ClassID:

212006

H01L2924/0002 - page 57 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#16801
20110056661
2011-03-10

Thermal block assemblies and instruments providing low thermal non-uniformity for rapid thermal cycling

#16802
20110056659
2011-03-10

Heat Dissipating Module

#16803
20110056658
2011-03-10

HEAT PIPE ASSEMBLY AND HEAT DISSIPATION DEVICE HAVING THE SAME

#16804
20110056657
2011-03-10

Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having the same

#16805
20110056655
2011-03-10

Dual-fluid heat exchanger

#16806
20110056650
2011-03-10

HEAT SINK

#16807
20110056589
2011-03-10

IRON-NICKLE ALLOY

#16808
20110054125
2011-03-03

CURABLE COMPOSITION AND USE THEREOF

#16809
20110054076
2011-03-03

Silicone containing encapsulant

#16810
20110054073
2011-03-03

CURABLE COMPOSITION AND USE THEREOF

#16811
20110053422
2011-03-03

Contact terminal unit and socket connector incorporated with the same contact terminal units

#16812
20110053374
2011-03-03

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

#16813
20110053369
2011-03-03

Methods of manufacturing a semiconductor memory device

#16814
20110053320
2011-03-03

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

#16815
20110053306
2011-03-03

Photovoltaic lead manufacture

#16816
20110052871
2011-03-03

HEAT DISSIPATING MATERIAL INCLUDING CARBON SUBSTRATE WITH NANOMETER-ORDER UNEVEN STRUCTURE AND ITS MANUFACTURING METHOD

#16817
20110052477
2011-03-03

Method for making the carbon nanotube heat sink

#16818
20110052444
2011-03-03

Lead-free solder alloy for printed circuit board assemblies for high-temperature environments

#16819
20110051771
2011-03-03

Optoelectronic component and method for producing an optoelectronic component

#16820
20110051512
2011-03-03

3D memory devices decoding and routing systems and methods

#16821
20110051415
2011-03-03

Convective heat-dissipating LED illumination lamp

#16822
20110051394
2011-03-03

Warm white lighting device

#16823
20110051375
2011-03-03

Highly integrated miniature radio frequency module

#16824
20110051368
2011-03-03

EXTERNAL THERMAL DEVICE AND RELATED ELECTRONIC DEVICE

#16825
20110051353
2011-03-03

Heat dissipation device for memory module

#16826
20110051305
2011-03-03

Series current limiter device

#16827
20110051150
2011-03-03

Unique mark and method to determine critical dimension uniformity and registration of reticles combined with wafer overlay capability

#16828
20110050988
2011-03-03

Optical element module and manufacturing method thereof, electronic element module and manufacturing method thereof, and electronic information device

#16829
20110050979
2011-03-03

Optical module, wafer scale package, and method for manufacturing those

#16830
20110050828
2011-03-03

Liquid discharge head and method for manufacturing the same

#16831
20110050807
2011-03-03

Inkjet printhead having selectively actuable nozzles arranged in nozzle pairs

#16832
20110050371
2011-03-03

Monolithically integrated active electronic circuit and waveguide structure for terahertz frequencies

#16833
20110050324
2011-03-03

Integrated smart power switch

#16834
20110050284
2011-03-03

Sense amplifier circuit and related configuration and operation methods

#16835
20110050126
2011-03-03

Wavelength converting system

#16836
20110050125
2011-03-03

Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same

#16837
20110049731
2011-03-03

Materials and methods for stress reduction in semiconductor wafer passivation layers

#16838
20110049730
2011-03-03

Device comprising an encapsulation unit

#16839
20110049727
2011-03-03

RECESSED INTERLAYER DIELECTRIC IN A METALLIZATION STRUCTURE OF A SEMICONDUCTOR DEVICE

#16840
20110049724
2011-03-03

BEOL interconnect structures and related fabrication methods

#16841
20110049723
2011-03-03

Methods and structures for controlling wafer curvature

#16842
20110049722
2011-03-03

Semiconductor circuit structure

#16843
20110049721
2011-03-03

Metal density aware signal routing

#16844
20110049719
2011-03-03

Semiconductor device and method for manufacturing the same

#16845
20110049714
2011-03-03

Illuminant

#16846
20110049713
2011-03-03

Dual contact metallization including electroless plating in a semiconductor device

#16847
20110049709
2011-03-03

Method of manufacturing a semiconductor device

#16848
20110049707
2011-03-03

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

#16849
20110049706
2011-03-03

Front side copper post joint structure for temporary bond in TSV application

#16850
20110049699
2011-03-03

Semiconductor device packaging structure

#16851
20110049688
2011-03-03

TCP-type semiconductor device

#16852
20110049684
2011-03-03

ANTICOUNTERFEITING SYSTEM AND METHOD FOR INTEGRATED CIRCUITS

#16853
20110049676
2011-03-03

Method, structure, and design structure for a through-silicon-via Wilkinson power divider

#16854
20110049674
2011-03-03

Interdigitated vertical parallel capacitor

#16855
20110049673
2011-03-03

Nanopillar decoupling capacitor

#16856
20110049672
2011-03-03

Semiconductor device

#16857
20110049670
2011-03-03

Semiconductor device including fuse having form of capacitor

#16858
20110049666
2011-03-03

Guard ring structures and method of fabricating thereof

#16859
20110049646
2011-03-03

Semiconductor device and method of forming the same

#16860
20110049635
2011-03-03

Handshake structure for improving layout density

#16861
20110049632
2011-03-03

Semiconductor device

#16862
20110049623
2011-03-03

Short channel lateral MOSFET and method

#16863
20110049596
2011-03-03

Semiconductor device having impurity doped polycrystalline layer including impurity diffusion prevention layer and dynamic random memory device including the semiconductor device

#16864
20110049593
2011-03-03

Semiconductor component

#16865
20110049586
2011-03-03

Device to detect and measure static electric charge

#16866
20110049555
2011-03-03

Optoelectronic semiconductor chip and method for producing same

#16867
20110049553
2011-03-03

Light emitting device package

#16868
20110049550
2011-03-03

Semiconductor light emitting element and semiconductor light emitting device

#16869
20110049540
2011-03-03

Method for fabricating robust light-emitting diodes

#16870
20110049539
2011-03-03

Light-Emitting Diode With High Color-Rendering Index

#16871
20110049536
2011-03-03

Light emitting diode package and method for manufacturing same

#16872
20110049515
2011-03-03

Chip structure with bumps and testing pads

#16873
20110049514
2011-03-03

TCP TYPE SEMICONDUCTOR DEVICE

#16874
20110049513
2011-03-03

SEMICONDUCTOR DEVICE HAVING MULTILAYER WIRING STRUCTURE AND METHOD OF FABRICATING THE SAME

#16875
20110049416
2011-03-03

Method for producing heterogeneous composites

#16876
20110048957
2011-03-03

Method for forming an ultrathin Cu barrier/seed bilayer for integrated circuit device fabrication

#16877
20110048930
2011-03-03

Selective nanotube growth inside vias using an ion beam

#16878
20110048797
2011-03-03

Surface mounted electronic component

#16879
20110048789
2011-03-03

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

#16880
20110048788
2011-03-03

Method for forming a via in a substrate and substrate with a via

#16881
20110048784
2011-03-03

Printed circuit board strip and panel

#16882
20110048689
2011-03-03

Architecture for gas cooled parallel microchannel array cooler

#16883
20110048683
2011-03-03

Heat pipe with composite wick structure

#16884
20110048682
2011-03-03

HEAT DISSIPATION DEVICE

#16885
20110048681
2011-03-03

Heat dissipation device with multiple heat sinks

#16886
20110048679
2011-03-03

HEAT DISSIPATION DEVICE

#16887
20110048678
2011-03-03

Heat dissipation device having support brackets with buckles to support the fan

#16888
20110048677
2011-03-03

HEAT-CONDUCTING ASSEMBLY FOR HEAT PIPES OF DIFFERENT DIAMETERS AND HEAT SINK HAVING THE SAME

#16889
20110048676
2011-03-03

Cooling system and electronic apparatus applying the same therein

#16890
20110048675
2011-03-03

HEAT SINK

#16891
20110048672
2011-03-03

Thermal ground plane for cooling a computer

#16892
20110047792
2011-03-03

Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating thin film transistor substrate

#16893
20110046767
2011-02-24

Method, system, and computer program product for preparing multiple layers of semiconductor substrates for electronic designs

#16894
20110046765
2011-02-24

INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM

#16895
20110045869
2011-02-24

IMAGING APPARATUS

#16896
20110045759
2011-02-24

Rack enclosure

#16897
20110045687
2011-02-24

ELECTRICAL CONNECTOR ASSEMBLY FOR FACILITATING HEAT DISSIPATION

#16898
20110045678
2011-02-24

Micro electromechanical system connector and method for manufacturing same

#16899
20110045655
2011-02-24

Manufacturing of semiconductor device

#16900
20110045644
2011-02-24

Fuse link structures using film stress for programming and methods of manufacture

#16901
20110045300
2011-02-24

Graphite complex and manufacturing method thereof

#16902
20110045287
2011-02-24

SEALING RESIN SHEET

#16903
20110045282
2011-02-24

Methods of forming graphene/(multilayer) boron nitride for electronic device applications

#16904
20110045246
2011-02-24

Method for evaluating oxide dielectric breakdown voltage of a silicon single crystal wafer

#16905
20110045209
2011-02-24

Continuous or discrete metallization layer on a ceramic substrate

#16906
20110044862
2011-02-24

Method for bonding plastic micro chip

#16907
20110044084
2011-02-24

MULTI-CHIP MEMORY DEVICE WITH STACKED MEMORY CHIPS, METHOD OF STACKING MEMORY CHIPS, AND METHOD OF CONTROLLING OPERATION OF MULTI-CHIP PACKAGE MEMORY

#16908
20110044052
2011-02-24

PRESS-FORGED LED METAL HOUSING AND LED METAL PACKAGE USING THE SAME

#16909
20110044037
2011-02-24

Light source

#16910
20110044026
2011-02-24

Illumination device with LED with a self-supporting grid containing luminescent material and method of making the self-supporting grid

#16911
20110044018
2011-02-24

Housing for an electrical device

#16912
20110044012
2011-02-24

Semiconductor device

#16913
20110044008
2011-02-24

Top actuated, force limiting heatsink retention system

#16914
20110044004
2011-02-24

HEAT TRANSFER APPARATUS HAVING A THERMAL INTERFACE MATERIAL

#16915
20110044003
2011-02-24

Heatsink structure

#16916
20110044001
2011-02-24

Cooling device for a plurality of power modules

#16917
20110044000
2011-02-24

Transparent heat-spreader for optoelectronic applications

#16918
20110043998
2011-02-24

Heat-dissipating module

#16919
20110043292
2011-02-24

Semiconductor integrated circuit

#16920
20110043245
2011-02-24

Component provided with an integrated circuit comprising a cryptorocessor and method of installation thereof

#16921
20110042829
2011-02-24

IC interconnect

#16922
20110042827
2011-02-24

BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES

#16923
20110042826
2011-02-24

Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner

#16924
20110042824
2011-02-24

Electronic part and method of manufacturing the same

#16925
20110042822
2011-02-24

Semiconductor device

#16926
20110042818
2011-02-24

Adding symmetrical filling material in an integrated circuit layout

#16927
20110042813
2011-02-24

Printed electronics

#16928
20110042807
2011-02-24

Chip package with heavily doped region and fabrication method thereof

#16929
20110042804
2011-02-24

Chip package with heavily doped regions and fabrication method thereof

#16930
20110042803
2011-02-24

Method For Fabricating A Through Interconnect On A Semiconductor Substrate

#16931
20110042789
2011-02-24

MATERIAL FOR CHEMICAL VAPOR DEPOSITION, SILICON-CONTAINING INSULATING FILM AND METHOD FOR PRODUCTION OF THE SILICON-CONTAINING INSULATING FILM

#16932
20110042785
2011-02-24

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

#16933
20110042779
2011-02-24

Fuse link structures using film stress for programming and methods of manufacture

#16934
20110042776
2011-02-24

Guard ring structures and method of fabricating thereof

#16935
20110042770
2011-02-24

Wafer level processing for backside illuminated image sensors

#16936
20110042766
2011-02-24

Photodetector, liquid crystal display device, and light emitting device

#16937
20110042761
2011-02-24

Eutectic flow containment in a semiconductor fabrication process

#16938
20110042752
2011-02-24

Semiconductor device including source/drain regions and a gate electrode, and having contact portions

#16939
20110042742
2011-02-24

Trench-gated MIS devices

#16940
20110042733
2011-02-24

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

#16941
20110042719
2011-02-24

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

#16942
20110042689
2011-02-24

Semiconductor light-emitting element array device, image exposing device, image forming apparatus, and image display apparatus

#16943
20110042679
2011-02-24

Electro-optical device and electronic device

#16944
20110042643
2011-02-24

Optoelectronic semiconductor chip having a multiple quantum well structure

#16945
20110042568
2011-02-24

Method for adjusting imaging magnification and charged particle beam apparatus

#16946
20110042226
2011-02-24

MANUFACTURING PROCESS OF A HIGH EFFICIENCY HEAT DISSIPATING DEVICE

#16947
20110042137
2011-02-24

SUSPENDED LEAD FRAME ELECTRONIC PACKAGE

#16948
20110042128
2011-02-24

Coreless packaging substrate and method for fabricating the same

#16949
20110042046
2011-02-24

Integrated coolant circuit arrangement, operating method and production method

#16950
20110042042
2011-02-24

RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT

#16951
20110042041
2011-02-24

Interlocked jets cooling method and apparatus

#16952
20110042038
2011-02-24

Power module assemblies with staggered coolant channels

#16953
20110042006
2011-02-24

E-chuck with automated clamped force adjustment and calibration

#16954
20110041115
2011-02-17

Non-invasive leakage power device characterization of integrated circuits using device grouping and compressive sensing

#16955
20110040527
2011-02-17

PROCESS CONDITION SENSING WAFER AND DATA ANALYSIS SYSTEM

#16956
20110039738
2011-02-17

Thermally conductive silicone grease composition

#16957
20110039409
2011-02-17

Method of designing semiconductor device and method of manufacturing the same

#16958
20110039398
2011-02-17

Efficient power management method in integrated circuit through a nanotube structure

#16959
20110039388
2011-02-17

Multi-thickness semiconductor with fully depleted devices and photonic integration

#16960
20110039373
2011-02-17

Semiconductor device and manufacturing method of semiconductor device

#16961
20110039372
2011-02-17

MEMS package and a method for manufacturing the same

#16962
20110039050
2011-02-17

Ultra-thin multi-layer packaging

#16963
20110039048
2011-02-17

SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT

#16964
20110038157
2011-02-17

Light-emitting systems

#16965
20110038156
2011-02-17

Light-emitting systems

#16966
20110038134
2011-02-17

PREVENTING OR MITIGATING GROWTH FORMATIONS ON METAL FILMS

#16967
20110038125
2011-02-17

Fastener and electronic device having the same

#16968
20110038122
2011-02-17

Phase Change Heat Spreader Bonded to Power Module by Energetic Multilayer Foil

#16969
20110038120
2011-02-17

Heat dissipation in computing device

#16970
20110037886
2011-02-17

Wafer level camera module with molded housing and method of manufacturing

#16971
20110037528
2011-02-17

Wave guiding structures for crosstalk reduction

#16972
20110037477
2011-02-17

Test structure for highly accelerated electromigration tests for thick metallization systems of solid state integrated circuits

#16973
20110037413
2011-02-17

Solid state lighting devices including light mixtures

#16974
20110037388
2011-02-17

WHITE LIGHT EMISSION DIODE AND WHITE LIGHT EMISSION DIODE LAMP

#16975
20110037175
2011-02-17

Interconnection between sublithographic-pitched structures and lithographic-pitched structures

#16976
20110037162
2011-02-17

HERMETIC PACKAGING AND METHOD OF FORMING THE SAME

#16977
20110037146
2011-02-17

Capacitors and methods of manufacture thereof

#16978
20110037143
2011-02-17

Semiconductor device using an aluminum interconnect to form through-silicon vias

#16979
20110037140
2011-02-17

Integrated circuit system with sealring and method of manufacture thereof

#16980
20110037134
2011-02-17

Solid-state image sensor device

#16981
20110037130
2011-02-17

Method and structure for self aligned contact for integrated circuits

#16982
20110037105
2011-02-17

Self-aligned selective metal contact to source/drain diffusion region

#16983
20110037084
2011-02-17

Lens-mounted light emitting unit

#16984
20110037080
2011-02-17

Methods for combining light emitting devices in a package and packages including combined light emitting devices

#16985
20110037072
2011-02-17

Multilayer wiring, semiconductor device, substrate for display device, and display device

#16986
20110037069
2011-02-17

METHOD AND APPARATUS FOR VISUALLY DETERMINING ETCH DEPTH

#16987
20110036627
2011-02-17

Method for contacting a rigid printed circuit board to a contact partner and arrangement of a rigid printed circuit board and contact partner

#16988
20110036552
2011-02-17

HEATSINK HAVING ONE OR MORE OZONE CATALYZING FINS

#16989
20110036545
2011-02-17

HIGH-PERFORMANCE HEAT SINK

#16990
20110036538
2011-02-17

METHOD AND DEVICE FOR COOLING A HEAT GENERATING COMPONENT

#16991
20110035939
2011-02-17

Method of manufacturing multilayer wiring board

#16992
20110035935
2011-02-17

HEAT SINK FAST DISASSEMBLING STRUCTURE

#16993
20110035186
2011-02-10

Portable wireless sensor

#16994
20110035043
2011-02-10

Method and apparatus for wireless transmission of diagnostic information

#16995
20110034912
2011-02-10

Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy

#16996
20110034606
2011-02-10

COMPOSITE DIELECTRIC COMPOSITION HAVING SMALL VARIATION OF CAPACITANCE WITH TEMPERATURE AND SIGNAL-MATCHING EMBEDDED CAPACITOR PREPARED USING THE SAME

#16997
20110034329
2011-02-10

Method for forming porous material in microcavity or micropassage by mechanicochemical polishing

#16998
20110034047
2011-02-10

Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging

#16999
20110034022
2011-02-10

Semiconductor package and fabrication method

#17000
20110033984
2011-02-10

Mold cleaning sheet and method of producing semiconductor devices using the same

#17001
20110033982
2011-02-10

Lead-forming die and method of manufacturing semiconductor device utilizing lead-forming die

#17002
20110033958
2011-02-10

Method for forming oxide film on silicon wafer

#17003
20110032704
2011-02-10

LIGHTING DISPLAY APPARATUS AND THE METHOD FOR MANUFACTURING THE SAME

#17004
20110032680
2011-02-10

Heat sink assembly having clip

#17005
20110032679
2011-02-10

Semiconductor module

#17006
20110032678
2011-02-10

Nano-tube thermal interface structure

#17007
20110032676
2011-02-10

Power inverter

#17008
20110032675
2011-02-10

Heat dissipation device

#17009
20110032672
2011-02-10

Memory Heat Sink System

#17010
20110032660
2011-02-10

Method of manufacturing complimentary metal-insulator-metal (MIM) capacitors

#17011
20110032659
2011-02-10

Complimentary metal-insulator-metal (MIM) capacitors and method of manufacture

#17012
20110032649
2011-02-10

ESD PROTECTIVE DEVICE HAVING LOW CAPACITANCE AND STABILITY AND A PREPARING PROCESS THEREOF

#17013
20110032535
2011-02-10

Interferometer for determining overlay errors

#17014
20110032467
2011-02-10

Copper alloy and liquid-crystal display device

#17015
20110032435
2011-02-10

Liquid crystal display device, semiconductor device, and electronic appliance

#17016
20110032409
2011-02-10

Optical module for a camera device, baffle substrate, wafer scale package, and manufacturing methods therefor

#17017
20110032400
2011-02-10

IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME

#17018
20110032100
2011-02-10

Wireless tag and method of producing wireless tag

#17019
20110032065
2011-02-10

Two layer transformer

#17020
20110032025
2011-02-10

Programmable semiconductor device

#17021
20110031982
2011-02-10

Tamper-resistant electronic circuit and module incorporating electrically conductive nano-structures

#17022
20110031894
2011-02-10

Lighting device having first, second and third groups of solid state light emitters, and lighting arrangement

#17023
20110031864
2011-02-10

Thermally conductive mounting element for attachment of printed circuit board to heat sink

#17024
20110031635
2011-02-10

Stacked Integrated Circuit Device

#17025
20110031633
2011-02-10

Air channel interconnects for 3-D integration

#17026
20110031632
2011-02-10

Die stacking with an annular via having a recessed socket

#17027
20110031626
2011-02-10

Metal wiring of semiconductor device and forming method thereof

#17028
20110031625
2011-02-10

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

#17029
20110031611
2011-02-10

Embedded laminated device

#17030
20110031603
2011-02-10

Semiconductor devices having stress relief layers and methods for fabricating the same

#17031
20110031590
2011-02-10

Method of fabricating an identification mark utilizing a liquid film assisted by a laser

#17032
20110031583
2011-02-10

High frequency device

#17033
20110031582
2011-02-10

Fin anti-fuse with reduced programming voltage

#17034
20110031553
2011-02-10

Semiconductor device having transistors each having gate electrode of different metal ratio and production process thereof

#17035
20110031551
2011-02-10

Structure and method for forming laterally extending dielectric layer in a trench-gate FET

#17036
20110031536
2011-02-10

Layout structure of standard cell, standard cell library, and layout structure of semiconductor integrated circuit

#17037
20110031523
2011-02-10

White light emitting device, backlight, liquid crystal display device, and illuminating device

#17038
20110031519
2011-02-10

Semiconductor light emitting device and method for manufacturing the same

#17039
20110031504
2011-02-10

Apparatus and method for increasing thermal conductivity of a substrate

#17040
20110031493
2011-02-10

Semiconductor device and manufacturing method thereof

#17041
20110031000
2011-02-10

RESIN COMPOSITION, CARRIER MATERIAL WITH RESIN, MULTI-LAYERED PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

#17042
20110030940
2011-02-10

CARBON FIBER CARBON COMPOSITE MOLDED BODY, CARBON FIBER-REINFORCED CARBON COMPOSITE MATERIAL AND MANUFACTURING METHOD THEREOF

#17043
20110030938
2011-02-10

HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION SYSTEM ADOPTING THE SAME

#17044
20110030930
2011-02-10

HEAT DISSIPATION DEVICE

#17045
20110030928
2011-02-10

Cooling Device and Method

#17046
20110030925
2011-02-10

Apparatus and method for thermal management using vapor chamber

#17047
20110030920
2011-02-10

Heat Sink Structure

#17048
20110030919
2011-02-10

Thermal module mount structure

#17049
20110030917
2011-02-10

Heat exchange for a thermoelectric thin film element

#17050
20110030894
2011-02-10

Manufacturing method for a vaccum heat insulator

#17051
20110030400
2011-02-10

Evaporator and cooling circuit

#17052
20110030217
2011-02-10

Method of manufacturing a heat exchanger

#17053
20110027992
2011-02-03

Memory device with improved data retention

#17054
20110027991
2011-02-03

Interconnect structure for semiconductor devices

#17055
20110027990
2011-02-03

Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through hole

#17056
20110027985
2011-02-03

SEMICONDUCTOR DEVICE HAVING AERIAL WIRING AND MANUFACTURING METHOD THEREOF

#17057
20110027961
2011-02-03

Semiconductor component and method of manufacture

#17058
20110027958
2011-02-03

Methods of forming silicide regions and resulting MOS devices

#17059
20110027949
2011-02-03

Semiconductor device and method of manufacturing the same

#17060
20110027942
2011-02-03

Semiconductor package

#17061
20110027934
2011-02-03

Photoelectric conversion apparatus and image pickup system using photoelectric conversion apparatus

#17062
20110027930
2011-02-03

Low temperature wafer level processing for MEMS devices

#17063
20110027927
2011-02-03

Light-emitting diode cutting method and product thereof

#17064
20110027922
2011-02-03

Semiconductor light emitting device manufacture method

#17065
20110027917
2011-02-03

Manufacturing method of semiconductor device

#17066
20110027603
2011-02-03

Enhancing Thermal Properties of Carbon Aluminum Composites

#17067
20110027565
2011-02-03

Highly thermally conductive resin molded article

#17068
20110027466
2011-02-03

Boron-containing hydrogen silsesquioxane polymer, integrated circuit device formed using the same, and associated methods

#17069
20110027122
2011-02-03

Cu-Ni-Si-Co-Cr System Alloy for Electronic Materials

#17070
20110027038
2011-02-03

HEAT SINK ANCHORING APPARATUS

#17071
20110026327
2011-02-03

Bit-line connections for non-volatile storage

#17072
20110026297
2011-02-03

Variable and reversible resistive element, non-volatile memory device and methods for operating and manufacturing the non-volatile memory device

#17073
20110026293
2011-02-03

Semiconductor device

#17074
20110026289
2011-02-03

Cell structure for dual port SRAM

#17075
20110026263
2011-02-03

Surface-textured encapsulations for use with light emitting diodes

#17076
20110026251
2011-02-03

LED illuminating device

#17077
20110026226
2011-02-03

Vehicular electronics assembly

#17078
20110026175
2011-02-03

ELECTROSTATIC DISCHARGE PROTECTING CIRCUIT WITH ULTRA-LOW STANDBY LEAKAGE CURRENT FOR TWICE SUPPLY VOLTAGE TOLERANCE

#17079
20110026174
2011-02-03

Electrostatic discharge protection element and electrostatic discharge protection chip and method of producing the same

#17080
20110025839
2011-02-03

Wafer imaging and processing method and apparatus

#17081
20110025443
2011-02-03

Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits

#17082
20110025192
2011-02-03

Illumination device with LED and a transmissive support comprising a luminescent material

#17083
20110024923
2011-02-03

Wafer level hermetic bond using metal alloy with keeper layer

#17084
20110024921
2011-02-03

Contact layout structure

#17085
20110024914
2011-02-03

Three-dimensional semiconductor device comprising an inter-die connection on the basis of functional molecules

#17086
20110024910
2011-02-03

METALLURGY FOR COPPER PLATED WAFERS

#17087
20110024909
2011-02-03

Bilayer metal capping layer for interconnect applications

#17088
20110024908
2011-02-03

Low resistance high reliability contact via and metal line structure for semiconductor device

#17089
20110024907
2011-02-03

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#17090
20110024901
2011-02-03

Manufacturing method of semiconductor device and semiconductor device

#17091
20110024900
2011-02-03

Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system

#17092
20110024893
2011-02-03

Stacked semiconductor package and method for manufacturing the same

#17093
20110024887
2011-02-03

Integrated circuit packaging system with through silicon via base and method of manufacture thereof

#17094
20110024885
2011-02-03

METHOD FOR MAKING SEMICONDUCTOR CHIPS HAVING COATED PORTIONS

#17095
20110024882
2011-02-03

SEMICONDUCTOR DEVICE

#17096
20110024873
2011-02-03

SEMICONDUCTOR DEVICE HAVING A FUSE REGION AND METHOD FOR FORMING THE SAME

#17097
20110024872
2011-02-03

Fuse of semiconductor device and method of forming the same

#17098
20110024864
2011-02-03

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

#17099
20110024849
2011-02-03

Semiconductor device and method of fabricating the same

#17100
20110024848
2011-02-03

Devices for shielding a signal line over an active region