212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Memory device peripheral interconnects and method of manufacturing
#21002Interconnect structure having enhanced electromigration reliability and a method of fabricating same
#21003SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#21004Semiconductor device and manufacturing method of semiconductor device
#21005Structure and process for conductive contact integration
#21006Semiconductor device and a method for manufacturing the same
#21007Fine-Pitch Ball Grid Array Package Design
#21008SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE
#21009Lead Frame
#21010Semiconductor chip and semiconductor device, and method of manufacturing the same
#21011Group III nitride semiconductor substrate, substrate for group III nitride semiconductor device, and methods of making same
#21012Semiconductor device with crack prevention ring
#21013Thermal sensing and reset protection for an integrated circuit chip
#21014Lateral oxidation with high-K dielectric liner
#21015Semiconductor device and method for fabricating semiconductor device
#21016Light emitting device package structure and fabricating method thereof
#21017Light emitting device package including a semiconductor substrate having at least one surface
#21018Solid state LED bridge rectifier light engine
#21019Semiconductor wafer and method of forming sacrificial bump pad for wafer probing during wafer sort test
#21020Radiation detection apparatus and radiation detection system having a light source located to reduce dark current
#21021WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#21022Curvilinear wiring structure to reduce areas of high field density in an integrated circuit
#21023CIRCUIT STRUCTURE AND PHOTOMASK FOR DEFINING THE SAME
#21024Wired circuit board and producing method thereof
#21025Heat Radiating Fin
#21026Quick temperature-equlizing heat-dissipating device
#21027Blowerless heat exchanger based on micro-jet entrainment
#21028Heat radiating unit
#21029Heat sink for chips
#21030Heat sink for chips
#21031Heat sink for chips
#21032Mitigating heat in an integrated circuit
#21033Systems and methods for detecting defects on a wafer and generating inspection results for the wafer
#21034LOW-CORROSION EPOXY RESINS AND PRODUCTION METHODS THEREFOR
#21035Liquid resin composition for electronic components and electronic component device
#21036METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A STEPPED THROUGH-HOLE
#21037Butted source contact and well strap
#21038Method for forming self-assembled mono-layer liner for Cu/porous low-k interconnections
#21039Method of manufacturing thin film transistor substrate
#21040HEAT DISSIPATION ASSEMBLY
#21041Enhancing the cooling of dual in-line memory modules
#21042Heat sink and method of manufacturing the same
#21043Two-phase cooling circuit
#21044High-power thyristor module having cooling effect
#21045Combination heat sink
#21046DC and RF pass broadband surge suppressor
#21047Package level ESD protection and method therefor
#21048Method for Tamperproof Identification of Individual Electronic Sub-Assemblies
#21049Connecting analog response to separate strobed comparator input on IC
#21050POWER MODULE LAYOUT FOR AUTOMOTIVE POWER CONVERTERS
#21051ORGANIC LIGHT EMITTING DEVICE BASED LIGHTING FOR LOW COST, FLEXIBLE LARGE AREA SIGNAGE
#21052Apparatus and method for controlling the motor power
#21053Contact layout structure
#21054SYSTEMS AND METHODS FOR VERTICAL STACKED SEMICONDUCTOR DEVICES
#21055CHIP STRUCTURE AND METHOD OF REWORKING CHIP
#21056Oversized contacts and vias in layout defined by linearly constrained topology
#21057Semiconductor device and method for fabricating semiconductor device
#21058DAMASCENE WIRING FABRICATION METHODS INCORPORATING DIELECTRIC CAP ETCH PROCESS WITH HARD MASK RETENTION
#21059Semiconductor device and fabrication method thereof
#21060Semiconductor device and manufacturing method thereof
#21061Metal line of semiconductor device and method for forming the same
#21062Low-resistance interconnects and methods of making same
#21063Semiconductor device and multilayer wiring board
#21064Design method of semiconductor package substrate to cancel a reflected wave
#21065System, structure, and method of manufacturing a semiconductor substrate stack
#21066Scribe line structure for wafer dicing and method of making the same
#21067Scalable integrated circuit high density capacitors
#21068Method of manufacturing M-I-M capacitor of semiconductor device
#21069SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME
#21070Programmable devices and methods of manufacture thereof
#21071Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor
#21072Semiconductor devices with active regions of different heights
#21073SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#21074Integrated circuits having a contact structure having an elongate structure and methods for manufacturing the same
#21075SINGLE-POLY NON-VOLATILE MEMORY CELL
#21076MOSFET with asymmetrical extension implant
#21077Reduced free-charge carrier lifetime device
#21078Semiconductor light emitting diodes having reflective structures and methods of fabricating same
#21079Multifaced microdevice system array
#21080Organic light emitting display and method for making the same
#21081Semiconductor unit
#21082TEG pattern for detecting void in device isolation layer and method of forming the same
#21083Semiconductor device and manufacturing method of the same
#21084Semiconductor for use in harsh environments
#21085Thermosetting composition
#21086Fabrication of semiconductor interconnect structure
#21087Method of manufacturing wiring substrate
#21088Ceramic metal composite and semiconductor device using the same
#21089Silicon nitride substrate, silicon nitride circuit board utilizing the same, and use thereof
#21090Temperature Managing For Electronic Components
#21091Cooling fin structure and heat-dissipating module thereof
#21092Stacked and redundant chip coolers
#21093HEAT DISSIPATION DEVICE
#21094Multilayered polymeric structure
#21095Nitride semiconductor heterostructures and related methods
#21096Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
#21097System and method for routing connections with improved interconnect thickness
#21098Monitoring plasma induced damage during semiconductor wafer processes
#21099EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME
#21100Method for forming low dielectric constant fluorine-doped layers
#21101Manufacturing method for micro-transformers
#21102Optimal tungsten through wafer via and process of fabricating same
#21103Semiconductor device having multiple wiring layers and method of producing the same
#21104Method of forming a contact structure
#21105Methods of fabricating interconnect structures containing various capping materials for electrical fuse and other related applications
#21106Process for assembling wafers by means of molecular adhesion
#21107METHOD OF FORMING AN ELECTRONIC DEVICE INCLUDING REMOVING A DIFFERENTIAL ETCH LAYER
#21108Battery pack
#21109Aluminum-silicon carbide composite and heat dissipation device employing the same
#21110Adhesive composition
#21111Diversity proximity communication
#21112Electronic device and heat dissipation unit thereof
#21113Electronic component
#21114Load driving semiconductor apparatus
#21115ELECTRONIC DEVICE MOUNTING APPARATUS AND RESONANCE SUPPRESSION METHOD THEREOF
#21116Electronic device and heat dissipation unit thereof
#21117Securing device for assembling heat dissipation module onto electronic component
#21118HEAT DISSIPATING STRUCTURE
#21119System and method for proportional cooling with liquid metal
#21120System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
#21121Heat-dissipating structure
#21122Memory module with vertically accessed interposer assemblies
#21123Circuit configurations having four terminal JFET devices
#21124Methods and materials for the reduction and control of moisture and oxygen in OLED devices
#21125Double-sided emission type organic light emitting diode display
#21126Circuit arrangement and system for use in a motor vehicle
#21127Multilayer films for package applications and method for making same
#21128Semiconductor device including interconnects, vias connecting the interconnects and greater thickness of the liner film adjacent the vias
#21129Redundancy design with electro-migration immunity
#21130Semiconductor device and method for manufacturing semiconductor device
#21131Interconnect structure with a mushroom-shaped oxide capping layer and method for fabricating same
#21132Dielectric materials and methods for integrated circuit applications
#21133Semiconductor device and method for manufacturing semiconductor device
#21134IC device having low resistance TSV comprising ground connection
#21135Semiconductor apparatus
#21136TSVS having chemically exposed TSV tips for integrated circuit devices
#21137Through substrate via including variable sidewall profile
#21138Semiconductor device, wafer structure and method for fabricating semiconductor device
#21139BONDED INTERMEDIATE SUBSTRATE AND METHOD OF MAKING SAME
#21140Semiconductor device and method of manufacturing the same
#21141Efficient interconnect structure for electrical fuse applications
#21142Structure for interconnect structure containing various capping materials for electrical fuse and other related applications
#21143Semiconductor device and method for isolating the same
#21144Microelectronic devices having an EMI shield and associated systems and methods
#21145Electrical contact structure having multiple metal interconnect levels staggering one another
#21146Trench MOSFET with an ONO insulating layer sandwiched between an ESD protection module atop and a semiconductor substrate
#21147Nonvolatile semiconductor memory
#21148SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#21149Memory device interconnects and method of manufacturing
#21150Method for forming metal electrode, method for manufacturing semiconductor light emitting elements and nitride based compound semiconductor light emitting elements
#21151Semiconductor light emitting device
#21152SCRIBE BASED BOND PADS FOR INTEGRATED CIRCUITS
#21153LED-based light module package including a ceramic layer and a light sensor
#21154Nanostructure-based heating devices and methods of use
#21155Plasma etching method capable of detecting end point and plasma etching device therefor
#21156Method of enabling solder deposition on a substrate and electronic package formed thereby
#21157Mounting structure and method for mounting electronic component onto circuit board
#21158Liquid cooling system with automatic pump speed control
#21159Method and apparatus of water cooling several parallel circuit cards each containing several chip packages
#21160HEAT DISSIPATION DEVICE
#21161HEAT DISSIPATING DEVICE AND HEAT CONDUCTION STRUCTURE THEREOF
#21162Geometrically reoriented low-profile phase plane heat pipes
#21163Heat sink memory chip
#21164TRANSFER PRODUCT, TRANSFER PRODUCT FABRICATION METHOD, AND TRANSFER PRODUCT ARRANGEMENT POSITION IDENTIFYING METHOD
#21165Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium
#21166Semiconductor device and manufacturing method thereof
#21167Interconnect structure having a silicide/germanide cap layer
#21168Semiconductor device having multiple wiring layers and method of producing the same
#21169Semiconductor device manufacturing method
#21170METHOD FOR FABRICATING HIGH COMPRESSIVE STRESS FILM AND STRAINED-SILICON TRANSISTORS
#21171Metal-Insulator-Metal Capacitor
#21172Semiconductor integrated circuit
#21173Reference data encoding in image sensors
#21174Inkjet printhead with nozzle layer defining etchant holes
#21175Adjustable device and method for varying the apparant value of capacitance
#21176Substrate stress measuring technique
#21177Semiconductor Substrate and Method for Manufacturing the Same
#21178Apparatus and method for preventing configurable system-on-a-chip integrated circuits from beginning I/O limited
#21179Semiconductor device and method for manufacturing the same
#21180Method for manufacturing semiconductor device and semiconductor device
#21181CuSiN/SiN diffusion barrier for copper in integrated-circuit devices
#21182Optically transparent wires for secure circuits and methods of making same
#21183Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler
#21184Interconnection of lead frame to die utilizing flip chip process
#21185Semiconductor device and method of manufacturing the same
#21186Fuse structure
#21187Solid state imaging device and manufacturing method thereof
#21188Semiconductor Device, Memory Module, and Method of Manufacturing a Semiconductor Device
#21189Short channel lateral MOSFET and method
#21190Segmented pillar layout for a high-voltage vertical transistor
#21191CONDUCTIVE HARD MASK TO PROTECT PATTERNED FEATURES DURING TRENCH ETCH
#21192Memory device transistors
#21193Integrated CMOS porous sensor
#21194Encapsulation for phosphor-converted white light emitting diode
#21195Multi-chip module single package structure for semiconductor
#21196LED module, and LED chain containing the same
#21197Image display system and manufacturing method thereof
#21198Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus
#21199Security element with IC card
#21200ELECTRICALLY CONDUCTIVE PASTE AND MULTILAYER CERAMIC SUBSTRATE
#21201Electronic carrier board
#21202Liquid cooling heat dissipating device
#21203Lamellar zirconium phosphate
#21204Thermal pump module and temperature regulation
#21205Method of forming a wiring having carbon nanotube
#21206Methods for cell phasing and placement in dynamic array architecture and implementation of the same
#21207SEMICONDUCTOR DEVICE
#21208Fastening assembly for heat dissipation device
#21209Method for nitriding substrate and method for forming insulating film
#21210Non-plasma capping layer for interconnect applications
#21211PROCESS FOR FORMING A DIELECTRIC ON A COPPER-CONTAINING METALLIZATION AND CAPACITOR ARRANGEMENT
#21212Edge seal for a semiconductor device and method therefor
#21213Tapered through-silicon via structure
#21214Semiconductor device having channel with cooling fluid and manufacturing method thereof
#21215Method for manufacturing an active socket for facilitating proximity communication
#21216Alignment method of chips
#21217POROUS STRUCTURED THERMAL TRANSFER ARTICLE
#21218Method for making thermal interface material
#21219Method and apparatus for the placement of electronic components, in particular semi conductor chips on a substrate
#21220Three dimensional stacked nonvolatile semiconductor memory
#21221Semiconductor memory device and method of performing data reduction test
#21222LED LAMP
#21223LED illuminating device and light engine thereof
#21224Light collimation and mixing of remote light sources
#21225LIGHTING DEVICE AND METHOD OF PRODUCING THE SAME
#21226LED lamp
#21227FLEXIBLE HEAT SINK INSTALLATION FOR EARLY BLADE BOARD MANUFACTURING
#21228Heat dissipation assembly
#21229Heat sink assembly
#21230Heat sink clip
#21231Backplate for heat radiator
#21232Capacitor structure with raised resonance frequency
#21233Large dynamic range cameras
#21234Electrical fuse devices
#21235Semiconductor integrated circuit
#21236Phosphor and manufacturing method therefore, and light emission device using the phosphor
#21237Substrate with check mark and method of inspecting position accuracy of conductive glue dispensed on the substrate
#21238Method of manufacturing an overlay mark
#21239Semiconductor Device and Method of Manufacturing a Semiconductor Device
#21240Intermetallic diffusion block device and method of manufacture
#21241Semiconductor device and method for manufacturing the same
#21242MEMS package having formed metal lid
#21243Wafer level package and method of fabricating the same
#21244Semiconductor package having chip selection through electrodes and stacked semiconductor package having the same
#21245Zero-reflow TSOP stacking
#21246Edge seal for a semiconductor device
#21247Vertical transmission line structure that includes bump elements for flip-chip mounting
#21248Semiconductor device, method for manufacturing semiconductor device and apparatus for manufacturing semiconductor
#21249Semiconductor device and method for manufacturing the same
#21250Method of manufacturing semiconductor device
#21251Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same
#21252SEMICONDUCTOR DEVICE HAVING A REDUCED FUSE THICKNESS AND METHOD FOR MANUFACTURING THE SAME
#21253SYSTEM FOR POWER PERFORMANCE OPTIMIZATION OF MULTICORE PROCESSOR CHIP
#21254Method of manufacturing an image sensing micromodule
#21255SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#21256Nonvolatile semiconductor memory device and method of manufacturing the same
#21257Three dimensional stacked nonvolatile semiconductor memory
#21258Low resistance wiring structure and liquid crystal display device using the same
#21259Inorganic Sulfate Ion Scavenger, Inorganic Scavenging Composition, and Electronic Component-Sealing Resin Composition, Electronic Component-Sealing Material, Electronic Component, Varnish, Adhesive, Paste, and Product Employing Same
#21260Surface-mountable electronic device
#21261INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
#21262Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board
#21263Heat Sink and Method of Manufacturing the Same
#21264Method of flatting evaporating section of heat pipe embedded in heat dissipation device
#21265Heat dissipation device
#21266Heat plate type cooler module
#21267Electrospray Evaporative Cooling (ESC)
#21268Electronic device cooling apparatus and electronic device including the same
#21269HEAT EXCHANGE DEVICE
#21270HEAT DISSIPATION DEVICE
#21271Heat dissipation device having fastener assemblies for attachment thereof to a heat-generating component
#21272Lightweight thermal management material for enhancement of through-thickness thermal conductivity
#21273Probe sheet and electrical connecting apparatus
#21274Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging
#21275Spring interconnect structures
#21276Self-aligned barrier layers for interconnects
#21277Interconnections for integrated circuits
#21278Semiconductor device and manufacturing method therefor
#21279Method for fabricating semiconductor device
#21280Bottom source LDMOSFET method
#21281Method of fabricating semiconductor integrated circuit device
#21282Mold cleaning sheet and method of producing semiconductor devices using the same
#21283Recycling faulty multi-die packages
#21284Methods and apparatuses for determining thickness of a conductive layer
#21285End point detection method, end point detection device, and gas phase reaction processing apparatus equipped with end point detection device
#21286Thick film getter paste compositions with pre-hydrated desiccant for use in atmosphere control
#21287Rapid generation of carbon filament structures of controlled geometries at low temperatures
#21288Silicon carbide substrate, semiconductor device, wiring substrate, and silicon carbide manufacturing method
#21289CIRCUIT WIRING LAYOUT IN SEMICONDUCTOR MEMORY DEVICE AND LAYOUT METHOD
#21290Illumination apparatus and method of producing a planar light output
#21291Illumination system
#21292White Light Emitting Diode Module
#21293Heat radiator
#21294Heat sink clip and assembly
#21295Heat sink
#21296COOLING DEVICE, HEAT SINK, AND ELECTRONIC APPARATUS
#21297Short-circuit current limiter
#21298Temperature protection circuit, power supply, and electronic device
#21299Display device
#21300Integrated inductor