Reliable interconnects

SEMICONDUCTOR DEVICE

Semiconductor device having via connecting between interconnects

Fabrication of a diffusion barrier cap on copper containing conductive elements

Semiconductor device having wiring with oxide layer of impurity from the wiring

Semiconductor device bonding with stress relief connection pads

Semiconductor device and method of fabricating semiconductor device

Fabricating product chips and die with a feature pattern that contains information relating to the product chip

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

THREE-DIMENSIONAL STRUCTURAL SEMICONDUCTOR DEVICE

Semiconductor component with marginal region

Monolithic integrated composite device having silicon integrated circuit and silicon optical device integrated thereon, and fabrication method thereof

Semiconductor device having variably laterally doped zone with decreasing concentration formed in an edge region

Semiconductor device having a plurality of misfets formed on a main surface of a semiconductor substrate

Method of manufacture of contact plug and interconnection layer of semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Double-sided integrated circuit chips

Semiconductor device having a contact plug and manufacturing method thereof

Carrier and optical semiconductor device based on such a carrier

Method for Packaging White-Light LED and LED Device Produced Thereby

Device for defeating reverse engineering of integrated circuits by optical means

Device for defeating reverse engineering of integrated circuits by optical means

Vertical thermoelectric structures

CMOS IMAGE SENSOR PACKAGE AND CAMERA MODULE WITH SAME

Heat sink

ANNULAR HEAT DISSIPATING DEVICE

ALIGNMENT MECHANISM FOR ALIGNING AN INTEGRATED CIRCUIT

Method of attaching integrated circuits to a carrier

Method of shielding an electronic component from electromagnetic interference (EMI)

Observing an internal link via a second link

Epoxy Resin Composition for Optical-Semiconductor Encapsulation, Cured Resin Thereof, and Optical Semiconductor Device Obtained with the same

Method for forming a fine pattern using isotropic etching

Method and fabricating semiconductor device and semiconductor device

Methods for incorporating high dielectric materials for enhanced SRAM operation and structures produced thereby

Structure, design structure and method of manufacturing a structure having VIAS and high density capacitors

Methods for forming back-end-of-line resistive semiconductor structures

Molding apparatus for manufacturing a semiconductor device and method using the same

Method, system, and apparatus for a secure bus on a printed circuit board

Plating member

Substrate joining method and 3-D semiconductor device

Heat-dissipating structure and manufacturing method thereof

Semiconductor module for use in power supply

Heat dissipation system for a heat generating electronic device

LED lamp assembly

Microelectronic package with high temperature thermal interface material

Power semiconductor module and method for its production

Narrow gap spray cooling in a globally cooled enclosure

Cooling device and electronic device

Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator

Electrostatic chuck assembly

System and method for excess voltage protection in a multi-die package

Switched mode power supply

Integrated circuit package system with mold gate

Stacked semiconductor device and method

Method of fabricating semiconductor device and semiconductor device

Interconnect structures comprising capping layers with low dielectric constants and methods of making the same

Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganese

Reliability of wide interconnects

Conformal adhesion promoter liner for metal interconnects

Multi-layered metal line of semiconductor device for preventing diffusion between metal lines and method for forming the same

Semiconductor device and method of manufacturing the same

Interconnect structures, design structure and method of manufacture

Nitrogen-containing metal cap for interconnect structures

INTEGRATED CIRCUIT STRUCTURES AND FABRICATING METHODS THAT USE VOIDS IN THROUGH HOLES AS JOINING INTERFACES

Semiconductor package and manufacturing method thereof

Method of packaging and interconnection of integrated circuits

Back-end-of-line resistive semiconductor structures

MODULAR & SCALABLE INTRA-METAL CAPACITORS

Contact and VIA interconnects using metal around dielectric pillars

Electrically programmable fuse and fabrication method

Integrated circuit structure having bottle-shaped isolation

Semiconductor device and fabrication process thereof

Microelectromechanical system package with strain relief bridge

Self-aligned borderless contacts for high density electronic and memory device integration

Electro-static discharge and latchup resistant semiconductor device

Method and structure for forming a shielded gate field effect transistor

Radiation-emitting chip comprising at least one semiconductor body

ILLUMINATION ASSEMBLY INCLUDING CHIP-SCALE PACKAGED LIGHT-EMITTING DEVICE

Vertical light emitting diodes

Optoelectronic semiconductor chip and method for manufacturing a contact structure for such a chip

Light-emitting device with a wavelength converting layer and method for manufacturing the same

METHOD OF FORMING METAL LINE OF INDUCTOR

Plated article having metal thin film formed by electroless plating, and manufacturing method thereof

Thermal conducting principle and device for prestressed clamping type multi-layered structure

Thermal conducting principle and device for prestressed clamping type multi-layered structure

Reinforced Thermal Module Structure

HEAT DISSIPATION DEVICE CAPABLE OF COLLECTING AIR

Reinforced thermal module structure

Heat sink and cooling and packaging stack for press-packages

Heat dissipation device

High performance compact heat exchanger

Heat dispensing unit for memory chip

Heat dispensing unit for memory chip

System for dissipating heat energy

Patterned structure for a thermal interface

Method for cutting electric fuse

Method for fabricating integrated circuit including separated diffusion regions of different type each having four gate electrodes with each of two complementary gate electrode pairs formed from respective linear condcutive segment

Method for fabricating integrated circuit having at least three linear-shaped gate electrode level conductive features of equal length positioned side-by-side at equal pitch

Using Multi-Layer/Multi-Input/Multi-Output (MLMIMO) models for metal-gate structures

RESIN COMPOSITION CONTAINING FINE METAL OXIDE PARTICLES

Method for fabricating semiconductor device

Method of manufacturing semiconductor device

Methods of making compliant semiconductor chip packages

Lead frame, method of manufacturing the same, and method of manufacturing semiconductor device

Bonded metal and ceramic plates for thermal management of optical and electronic devices

Heat spreader, electronic apparatus, and heat spreader manufacturing method

Electronic board and cold plate for said board

INTEGRATED PASSIVE DEVICE AND IPD TRANSFORMER

Integrated circuit and method for manufacturing an integrated circuit

Packaged voltage regulator and inductor array

IC having viabar interconnection and related method

Semiconductor device having an interconnect structure and a reinforcing insulating film

Interlayer insulating film, wiring structure and electronic device and methods of manufacturing the same

Through silicon via layout

Modulated deposition process for stress control in thick TiN films

Semiconductor devices and structures thereof

AMORPHOUS CARBON FILM, SEMICONDUCTOR DEVICE, FILM FORMING METHOD, FILM FORMING APPARATUS AND STORAGE MEDIUM

Semiconductor device and semiconductor device manufacturing method

Enhanced reliability for semiconductor devices using dielectric encasement

Method for forming bumps in substrates with through vias

Circuit structures and methods with BEOL layers configured to block electromagnetic edge interference

Through wafer vias and method of making same

Through wafer vias and method of making same

Metal wiring structure for integration with through substrate vias

Assembling of Electronic Members on IC Chip

Capacitor structure

Semiconductor device

Electrical fuse and semiconductor device

Integrated circuit structure, design structure, and method having improved isolation and harmonics

Passive temperature compensation of silicon MEMS devices

Solid-state image sensor

SHORT-CHANNEL SCHOTTKY-BARRIER MOSFET DEVICE AND MANUFACTURING METHOD

IC resistor formed with integral heatsinking structure

Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry

Through silicon via and method of fabricating same

Stack-type semiconductor device

Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure

Field-effect device and manufacturing method thereof

CMOS thermoelectric refrigerator

Integrated circuits comprising an active transistor electrically connected to a trench capacitor by an overlying contact and methods of making

Semiconductor device and method of manufacturing the same

Electrical antifuse having a multi-thickness dielectric layer

Integrated circuit including a linear-shaped conductive structure forming one gate electrode and having length greater than or equal to one-half the length of linear-shaped conductive structure forming two gate electrodes

Semiconductor device with gate level including four transistors of first type and four transistors of second type separated by non-diffusion region and having at least two gate contacts positioned outside separating non-diffusion region

Integrated circuit device with gate level region including at least three linear-shaped conductive segments having offset line ends and forming three transistors of first type and one transistor of second type

Integrated circuit device with gate level region including non-gate linear conductive segment positioned within 965 nanometers of four transistors of first type and four transistors of second type

Method for fabricating integrated circuit having three or more linear-shaped gate electrode level conductive segments of both equal length and equal pitch

TUNABLE WHITE LIGHT BASED ON POLARIZATION SENSITIVE LIGHT-EMITTING DIODES

Light emitting diode with ITO layer and method for fabricating the same

Light emitting device for AC operation

Light emitting device with an insulating layer

Large area thin freestanding nitride layers and their use as circuit layers

Chip module for an RFID system

Method to direct pattern metals on a substrate

Stacked MEMS device

Printed wiring board

Compliant pin strip with integrated dam bar

Microscale cooling apparatus and method

Heat exchanger having winding micro-channels

HEAT DISSIPATION DEVICE

Microheat exchanger for laser diode cooling

COOLING SYSTEM UTILIZING CARBON NANOTUBES FOR COOLING OF ELECTRICAL SYSTEMS

WIND-GUIDING COVER

HEAT PIPE WITH FLAT END AND METHOD OF MANUFACTURING THE SAME

COOLER MODULE

Heat dissipation device with locking tabs

HEAT SINK ASSEMBLY

THERMOELECTRIC MODULE AND METALLIZED SUBSTRATE

ENHANCED THERMALLY ISOLATED THERMOELECTRICS

Method for the sorption of gaseous contaminants by means of nanostructured sorbers in the form of a fiber

Reinforced backplate for use with electrical connector assembly having insulative coating thereon

Method for forming laterally extending dielectric layer in a trench-gate FET

Single spacer process for multiplying pitch by a factor greater than two and related intermediate IC structures

Method of forming semiconductor devices containing metal cap layers

Through wafer vias with dishing correction methods

Memory cell device with coplanar electrode surface and method

Method of manufacturing light emitting device

Controlling edge emission in package-free LED die

Substrate processing control method and storage medium

Method for repair of semiconductor device

Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties

ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES

Mounting structure with heat sink for electronic component and female securing member for same

Thermal control system for a light-emitting diode fixture

Contact cooled electronic enclosure

FAN FRAME ASSEMBLY FOR A HEAT SINK

Semiconductor member, semiconductor article manufacturing method, and LED array using the manufacturing method

Method and apparatus for effecting stable operation of resonant tunneling diodes

Detector arrangement

Hybrid-Level Three-Dimensional Mask-Programmable Read-Only Memory

Winged vias to increase overlay margin

Polishing systems and methods for removing conductive material from microelectronic substrates

Back-end-of-line wiring structures with integrated passive elements and design structures for a radiofrequency integrated circuit

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

OHMIC ELECTRODE STRUCTURE AND SEMICONDUCTOR ELEMENT

Embedded inductor and method of producing thereof

Reduced stiction and mechanical memory in MEMS devices

Structure for reducing integrated circuit corner peeling

Programmable precision resistor and method of programming the same

Pinched poly fuse

INTEGRATED CIRCUIT WITH BUILT-IN HEATING CIRCUITRY TO REVERSE OPERATIONAL DEGENERATION

Image sensor chip package structure and method thereof

IMAGE PICKUP APPARATUS, MANUFACTURING METHOD THEREOF, AND MOBILE TERMINAL

Imaging device, method for manufacturing the imaging device and cellular phone

Flip-chip interconnection through chip vias

Replacement spacers for MOSFET fringe capacitance reduction and processes of making same

Process for producing a contact pad on a region of an integrated circuit, in particular on the electrodes of a transistor

Semiconductor device and manufacturing method thereof

METHODS, STRUCTURES AND SYSTEMS FOR INTERCONNECT STRUCTURES IN AN IMAGER SENSOR DEVICE

Method of forming a low capacitance semiconductor device and structure therefor

Solid-state imaging device with vertical gate electrode and method of manufacturing the same

Integrated circuit including at least three linear-shaped conductive structures at equal pitch including linear-shaped conductive structure having non-gate portion length greater than gate portion length

Method for fabricating integrated circuit with gate electrode level region including two side-by-side ones of at least three linear-shaped conductive structures electrically connected to each other through non-gate level

Semiconductor device with linearly restricted gate level region including four transistors of first type and four transistors of second type with gate defining shapes of different length

Semiconductor device including at least six transistor forming linear shapes with at least two transistor forming linear shapes having offset ends

Integrated circuit including at least six linear-shaped conductive structive structures at equal pitch including at least two linear-shaped conductive structures having non-gate portions of different length

Semiconductor device with gate level including transistors of first type and transistors of second type with corresponding gate contact placement restriction

Method for forming an insulated gate field effect device

Optical semiconductor device module having leaf springs with different rectangularly-shaped terminals

Top contact LED thermal management

Optical bonding composition for LED light source

Optical Element, Radiation-Emitting Component and Method for Producing an Optical Element

Semiconductor element and display device using the same

Nitride semiconductor light-emitting devices

Multiple Quantum-Well Structure, Radiation-Emitting Semiconductor Base and Radiation-Emitting Component

Multilayered circuit board and semiconductor device

Multilayer printed circuit board using paste bumps

Heat conductive plate structure

Fan assembly

Heat dissipation utilizing flow of refrigerant

HEAT EXCHANGER FOR COOLING SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME

Dissipation utilizing flow of refrigerant

Heat dissipating device and fin assembly thereof

HEAT DISSIPATION DEVICE

Heat sink assembly

Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages

Multilevel interconnection board and method of fabricating the same

DOWNHOLE TOOL WITH THIN FILM THERMOELECTRIC COOLING

Method of enhancing on-chip inductance structure utilizing silicon through via technology

Integrated circuit with gate electrode level region including multiple linear-shaped conductive structures forming gate electrodes of transistors and including uniformity extending portions of different size

Semiconductor device including transistor forming linear shapes including gate portions and extending portions of different size

Semiconductor device and associated layouts having transistors formed from six linear conductive segments with gate electrode connection through single interconnect level

Semiconductor device including at least six transistor forming linear shapes including at least two transistor forming linear shapes having different extension distances beyond gate contact

Nanodiamond thermal grease

Method of fabricating a semiconductor device

CARBON NANOTUBE INTERCONNECT STRUCTURES

Method for making a nanotube-based electrical connection between two facing surfaces

High voltage sensor device and method therefor

Method of fabricating high voltage semiconductor devices with JFET regions containing dielectrically isolated junctions

Method for evaluating semiconductor wafer

Nanosensors

INTERFACE-INFUSED NANOTUBE INTERCONNECT

Nickel-rhenium alloy powder and conductor paste containing the same

Thermal conduction principle and device for intercrossed structure having different thermal characteristics

Low leakage metal-containing cap process using oxidation

Use of Extracts from AMTHS plants in Lowering Blood Glucose

Passive heat sink and light emitting diode lighting device using the same

LED ILLUMINATION DEVICE WITH CUBIC ZIRCONIA LENS

Lighting device

Integrated power passives

Wafer-to-wafer stacking

Heat dissipation device

Heat dissipation device

Electronic chip module

Electronic component unit and coupling mechanism

HEAT DISSIPATION DEVICE

HEAT-DISSIPATING DEVICE

AIRFLOW CONDUCTING APPARATUS

ESD protection device

Wide band and radio frequency waveguide and hybrid integration in a silicon package

Semiconductor integrated circuit device

Semiconductor device and method of fabricating semiconductor device

PACKAGING STRUCTURE FOR INTEGRATION OF MICROELECTRONICS AND MEMS DEVICES BY 3D STACKING AND METHOD FOR MANUFACTURING THE SAME

Electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components

ELECTRICAL CONDUCTOR LINE HAVING A MULTILAYER DIFFUSION BARRIER FOR USE IN A SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

Implementing Reduced Hot-Spot Thermal Effects for SOI Circuits

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

INTEGRATED CIRCUIT WITH MICRO-PORES CERAMIC HEAT SINK

Housing for a semiconductor component

Package for an integrated circuit

Semiconductor device and manufacturing method therefor

SEMICONDUCTOR CHIP SHAPE ALTERATION

Semiconductor device and method for manufacturing the same

Poly resistor and poly eFuse design for replacement gate technology

Semiconductor device

MULTILAYER INTEGRATED CIRCUIT HAVING AN INDUCTOR IN STACKED ARRANGEMENT WITH A DISTRIBUTED CAPACITOR

Integrated circuit including at least six linear-shaped conductive structures forming gate electrodes of transistors with at least two different extension distances beyond conductive contacting structures

Semiconductor device with gate level including gate electrode conductors for transistors of first type and transistors of second type with some gate electrode conductors of different length

Integrated circuit with gate electrode level including at least four linear-shaped conductive structures of equal length and equal pitch with linear-shaped conductive structure forming one transistor

Integrated circuit including at least three linear-shaped conductive structures of different length each forming gate of different transistor

Semiconductor device including two transistors of first type having gates formed by conductors of different length respectively aligned with two transistors of second type having gates formed by conductors of different length

Semiconductor device with linearly restricted gate level region including four serially connected transistors of first type and four serially connected transistors of second type separated by non-diffusion region

Integrated circuit including gate electrode level region including at least four linear-shaped conductive structures of equal length having aligned ends and positioned at equal pitch and forming multiple gate electrodes of transistors of different type

Integrated circuit including gate electrode level region including at least three linear-shaped conductive structures of equal length having aligned ends and positioned at equal pitch and forming multiple gate electrodes of transistors of different type

Integrated circuit with gate electrode level including at least six linear-shaped conductive structures forming gate electrodes of transisters with at least one pair of linear-shaped conductive structures having offset ends

Optoelectronic semiconductor chip

Arrangement for generating mixed light and method for producing such an arrangement

Semiconductor light emitting device

Semiconductor light emitting device including a window layer and a light-directing structure