212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Semiconductor device
#1802Methods of manufacturing semiconductor devices
#1803Activating reactions in integrated circuits through electrical discharge
#1804Semiconductor package
#1805Semiconductor device having a Pd-containing adhesion layer
#1806Semiconductor device having MIM capacitor
#1807Planar cavity MEMS and related structures, methods of manufacture and design structures
#1808Rigid-flexible circuit interconnects
#1809Semiconductor image sensor module and method of manufacturing the same
#1810Systems and methods for improved chip device performance
#1811Semiconductor device
#1812Structure comprising an inductor and resistor
#1813Printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
#1814Hybrid integrated optical device
#1815Planar cavity MEMS and related structures, methods of manufacture and design structures
#1816Light emitting device and LED light bulb
#1817ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
#1818Method for manufacturing semiconductor device and manufacturing apparatus of semiconductor device
#1819Display device
#1820Power gating for three dimensional integrated circuits (3DIC)
#18213D semiconductor device and structure
#1822Programmable fuse with single fuse pad and control methods thereof
#1823INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#1824Diffusion barrier layer formation
#1825Semiconductor device and manufacturing method thereof
#1826Semiconductor wafer device and manufacturing method thereof
#1827Methods for Multi-Wire Routing and Apparatus Implementing Same
#1828Crosstalk suppression in wireless testing of semiconductor devices
#1829Particle production apparatus, particle production method and method for producing semiconductor encapsulating resin composition
#1830Particle production apparatus, particle production method and method for producing semiconductor encapsulating resin composition
#1831Wafer level package for a MEMS sensor device and corresponding manufacturing process
#1832Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry
#1833Semiconductor integrated circuit device
#1834Light emitting module
#1835Integrated electronic device with transceiving antenna and magnetic interconnection
#1836Silicon package having electrical functionality by embedded passive components
#1837Substrate processing apparatus, method of manufacturing semiconductor device, and thermocouple support
#1838Computer cooling system and method of use
#1839Solid-state transducer devices with optically-transmissive carrier substrates and related systems, methods, and devices
#18403DIC seal ring structure and methods of forming same
#1841Avalanche diode having an enhanced defect concentration level and method of making the same
#1842Capacitors with Barrier Dielectric Layers, and Methods of Formation Thereof
#1843Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects
#1844Etch damage and ESL free dual damascene metal interconnect
#1845Semiconductor device, related manufacturing method, and related electronic device
#1846Light-emitting device
#1847Vertical memory devices and methods of manufacturing the same
#1848Compact optoelectronic modules
#1849Method of fabricating field effect transistor having non-orthogonal gate electrode
#1850Nonvolatile nanotube switches and systems using same
#1851Method for measuring overlay and measuring apparatus, scanning electron microscope, and GUI
#1852Diode light source for a projector
#1853Apparatus with forward and reverse-biased light emitting diodes coupled in parallel
#1854Socket contact techniques and configurations
#1855Nonvolatile memory devices and methods forming the same
#1856Light emitting element and light emitting element array
#1857Silicon-based heat dissipation device for heat-generating devices
#1858Systems and methods for producing flat surfaces in interconnect structures
#1859Vertical hall sensor circuit comprising stress compensation circuit
#1860Configurable Vertical Integration
#1861Liquid cooling
#1862Organic silicon resin composition, white prepreg and white laminate using same
#1863Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device
#1864Semiconductor device and method for manufacturing same
#1865Crack stop barrier and method of manufacturing thereof
#1866Semiconductor structures
#1867Nanotube structure based metal damascene process
#1868Semiconductor module
#1869Semiconductor devices and methods of formation thereof
#1870Systems and methods to enhance passivation integrity
#1871Passivation structure and method of making the same
#1872Device without zero mark layer
#1873System and method for determining a cause of network congestion
#1874Method of forming conductive lines in circuits
#1875Functional panel, light-emitting panel, display panel, and sensor panel
#1876Planar cavity MEMS and related structures, methods of manufacture and design structures
#1877Cooling structure for electronic device
#1878Compact emitter for warm dimming and color tunable lamp
#1879Systems and methods for generating depth maps using a camera arrays incorporating monochrome and color cameras
#1880OPTOELECTRONIC MODULE AND A PROCESS FOR THE PRODUCTION OF AN OPTOELECTRONIC MODULE
#1881Solid-state imaging device having through electrode provided therein and electronic apparatus including the solid-state imaging device
#1882Integrated tunable filter architecture
#1883Lead frame and method of producing a chip housing
#1884Self-repair logic for stacked memory architecture
#1885Fuse element programming circuit and method
#1886Microfabricated ultrasonic transducers and related apparatus and methods
#1887Method of Joining Metal-Ceramic Substrates to Metal Bodies
#1888Containers for holding and dispensing stacks of electronic device components
#1889Synthetic skin for recording and modulating physiological activities
#1890Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects
#1891Integrated heat exchange assembly and an associated method thereof
#1892Interposers with electrically conductive features having different porosities
#1893LED package with integrated features for gas or liquid cooling
#1894Lead frame
#1895Semiconductor structure
#1896Circuit configuration and manufacturing processes for vertical transient voltage suppressor (TVS) and EMI filter
#1897Asymmetric FET
#1898Magnetic core inductors for integrated voltage regulator
#1899Stacked semiconductor chip RGBZ sensor
#1900Stacked semiconductor chip RGBZ sensor
#1901Semiconductor integrated circuit device and a method of manufacturing the same
#1902Non-volatile semiconductor memory device and manufacturing method thereof
#1903Light emitting device
#1904Semiconductor device and method fabricating the same
#1905Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method
#1906Self-aligned interconnects formed using subtractive techniques
#1907Gate tie-down enablement with inner spacer
#1908Interconnect wires including relatively low resistivity cores
#1909Titanium silicide formation in a narrow source-drain contact
#1910Conformal low temperature hermetic dielectric diffusion barriers
#1911Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same
#1912Heat transport structure and manufacturing method thereof
#1913Thermal management system for an aircraft avionics bay
#1914Liquid cooling radiation system and liquid radiator thereof
#1915Modular deformable platform
#1916Output discharge techniques for load switches
#1917LED with high thermal conductivity particles in phosphor conversion layer
#1918Wavelength converted semiconductor light emitting device
#1919Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same
#1920Semiconductor device and method for manufacturing the same
#1921Semiconductor chip including region having rectangular-shaped gate structures and first metal structures
#1922Semiconductor CIP including region having rectangular-shaped gate structures and first metal structures
#1923Memory having memory cell string and coupling components
#1924Formation method of semiconductor device with embedded capacitor
#1925Vertical nanowire transistor for input/output structure
#1926Optimizing Layout of Irregular Structures in Regular Layout Context
#1927Method and structures for heat dissipating interposers
#1928Method for producing an integrated heterojunction semiconductor device
#1929Reduced dark current photodetector with charge compensated barrier layer
#1930Method of forming a semiconductor device having a dopant in the substrate adjacent the insulator
#1931Luminescent device having light-emitting element and transistor
#1932Photosensitive imaging devices and associated methods
#1933Semiconductor Device and Method of Fabricating the Same
#1934Semiconductor device
#1935Semiconductor device substrate, semiconductor device wiring member and method for manufacturing them, and method for manufacturing semiconductor device using semiconductor device substrate
#1936Method for producing glass substrate with through glass vias and glass substrate
#1937Semiconductor device and method for designing a semiconductor device
#1938Room-temperature-bonded semiconductor device and manufacturing method of room-temperature-bonded semiconductor device
#1939Electronic apparatus cooling system
#1940Hermetic sealing lid member
#1941Semiconductor device and display device
#1942Preparation method for high-voltage LED device integrated with pattern array
#1943Semiconductor device, method for manufacturing same, and semiconductor module
#1944Integrated circuits and methods of manufacturing
#1945Power module
#1946Semiconductor constructions
#1947Electronic device for vehicle
#1948Electroluminescent light source with an adjusted or adjustable luminance parameter and method for adjusting a luminance parameter of the electroluminescent light source
#1949Double sided NMOS/PMOS structure and methods of forming the same
#1950Flexible memory system with a controller and a stack of memory
#1951Apparatus and methods for processing exfoliated graphite materials
#1952Inkjet system for printing a printed circuit board
#1953Photo-emission semiconductor device and method of manufacturing same
#1954METHOD OF PRODUCING A SEMICONDUCTOR BODY
#1955Semiconductor device and production method therefor
#1956Methods of forming platinum-containing constructions
#1957THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
#1958Semiconductor adhesive, and semiconductor device and method for manufacturing same
#1959Half-bridge power semiconductor module and method of manufacturing same
#1960Integrated circuit structure with active and passive devices in different tiers
#1961Contact structure and formation thereof
#1962Semiconductor device and fabrication method for the same
#1963Electrical fuse structure and method of formation
#1964Integrated circuit having slot via and method of forming the same
#1965Semiconductor device and method of manufacturing the same
#1966FLEXIBLE MODULAR HIERARCHICAL ADAPTIVELY CONTROLLED ELECTRONIC-SYSTEM COOLING AND ENERGY HARVESTING FOR IC CHIP PACKAGING, PRINTED CIRCUIT BOARDS, SUBSYSTEMS, CAGES, RACKS, IT ROOMS, AND DATA CENTERS USING QUANTUM AND CLASSICAL THERMOELECTRIC MATERIALS
#1967UV epoxy resin instillation molding method and application thereof
#1968Circuit board and method for manufacturing a circuit board
#1969Baluns for RF signal conversion and impedance matching
#1970Semiconductor devices, memory devices, and related methods
#1971Optoelectronic semiconductor device having a side face as mounting side
#1972Fluidic assembly top-contact LED disk
#1973Method for silicide formation
#1974Semiconductor device and electronic apparatus including a semiconductor device having bonded sensor and logic substrates
#1975Methods, structures and devices for intra-connection structures
#1976Optoelectronic semiconductor chip and method for fabrication thereof
#1977Insulated circuit board, power module and power unit
#1978Semiconductor structure with integrated passive structures
#1979Methods for Forming Ceramic Substrates with Via Studs
#1980Apparatuses and related methods for staggering power-up of a stack of semiconductor dies
#1981Temperature detection and reporting system and method in power driving and/or consuming system
#1982Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said composition
#1983Cooling trough, cooler and power module assembly
#1984COOLING SYSTEM AND COOLING METHOD FOR ELECTRONIC EQUIPMENT
#1985Light emitting diode
#1986Semiconductor device having a trench gate electrode
#1987Three-dimensional semiconductor memory devices
#1988Versatile and reliable intelligent package
#1989Heat-dissipating structure and method for manufacturing same
#1990Bonding scheme for diamond components which has low thermal barrier resistance in high power density applications
#1991Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package
#1992Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method
#1993Cooling system for a computer system
#1994Substrate for light emitting device and manufacturing method of substrate for light emitting device
#1995Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layer
#1996SAW device and method for manufacturing SAW device
#1997Device and method for controlling operation of power module composed of switches
#1998GaN circuit drivers for GaN circuit loads
#1999Light emitting device and adaptive driving beam headlamp system
#2000Light-emitting semiconductor chip
#2001Source/drain contacts for non-planar transistors
#2002Semiconductor film with adhesion layer and method for forming the same
#2003Semiconductor devices having staggered air gaps
#2004Leadframe and the method to fabricate thereof
#2005Display, LED chip therefor, pixel therefor, controlling method therefor, computer program therefor
#2006Thermal management for light-emitting diodes
#2007MEMS grid for manipulating structural parameters of MEMS devices
#2008Implantable electrode device and a method for manufacturing thereof
#2009Imaging device
#2010Transformer of the balanced-unbalanced type
#2011LED lamp heat sink
#2012Light emitting diodes with enhanced thermal sinking and associated methods of operation
#2013Optoelectronic semiconductor chip
#2014Light emitting device with improved extraction efficiency
#2015Method of forming a high electron mobility transistor
#2016Dual facing BSI image sensors with wafer level stacking
#2017Analog circuit and semiconductor device
#2018Method of forming a heterojunction semiconductor device having integrated clamping device
#2019ESD protection device
#2020Oversized Contacts and Vias in Layout Defined by Linearly Constrained Topology
#2021Arrangement of penetrating electrode interconnections
#2022Stacked semiconductor devices
#2023Through substrate vias with improved connections
#2024Heat dissipation component and method for manufacturing same
#2025Method for manufacturing semiconductor structure
#2026Structure and formation method of damascene structure
#2027Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
#2028Method for manufacturing a semiconductor device
#2029Global dielectric and barrier layer
#2030Enhancement of iso-via reliability
#2031Sub-pixel for a display with controllable viewing angle
#2032Microfabricated ultrasonic transducers and related apparatus and methods
#2033Structures, Apparatuses and Methods for Fabricating Sensors in Multi-Layer Structures
#2034Metrology method and apparatus, lithographic system, device manufacturing method and substrate
#2035Structures for radiative cooling
#2036Evaporation cooling devices and systems and methods of removing heat from hot spots
#2037Polishing system
#2038Heat dissipating structure
#2039Cooling system and electronic device
#2040Heat exchanger
#2041Heat sink assemblies for transient cooling
#2042Light-emitting dies incorporating wavelength-conversion materials and related methods
#2043Luminescent ceramic for a light emitting device
#2044Semiconductor light emitting device and method of fabricating the same
#2045Cascode semiconductor device structure and method therefor
#2046Methods for Linewidth Modification and Apparatus Implementing the Same
#2047SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#2048PACKAGE SUBSTRATE
#2049Electronic part mounting heat-dissipating substrate
#2050Semiconductor device and method for manufacturing semiconductor device
#2051Controllable integrated capacitive device
#2052Interconnect structure with porous low k dielectric and barrier layer
#2053Power-module substrate with cooler and method of producing the same
#2054Semiconductor module and conductive member for semiconductor module including cut in bent portion
#2055Metal interconnect structure
#2056Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures
#2057Heat transfer assemblies
#2058Composition for heat-dissipation members, heat-dissipation member, electronic device, and method of producing heat dissipating member
#2059Ceramic substrate, electronic component, and method of manufacturing ceramic substrate
#2060Heat dissipating structure
#2061Semiconductor device
#2062Devices, systems, and methods for ion trapping
#2063Image sensor including planar boundary between optical black and active pixel sensor areas
#2064Method of providing an imaging system and imaging system thereof
#2065Nonvolatile memory device and method for fabricating the same
#20663D semiconductor structure and device
#2067THREE DIMENSIONAL INTEGRATED CIRCUIT
#2068Heterogeneous device
#2069Semiconductor device
#2070Semiconductor device having interconnection in package and method for manufacturing the same
#2071Semiconductor structure
#2072Thermal ground plane
#2073Microelectromechanical device with signal routing through a protective cap
#2074METHODS AND APPARATUSES FOR CONFIGURING ARTIFICIAL RETINA DEVICES
#2075Thermo-electrically pumped light-emitting diodes
#2076Semiconductor device with a recessed ohmic contact and methods of fabrication
#2077High electron mobility transistors with improved heat dissipation
#2078Solid-state imaging device
#2079Semiconductor device, display device, and electronic device
#2080Electronic part mounting heat-dissipating substrate
#2081Display having vertical gate line extensions and minimized borders
#2082Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
#2083Method for producing multi-level metalization on a ceramic substrate
#2084Semiconductor apparatus, solid-state image sensing apparatus, and camera system
#2085Power managers for an integrated circuit
#2086Piezoelectric vibration component and method for manufacturing the same
#2087Piezoelectric vibration component and method for manufacturing the same
#2088Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus
#2089High-voltage solid-state transducers and associated systems and methods
#2090Via structures including etch-delay structures and semiconductor devices having via plugs
#2091Method and system for object reconstruction
#2092Monolithic three-dimensional (3D) ICs with local inter-level interconnects
#2093Schottky-CMOS asynchronous logic cells
#2094Bonding structure between semiconductor device package
#2095Lighting apparatuses and LED modules for both illumination and optical communication
#2096Cu column, Cu core column, solder joint, and through-silicon via
#2097Dual-sided die packages
#2098Sealing sheet
#2099Apparatuses for bonding semiconductor chips
#2100Heater elements with enhanced cooling