Polymer thick film solder alloy/metal conductor compositions

Touch screen panel and touch screen assembly including the same

Laser ablation technique for electrical contact to buried electrically conducting layers in diamond

HEAT DISSIPATION MODULE AND METHOD OF USING THE HEAT DISSIPATION MODULE

Bearing cup structure and thermal module thereof

Mounting a heat sink module

FAN MODULE

Heat dissipation substrate and method for manufacturing the same

Apparatus and method of separating wafer from carrier

Method for assigning terminal of semiconductor package, apparatus, and semiconductor package

Method to detect wafer arcing in semiconductor manufacturing equipment

Process control methods for CMP (chemical mechanical polishing) and other polishing methods used to form semiconductor devices

Method for manufacturing silicon carbide semiconductor device

Electroless gap fill

Methods of forming copper-based conductive structures on an integrated circuit device

Method of manufacturing a semiconductor component

Method of forming a composite substrate

Method for manufacturing light emitting diode package

Methods for producing and placing wavelength converting structures

Substrate bonding apparatus and substrate bonding method

Fine tuning highly resistive substrate resistivity and structures thereof

METHOD FOR PREPARING A THIN FILM DEVICE AND METHOD FOR PREPARING A COMMON MODE FILTER USING THE SAME

Process for making a structure with hermetically closed cavity under controlled atmosphere

Magnetoresistive random access memory (MRAM) die including an integrated magnetic security structure

Semiconductor memory device including power decoupling capacitor

Substrate for Carrying Light Emitting Diodes and Manufacturing Method Thereof

LED STRING LIGHT MADE VIA SMD MANUFACTURING PROCESS

LOW COST INTERPOSER FABRICATED WITH ADDITIVE PROCESSES

Method of manufacturing a plurality of optical devices for cameras

HIGH CAPACITANCE DENSITY METAL-INSULATOR-METAL CAPACITORS

Digital system for the detection of variations in operating conditions of an integrated circuit

RF calibration through-chip inductive coupling

Power module including leakage current protection circuit

Lighting system with thermal management system

Semiconductor device and method for fabricating the same

Electronic device with reduced non-device edge area

Non-uniform silicon dioxide and air gap for separating memory cells

Ceramic heat sink material for pressure contact structure and semiconductor module using the same

Programmable fuse structure and methods of forming

Solid-state imaging device and camera system

Magnetoresistive random access memory (MRAM) package including a multilayer magnetic security structure

Semiconductor device with gate stack structure

Semiconductor device and method for fabricating the same

Vertical transistor having edge termination structure

Semiconductor device, PFC circuit, power supply device, and amplifier

MOUNTING DEVICE FOR A LIGHT EMITTING DIODE

Light emitting device and method for manufacturing the same

Light emitting device and method for manufacturing the same

Light-emitting diode packaging structure of low angular correlated color temperature deviation

High brightness light emitting diode structure

Double-sided optical sensor for a camera module

High efficiency broadband semiconductor nanowire devices

Method for manufacturing a heat sink

Cooling plate

Electronic device and fan module

Heat dissipation device

THERMAL ELECTRIC COOLER AND METHOD

Method of bonding components to each other using exothermic reactions

SiC semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device with glass pieces

Method and apparatus for protection against process-induced charging

Backside illuminated image sensor

Method for making an electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board

Coating apparatus and manufacturing method of coated body

Combustion experimental apparatus

Via formation for cross-point memory

Semiconductor device

Color mixing using the reflective properties of OLEDs

Electronic device assemblies including conductive vias having two or more conductive elements

Cross-domain ESD protection scheme

Lighting device and lighting method

Camera module

METHOD FOR PACKAGING IMAGE SENSOR STRUCTURE AND IMAGE SENSOR STRUCTURE FORMED FROM THE SAME

Method for testing semiconductor wafer

Light emitting device, and illumination apparatus and system using same

Processes for forming integrated circuits and integrated circuits formed thereby

HNOsingle wafer clean process to strip nickel and for MOL post etch

Semiconductor component that includes a protective structure

3D transmission lines for semiconductors

Metal shield for integrated circuits

Semiconductor device including a stress buffer material formed above a low-k metallization system

Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devices

Thin film resistor structure

Embedded memory device having MIM capacitor formed in excavated structure

Fuse and integrated conductor

Planar cavity MEMS and related structures, methods of manufacture and design structures

Shielded gate MOSFET device with a funnel-shaped trench

Electromigration resistant standard cell device

Composite semiconductor device with active oscillation prevention

ESD protection circuit

Composition for reflection film for light emitting element, light emitting element, and method of producing light emitting element

Light emitting device with encapsulant formed with barriers and light emitting device package having the same

Phosphor encapsulating sheet, light emitting diode device, and producing method thereof

LED package structure

SIDEWALL TEXTURING OF LIGHT EMITTING DIODE STRUCTURES

Image sensor for two-dimensional and three-dimensional image capture

Interposer with extruded feed-through vias

Method for fabricating a physical unclonable interconnect function array

SUBSTRATE FOR POWER MODULE

FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES AND METHODS THEREOF

TUBULAR RADIATING SEAT INTEGRALLY FORMED BY ONE WORKING PROCEDURE

Cold plate with combined inclined impingement and ribbed channels

Loop heat pipe and electronic equipment using the same

Hybrid heat exchanger

Three-dimensional system-in-package architecture

Manufacturing method for semiconductor integrated circuit device

Method of forming a trench electrode device with wider and narrower regions

System and method for miniaturization of synthetic jets

Through-substrate via (TSV) testing

CHIP ARRANGEMENTS AND METHODS FOR FORMING A CHIP ARRANGEMENT

System and method for cooling information handling resources

Variable projector cooling apparatus and method

Test assembly for verifying heat spreader grounding in a production test

Test chip, test board and reliability testing method

Multichannel DC-DC converter

Wafer-level underfill and over-molding

Semiconductor device having signal line and power supply line intersecting with each other

BEOL interconnect with carbon nanotubes

Semiconductor memory device

Interconnect structures

Methods and layers for metallization

Heat sink apparatus for microelectronic devices

Apparatus for chip thermal stress relief

Semiconductor integrated circuit capacitance device

Structure and method for a fishbone differential capacitor

Electrostatic discharge protection devices

Power field effect transistor

Dendritic metal structures, methods for making dendritic metal structures, and devices including them

Optoelectronic semiconductor chip

Vertical solid-state transducers having backside terminals and associated systems and methods

Light-emitting diode chip and method for producing the same

Semiconductor device and method for manufacturing the same

Semiconductor light emitting device

LIGHT-EMITTING DIODE DEVICE

HEAT DISSIPATION BASE AND METHOD OF MANUFACTURING SAME

Heat-dissipating assembly and method for manufacturing the same

HEAT-DISSIPATING BASE STRUCTURE AND METHOD FOR MANUFACTURING SAME

Replacement gate electrode with multi-thickness conductive metallic nitride layers

Method for chip package

Charged particle beam apparatus, thin film forming method, defect correction method and device forming method

SYSTEM INCLUDING THERMAL INTERFACE MATERIAL

Optical bench on substrate

Sensor comprising a multi-layered ceramic substrate and method for its production

Latch up detection

Methods of manufacture and use of energized ophthalmic devices having an electrical storage mode

Methods and apparatus to form electronic circuitry on ophthalmic devices

Digital camera having image processor and printer

Energy harvesting

Diffusion Barrier Layer, Metal Interconnect Arrangement and Method of Manufacturing the Same

Through silicon via layout pattern

Semiconductor device, memory system and method of manufacturing the semiconductor device

Metallic capped interconnect structure with high electromigration resistance and low resistivity

INTEGRATED CIRCUITS WITH IMPROVED INTERCONNECT RELIABILITY USING AN INSULATING MONOLAYER AND METHODS FOR FABRICATING SAME

Method of manufacturing forming conductive line pattern in boundary region

Power semiconductor module system with undercut connection

Method for the production of a substrate comprising embedded layers of getter material

Structure and method for strain-relieved TSV

METHOD OF FORMING RESISTOR OF SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE THEREOF

Compact sensor module

Planar cavity MEMS and related structures, methods of manufacture and design structures

Replacement gate electrode with multi-thickness conductive metallic nitride layers

SOI wafer and method of manufacturing the same

Analog floating-gate memory with N-channel and P-channel MOS transistors

Apparatus and method for electronic circuit protection

Light emitting diode component comprising polysilazane bonding layer

Light emitting device and method

Light emitting element and production method for same, production method for light-emitting device, illumination device, backlight, display device, and diode

Method for processing semiconductors using a combination of electron beam and optical lithography

Structures and methods for testing printable integrated circuits

Overvoltage testing apparatus

LIGHT-EMITTING DIODE DEVICE

Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing

Cooler and cooling device

Cooling system for a computer system

Laminate and method for separating the same

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Manufacturing semiconductor device with film for forming protective layer

Method for manufacturing integral imaging device

Pattern forming method, pattern forming apparatus, and method for manufacturing semiconductor device

Inspection apparatus, inspection method, exposure method, and method for manufacturing semiconductor device

Dual hard mask lithography process

Pattern measuring method, pattern measuring apparatus, and program using same

Nonvolatile memory device, method for operating the same, and method for fabricating the same

Color-tunable lighting devices and methods of use

Method and apparatus for attachment of integrated circuits

Electronic apparatus with heat dissipation module

Integrated circuit chip, mobile device including the same, and method for operating the mobile device with improved impedance matching function control

Heat spreading substrate

Metal fuse structure for improved programming capability

Light-emitting diode with adjustable light beams and method for controlling the same

Semiconductor device and manufacturing method thereof

Efficient non-integral multi-height standard cell placement

Semiconductor device having non-planar interface between a plug layer and a contact layer

STRUCTURE AND MANUFACTURING METHOD FOR REDUCING STRESS OF CHIP

Semiconductor device

Metal layer air gap formation

Interconnect structures and methods of manufacturing of interconnect structures

METAL INTERCONNECT OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same

MULTILAYER WIRING BOARD AND ELECTRONIC DEVICE

Semiconductor Wafer Adapted to Support Transparency in Partial Wafer Processing

Integrated circuit including cross-coupled transistors having gate electrodes formed within gate level feature layout channels with gate contact position and offset specifications

Semiconductor device and manufacturing method thereof

Semiconductor structure having aluminum layer with high reflectivity

Semiconductor device and peeling off method and method of manufacturing semiconductor device

Radiation-emitting semiconductor chip and method for producing a radiation-emitting semiconductor chip

Semiconductor light emitting element, method of manufacturing the same, and vehicle lighting unit utilizing the same

Light-emitting device

High voltage light emitting diode chip and its manufacturing method

Heat spreading substrate

LIGHT EMITTING DEVICE WITH PLANAR CURRENT BLOCK STRUCTURE

Controlled synthesis of monolithically-integrated graphene structure

Semiconductor application installation adapted with a temperature equalization system

Three-dimensional microfluidic micro-droplet arrays for electronic integrated circuit and component cooling, energy-harvesting, chemical and biochemical microreactors, miniature bioreactors, and other applications

Composite heat spreader containing synthetic graphite sheet and compressed graphite layer joined without adhesive

Synthetic jet embedded heat sink

Heat dissipating mechanism adapted to an electronic device and electronic device therewith

HEAT DISSIPATION DEVICE WITH CONVECTION DRIVEN IMPELLER

Heat pipe structure

Liquid cooling system and method for cooling at least one radio unit

Heat exchanger backing plate and method of assembling same

Ball grid structure

Methods of manufacturing semiconductor devices including use of a protective material

Method for etching polycrystalline silicon, method for manufacturing semiconductor device, and etching program

Low dielectric photoimageable compositions and electronic devices made therefrom

Through-substrate optical coupling to photonics chips

Integrated optical interconnect

GROUNDING MECHANISM FOR HEAT SINK ASSEMBLY

Solar powered apparatus having a thermally decoupled solar panel for tracking a portable asset

Protection systems for integrated circuits and methods of forming the same

Semiconductor integrated circuit with testing and repairing via

Light emitting diode and integrated package therefor

Photo-patternable dielectric materials curable to porous dielectric materials, formulations, precursors and methods of use thereof

Electronic device and fabrication method thereof

Methods of Forming Device Level Conductive Contacts to Improve Device Performance and Semiconductor Devices Comprising Such Contacts

Metal line and via formation using hard masks

Airgap-containing interconnect structure with patternable low-k material and method of fabricating

Dual-metal self-aligned wires and vias

Semiconductor device and method of manufacturing the same

INTERCONNECTION STRUCTURES IN A SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SAME

Copper Interconnect for III-V Compound Semiconductor Devices

Semiconductors structure with elements having different widths and methods of making the same

Stress reduction apparatus with an inverted cup-shaped layer

On-chip ferrite bead inductor

Method of manufacturing semiconductor device and semiconductor device

Noise shielding techniques for ultra low current measurements in biochemical applications

Cross-coupled transistor circuit defined on four gate electrode tracks

Insulated gate bipolar transistor structure having low substrate leakage

Trench MOSFET having a top side drain

Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips

Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component

Optoelectronic component

Radiation-emitting component and method for producing radiation-emitting components

Light-Emitting Diode Area Light Module and Method for Packaging the Same

Light-emitting diode light module free of jumper wires

Power module for supporting high current densities

Critical dimension and pattern recognition structures for devices manufactured using double patterning techniques

Nanoscale emitters with polarization grading

Wet etching methods for copper removal and planarization in semiconductor processing

Electrical conductors and methods of manufacturing electrical conductors

HEAT RADIATOR

HEAT SINK ASSEMBLY

Cooler

Synthetic jet embedded heat sink

Cooling device with cooling passage for liquid refrigerant and juxtaposed fin assembly

Flexible metallic heat connector

Hermetically sealed electronic device using solder bonding

Gas enclosure assembly and system

Intelligent serial interface

Fastening structure for thermal module

Lighting device and method of making lighting device

Stacked substrate structure

Test System with Hopper Equipment

Testing System with Mobile Storage Carts and Computer-Controlled Loading Equipment

Test System with Test Trays and Automated Test Tray Handling

Testing system with test trays

Test System With Test Trays and Automated Test Tray Flipper

Test System with Test Trays and Automated Test Tray Handling

3-dimensional integrated circuit testing using MEMS switches with tungsten cone contacts

Inductors and wiring structures fabricated with limited wiring material

Through silicon via structure and method of fabricating the same

Devices including metal-silicon contacts using indium arsenide films and apparatus and methods

Electrostatic discharge protection device

Capacitor arrays for minimizing gradient effects and methods of forming the same

Semiconductor device and a method for manufacturing a semiconductor device

Cross-coupled transistor circuit defined on three gate electrode tracks

Cross-coupled transistor circuit defined on two gate electrode tracks

Meander line resistor structure

Adjustable meander line resistor

Interface engineering to optimize metal-III-V contacts

System-on-chip electronic device with aperture fed nanofilm antenna

Hybrid silicone composition for light emitting device

Radiation-emitting component and method for producing a radiation-emitting component

Logic circuit and semiconductor device

High-efficiency heat-dissipating paint composition using a carbon material

APPARATUS FOR SECURE DEVICE TO EDGE OF PLATE

Heat-dissipating module having loop-type vapor chamber

Semiconductor device cooling module

Bonding stress testing arrangement and method of determining stress

Electronic device and speed-up booting module and method thereof using heat pipes