Display device with pixel including capacitor

Electronic device

Cooling apparatus having vertical flow channels

Nanostructured LED

Method of forming a composite substrate

Passivated and faceted for fin field effect transistor

Pads and pin-outs in three dimensional integrated circuits

Array substrate of organic light-emitting diodes and method for packaging the same

Optoelectronic semiconductor component and flashlight

Semiconductor devices including a capping layer

Method for layout design and structure with inter-layer vias

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Interconnect structure for semiconductor devices

Semiconductor module including a case and base board

Gate tie-down enablement with inner spacer

Method for forming self-aligned contact

Triangular routing for high speed differential pair length matching

LED lamps with improved quality of light

Curable composition, cured product, method for using curable composition, and optical device

Fixation of heat sink on SFP/XFP cage

Electronic component and manufacturing method therefor

Structures incorporating and methods of forming metal lines including carbon

Light emitting package having a guiding member guiding an optical member

LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

Sidewall passivation for HEMT devices

Semiconductor device and method for manufacturing the same

Semiconductor device having varying wiring resistance

Structure and method for FinFET SRAM

FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE

Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor sealing material

Substrate dividing method

Semiconductor device and method

Heat dissipation component for semiconductor element

METHOD FOR FORMING BASE FILM OF GRAPHENE, GRAPHENE FORMING METHOD, AND APPARATUS FOR FORMING BASE FILM OF GRAPHENE

Resin composition for semiconductor encapsulation and semiconductor device

Covering for a component and method for producing a covering for a component

Multi-layer cooling element

Top port multi-part surface mount silicon condenser microphone

Semiconductor device

Semiconductor devices with cavities

Power module having a switch module for supporting high current densities

Light-emitting structure having a plurality of light-emitting structure units

Semiconductor devices and methods of fabricating the same

Embedded nonvolatile memory and forming method thereof

PC-LED module with enhanced white rendering and conversion efficiency

Semiconductor constructions

Power and ground routing of integrated circuit devices with improved IR drop and chip performance

Semiconductor device structures

Method for manufacturing an arrangement including a chip carrier notch

Methods of forming nanostructures having low defect density

DC-DC converter assembly, method of manufacturing a DC-DC converter assembly and method of manufacturing an output inductor for a DC-DC converter assembly

Current sensor devices and methods

Integrated multi-sensor module

Information carrying card comprising a cross-linked polymer composition, and method of making the same

Lighting device and method of making lighting device

Method for producing a conductive multiple substrate stack

Semiconductor device having field plate structures, source regions and gate electrode structures between the field plate structures

METHOD FOR FABRICATING ELECTRONIC DEVICE

MAGNETIC COUPLING AND CANCELLATION ARRANGEMENT

SRAM cells with vertical gate-all-round MOSFETs

Semiconductor memory device including output buffer

Semiconductor structure and method making the same

Two step metallization formation

Doping control of metal nitride films

Integrated circuit and method of forming an integrated circuit

Method for introducing at least one cutout or aperture into a sheetlike workpiece

Stacked DRAM device and method of manufacture

System for designing integrated circuit layout and method of making the integrated circuit layout

Thermally conductive resin molded article

Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device

Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device

Curable silicone composition, curable hot-melt silicone, and optical device

Method of manufacturing heat dissipating device

Non-volatile memory with silicided bit line contacts

Semiconductor device with patterned ground shielding

Chip capacitor, circuit assembly, and electronic device

Planar heat pipe

Modular apparatuses and system for backplane connections

Support structure for integrated circuitry

Electronic device and methods of providing and using electronic device

Electronic component mounting structure

Substrate for integrated circuit package

LEDs mounted on curved lead frame

Substrate used for LED encapsulation, three-dimensional LED encapsulation, bulb comprising three-dimensional LED encapsulation and manufacturing method therefor

Method of manufacturing an intermediate product for an interposer and intermediate product for an interposer

Heat-dissipation and shielding structure and communications product

Housing for encasing a mobile computing device

Elastic wave device

Light-emitting device and manufacturing method thereof

Solid state lighting devices with improved contacts and associated methods of manufacturing

Display device

Display device with separation member including steps

Integrated circuit devices and fabrication techniques

Semiconductor module and semiconductor driving device

Aluminum-silicon carbide composite and production method therefor

Doped protection layer for contact formation

Electronic component having a connection element

Method for manufacturing passive optical components, and devices comprising the same

High-frequency component

Power module and power circuit

Antenna module and circuit module

Light emitting device

RF switch on high resistive substrate

Patterning approach for improved via landing profile

Inverter power module packaging with cold plate

Mechanically stable, thermally conductive and electrically insulating stack forming a mounting device for electronic components

Method for producing glass substrate and glass sheet

Flat heat pipe with reservoir function

Multilayer wiring board

Component built-in substrate

Organic light emitting diode display and method for manufacturing organic light emitting diode display

System and method for selected pump LEDs with multiple phosphors

Optical devices, in particular computational cameras, and methods for manufacturing the same

System and method for sub-column parallel digitizers for hybrid stacked image sensor using vertical interconnects

Semiconductor integrated circuit device

Logic cell including single layer via contact and deep via contact

Method and apparatus for back end of line semiconductor device processing

Semiconductor devices having nonlinear bitline structures

Self-aligned via and plug patterning for back end of line (BEOL) interconnects

Methods for manufacturing a thin film resistor over interconnect pads

Thermal interface material (TIM) with thermally conductive integrated release layer

Hybrid photonic and electronic integrated circuits

Cooling member for lighting and/or signaling system

Electric power conversion apparatus

Semiconductor device, and semiconductor chip having chip identification information

Methods for producing laminate and substrate for mounting a semiconductor device

Hybrid multilayer device

Opening fill process and structures formed thereby

Colour ILED display on silicon

Optical bench on substrate and method of making the same

Hybrid material for use as coating means in optoelectronic components

Void forming composition, semiconductor device provided with voids formed using composition, and method for manufacturing semiconductor device using composition

Multilayer substrate

Semiconductor device and manufacturing method of semiconductor device

Light emitting diodes and reflector

Copper contact plugs with barrier layers

Methods and apparatuses to form self-aligned caps

Switching system and method

Semiconductor device and multiphase semiconductor device

Light-emitting diode and application therefor

Semiconductor system, device and structure

Semiconductor device and method for manufacturing the same

Wafer marking method

Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure

Heat spreader and method for manufacturing the same

Thermally conductive sheet

Fluid heat exchanger

Substrate for use in manufacturing display device and method for forming element on substrate

Circuit board, display device, and process for production of circuit board

Memory device and memory cell

Self aligned active trench contact

Semiconductor device

Power device cassette with auxiliary emitter contact

Illumination devices, and methods of fabricating same

System, structure, and method of manufacturing a semiconductor substrate stack

MIMCAP structure in a semiconductor device package

Semiconductor structure and method making the same

Heat-dissipating sheet having high thermal conductivity and its production method

Gas cushion apparatus and techniques for substrate coating

Semiconductor image sensor module and method of manufacturing the same

Display device with defective pixel correction

Glass interposer integrated high quality electronic components and systems

Method of marking a semiconductor package

Method of forming metal interconnection

LED lamp filament

Package, light-emitting device, and method for manufacturing the same

Optical systems fabricated by printing-based assembly

Light-emitting diode and method for manufacturing the same

Optical systems fabricated by printing-based assembly

Optical systems fabricated by printing-based assembly

Method and structures for via substrate repair and assembly

Method for low temperature bonding of wafers

Multilevel via placement with improved yield in dual damascene interconnection

Display device and electronic device

Enhanced boiling with selective placement of nucleation sites

CTE-matched heat pipe

Plating apparatus

Method for cooling a component of a motor vehicle, cooling device, and motor vehicle

Semiconductor device

Semiconductor Device

Semiconductor chip including integrated circuit having cross-coupled transistor configuration and method for manufacturing the same

Integrated circuit having spare circuit cells

Photolithography alignment mark structures and semiconductor structures

Gate tie-down enablement with inner spacer

FinFET low resistivity contact formation method

MEMS grid for manipulating structural parameters of MEMS devices

Boundary scan chain for stacked memory

Thermosiphon with integrated components

Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates

Active rectifier for alternator

Light-emitting device having an insulating layer of projections and depressions

Light emitting device with nanostructured phosphor

LED based device with wide color gamut

Light emitting device and lighting system having the same

Interconnect structure and method of forming same

Metal line structure and method

MOS antifuse with void-accelerated breakdown

Substrate structures and methods of manufacture

Phase changing on-chip thermal heat sink

Electronic device component with an integral diamond heat spreader

Gate tie-down enablement with inner spacer

Semiconductor devices with back surface isolation

Marking method for wafer dice

Sealing composition and method of manufacturing semiconductor device

Light emitting device

Method and apparatus for producing large, single-crystals of aluminum nitride

Hybrid felts of electrospun nanofibers

Light emitting diode (LED) components including multiple LED dies that are attached to lead frames

IE type trench gate IGBT

Interconnect structure and methods of making same

Voltage droop mitigation in 3D chip system

Sensor module and method of manufacturing the same

Ceramic substrate and its manufacturing method, power module

Hermetically sealed MEMS device and its fabrication

Controller for an electric heating device and method for producing same

Flexible-to-rigid tubing

Semiconductor device having impedance calibration function to data output buffer and semiconductor module having the same

Vertical solid-state transducers having backside terminals and associated systems and methods

Light emitting diode chip

Solid-state image sensor electronic device

Light emitting device reflective bank structure

Interconnect structure for semiconductor devices

Decoupling capacitors and arrangements

Ground via clustering for crosstalk mitigation

Low-K dielectric layer and porogen

Semiconductor structures having low resistance paths throughout a wafer

Flexible-to-rigid tubing

Flexible-to-rigid tubing

Circuit board

Radio-frequency (RF) component

Method of forming stacked trench contacts and structures formed thereby

Systems and methods for coupling a semiconductor device of an automation device to a heat sink

Heat diffusion sheet

Compact vertical inductors extending in vertical planes

Method for manufacturing display device including a wiring layer of a molybdenum-based material

Efficient lighting system with wide color range

Solid state lamp using light emitting strips

Thermal interface material with ion scavenger

Nickel particle composition, bonding material, and bonding method in which said material is used

Method for manufacturing electronic device, and electronic device

Semiconductor apparatus, solid-state image sensing apparatus, and camera system having via holes between substrates

Integration of a replica circuit and a transformer above a dielectric substrate

Composite component and front-end module

Light emitting device package and lighting system including the same

Method for separating regions of a semiconductor layer

Capacitor and method for making same

Circuit substrate, image sensor, and electronic apparatus

Method for producing one-time-programmable memory cells and corresponding integrated circuit

Chemical direct pattern plating method

Semiconductor package and fabricating method thereof

Semiconductor chip

Resonance circuit complex electronic component and resonance circuit device

Light emitting device and light emitting device package

Semiconductor device having metallic source and drain regions

Electrostatic discharge protection device for differential signal devices

Method for integrating a light emitting device

Solid state transducers with state detection, and associated systems and methods

Electronic module including a device for dissipating heat generated by a semiconductor unit situated in a plastic housing and method for manufacturing an electronic module

Phase-change cooler and phase-change cooling method

Semiconductor device

Layout optimization of a main pattern and a cut pattern

Lighting device

Heat generation point detection method and heat generation point detection device

LED module having planar sectors for emitting different light spectra

Epoxy resin molding material for sealing and electronic component device

Planar cavity MEMS and related structures, methods of manufacture and design structures

Light-emitting device

Ohmic contacts for semiconductor structures

Nonvolatile memory devices having single-layered gates and methods of fabricating the same

System and method for gas-phase passivation of a semiconductor surface

Conductive structures, systems and devices including conductive structures and related methods

Aluminium-silicon carbide composite, and power-module base plate

Power conversion apparatus

Device for switching a semiconductor-based switch and sensor for detecting a current change velocity at a semiconductor-based switch

Wafer-level light emitting diode package and method of fabricating the same

Semiconductor device and method of manufacturing the same

Method for designing vehicle controller-only semiconductor based on die and vehicle controller-only semiconductor by the same

Noise shielding techniques for ultra low current measurements in biochemical applications

Mounting substrate and electronic apparatus

Contact structure of gate structure

3D antenna for integrated circuits

Three-dimensional memory structure having a back gate electrode

Semiconductor device attached to an exposed pad

Interconnection structure and manufacturing method thereof

Heat dissipation assembly and electronic device

Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer

Integrated circuit with conductive line having line-ends

Device sandwich structured composite housing

Method and system for ion beam delayering of a sample and control thereof

Microelectronic interconnect element with decreased conductor spacing

Metal cap assembly for optical communications

Network of electronic devices assembled on a flexible support and communication method

Conductive spline for metal gates

Method and system for ion beam delayering of a sample and control thereof

MEMS grid for manipulating structural parameters of MEMS devices

Wafer-level manufacture of devices, in particular of optical devices

Method for the electrical passivation of electrode arrays and/or conductive paths in general, and a method for producing stretchable electrode arrays and/or stretchable conductive paths in general

Light-emitting device

Light-emitting device and method for manufacturing the same

LED with remote phosphor and shell reflector