatus

Nanowire LED structure and method for manufacturing the same

Semiconductor device having optical fuse and electrical fuse

Electric power converter

Signal transmission device

Semiconductor device and method of fabricating the same

Wafer temperature sensing methods and related semiconductor wafer

Wafer level packaging bond

Semiconductor device and manufacturing method thereof

Copper interconnect structure and method for manufacturing the same

Preventing shorting dendritic migration between electrodes

Method for fabricating a carbon nanotube interconnection structure

Capacitor using middle of line (MOL) conductive layers

Hybrid transformer structure on semiconductor devices

Light-emitting device and electronic device

Semiconductor light emitting device and method for manufacturing same

Semiconductor element and display device using the same

Organic optoelectronic device and method for the encapsulation thereof

Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration

Semiconductor device

Semiconductor device, electronic device, and method of manufacturing semiconductor device

Heat sink module

Refrigerant pipe attachment structure

Heat sink and heat sink fan

Cooling fin structure

Heat-dissipation unit with heat-dissipation microstructure and method of manufacturing same

Fluid heat exchange apparatus

Methods of forming patterns, and methods of forming integrated circuitry

Light emitting devices having dislocation density maintaining buffer layers

Lighting device

Cooling system for electronics

Curable composition

Illumination device and liquid crystal display device

Integrated circuit

Noncontact determination of interface trap density for semiconductor-dielectric interface structures

Methods for selective reverse mask planarization and interconnect structures formed thereby

Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro

Through-substrate via formation with improved topography control

Method of wiring layout, semiconductor device, program for supporting design of wiring layout, and method for manufacturing semiconductor device

Method for dicing a semiconductor wafer having through silicon vias and resultant structures

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device having conductive pads and a method of manufacturing the same

Plasma treatment for semiconductor devices

Semiconductor device and method for manufacturing the same

System and method for an electronic package with a fail-open mechanism

Body-bias voltage routing structures

Photo alignment mark for a gate last process

Low resistance stacked annular contact

Semiconductor chip that emits polarized radiation

Phosphor layer-covered optical semiconductor element, producing method thereof, optical semiconductor device, and producing method thereof

Semiconductor device and method of fabricating the same

Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components

Structures for radiative cooling

Mounting system for fluid heat exchange systems

Resin composition, hardened coating films therefrom, and photosemiconductor device using same

Integrated decoupling capacitor utilizing through-silicon via

Electro-optical component

Sense amplifier soft-fail detection circuit

Techniques for refreshing a semiconductor memory device

Electronic package module and method of manufacturing the same

Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module

ESD protection device and method for producing same

Tunable bragg stack

Digital cameras with direct luminance and chrominance detection

Adaptive on die decoupling devices and methods

Semiconductor device and manufacturing method thereof

Semiconductor wafers recrystallized in a partially surrounding thin film capsule

Semiconductor substrate and fabrication method thereof

Substrate build up layer to achieve both finer design rule and better package coplanarity

Integrated decoupling capacitor utilizing through-silicon via

Stress relief for plastic encapsulated devices

Power semiconductor module

Interconnect with titanium—oxide diffusion barrier

Integrated circuit device having a copper interconnect

THROUGH-SILICON VIA (TSV) DIE AND METHOD TO CONTROL WARPAGE

Semiconductor device comprising a diode and a method for producing such a device

Nitride semiconductor device

Encapsulation housing and LED module with the same

Graphite-containing substrates for LED packages

Thermosetting silicone resin sheet and method for producing the same, and light-emitting apparatus using the thermosetting silicone resin sheet and method for producing the same

Full-color LED display device and manufacturing method thereof

Method of fabricating GaN high voltage HFET with passivation plus gate dielectric multilayer structure

Thin film transistor array substrate and a thin film transistor which comprise a conductive structure comprising a blocking layer and a diffusion prevention layer

Metal oxide film and method for forming metal oxide film

Light emitting device and light emitting device array

Apparatus and method for reducing acoustical noise in synthetic jets

Wiring substrate having a plurality of connection terminals and a filling member provided therebetween

Thermal management system containing a graphene oxide-coated graphitic foil laminate for electronic device application

Heat dissipating device and heat dissipating fin

Apparatus for filling a wafer via with solder

Boundary scan chain for stacked memory

Method of Semiconductor Integrated Circuit Fabrication

LED die dispersal in displays and light panels with preserving neighboring relationship

Process for growing at least one nanowire using a transition metal nitride layer obtained in two steps

Resin compositions comprising sorbic esters

Macro-channel water-cooled heat-sink for diode-laser bars

Macro channel water-cooled heat-sink for diode-laser bars

Multiple data line memory and methods

Active cooling device with electro-statically moving electrode and method of active cooling with electro-statically moving electrode

Printed circuit board, and method for manufacturing printed circuit board

Shielded system

Chip-housing module and a method for forming a chip-housing module

Environmental sensitive electronic device package

Power converter including semiconductor module and cooler

Cooling apparatus for an electrical substrate

Adjustable integrated circuit antenna structure

Device comprising an encapsulation unit

Laminate electronic device

Etch damage and ESL free dual damascene metal interconnect

Semiconductor structures and methods of manufacturing the same

Self-enclosed asymmetric interconnect structures

Through silicon via stacked structure and a method of manufacturing the same

Semiconductor device and method of manufacturing the same

COPPER HILLOCK PREVENTION WITH HYDROGEN PLASMA TREATMENT IN A DEDICATED CHAMBER

Semiconductor device with encapsulant

Patterning methods and methods of forming electrically conductive lines

Method for processing a semiconductor carrier, a semiconductor chip arrangement and a method for manufacturing a semiconductor device

Semiconductor device having ground shield structure and fabrication method thereof

Inductor structure with a current return encompassing a coil

Semiconductor structure and fabrication method

Semiconductor device including ESD protection device

Holder on chip module structure

Methods and integrated circuit package for sensing fluid properties

Replacement gate electrode with multi-thickness conductive metallic nitride layers

Connecting through vias to devices

Semiconductor device

Semiconductor structure

Semiconductor device

Fin field effect transistors having a nitride containing spacer to reduce lateral growth of epitaxially deposited semiconductor materials

Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure

Pads and pin-outs in three dimensional integrated circuits

Nanowire LED structure and method for manufacturing the same

Tilted emission LED array

Display device including first to sixth transistors and light-emitting element

Semiconductor device

Arrangement for energy conditioning

Chip support board structure

Method of manufacturing a chip support board structure

Flexible package-to-socket interposer

Package substrate dynamic pressure structure

Apparatus for vertically integrated backside illuminated image sensors

Apparatus for mounting optical member and method of manufacturing light emitting device

Method for producing singulated semiconductor devices

Multi-wafer reactor

Silicone resin

Method of embedding an electronic component into an aperture of a substrate

MOSFET stack package

High performance vertical interconnection

Metal injection molded heat dissipation device

Diode lighting arrangement

Bi-directional bipolar junction transistor for high voltage electrostatic discharge protection

High-resistance thin-film resistor and method of forming the resistor

Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip

System for detecting a laser attack on an integrated circuit chip

CD control

Active matrix substrate, and display device

Semiconductor device including contact pads

Dual hard mask lithography process

Damascene gap structure

Semiconductor packages with integrated antenna and method of forming thereof

Semiconductor element cooling structure

Co-support circuit panel and microelectronic packages

Semiconductor device including magnetically coupled monolithic integrated coils

Folded conical inductor

Passive component as thermal capacitance and heat sink

Layout schemes for cascade MOS transistors

Curable composition

Curable composition

Light emitting device and light emitting device package having the same

Light emitting device

Light emitting element

Light emitting device and method of fabricating the same

Stacked chip module with integrated circuit chips having integratable and reconfigurable built-in self-maintenance blocks

Lensless optical navigation device for directing radiation via reflection by three total internal surfaces

AIR DUCT AND HEAT DISSIPATION SYSTEM HAVING THE SAME

Adjusting substrate temperature to improve CD uniformity

Three dimensional interconnected porous graphene-based thermal interface materials

ESD/antenna diodes for through-silicon vias

Method and system for wafer quality predictive modeling based on multi-source information with heterogeneous relatedness

System for wafer quality predictive modeling based on multi-source information with heterogeneous relatedness

Retention device and electrical connector assembly used thereof

Stress reduction apparatus

Graphene barrier layers for interconnects and methods for forming the same

Semiconductor device manufacturing method

Method and apparatus for depositing phosphor on semiconductor-light emitting device

End-cut first approach for critical dimension control

Advanced handler wafer bonding and debonding

Metallization scheme for integrated circuit

Stretchable electronic device and method of manufacturing same

Cooled electrical assembly

Electronic device with air guiding apparatus

Impedance matching network with improved quality factor and method for matching an impedance

Rolled-up transformer structure for a radiofrequency integrated circuit (RFIC)

Architectural floorplan for a structured ASIC manufactured on a 28 NM CMOS process lithographic node or smaller

Reactive material for integrated circuit tamper detection and response

Alignment key of semiconductor device and method of fabricating the same

Silicone polymers with high refractive indices and extended pot life

Semiconductor structure and method of generating masks for making integrated circuit

Cooling channels in 3DIC stacks

Semiconductor device and method of fabricating the same

Three dimensional stacked semiconductor structure and method for manufacturing the same

Metal-oxide-metal capacitor structure

Electronic device comprising a semiconductor structure having an integrated circuit back end capacitor and thin film resistor and method of manufacturing the same

Rolled-up inductor structure for a radiofrequency integrated circuit (RFIC)

Semiconductor device

Method for making image sensors using wafer-level processing and associated devices

Surface acoustic wave (SAW) device package and method for fabricating same

Methods of forming secured metal gate antifuse structures

Advanced faraday shield for a semiconductor device

Semiconductor structure having contact plug and metal gate transistor and method of making the same

Solid-state imaging device

Surface mountable power components

Curable composition

Light-emitting device comprising partition including overhang portion

Using stress reduction barrier sub-layers in a semiconductor die

Group III nitride composite substrate and method for manufacturing the same, laminated group III nitride composite substrate, and group III nitride semiconductor device and method for manufacturing the same

Method for producing amorphous oxide thin film and thin film transistor

Circuit board, semiconductor device, and method of manufacturing semiconductor device

Thermal extraction using radiation

Method of manufacturing a semiconductor device including dummy regions and dummy wirings

Optoelectronic semiconductor module and display having a plurality of such modules

Electronic device, structure, and heat sink

Efficient cooling duct

Air flow system

Array substrate for flexible display device

Integrated circuit to operate in an area of ionizing radiation, and having an output for a radiation dose-dependent way damage information, and alarm indicators and corresponding method

Reconfiguring through silicon vias in stacked multi-die packages

Method of evaluating metal contamination in semiconductor sample and method of manufacturing semiconductor substrate

Semiconductor device test structures and methods

Test method and test arrangement

Semiconductor device and test method

Semiconductor device having a self-forming barrier layer at via bottom

High-voltage integrated metal capacitor and fabrication method

Guard rings on fin structures

Active area shaping of III-nitride devices utilizing a field plate defined by a dielectric body

Hydrogen mitigation schemes in the passivation of advanced devices

Semiconductor devices and processing methods

Semiconductor device and designing method of semiconductor device

Method and system for adaptively controlling a laser-based material processing process and method and system for qualifying same

Contact and via interconnects using metal around dielectric pillars

Method for making epitaxial structure

Method of epitaxially forming contact structures for semiconductor transistors

Electric power converter

Compound semiconductor device and method of manufacturing the same

Method for embedding a LED network

Film interposer for integrated circuit devices

Integrated voltage regulators with magnetically enhanced inductors

BGA structure using CTF balls in high stress regions

Dielectrophoretic restriction to prevent vapor backflow

Dielectrophoretic cooling solution for electronics

Integrated assembly for installing integrated circuit devices on a substrate

Extended drain non-planar MOSFETs for electrostatic discharge (ESD) protection

Thin film transistor array substrate and liquid crystal display apparatus thereof

Monolithic full-color LED micro-display on an Active Matrix panel manufactured using flip-chip technology

Use of electrical power multiplication for power smoothing in power distribution

Electronic circuit with a reverse conducting transistor device

Directed self assembly of block copolymers to form vias aligned with interconnects

Method and apparatus to improve reliability of vias

Methods of providing dielectric to conductor adhesion in package structures

Forming barrier walls, capping, or alloys /compounds within metal lines

Pitch quartering to create pitch halved trenches and pitch halved air gaps

Controlled solder height packages and assembly processes

Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same

Epitaxial structure

Electrical fuse and method of fabricating the same

Capacitor and method for making same

Repeated spin current interconnects

Reverse polarity protection for n-substrate high-side switches

Light emitting device

Phosphor layer attaching kit, optical semiconductor element-phosphor layer attaching body, and optical semiconductor device

Light emitting diode

Light emitting device equipped with protective member

LED PACKAGE STRUCTURE WITH TRANSPARENT ELECTRODES

LED emitter with improved white color appearance

Semiconductor epitaxial structure

Adjustable heat pipe thermal unit

Cooling technique

Electro-hydrodynamic cooling with enhanced heat transfer surfaces

INTERPOSER HAVING EMBEDDED MEMORY CONTROLLER CIRCUITRY

Radio frequency front end module circuit incorporating an efficient high linearity power amplifier

Al alloy film for display or semiconductor device, display or semiconductor device having Al alloy film, and sputtering target

Optical receptacle and optical module provided with same

Dynamic beam aperture control to reduce radiation dose using collimator