Applying trenched transient voltage suppressor (TVS) technology for distributed low pass filters

LED illumination device

Device and method for hermetically sealing a cavity in an electronic component

Liquid resin composition, semi-conductor device, and process of fabricating the same

Method for fabricating a metal interconnection using a dual damascene process and resulting semiconductor device

RF power transistor package

Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode

Die stacking with an annular via having a recessed socket

Method for the production of a component structure

Air gap in integrated circuit inductor fabrication

Circuit protection device including resistor and fuse element

Electrical fuse structure and method

Semiconductor device

Interconnection system on a plane adjacent to a solid-state device structure

Insulated gate semiconductor device

Trig modulation electrostatic discharge (ESD) protection devices

Semiconductor device and method for manufacturing the same

LED chip package structure using a substrate as a lampshade and method for making the same

Optoelectronic component

DIAMOND SEMICONDUCTOR ELEMENT AND PROCESS FOR PRODUCING THE SAME

High-density nonvolatile memory

Test pads coupled with leads unconnected with die pads

High-stability microencapsulated hardened for epoxy resin and epoxy resin composition

Securities, chip mounting product, and manufacturing method thereof

MICRO-ELECTROMECHANICAL SYSTEM

POLYCRYSTALLINE, MAGNETIC CERAMIC MATERIAL, MICROWAVE MAGNETIC DEVICE, AND NON-RECIPROCAL CIRCUIT DEVICE COMPRISING SUCH MICROWAVE MAGNETIC DEVICE

Passive cooling in response to ambient environmental properties

Long-acting heat pipe and corresponding manufacturing method

METAL TUBES FOR HEAT PIPES AND METHOD OF MANUFACTURING THE SAME

HEAT PLATE WITH CAPILLARY SUPPORTING STRUCTURE AND MANUFACTURING METHOD THEREOF

Boil Cooling Method, Boil Cooling Apparatus, Flow Channel Structure and Applied Product Thereof

HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE

Low profile heat sink for semiconductor devices

Case and rack system for liquid submersion cooling of electronic devices connected in an array

Metal-gate thermocouple

Addition-curable silicone composition and cured product thereof

Semiconductor device fabrication method

Semiconductor array and method for manufacturing a semiconductor array

Method for forming doped polysilicon via connecting polysilicon layers

Method of detecting heavy metal in semiconductor substrate

Cladding material and its manufacturing method, press-forming method, and heat sink using cladding material

GRADED COMPOSITION ENCAPSULATION THIN FILM COMPRISING ANCHORING LAYER AND METHOD OF FABRICATING THE SAME

Fastener

Semiconductor device, and energy transmission device using the same

Light emitting device and display device using same

Heat sink assembly

Heat dissipating device

Transient voltage protection device, material, and manufacturing methods

Image processing apparatus having card reader for applying effects stored on a card to a stored image

MAGNETIC FIELD GUARD RINGS

Antifuse and methods of operating and manufacturing the same

GaN-based semiconductor light-emitting element, light-emitting element assembly, light-emitting apparatus, method of driving GaN-based semiconductor light-emitting element, and image display apparatus

LED illuminating device and light engine thereof

Semiconductor integrated circuit device

Semiconductor structure and method of making the same

Structure and method for hybrid tungsten copper metal contact

Semiconductor devices including porous insulators

Semiconductor device and manufacturing method thereof

Semiconductor chip with integrated via

Electronic device packages and methods of formation

Configuration terminal for integrated devices and method for configuring an integrated device

Semiconductor including cup-shaped leadframe packaging techniques

LOW K INTERCONNECT DIELECTRIC USING SURFACE TRANSFORMATION

MEMS-topped integrated circuit with a stress relief layer

Semiconductor device

Semiconductor device with multi-trench separation region

Method of fabricating back-illuminated imaging sensors using a bump bonding technique

CARBON NANOTUBE MEMORY CELLS HAVING FLAT BOTTOM ELECTRODE CONTACT SURFACE

Wafer level CSP sensor

Gated beta-molybdenum oxide sensor

Continuous plating system and method with mask registration

Method for monitoring patterning integrity of etched openings and forming conductive structures with the openings

Suspension Board with Circuit and Production Method Thereof

High Thermal Conductivity Heat Sinks With Z-Axis Inserts

PROTECTIVE CAP FOR THERMAL GREASE OF HEAT SINK

HEAT DISSIPATION MODULE

Radiating fin

Protective device for protecting thermal interface material and fasteners of heat dissipation device

Lead cutter and method of cutting lead

RESIN COMPOSITION AND USE OF THE SAME

Printed circuit board

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape

Semiconductor device, its manufacturing method, and sputtering target material for use in the method

Methods of fabricating camera modules including aligning lenses on transparent substrates with image sensor chips

Etching process state judgment method and system therefor

Crystal unit

Alumina substrate and method of making an alumina substrate

Substrate structure and method of forming the same

Methods, objects and apparatus employing machine readable data

Lighting device, automotive headlights and method for producing a lighting device

Light emitting diode lamp

Printed circuit board

Power supply architecture for structural ASIC

Heatsink for heat-producing device

Method for integrating heat transfer members, and an LED device

Mounting device for mounting heat sink onto electronic component

SYSTEM INCLUDING AN ELECTRONIC MODULE WITH A HEAT SPREADER

Processor for image capture and printing

Apparatus and method for semiconductor wafer alignment

Liquid crystal display device

Organic light emitting display device

Semiconductor device

Multi-level anti-fuse and methods of operating and fabricating the same

Device for protecting an integrated circuit against a laser attack

Inverted magnetic isolator

Epoxy resin curing agent produced by heating anhydride and polyester in presence of hydrogen and hydrogenation catalyst

Corrosion resistant via connections in semiconductor substrates and methods of making same

Configurable non-volatile logic structure for characterizing an integrated circuit device

METAL LINE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Surface treatment for selective metal cap applications

Integrated circuit system having different-size solder bumps and different-size bonding pads

Semiconductor package having thermal stress canceller member

Heat dissipation for integrated circuit

Semiconductor device

Fuse part of semiconductor device and method of fabricating the same

Semiconductor device having an annular guard ring

Semiconductor memory device and method of manufacturing the same

Method of manufacturing semiconductor device having contact plugs

Low VT antifuse device

ELECTRICAL SURGE PROTECTIVE APPARATUS

Semiconductor light emitting devices including multiple semiconductor light emitting elements in a substrate cavity

Method for detecting a void

WIRELESS REMOTE-CONTROL COOLER ASSEMBLY FOR MOTHERBOARD

Methods of Forming Dual-Damascene Metal Wiring Patterns for Integrated Circuit Devices and Wiring Patterns Formed Thereby

Inductor with patterned ground plane

High density circuit board and manufacturing method thereof

Heat sink and cooler

METHOD OF MAKING HEAT SINK

Epoxy Resin Molding Material for Sealing, and Electronic Component Device

Contact structure and forming method thereof and connecting structure thereof

METHOD OF FORMING A COBALT METAL NITRIDE BARRIER FILM

Method of forming shielded gate FET with self-aligned features

Method for making a light-emitting microelectronic device with semi-conducting nanowires formed on a metal substrate

LED chip package structure and method for manufacturing the same

Sensor, method, and design structure for a low-k delamination sensor

Mark forming method and method for manufacturing semiconductor device

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL STACKED OPTICAL DEVICE

THREE-DIMENSIONAL STACKED OPTICAL DEVICE

Active solid heatsink device and fabricating method thereof

Conforming, electro-magnetic interference reducing cover for circuit components

Mounting device for mounting heat sink onto electronic component

Heat radiator

Mounting device for mounting heat sink onto electronic component

Heat dissipation device

Electronic device, cooling device and loop heat pipe

Heat-dissipating module

Cooling device and electronic apparatus having the cooling device

Electronic device

Light emitting device, illuminating apparatus having the same, and liquid crystal display apparatus

Digital camera with card reader for reading program script

Electrical fuse devices and methods of operating the same

Inductor having opening enclosed within conductive line and related method

Radio frequency noise and interference suppression in an integrated circuit

Semiconductor device

Manufacturing method of a semiconductor device, a semiconductor wafer, and a test method

Backlight unit

Light-emitting device

Light emitting diode package for projection system

White light emitting diode package for incandescent color

Semiconductor device using a plurality of high-potential-side reference voltages

Increasing exposure tool alignment signal strength for a ferroelectric capacitor layer

Alignment mark for opaque layer

SEMICONDUCTOR INTEGRATED CIRCUIT AND LAYOUT METHOD FOR THE SAME

Semiconductor element and semiconductor element fabrication method

Semiconductor integrated circuit

Reducing patterning variability of trenches in metallization layer stacks with a low-k material by reducing contamination of trench dielectrics

Semiconductor device and method of manufacturing the same

Semiconductor structure

Copper interconnection structure, barrier layer including carbon and hydrogen

Voltage controlled oscillator

Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices

Control of localized air gap formation in an interconnect stack

STRUCTURES AND METHODS TO ENHANCE COPPER METALLIZATION

Forming thick metal interconnect structures for integrated circuits

Method of aligning deposited nanotubes onto an etched feature using a spacer

Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate

Underbump metallurgy for enhanced electromigration resistance

Multiple Layer Metal Integrated Circuits and Method for Fabricating Same

Flip chip interconnection structure with bump on partial pad and method thereof

Semiconductor through silicon vias of variable size and method of formation

Structure for reduction of soft error rates in integrated circuits

Electronic device with shielding structure and method of manufacturing the same

Semiconductor device with an interconnect element and method for manufacture

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

Through hole vias at saw streets including protrusions or recesses for interconnection

Semiconductor wafer, semiconductor device, and method of manufacturing semiconductor device

Micro-heater arrays and pn-junction devices having micro-heater arrays, and methods for fabricating the same

Semiconductor devices and methods of manufacture thereof

Semiconductor device

Fuse part in semiconductor device and method for forming the same

ELECTRICAL FUSE STRUCTURE

Semiconductor integrated circuit device and a method of manufacturing the same

ELECTROMAGNETIC INTERFERENCE SHIELD STRUCTURES FOR SEMICONDUCTOR COMPONENTS

ESD protection device and manufacturing method thereof

HIGH FREQUENCY SEMICONDUCTOR CIRCUIT DEVICE

Termination structure for power devices

Nonvolatile semiconductor memory device including pillars buried inside through holes

Semiconductor device and fabrication method for the semiconductor device

SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SEMICONDUCTOR DEVICE

Monolithically integrated photodetectors

Package for optical semiconductor element

Side view LED package and back light module comprising the same

Multifunctional tape

Method of controlling stress in gallium nitride films deposited on substrates

Thin-film semiconductor device and method for manufacturing the same

VOLTAGE SWITCHABLE DIELECTRIC MATERIALS WITH LOW BAND GAP POLYMER BINDER OR COMPOSITE

Multi-layer/multi-input/multi-output (MLMIMO) models and method for using

System and method of forming a low profile conformal shield

Electronic device package with connection terminals including uneven contact surfaces

Method for fabricating package substrate and die spacer layers having a ceramic backbone

Process for preparing a heatsink system and heatsink system obtainable by said process

Vapor vortex heat sink

Cooling Fins for a Heat Pipe

Heat sink assembly and method for manufacturing the same

Cooling member

System and method for wireless and dynamic intra-process measurement of integrated circuit parameters

MOS capacitance test structure and associated method for measuring a curve of capacitance as a function of the voltage

Air diverter for directing air upwardly in an equipment enclosure

Layout of power semiconductor contacts on a cooling surface

Semiconductor device and method for manufacturing the same

Method for fabricating semiconductor device with interface barrier

Dual damascene process

Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby

Methods of forming an antifuse and a conductive interconnect, and methods of forming DRAM circuitry

Method of forming a transistor gate of a recessed access device, method of forming a recessed transistor gate and a non-recessed transistor gate, and method of fabricating an integrated circuit

Method of forming an interconnect on a semiconductor substrate

Semiconductor device and peeling off method and method of manufacturing semiconductor device

Integrated circuit chip design flow methodology including insertion of on-chip or scribe line wireless process monitoring and feedback circuitry

Method and structure of integrated rhodium contacts with copper interconnects

Method of protecting semiconductor chips from mechanical and ESD damage during handling

Magnetically de-coupling magnetic memory cells and bit/word lines for reducing bit selection errors

One-time programmable memory cell

Semiconductor memory devices with interface chips having memory chips stacked thereon

LED illuminating device and light engine thereof

LED illumination device and light engine thereof

Heat sink arrangement for electrical apparatus

Electronic device

Electrical assembly and fastening assembly thereof

Heat sink assembly having a clip

Electromagnetically-actuated micropump for liquid metal alloy

Heat sink and heat dissipation device having the same

ELECTRONIC DEVICE HAVING A HEAT DISSIPATING MECHANISM

Lithographic apparatus and method

Dual display module and display apparatus having the same

Transducer for high-frequency antenna coupling and related apparatus and method

Image sensor monitor structure in scribe area

SEMICONDUCTOR MODULE

Multi-layered metal interconnection

Semiconductor device having a multilevel interconnect structure and method for fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME

Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding

Semiconductor device with cross-talk isolation using M-cap and method thereof

INTEGRATED PASSIVE DEVICE AND METHOD WITH LOW COST SUBSTRATE

SEMICONDUCTOR DEVICE HAVING FUSE PATTERN AND METHODS OF FABRICATING THE SAME

Fuse of semiconductor device and method for forming the same

Isolation structures for integrated circuits

LAYER STACK INCLUDING A TUNGSTEN LAYER

Sensor device and production method therefor

Integrated circuitry

Tantalum lanthanide oxynitride films

Embedded memory device and a manufacturing method thereof

Semiconductor device

Stacked bit line dual word line nonvolatile memory

Semiconductor constructions

Power and ground routing of integrated circuit devices with improved IR drop and chip performance

Light emitting diodes with light filters

Light emitting diode with side electrodes

Method of making silicon carbide semiconductor device having multi-layered passivation film with uneven surfaces

PROCESS FOR FORMING A WIRING FILM, A TRANSISTOR, AND AN ELECTRONIC DEVICE

Nanowire-based device having isolated electrode pair

Analysis apparatus and analysis method for semiconductor device

Photo-sensing device, photosensor, and display device

Removal of surface oxides by electron attachment

Multilayer wiring substrate with a reinforcing layer for preventing a warp

Heat Exchanger for Small Components

HEAT-DISSIPATING DEVICE

HEAT DISSIPATION DEVICE

Heat dissipation device

Heat dissipation assembly with stretchable fasteners

Method of bonding carbon nanotubes

ENCAPSULATION COMPOSITION FOR PRESSURE SIGNAL TRANSMISSION AND SENSOR

Diagnostic method for root-cause analysis of FET performance variation

Frit sealing system and method of manufacturing organic light emitting display device

Semiconductor integrated circuit device and a method of manufacturing the same

Method for fabricating semiconductor device

Wafer level IC assembly method

Deposition and selective removal of conducting helplayer for nanostructure processing

Self-encapsulated silver alloys for interconnects

Pattern matching processing system and computer readable medium

Locking device for reliably securing a temperature sensor on a heat sink

Semiconductor device and method comprising a high voltage reset driver and an isolated memory array

Multi-chip package

Light-emitting-diode backlight device

Method of forming a permanent carrier and spacer wafer for wafer level optics and associated structure

DEVICE, IN PARTICULAR INTELLIGENT POWER MODULE WITH PLANAR CONNECTION

Protective cap for thermal grease

Cooling facility for cooling a component

Electric power conversion apparatus

Electrostatic discharge (ESD) device and method of fabricating