ClassID:

212006

H01L2924/0002 - page 71 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and

Recent Application in this class:
#21001
20090289369
2009-11-26

Memory device peripheral interconnects and method of manufacturing

#21002
20090289368
2009-11-26

Interconnect structure having enhanced electromigration reliability and a method of fabricating same

#21003
20090289367
2009-11-26

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#21004
20090289366
2009-11-26

Semiconductor device and manufacturing method of semiconductor device

#21005
20090289365
2009-11-26

Structure and process for conductive contact integration

#21006
20090289364
2009-11-26

Semiconductor device and a method for manufacturing the same

#21007
20090289363
2009-11-26

Fine-Pitch Ball Grid Array Package Design

#21008
20090289355
2009-11-26

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE

#21009
20090289337
2009-11-26

Lead Frame

#21010
20090289331
2009-11-26

Semiconductor chip and semiconductor device, and method of manufacturing the same

#21011
20090289330
2009-11-26

Group III nitride semiconductor substrate, substrate for group III nitride semiconductor device, and methods of making same

#21012
20090289325
2009-11-26

Semiconductor device with crack prevention ring

#21013
20090289321
2009-11-26

Thermal sensing and reset protection for an integrated circuit chip

#21014
20090289306
2009-11-26

Lateral oxidation with high-K dielectric liner

#21015
20090289281
2009-11-26

Semiconductor device and method for fabricating semiconductor device

#21016
20090289273
2009-11-26

Light emitting device package structure and fabricating method thereof

#21017
20090289272
2009-11-26

Light emitting device package including a semiconductor substrate having at least one surface

#21018
20090289267
2009-11-26

Solid state LED bridge rectifier light engine

#21019
20090289253
2009-11-26

Semiconductor wafer and method of forming sacrificial bump pad for wafer probing during wafer sort test

#21020
20090289170
2009-11-26

Radiation detection apparatus and radiation detection system having a light source located to reduce dark current

#21021
20090288870
2009-11-26

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#21022
20090288869
2009-11-26

Curvilinear wiring structure to reduce areas of high field density in an integrated circuit

#21023
20090288867
2009-11-26

CIRCUIT STRUCTURE AND PHOTOMASK FOR DEFINING THE SAME

#21024
20090288862
2009-11-26

Wired circuit board and producing method thereof

#21025
20090288810
2009-11-26

Heat Radiating Fin

#21026
20090288808
2009-11-26

Quick temperature-equlizing heat-dissipating device

#21027
20090288807
2009-11-26

Blowerless heat exchanger based on micro-jet entrainment

#21028
20090288806
2009-11-26

Heat radiating unit

#21029
20090288804
2009-11-26

Heat sink for chips

#21030
20090288803
2009-11-26

Heat sink for chips

#21031
20090288802
2009-11-26

Heat sink for chips

#21032
20090288425
2009-11-26

Mitigating heat in an integrated circuit

#21033
20090287440
2009-11-19

Systems and methods for detecting defects on a wafer and generating inspection results for the wafer

#21034
20090286951
2009-11-19

LOW-CORROSION EPOXY RESINS AND PRODUCTION METHODS THEREFOR

#21035
20090286930
2009-11-19

Liquid resin composition for electronic components and electronic component device

#21036
20090286396
2009-11-19

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A STEPPED THROUGH-HOLE

#21037
20090286395
2009-11-19

Butted source contact and well strap

#21038
20090286394
2009-11-19

Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections

#21039
20090286386
2009-11-19

Method of manufacturing thin film transistor substrate

#21040
20090284929
2009-11-19

HEAT DISSIPATION ASSEMBLY

#21041
20090284928
2009-11-19

Enhancing the cooling of dual in-line memory modules

#21042
20090284927
2009-11-19

Heat sink and method of manufacturing the same

#21043
20090284926
2009-11-19

Two-phase cooling circuit

#21044
20090284922
2009-11-19

High-power thyristor module having cooling effect

#21045
20090284920
2009-11-19

Combination heat sink

#21046
20090284888
2009-11-19

DC and RF pass broadband surge suppressor

#21047
20090284881
2009-11-19

Package level ESD protection and method therefor

#21048
20090284349
2009-11-19

Method for Tamperproof Identification of Individual Electronic Sub-Assemblies

#21049
20090284267
2009-11-19

Connecting analog response to separate strobed comparator input on IC

#21050
20090284213
2009-11-19

POWER MODULE LAYOUT FOR AUTOMOTIVE POWER CONVERTERS

#21051
20090284158
2009-11-19

ORGANIC LIGHT EMITTING DEVICE BASED LIGHTING FOR LOW COST, FLEXIBLE LARGE AREA SIGNAGE

#21052
20090284079
2009-11-19

Apparatus and method for controlling the motor power

#21053
20090283921
2009-11-19

Contact layout structure

#21054
20090283917
2009-11-19

SYSTEMS AND METHODS FOR VERTICAL STACKED SEMICONDUCTOR DEVICES

#21055
20090283916
2009-11-19

CHIP STRUCTURE AND METHOD OF REWORKING CHIP

#21056
20090283915
2009-11-19

Oversized contacts and vias in layout defined by linearly constrained topology

#21057
20090283913
2009-11-19

Semiconductor device and method for fabricating semiconductor device

#21058
20090283912
2009-11-19

DAMASCENE WIRING FABRICATION METHODS INCORPORATING DIELECTRIC CAP ETCH PROCESS WITH HARD MASK RETENTION

#21059
20090283910
2009-11-19

Semiconductor device and fabrication method thereof

#21060
20090283909
2009-11-19

Semiconductor device and manufacturing method thereof

#21061
20090283908
2009-11-19

Metal line of semiconductor device and method for forming the same

#21062
20090283907
2009-11-19

Low-resistance interconnects and methods of making same

#21063
20090283901
2009-11-19

Semiconductor device and multilayer wiring board

#21064
20090283892
2009-11-19

Design method of semiconductor package substrate to cancel a reflected wave

#21065
20090283871
2009-11-19

System, structure, and method of manufacturing a semiconductor substrate stack

#21066
20090283869
2009-11-19

Scribe line structure for wafer dicing and method of making the same

#21067
20090283858
2009-11-19

Scalable integrated circuit high density capacitors

#21068
20090283857
2009-11-19

Method of manufacturing M-I-M capacitor of semiconductor device

#21069
20090283855
2009-11-19

SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME

#21070
20090283853
2009-11-19

Programmable devices and methods of manufacture thereof

#21071
20090283840
2009-11-19

Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor

#21072
20090283837
2009-11-19

Semiconductor devices with active regions of different heights

#21073
20090283834
2009-11-19

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#21074
20090283833
2009-11-19

Integrated circuits having a contact structure having an elongate structure and methods for manufacturing the same

#21075
20090283814
2009-11-19

SINGLE-POLY NON-VOLATILE MEMORY CELL

#21076
20090283806
2009-11-19

MOSFET with asymmetrical extension implant

#21077
20090283799
2009-11-19

Reduced free-charge carrier lifetime device

#21078
20090283787
2009-11-19

Semiconductor light emitting diodes having reflective structures and methods of fabricating same

#21079
20090283777
2009-11-19

Multifaced microdevice system array

#21080
20090283774
2009-11-19

Organic light emitting display and method for making the same

#21081
20090283765
2009-11-19

Semiconductor unit

#21082
20090283764
2009-11-19

TEG pattern for detecting void in device isolation layer and method of forming the same

#21083
20090283762
2009-11-19

Semiconductor device and manufacturing method of the same

#21084
20090283748
2009-11-19

Semiconductor for use in harsh environments

#21085
20090283719
2009-11-19

Thermosetting composition

#21086
20090283499
2009-11-19

Fabrication of semiconductor interconnect structure

#21087
20090283497
2009-11-19

Method of manufacturing wiring substrate

#21088
20090283309
2009-11-19

Ceramic metal composite and semiconductor device using the same

#21089
20090283307
2009-11-19

Silicon nitride substrate, silicon nitride circuit board utilizing the same, and use thereof

#21090
20090283248
2009-11-19

Temperature Managing For Electronic Components

#21091
20090283246
2009-11-19

Cooling fin structure and heat-dissipating module thereof

#21092
20090283244
2009-11-19

Stacked and redundant chip coolers

#21093
20090283243
2009-11-19

HEAT DISSIPATION DEVICE

#21094
20090283196
2009-11-19

Multilayered polymeric structure

#21095
20090283028
2009-11-19

Nitride semiconductor heterostructures and related methods

#21096
20090282852
2009-11-19

Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics

#21097
20090282382
2009-11-12

System and method for routing connections with improved interconnect thickness

#21098
20090281745
2009-11-12

Monitoring plasma induced damage during semiconductor wafer processes

#21099
20090281225
2009-11-12

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME

#21100
20090280653
2009-11-12

Method for forming low dielectric constant fluorine-doped layers

#21101
20090280646
2009-11-12

Manufacturing method for micro-transformers

#21102
20090280643
2009-11-12

Optimal tungsten through wafer via and process of fabricating same

#21103
20090280642
2009-11-12

Semiconductor device having multiple wiring layers and method of producing the same

#21104
20090280641
2009-11-12

Method of forming a contact structure

#21105
20090280636
2009-11-12

Methods of fabricating interconnect structures containing various capping materials for electrical fuse and other related applications

#21106
20090280595
2009-11-12

Process for assembling wafers by means of molecular adhesion

#21107
20090280588
2009-11-12

METHOD OF FORMING AN ELECTRONIC DEVICE INCLUDING REMOVING A DIFFERENTIAL ETCH LAYER

#21108
20090280401
2009-11-12

Battery pack

#21109
20090280351
2009-11-12

Aluminum-silicon carbide composite and heat dissipation device employing the same

#21110
20090280332
2009-11-12

Adhesive composition

#21111
20090279571
2009-11-12

Diversity proximity communication

#21112
20090279301
2009-11-12

Electronic device and heat dissipation unit thereof

#21113
20090279276
2009-11-12

Electronic component

#21114
20090279266
2009-11-12

Load driving semiconductor apparatus

#21115
20090279265
2009-11-12

ELECTRONIC DEVICE MOUNTING APPARATUS AND RESONANCE SUPPRESSION METHOD THEREOF

#21116
20090279264
2009-11-12

Electronic device and heat dissipation unit thereof

#21117
20090279263
2009-11-12

Securing device for assembling heat dissipation module onto electronic component

#21118
20090279262
2009-11-12

HEAT DISSIPATING STRUCTURE

#21119
20090279259
2009-11-12

System and method for proportional cooling with liquid metal

#21120
20090279257
2009-11-12

System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling

#21121
20090279256
2009-11-12

Heat-dissipating structure

#21122
20090279243
2009-11-12

Memory module with vertically accessed interposer assemblies

#21123
20090278570
2009-11-12

Circuit configurations having four terminal JFET devices

#21124
20090278455
2009-11-12

Methods and materials for the reduction and control of moisture and oxygen in OLED devices

#21125
20090278452
2009-11-12

Double-sided emission type organic light emitting diode display

#21126
20090278404
2009-11-12

Circuit arrangement and system for use in a motor vehicle

#21127
20090278277
2009-11-12

Multilayer films for package applications and method for making same

#21128
20090278261
2009-11-12

Semiconductor device including interconnects, vias connecting the interconnects and greater thickness of the liner film adjacent the vias

#21129
20090278260
2009-11-12

Redundancy design with electro-migration immunity

#21130
20090278259
2009-11-12

Semiconductor device and method for manufacturing semiconductor device

#21131
20090278258
2009-11-12

Interconnect structure with a mushroom-shaped oxide capping layer and method for fabricating same

#21132
20090278254
2009-11-12

Dielectric materials and methods for integrated circuit applications

#21133
20090278252
2009-11-12

Semiconductor device and method for manufacturing semiconductor device

#21134
20090278244
2009-11-12

IC device having low resistance TSV comprising ground connection

#21135
20090278240
2009-11-12

Semiconductor apparatus

#21136
20090278238
2009-11-12

TSVS having chemically exposed TSV tips for integrated circuit devices

#21137
20090278237
2009-11-12

Through substrate via including variable sidewall profile

#21138
20090278236
2009-11-12

Semiconductor device, wafer structure and method for fabricating semiconductor device

#21139
20090278233
2009-11-12

BONDED INTERMEDIATE SUBSTRATE AND METHOD OF MAKING SAME

#21140
20090278230
2009-11-12

Semiconductor device and method of manufacturing the same

#21141
20090278229
2009-11-12

Efficient interconnect structure for electrical fuse applications

#21142
20090278228
2009-11-12

Structure for interconnect structure containing various capping materials for electrical fuse and other related applications

#21143
20090278225
2009-11-12

Semiconductor device and method for isolating the same

#21144
20090278219
2009-11-12

Microelectronic devices having an EMI shield and associated systems and methods

#21145
20090278207
2009-11-12

Electrical contact structure having multiple metal interconnect levels staggering one another

#21146
20090278199
2009-11-12

Trench MOSFET with an ONO insulating layer sandwiched between an ESD protection module atop and a semiconductor substrate

#21147
20090278190
2009-11-12

Nonvolatile semiconductor memory

#21148
20090278178
2009-11-12

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

#21149
20090278173
2009-11-12

Memory device interconnects and method of manufacturing

#21150
20090278150
2009-11-12

Method for forming metal electrode, method for manufacturing semiconductor light emitting elements and nitride based compound semiconductor light emitting elements

#21151
20090278143
2009-11-12

Semiconductor light emitting device

#21152
20090278124
2009-11-12

SCRIBE BASED BOND PADS FOR INTEGRATED CIRCUITS

#21153
20090278034
2009-11-12

LED-based light module package including a ceramic layer and a light sensor

#21154
20090277897
2009-11-12

Nanostructure-based heating devices and methods of use

#21155
20090277872
2009-11-12

Plasma etching method capable of detecting end point and plasma etching device therefor

#21156
20090277866
2009-11-12

Method of enabling solder deposition on a substrate and electronic package formed thereby

#21157
20090277684
2009-11-12

Mounting structure and method for mounting electronic component onto circuit board

#21158
20090277617
2009-11-12

Liquid cooling system with automatic pump speed control

#21159
20090277616
2009-11-12

Method and apparatus of water cooling several parallel circuit cards each containing several chip packages

#21160
20090277615
2009-11-12

HEAT DISSIPATION DEVICE

#21161
20090277614
2009-11-12

HEAT DISSIPATING DEVICE AND HEAT CONDUCTION STRUCTURE THEREOF

#21162
20090277613
2009-11-12

Geometrically reoriented low-profile phase plane heat pipes

#21163
20090277607
2009-11-12

Heat sink memory chip

#21164
20090277004
2009-11-12

TRANSFER PRODUCT, TRANSFER PRODUCT FABRICATION METHOD, AND TRANSFER PRODUCT ARRANGEMENT POSITION IDENTIFYING METHOD

#21165
20090275688
2009-11-05

Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium

#21166
20090275196
2009-11-05

Semiconductor device and manufacturing method thereof

#21167
20090275195
2009-11-05

Interconnect structure having a silicide/germanide cap layer

#21168
20090275194
2009-11-05

Semiconductor device having multiple wiring layers and method of producing the same

#21169
20090275160
2009-11-05

Semiconductor device manufacturing method

#21170
20090274852
2009-11-05

METHOD FOR FABRICATING HIGH COMPRESSIVE STRESS FILM AND STRAINED-SILICON TRANSISTORS

#21171
20090273881
2009-11-05

Metal-Insulator-Metal Capacitor

#21172
20090273870
2009-11-05

Semiconductor integrated circuit

#21173
20090273692
2009-11-05

Reference data encoding in image sensors

#21174
20090273649
2009-11-05

Inkjet printhead with nozzle layer defining etchant holes

#21175
20090273394
2009-11-05

Adjustable device and method for varying the apparant value of capacitance

#21176
20090273393
2009-11-05

Substrate stress measuring technique

#21177
20090273102
2009-11-05

Semiconductor Substrate and Method for Manufacturing the Same

#21178
20090273101
2009-11-05

Apparatus and method for preventing configurable system-on-a-chip integrated circuits from beginning I/O limited

#21179
20090273090
2009-11-05

Semiconductor device and method for manufacturing the same

#21180
20090273089
2009-11-05

Method for manufacturing semiconductor device and semiconductor device

#21181
20090273085
2009-11-05

CuSiN/SiN diffusion barrier for copper in integrated-circuit devices

#21182
20090273084
2009-11-05

Optically transparent wires for secure circuits and methods of making same

#21183
20090273070
2009-11-05

Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler

#21184
20090273065
2009-11-05

Interconnection of lead frame to die utilizing flip chip process

#21185
20090273056
2009-11-05

Semiconductor device and method of manufacturing the same

#21186
20090273055
2009-11-05

Fuse structure

#21187
20090273047
2009-11-05

Solid state imaging device and manufacturing method thereof

#21188
20090273044
2009-11-05

Semiconductor Device, Memory Module, and Method of Manufacturing a Semiconductor Device

#21189
20090273028
2009-11-05

Short channel lateral MOSFET and method

#21190
20090273023
2009-11-05

Segmented pillar layout for a high-voltage vertical transistor

#21191
20090273022
2009-11-05

CONDUCTIVE HARD MASK TO PROTECT PATTERNED FEATURES DURING TRENCH ETCH

#21192
20090273019
2009-11-05

Memory device transistors

#21193
20090273009
2009-11-05

Integrated CMOS porous sensor

#21194
20090272996
2009-11-05

Encapsulation for phosphor-converted white light emitting diode

#21195
20090272988
2009-11-05

Multi-chip module single package structure for semiconductor

#21196
20090272986
2009-11-05

LED module, and LED chain containing the same

#21197
20090272978
2009-11-05

Image display system and manufacturing method thereof

#21198
20090272901
2009-11-05

Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus

#21199
20090272813
2009-11-05

Security element with IC card

#21200
20090272566
2009-11-05

ELECTRICALLY CONDUCTIVE PASTE AND MULTILAYER CERAMIC SUBSTRATE

#21201
20090272563
2009-11-05

Electronic carrier board

#21202
20090272512
2009-11-05

Liquid cooling heat dissipating device

#21203
20090272293
2009-11-05

Lamellar zirconium phosphate

#21204
20090272125
2009-11-05

Thermal pump module and temperature regulation

#21205
20090271982
2009-11-05

Method of forming a wiring having carbon nanotube

#21206
20090271753
2009-10-29

Methods for cell phasing and placement in dynamic array architecture and implementation of the same

#21207
20090271140
2009-10-29

SEMICONDUCTOR DEVICE

#21208
20090269952
2009-10-29

Fastening assembly for heat dissipation device

#21209
20090269940
2009-10-29

Method for nitriding substrate and method for forming insulating film

#21210
20090269929
2009-10-29

Non-plasma capping layer for interconnect applications

#21211
20090269914
2009-10-29

PROCESS FOR FORMING A DIELECTRIC ON A COPPER-CONTAINING METALLIZATION AND CAPACITOR ARRANGEMENT

#21212
20090269912
2009-10-29

Edge seal for a semiconductor device and method therefor

#21213
20090269905
2009-10-29

Tapered through-silicon via structure

#21214
20090269904
2009-10-29

Semiconductor device having channel with cooling fluid and manufacturing method thereof

#21215
20090269884
2009-10-29

Method for manufacturing an active socket for facilitating proximity communication

#21216
20090269862
2009-10-29

Alignment method of chips

#21217
20090269521
2009-10-29

POROUS STRUCTURED THERMAL TRANSFER ARTICLE

#21218
20090269498
2009-10-29

Method for making thermal interface material

#21219
20090269178
2009-10-29

Method and apparatus for the placement of electronic components, in particular semi conductor chips on a substrate

#21220
20090268522
2009-10-29

Three dimensional stacked nonvolatile semiconductor memory

#21221
20090268498
2009-10-29

Semiconductor memory device and method of performing data reduction test

#21222
20090268470
2009-10-29

LED LAMP

#21223
20090268468
2009-10-29

LED illuminating device and light engine thereof

#21224
20090268460
2009-10-29

Light collimation and mixing of remote light sources

#21225
20090268450
2009-10-29

LIGHTING DEVICE AND METHOD OF PRODUCING THE SAME

#21226
20090268447
2009-10-29

LED lamp

#21227
20090268410
2009-10-29

FLEXIBLE HEAT SINK INSTALLATION FOR EARLY BLADE BOARD MANUFACTURING

#21228
20090268409
2009-10-29

Heat dissipation assembly

#21229
20090268408
2009-10-29

Heat sink assembly

#21230
20090268407
2009-10-29

Heat sink clip

#21231
20090268395
2009-10-29

Backplate for heat radiator

#21232
20090268369
2009-10-29

Capacitor structure with raised resonance frequency

#21233
20090268043
2009-10-29

Large dynamic range cameras

#21234
20090267723
2009-10-29

Electrical fuse devices

#21235
20090267644
2009-10-29

Semiconductor integrated circuit

#21236
20090267485
2009-10-29

Phosphor and manufacturing method therefore, and light emission device using the phosphor

#21237
20090267241
2009-10-29

Substrate with check mark and method of inspecting position accuracy of conductive glue dispensed on the substrate

#21238
20090267240
2009-10-29

Method of manufacturing an overlay mark

#21239
20090267234
2009-10-29

Semiconductor Device and Method of Manufacturing a Semiconductor Device

#21240
20090267228
2009-10-29

Intermetallic diffusion block device and method of manufacture

#21241
20090267225
2009-10-29

Semiconductor device and method for manufacturing the same

#21242
20090267223
2009-10-29

MEMS package having formed metal lid

#21243
20090267211
2009-10-29

Wafer level package and method of fabricating the same

#21244
20090267208
2009-10-29

Semiconductor package having chip selection through electrodes and stacked semiconductor package having the same

#21245
20090267205
2009-10-29

Zero-reflow TSOP stacking

#21246
20090267204
2009-10-29

Edge seal for a semiconductor device

#21247
20090267201
2009-10-29

Vertical transmission line structure that includes bump elements for flip-chip mounting

#21248
20090267198
2009-10-29

Semiconductor device, method for manufacturing semiconductor device and apparatus for manufacturing semiconductor

#21249
20090267193
2009-10-29

Semiconductor device and method for manufacturing the same

#21250
20090267185
2009-10-29

Method of manufacturing semiconductor device

#21251
20090267184
2009-10-29

Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same

#21252
20090267180
2009-10-29

SEMICONDUCTOR DEVICE HAVING A REDUCED FUSE THICKNESS AND METHOD FOR MANUFACTURING THE SAME

#21253
20090267179
2009-10-29

SYSTEM FOR POWER PERFORMANCE OPTIMIZATION OF MULTICORE PROCESSOR CHIP

#21254
20090267172
2009-10-29

Method of manufacturing an image sensing micromodule

#21255
20090267160
2009-10-29

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

#21256
20090267131
2009-10-29

Nonvolatile semiconductor memory device and method of manufacturing the same

#21257
20090267128
2009-10-29

Three dimensional stacked nonvolatile semiconductor memory

#21258
20090267087
2009-10-29

Low resistance wiring structure and liquid crystal display device using the same

#21259
20090267024
2009-10-29

Inorganic Sulfate Ion Scavenger, Inorganic Scavenging Composition, and Electronic Component-Sealing Resin Composition, Electronic Component-Sealing Material, Electronic Component, Varnish, Adhesive, Paste, and Product Employing Same

#21260
20090266593
2009-10-29

Surface-mountable electronic device

#21261
20090266590
2009-10-29

INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME

#21262
20090266584
2009-10-29

Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board

#21263
20090266531
2009-10-29

Heat Sink and Method of Manufacturing the Same

#21264
20090266522
2009-10-29

Method of flatting evaporating section of heat pipe embedded in heat dissipation device

#21265
20090266521
2009-10-29

Heat dissipation device

#21266
20090266518
2009-10-29

Heat plate type cooler module

#21267
20090266516
2009-10-29

Electrospray Evaporative Cooling (ESC)

#21268
20090266515
2009-10-29

Electronic device cooling apparatus and electronic device including the same

#21269
20090266514
2009-10-29

HEAT EXCHANGE DEVICE

#21270
20090266513
2009-10-29

HEAT DISSIPATION DEVICE

#21271
20090266512
2009-10-29

Heat dissipation device having fastener assemblies for attachment thereof to a heat-generating component

#21272
20090266477
2009-10-29

Lightweight thermal management material for enhancement of through-thickness thermal conductivity

#21273
20090264025
2009-10-22

Probe sheet and electrical connecting apparatus

#21274
20090263991
2009-10-22

Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging

#21275
20090263986
2009-10-22

Spring interconnect structures

#21276
20090263965
2009-10-22

Self-aligned barrier layers for interconnects

#21277
20090263964
2009-10-22

Interconnections for integrated circuits

#21278
20090263963
2009-10-22

Semiconductor device and manufacturing method therefor

#21279
20090263951
2009-10-22

Method for fabricating semiconductor device

#21280
20090263947
2009-10-22

Bottom source LDMOSFET method

#21281
20090263943
2009-10-22

Method of fabricating semiconductor integrated circuit device

#21282
20090263940
2009-10-22

Mold cleaning sheet and method of producing semiconductor devices using the same

#21283
20090263935
2009-10-22

Recycling faulty multi-die packages

#21284
20090263918
2009-10-22

Methods and apparatuses for determining thickness of a conductive layer

#21285
20090263911
2009-10-22

End point detection method, end point detection device, and gas phase reaction processing apparatus equipped with end point detection device

#21286
20090263587
2009-10-22

Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control

#21287
20090263568
2009-10-22

Rapid generation of carbon filament structures of controlled geometries at low temperatures

#21288
20090263306
2009-10-22

Silicon carbide substrate, semiconductor device, wiring substrate, and silicon carbide manufacturing method

#21289
20090262564
2009-10-22

CIRCUIT WIRING LAYOUT IN SEMICONDUCTOR MEMORY DEVICE AND LAYOUT METHOD

#21290
20090262545
2009-10-22

Illumination apparatus and method of producing a planar light output

#21291
20090262536
2009-10-22

Illumination system

#21292
20090262526
2009-10-22

White Light Emitting Diode Module

#21293
20090262505
2009-10-22

Heat radiator

#21294
20090262504
2009-10-22

Heat sink clip and assembly

#21295
20090262502
2009-10-22

Heat sink

#21296
20090262500
2009-10-22

COOLING DEVICE, HEAT SINK, AND ELECTRONIC APPARATUS

#21297
20090262477
2009-10-22

Short-circuit current limiter

#21298
20090262468
2009-10-22

Temperature protection circuit, power supply, and electronic device

#21299
20090262050
2009-10-22

Display device

#21300
20090261937
2009-10-22

Integrated inductor