Capacitor and method for fabricating the same

Chip identification pattern and method of forming

Butted contact shape to improve SRAM leakage current

Printed transistor and fabrication method

Light emitting device, light emitting module, and method for manufacturing light emitting device

Active matrix substrate, display device, method for inspecting the active matrix substrate, and method for inspecting the display device

Thin film transistor array panel, liquid crystal display, method for repairing the same, color filter array panel and method for manufacturing the same

Light emitting device, display apparatus, and illuminating apparatus

Method for interconnecting a conductive pad and an electrical contact via a spring, and corresponding device

Helmet mountable timed event RFID tag assembly and method of use

ELECTRONIC DEVICE WITH HEAT DISSIPATION DEVICE ASSEMBLY

Heat dissipation device assembly structure

THERMAL MODULE AND MANUFACTURING METHOD THEREOF

Radiator with integrated pump for actively cooling electronic devices

Liquid cooled data center with alternating coolant supply lines

COOLING SYSTEM AND METHOD FOR COOLING RADIO UNIT

Method for manufacturing optoelectronic devices

Method of making a heat radiating structure for high-power LED

Selective leadframe planishing

Highly abrasion-resistant imprint material containing urethane compound

Methods of forming contacts for semiconductor devices using a local interconnect processing scheme

Self-repair logic for stacked memory architecture

Apparatuses and methods including memory access in cross point memory

Through-hole mounting system with heat sinking elements clamped to one another against insulating body

Expansion Circuit Board Cooling

Chip-on-film package and device assembly including the same

TRANSPARENT THROUGH-GLASS VIA

Method for testing through-silicon-via

Contactless wafer probing with improved power supply

Gaussian surface lens quantum photon converter and methods of controlling LED colour and intensity

Lighting device with LED chip and protective cast

Semiconductor devices and methods of manufacturing the same

Semiconductor interconnect structure

Stacked memory allowing variance in device interconnects

Passivation for wafer level—chip-scale package devices

Via-free interconnect structure with self-aligned metal line interconnections

Conformal low temperature hermetic dielectric diffusion barriers

Clad material for insulating substrates

Leadframe having selective planishing

Semiconductor device

Localized strain relief for an integrated circuit

Low cost backside illuminated CMOS image sensor package with high integration

Layout designs with via routing structures

Capacitor and method of forming same

Power semiconductor module

Support for an optoelectronic semiconductor chip, and semiconductor chip

LIGHT-EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Method of producing an optoelectronic component and component

Method for fabricating semiconductor device and the semiconductor device

Flexible transparent conductive film, LED flexible transparent display structure using the film, and method for forming the display structure

Solid-state transducer assemblies with remote converter material for improved light extraction efficiency and associated systems and methods

Graphite filled polyester compositions

Multi-layer interconnection structure

SEGMENTED HEAT SINK FOR NATURAL-CONVECTION COOLED SYSTEMS

Chemical detection device having multiple flow channels

Flexible-to-rigid tubing

CONVERGED MEMORY AND STORAGE SYSTEM

Data storage based upon temperature considerations

Method of manufacturing semiconductor device

High density chip packages, methods of forming, and systems including same

Systems and methods of automatically detecting failure patterns for semiconductor wafer fabrication processes

Vertical structure semiconductor memory devices and methods of manufacturing the same

Cooling system for electronic components and led lamp having the same

Method for manufacturing optoelectronic devices

Power Electronics Cooling

Electronic device

Method and apparatus for ESD circuits

Solid-state image sensor and camera

Apparatus for inspecting defect with time/spatial division optical system

Through-silicon-via with sacrificial dielectric line

Lighting circuit

Thermal management for light-emitting diodes

Wireless power mechanisms for lab-on-a-chip devices

Semiconductor device having mesh-pattern wirings

Elongated via structures

Semiconductor device with self-aligned interconnects and blocking portions

Semiconductor device and method of forming a thin wafer without a carrier

SEMICONDUCTOR PACKAGE MODULE

Semiconductor device and method for manufacturing semiconductor device

Glass frit wafer bond protective structure

Integrated circuit power grid with improved routing resources and bypass capacitance

Stacked wafer structure and method for stacking a wafer

Memory and logic device and method for manufacturing the same

Capacitor for interposers and methods of manufacture thereof

Apparatus for vertically integrated backside illuminated image sensors

Multiple bonding in wafer level packaging

Twin-well lateral silicon controlled rectifier

Light emitting device, light emitting device package comprising the same and lighting system

Semiconductor light emitting device and method for manufacturing same

Semiconductor light emitting device, method of manufacturing the same, image display device, and electronic apparatus

Method for forming a buried metal layer structure

Electronic device with reduced non-device edge area

STACKED LED DEVICE WITH POSTS IN ADHESIVE LAYER

Method and apparatus for image sensor packaging

Liquid-cooled-type cooling device and manufacturing method for same

3-D stacked and aligned processors forming a logical processor with power modes controlled by respective set of configuration parameters

3-D stacked multiprocessor structure with vertically aligned identical layout operating processors in independent mode or in sharing mode running faster components

3-D stacked multiprocessor structure with vertically aligned identical layout operating processors in independent mode or in sharing mode running faster components

3-D stacked and aligned processors forming a logical processor with power modes controlled by respective set of configuration parameters

Structure for removable processor socket

Methods for fabricating and orienting semiconductor wafers

Silicidation and/or germanidation on SiGe or Ge by cosputtering Ni and Ge and using an intralayer for thermal stability

Software and method for via spacing in a semiconductor device

Semiconductor device fabrication method capable of scribing chips with high yield

Method for producing a conductor line

Gas barrier film and electronic device

Image processing apparatus

Phosphor reflector assembly for remote phosphor LED device

Etchstop layers and capacitors

ILLUMINATION SYSTEMS AND METHODS

Signal detecting system of multi wide capacitive touch-screen

Semiconductor component with coreless transformer

Intelligent power supervisor

Semiconductor device and control system

Stack type semiconductor device

3D integrated circuit system with connecting via structure and method for forming the same

Semiconductor devices including conductive features with capping layers and methods of forming the same

STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICES AND A FABRICATION METHOD THEREOF

Copper interconnect with CVD liner and metallic cap

Split loop cut pattern for spacer process

Interconnect structures for integrated circuits and their formation

METHOD FOR FORMING HEAT SINK WITH THROUGH SILICON VIAS

Connection structure for an integrated circuit with capacitive function

Electrical fuse and method of making

Methods and apparatus for glass removal in CMOS image sensors

Motor control multilayer circuit board

Method of manufacturing a semiconductor device including alignment mark

Semiconductor device and method for forming same

Gate electrodes with notches and methods for forming the same

Semiconductor light emitting element including protective film and light shielding member

Semiconductor light-emitting device, exhibit-irradiating illumination device, meat-irradiating illumination device, vegetable-irradiating illumination device, fresh fish-irradiating illumination device, general-purpose illumination device, and semiconductor light-emitting system

Semiconductor device and manufacturing method thereof

SOI wafer, manufacturing method therefor, and MEMS device

Substrate structure

HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME

HEAT DISPERSER WITH HEAT TRANSMISSION, HEAT CONVECTION AND HEAT RADIATION FUNCTION

Apparatus to cool a computing device

HEAT DISSIPATING APPARATUS WITH AIR DUCT

Cooling flow accelerator

Radial blower

Polyfunctional epoxy compound

Layer alignment in FinFET fabrication

Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device

Method of fabricating an electromechanical structure including at least one mechanical reinforcing pillar

Apparatus and method for endpoint detection during electronic sample preparation

Apparatus and method for endpoint detection during electronic sample preparation

Heat dissipation substrate and manufacturing method thereof

Formation of DRAM capacitor among metal interconnect

System in package assembly

Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features

HEAT DISSIPATION MODULE WITH MULTIPLE POROSITIES

Liquid-cooled arrangement having modular power semiconductor modules and at least one capacitor device, and power semiconductor module therefor

Modular liquid-cooled power semiconductor module, and arrangement therewith

Electronic element, variable capacitor, micro switch, method for driving micro switch, and MEMS type electronic element

Group III-N transistors for system on chip (SOC) architecture integrating power management and radio frequency circuits

Apparatus and method for electronic sample preparation

Semiconductor device and method of manufacturing the same

DUAL DAMASCENE STRUCTURE HAVING THROUGH SILICON VIA AND MANUFACTURING METHOD THEREOF

Through silicon via structure and method of fabricating the same

Guard ring design structure for semiconductor devices

Non-bridging contact via structures in proximity

Method for forming buried conductive line and structure of buried conductive line

Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus

Semiconductor device with self-aligned interconnects

Electroless filled conductive structures

Methods for forming silicon-based hermetic thermal solutions

Integrated circuit including thermal gate, related method and design structure

Sidewall free CESL for enlarging ILD gap-fill window

SOI substrate with acceptor-doped layer

Light emitting diode die and light emitting diode package incorporating the same

Polycarbonate compositions containing conversion material chemistry and having enhanced optical properties, methods of making and articles comprising the same

System and methods for warm white LED light source

Optoelectronic package and method for making same

Flat panel display device and method of manufacturing the same

Semiconductor device with heat removal structure and related production method

Semiconductor device and manufacturing method thereof

LOW RESISTANCE BIDIRECTIONAL JUNCTIONS IN WIDE BANDGAP SEMICONDUCTOR MATERIALS

Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same

Corrugated interfaces for multilayered interconnects

Heat spreader with high heat flux and high thermal conductivity

Reflowable opto-electronic module

Method for producing a luminescence conversion substance layer, a composition therefor and a component comprising such a luminescence conversion substance layer

Topography-aware lithography pattern check

Imaging devices with solid-state radiation detector with improved sensitivity

Light-emitting device for emitting light of multiple color temperatures

Many-up wiring substrate, wiring board, and electronic device

Thermal interface materials with thin film or metallization

Liquid crystal display panel and pixel electrode structure thereof

Configurable vertical integration

Test circuit and semiconductor apparatus including the same

High side gate driver, switching chip, and power device

Light-emitting device

Remote phosphor LED device with broadband output and controllable color

Adhesive compound and method for encapsulating an electronic arrangement

Multi-level stack having multi-level contact and method

Methods of forming conductive structures and methods of forming DRAM cells

Nanotube electronics templated self-assembly

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Semiconductor unit with cooler

Semiconductor device with embedded heat spreading

Contact element, in particular a solder tab and photovoltaic junction box with contact element, in particular a solder tab

SEMICONDUCTOR WAFER PROCESSING

Semiconductor structure and manufacturing method of the same

Planar polysilicon regions for precision resistors and electrical fuses and method of fabrication

Integrated Switching Device with Parallel Rectifier Element

INTEGRATED CIRCUIT HAVING FERROELECTRIC MEMORY WITH DENSE VIA BARRIER

Semiconductor device and manufacturing method thereof for protecting metal-gate from oxidation

Temperature stabilitized MEMS

Method for producing a semiconductor layer sequence, radiation-emitting semiconductor chip and optoelectronic component

Optoelectronic component and method for producing same

LED light source and corresponding backlight module

COMPACT LED PACKAGE

HEAT SINK RADIATION FIN AND BASE BLOCK MOUNTING STRUCTURE

HEAT DISSIPATION DEVICE

Thermal management system containing an integrated graphene film for electronic devices

Heat dissipating module capable of enhancing heat dissipating efficiency

Information carrying card comprising a cross-linked polymer composition, and method of making the same

Eddy current sensor and polishing method

Reverse damascene process

Edge triggered calibration

Memory having memory cell string and coupling components

LED spotlight having a reflector

LED lamp using blue and cyan LEDs and a phosphor

Information carrying card comprising a cross-linked polymer composition, and method of making the same

SEMICONDUCTOR CHIP DEVICE WITH VENTED LID

Semiconductor switch insulation protection device and power supply assembly

Silicon-based cooling package for cooling and thermally decoupling devices in close proximity

Heat Transfer For Superconducting Integrated Circuits At Millikelvin Temperatures

Heat-dissipating module

ELECTRONIC COMPONENT WITH GUIDING ELEMENT

WAFER ALIGNMENT MARK SCHEME

Display apparatus with color filters and light sources and method of controlling the same

Visually detecting electrostatic discharge events

Tunable capacitor integrated on one semiconductor die or on one module

Crystal controlled oscillator

High frequency amplifier

Clamping circuit

Apparatuses including scalable drivers and methods

Semiconductor device and method for manufacturing the same

Interconnect structure and method for forming the same

Interconnect structure having smaller transition layer via

Methods for fabricating integrated circuits having substrate contacts and integrated circuits having substrate contacts

Methods and apparatuses to form self-aligned caps

Semiconductor chip including a chip level based on a layout that includes both regular and irregular wires

Vertical mount package and wafer level packaging therefor

Semiconductor device with a copper line and method for manufacturing the same

Interconnect structure and method for forming the same

Wiring substrate having conductive bumps with resin sealing between bumps and method of making

Thermal management of stacked semiconductor chips with electrically non-functional interconnects

Back-side MOM/MIM devices

Discontinuous guard ring

Electrically conductive lines and integrated circuitry comprising a line of recessed access devices

Semiconductor devices and methods of manufacturing the same

Optoelectronic semiconductor device comprising a semiconductor chip, a carrier substrate and a film

LIGHT-EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME

LIGHT EMITTING DIODE LIGHT BAR STRUCTURE

Semiconductor device and method of fabricating the semiconductor device

Vertical semiconductor device having a non-conductive substrate and a gallium nitride layer

Thin film transistor array substrate

Reduction of OCD measurement noise by way of metal via slots

EBG structure, semiconductor device, and printed circuit board

HEAT DISSIPATION DEVICE

MEMORY MODULE WITH HEAT DISSIPATING APPARATUS

Heat dissipating device

Semiconductor cooling apparatus

Electric and electronic part copper alloy sheet with excellent bending workability and stress relaxation resistance

Thick-film pastes containing lead-tellurium-lithium-oxides, and their use in the manufacture of semiconductor devices

Thick-film pastes containing lead-tellurium-boron-oxides, and their use in the manufacture of semiconductor devices

Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices

Information carrying card comprising a cross-linked polymer composition, and method of making the same

Semiconductor structure having an air-gap region and a method of manufacturing the same

SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR CONTROLLING WARPING OF A SUBSTRATE

WH (wafer-holder) process

Anti-tampering devices and techniques for magnetoresistive random access memory

Tamper-resistant MRAM utilizing chemical alteration

LED color combiner

Heat dissipating assembly and elastic fastening member thereof

HEAT SINK PROFILE FOR INTERFACE TO THERMALLY CONDUCTIVE MATERIAL

Electronic control apparatus

Structural assembly for cold plate cooling

Semiconductor memory device

Passive within via

Method and apparatus for reduced parasitics and improved multi-finger transistor thermal impedance

MULTI-CHIP SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE WITH STRENGTHENED INTER-WIRE AIR GAP STRUCTURES

Conductive film and semiconductor device

Semiconductor chip and semiconductor arrangement

INTEGRATED CIRCUIT (IC) HAVING TSVS AND STRESS COMPENSATING LAYER

Electronic device including a trench and a conductive structure therein having a contact within a Schottky region and a process of forming the same

Semiconductor devices having contacts with intervening spacers and method for fabricating the same

Power semiconductor device

NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND ITS MANUFACTURING METHOD

Nitride semiconductor device

Contact structure of semiconductor device

Semiconductor light emitting device and method for manufacturing the same

Highly reflective coating on LED submount

LED package module structure

Direct growth of diamond in backside vias for GaN HEMT devices

Bundled memory and manufacture method for a bundled memory with an external input/output bus

Semiconductor device and method for manufacturing the same