LED semiconductor body and use of an LED semiconductor body

Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device

Semiconductor composite film, method for forming semiconductor composite film, thin film transistor, method for manufacturing thin film transistor, and electronic apparatus

Two-phase silicate-based yellow phosphor

Radiation detector

Method of producing a wall, particularly a wall of a micro heat exchanger, and micro heat exchanger comprising, in particular, nanotubes

WATER PILLOW FOR HEAT RADIATION

Vapor Chamber with Boiling-Enhanced Multi-Wick Structure

HEAT PIPE STRUCTURE AND THERMAL DISSIPATION SYSTEM APPLYING THE SAME

Planar Heat Dissipating Device

PULSATING COOLING SYSTEM

Heat sink assembly

Heat dissipation device

Method of manufacturing composite wiring board

Method and apparatus for detecting foreign matter attached to peripheral edge of substrate, and storage medium

Semiconductor integrated circuit device having power switch controller with gate insulator thickness for controlling multiple power switches

Integrated circuit having gate electrode level region including at least seven linear-shaped conductive structures at equal pitch including linear-shaped conductive structure forming transistors of two different types and at least three linear-shaped conductive structures having aligned ends

Integrated circuit including gate electrode level region including at least seven linear-shaped conductive structures of equal length positioned at equal pitch with at least two linear-shaped conductive structures each forming one transistor and having extending portion sized greater than gate portion

Integrated circuit having gate electrode level region including at least four linear-shaped conductive structures with some outer-contacted linear-shaped conductive structures having larger outer extending portion than inner extending portion

Method of fabricating integrated circuit including at least six linear-shaped conductive structures at equal pitch including at least two linear-shaped conductive structures having non-gate portions of different length

Semiconductor device and associated layouts having linear shaped gate electrodes defined along at least five adjacent gate electrode tracks of equal pitch

Electrodes of transistors with at least two linear-shaped conductive structures of different length

Integrated circuit with gate electrode level region including at least four linear-shaped conductive structures forming gate electrodes of transistors and including extending portions of at least two different sizes

Metrology through use of feed forward feed sideways and measurement cell re-use

Epoxy resin composition and cured article thereof

Epoxy resin composition and semiconductor device

Processing end point detection method, polishing method, and polishing apparatus

Socket with an improved cover lid

Wet etching methods for copper removal and planarization in semiconductor processing

METHOD FOR FORMING METAL FILM USING CARBONYL MATERIAL, METHOD FOR FORMING MULTI-LAYER WIRING STRUCTURE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device, manufacturing method and apparatus for the same

RESCUE STRUCTURE AND METHOD FOR LASER WELDING

Solder Interconnect

Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane

Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip

METHOD FOR MANUFACTURING METALLIZED ALUMINUM NITRIDE SUBSTRATE

Cooling and shielding of a high voltage converter

Arrangement and a method for cooling

Electronic component module and method for production thereof

Multidimensional Thermal Management Device for an Integrated Circuit Chip

THERMAL DEVICE FOR HEAT GENERATING SOURCE

Heat dissipation apparatus

Micro-electro-mechanical transducer having a surface plate

High frequency amplifying device

Double-emission organic light emitting diode display device

Interconnect structures for integration of multi-layered integrated circuit devices and methods for forming the same

Method and system for forming conductive bumping with copper interconnection

Mechanically stable diffusion barrier stack and method for fabricating the same

Cu-Mn Alloy Sputtering Target and Semiconductor Wiring

Chip mounting

Silicide formation on a wafer

Surface mount package with high thermal conductivity

PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING A PACKAGE SUBSTRATE

METHOD OF FORMING A CONDUCTIVE TRENCH IN A SILICON WAFER AND SILICON WAFER COMPRISING SUCH TRENCH

Diffusion region routing for narrow scribe-line devices

Semiconductor Wafer and Semiconductor Wafer Inspection Method

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

Interconnect line selectively isolated from an underlying contact plug

Method of Integrating an Element

Crackstop structures and methods of making same

Enablement of IC devices during assembly

Semiconductor device covered by front electrode layer and back electrode layer

Localized biasing for silicon on insulator structures

Semiconductor device with gate level including four transistors of first type and four transistors of second type separated by non-diffusion region with restricted gate contact placement over separating non-diffusion region

Integrated circuit including linear-shaped conductive structures that have gate portions and extending portions of different size

Integrated circuit device with gate electrode level region including two side-by-side ones of at least three linear-shaped conductive structures electrically connected to each other through non-gate level

Integrated circuit device with linearly defined gate electrode level region and shared diffusion region of first type connected to shared diffusion region of second type through at least two interconnect levels

Integrated circuit including at least six linear-shaped conductive structures forming gate electrodes and including four conductive contacting structures having at least two different connection distances

Integrated circuit including at least six linear-shaped conductive structures forming gate electrodes of transistors with at least two linear-shaped conductive structures of different length

Contact Structures in Substrate Having Bonded Interface, Semiconductor Device Including the Same, Methods of Fabricating the Same

Enhancement mode semiconductor device

GaN LED element and light emitting device having a structure to reduce light absorption by a pad electrode included therein

Semiconductor light emitting device package

LIGHT EMITTING DIODE

Light emitting device with tension relaxation

Crackstop structures and methods of making same

Cu alloy wiring film, TFT element for flat-panel display using the Cu alloy wiring film, and Cu alloy sputtering target for depositing the Cu alloy wiring film

Thermally conductive material and thermally conductive sheet molded from the thermally conductive material

Method of manufacturing cards that each include an electronic module and intermediate products

WELDING METHOD AND WELDING STRUCTURE OF CONDUCTIVE TERMINALS

PULSATING FLUID COOLING WITH FREQUENCY CONTROL

HEAT UNIFORMING DEVICE FOR ELECTRONIC APPARATUS

HEAT EXCHANGER UNIT

Structure and apparatus for cooling integrated circuits using cooper microchannels

Integrated circuit device and associated layout including gate electrode level region of 965 NM radius with linear-shaped conductive segments on fixed pitch

Method for fabricating integrated circuit with gate electrode level portion including at least two complementary transistor forming linear conductive segments and at least one non-gate linear conductive segment

Semiconductor device and associated layouts having linear shaped gate electrodes defined along at least five adjacent gate electrode tracks of equal pitch with gate electrode connection through single interconnect level

Integrated circuit device and associated layout including linear gate electrodes of different transistor types next to linear-shaped non-gate conductive segment

Semiconductor device having 1965 nm gate electrode level region including at least four active linear conductive segments and at least one non-gate linear conductive segment

Semiconductor device with linearly restricted gate level region including two transistors of first type and two transistors of second type with offset gate contacts

Integrated circuit and associated layout with gate electrode level portion including at least two complimentary transistor forming linear conductive segments and at least one non-gate linear conductive segment

Electrical connector having heat sink with large dissipation area

Microelectronic interconnect element with decreased conductor spacing

METHOD AND APPARATUS FOR MODIFYING INTEGRATED CIRCUIT BY LASER

Manufacturing method of semiconductor device

Methods of forming a contact structure

Semiconductor device fabrication method

Dual-damascene process to fabricate thick wire structure

STACKED MICROELECTRONIC LAYER AND MODULE WITH THREE-AXIS CHANNEL T-CONNECTS

Planar interconnect structure for hybrid circuits

Semiconductor light emitting device and method of manufacturing the same

Within-sequence metrology based process tuning for adaptive self-aligned double patterning

Graphite material and method for manufacturing the same

Thermally conductive sheet composite and method for manufacturing the same

Section processing method and its apparatus

Integrated photovoltaic cell and antenna

Back plate assembly

Strain reduction fixing structure

Thermal dissipation heat slug sandwich

HEAT SINK

HEAT-TRANSPORTING DEVICE, ELECTRONIC APPARATUS, SEALING APPARATUS, SEALING METHOD, AND METHOD OF PRODUCING A HEAT-TRANSPORTING DEVICE

HEAT DISSIPATION DEVICE

Liquid crystal display device

Electrical fuse devices and methods of operating the same

Display substrate and apparatus and method for testing display panel having the same

Radiation emitting device

Semiconductor device and method of manufacturing the same

DEVICE INCLUDING AN IMIDE LAYER WITH NON-CONTACT OPENINGS AND METHOD

MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE HAVING IMPROVED COPPER DIFFUSION PREVENTIVE FUNCTION OF PLUGS AND WIRINGS MADE OF COPPER OR COPPER ALLOY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Methods of Fabricating Semiconductor Devices Including Porous Insulating Layers

BGA PACKAGE

Integrated semiconductor outline package

Interconnect structure for high frequency signal transmissions

Method of forming a shielded semiconductor device and structure therefor

Semiconductor device and associated layouts having transistors formed from six linear conductive segments with intervening diffusion contact restrictions

Semiconductor device

Semiconductor device

Inductor and filter

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Storage nitride encapsulation for non-planar sonos NAND flash charge retention

Wafer level processing for backside illuminated sensors

MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads

Semiconductor device and associated layouts including gate electrode level region having arrangement of six linear conductive segments with side-to-side spacing less than 360 nanometers

Semiconductor device having at least three linear-shaped electrode level conductive features of equal length positioned side-by-side at equal pitch

Integrated circuit device and associated layout including two pairs of co-aligned complementary gate electrodes with offset gate contact structures

Integrated circuit device and associated layout including separated diffusion regions of different type each having four gate electrodes with each of two complementary gate electrode pairs formed from respective linear conductive segment

Interconnection structure and electronic device employing the same

Stabilizing breakdown voltages by forming tunnels for ultra-high voltage devices

Planar Metal-Insulator-Metal Circuit Element and Method for Planar Integration of Same

Semiconductor memory device

Semiconductor device having two pairs of transistors of different types formed from shared linear-shaped conductive features with intervening transistors of common type on equal pitch

Semiconductor device having at least four side-by-side electrodes of equal length and equal pitch with at least two transistor connections to power or ground

Semiconductor device and associated layouts including diffusion contact placement restriction based on relation to linear conductive segments

Semiconductor device and associated layouts having transistors formed from linear conductive segment with non-active neighboring linear conductive segment

Semiconductor device and associated layouts having transistors formed from six linear conductive segments with gate electrode-to-gate electrode connection through single interconnect level and common node connection through different interconnect level

Semiconductor device having linear-shaped gate electrodes of different transistor types with uniformity extending portions of different lengths

Semiconductor device and associated layout having three or more linear-shaped gate electrode level conductive segments of both equal length and equal pitch

METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR APPARATUS

Light Emitting Device and Manufacturing Method Therof

Light emitting diodes including barrier layers/sublayers and manufacturing methods therefor

Light emitting device and method for fabricating the same

HIGHLY POLARIZED WHITE LIGHT SOURCE BY COMBINING BLUE LED ON SEMIPOLAR OR NONPOLAR GaN WITH YELLOW LED ON SEMIPOLAR OR NONPOLAR GaN

Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package

IMPLANTED CONNECTORS IN LED SUBMOUNT FOR PEC ETCHING BIAS

Semiconductor device

BEOL compatible FET structure

LID OR CASE FOR SEALED PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Electronic component package

HEAT DISSIPATION DEVICE AND METHOD FOR MANUFACTURING THE SAME

Cooling fan

Enhanced heat pipe cooling with MHD fluid flow

VAPOR CHAMBER AND SUPPORTING STRUCTURE OF THE SAME

COVERED PLATE-TYPE HEAT PIPE

Heat pipe and method for manufacturing the same

Moving Body Cooling Apparatus

HEAT SINK

DEVICE FOR COOLING, IN PARTICULAR, ELECTRONIC COMPONENTS

Electrical fuse having sublithographic cavities thereupon

Source material for preparing low dielectric constant material

Semiconductor device and method for manufacturing the same

Interconnections having double capping layer and method for forming the same

Method of preparing an electrically insulating film and application for the metallization of vias

Deterministic generation of an integrated circuit identification number

Electronic Device and Method for Manufacturing Same

Wafer level hermetic bond using metal alloy with raised feature

Plated article having metal thin film formed by electroless plating

Methods for inhibiting tin whisker growth using abrasive powder coatings

Disabling faulty flash memory dies

Solid state lighting devices including light mixtures

LED illumination device and light engine thereof

Semiconductor device

Base for power module

Heat sink assembly having a clip

Fastening device for thermal module

Assembled Heat Sink Structure

ELECTRONIC DEVICE WITH HEAT SINK ASSEMBLY

Heat sink assembly including a heat pipe and a duct

Printed circuit board and electronic apparatus

HEAT DISSIPATION DEVICE AND METHOD FOR MOUNTING THE SAME

HEAT DISSIPATING DEVICE FOR ELECTRONIC DEVICE

Antistatic apparatus

SOLID-STATE IMAGE PICKUP APPARATUS AND MANUFACTURING METHOD THEREOF

Display device and electronic device using the same

Semiconductor device

Semiconductor component and method of determining temperature

Integrated circuit and method of protecting a circuit part of an integrated circuit

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Semiconductor device and method of manufacturing semiconductor device

Artificially tilted via connection

Integrated circuit structure

Multiple Patterning Method

SEMICONDUCTOR DEVICE INCLUDING INTERCONNECT LAYER MADE OF COPPER

CHIP PACKAGE WITH ESD PROTECTION STRUCTURE

Semiconductor device and method of manufacturing the same

Multi-chip package (MCP) having three dimensional mesh-based power distribution network, and power distribution method of the MCP

Through-substrate vias and method of fabricating same

Semiconductor device

Corresponding capacitor arrangement and method for making the same

Integrated circuit system employing alternating conductive layers

Suspended getter material-based structure

Self aligned MOS structure with polysilicon contact

Semiconductor device and method of manufacturing the same

METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING CAPACITOR ELEMENT

SEMICONDUCTOR DEVICE HAVING AN ANTI-PAD PEELING-OFF STRUCTURE

Semiconductor device and associated layouts including linear conductive segments having non-gate extension portions

SEMICONDUCTOR DEVICE

Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same

Side view light emitting diode package

Encapsulation for electronic and/or optoelectronic device

COPACKING CONFIGURATIONS FOR NONPOLAR GaN AND/OR SEMIPOLAR GaN LEDs

LIGHT EMITTING DIODE ILLUMINATING APPARATUS WITH SAME-TYPE LIGHT EMITTING DIODES

LED ASSEMBLY WITH COLOR TEMPERATURE CORRECTION CAPABILITY

Semiconductor devices having gallium nitride epilayers on diamond substrates

Triggered silicon controlled rectifier for RF ESD protection

METHOD FOR PRODUCING HETEROGENEOUS COMPOSITES

Methods and apparatus for conducting heat from an electronic assembly while providing shock protection

Method of construction of CTE matching structure with wafer processing and resulting structure

Tab tape for tape carrier package

Lead pin for package boards

HEAT-DISSIPATING PIPE MODULE

LIQUID COOLING HEAT DISSIPATING DEVICE WITH HEAT TUBES GATHERING HEAT SOURCES

Heat dissipation device having a clip

HEAT DISSIPATION DEVICE

Memory Module Assembly Including Heat Sink Attached To Integrated Circuits By Adhesive And Clips

Cu-ni-si system alloy

SOLAR CONCENTRATORS WITH TEMPERATURE REGULATION

Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit

Method and system for preparing wireless communication chips for later processing

Epoxy resin molding material for sealing and electronic component device

Procedure for obtaining nanotube layers of carbon with conductor or semiconductor substrate

Field effect transistor with metal source/drain regions

Semiconductor encapsulation material and method for encapsulating semiconductor using the same

Apparatuses and methods to enhance passivation and ILD reliability

METHOD FOR FORMING A POROUS MATERIAL

Buried bit line anti-fuse one-time-programmable nonvolatile memory

LED illumination device

Heat sink apparatus for solid state lights

Light emitting device having a phosphor layer

Heat sink assembly

APPARATUS FOR REMOVING HEAT FROM PC CIRCUIT BOARD DEVICES SUCH AS GRAPHICS CARDS AND THE LIKE

HEAT TRANSPORT DEVICE AND ELECTRONIC APPARATUS

Heat dissipation apparatus having a fan received therein

Information processing apparatus

System and method for portable information handling system parallel-wall thermal shield

SUPPORT DEVICE AND ELECTRONIC DEVICE USING SAME

Semiconductor device and method of fabricating the same

Film resistor and a method for forming and trimming a film resistor

BEOL wiring structures that include an on-chip inductor and an on-chip capacitor, and design structures for a radiofrequency integrated circuit

Methods of fabricating a BEOL wiring structure containing an on-chip inductor and an on-chip capacitor

Chip on film trace routing method for electrical magnetic interference reduction

Regulated energy supply for a rapidly cycling integrated circuit with reduced electromagnetic radiation

Semiconductor integrated circuit device

SEMICONDUCTOR DEVICE, SIGNAL TRANSMITTER, AND SIGNAL TRANSMISSION METHOD

Drive circuit device for a power semiconductor, and signal transfer circuit device for use therein

Integrated tester chip using die packaging technologies

Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same

Light emitting device having a refractory phosphor layer

Methods and apparatuses for enhancing heat dissipation from a light emitting device

Nano filament structure and methods of forming the same

Light emitting device having a transparent thermally conductive layer

Onboard electric power control device

Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire

PROCESS FOR FABRICATING AN INTEGRATED ELECTRONIC CIRCUIT INCORPORATING A PROCESS REQUIRING A VOLTAGE THRESHOLD BETWEEN A METAL LAYER AND A SUBSTRATE

SEMICONDUCTOR DEVICE WITH IMPROVED INTERCONNECTION OF CONDUCTOR PLUG

Method of forming stacked trench contacts and structures formed thereby

Method for Manufacturing Contact Openings, Method for Manufacturing an Integrated Circuit, an Integrated Circuit

Methods of Manufacturing Copper Interconnect Systems

Semiconductor device with reduced increase in copper film resistance

Semiconductor device manufacturing method using valve metal and nitride of valve metal

Methods of forming improved electromigration resistant copper films and structures formed thereby

SELF-ALIGNED CAP AND BARRIER

Structure to facilitate plating into high aspect ratio vias

Semiconductor device and method of manufacturing the same

Semiconductor with bottom-side wrap-around flange contact

INJECTION MOLDED METAL IC PACKAGE STIFFENER AND PACKAGE-TO-PACKAGE INTERCONNECT FRAME

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

THERMALLY BALANCED HEAT SINKS

Method and apparatus for generating reticle data

Protective seal ring for preventing die-saw induced stress

Scribe seal connection

Alignment for backside illumination sensor

METHOD OF FABRICATING AN ELECTROMECHANICAL STRUCTURE INCLUDING AT LEAST ONE MECHANICAL REINFORCING PILLAR

SHUTTLE WAFER AND METHOD OF FABRICATING THE SAME

Method for production of packaged electronic components, and a packaged electronic component

Strained semiconductor device

Semiconductor device reducing output capacitance due to parasitic capacitance

Semiconductor device and method of fabricating the same

Separative extended gate field effect transistor based uric acid sensing device, system and method for forming thereof