212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Photodiode chip having a high limit frequency
#21902Semiconductor device with an improved operating property
#21903Self-repairing field effect transisitor
#21904Integrated circuit die, integrated circuit package, and packaging method
#21905Semiconductor device
#21906Guard ring extension to prevent reliability failures
#21907Trench depth monitor for semiconductor manufacturing
#21908Heat radiator and power module
#21909HEAT EXCHANGER HAVING TEMPERATURE-ACTUATED VALVES
#21910Heat exchanger device and method for heat removal or transfer
#21911Portable computer and method for preheating portable computer before booting
#21912Analyte monitoring device and methods of use
#21913Analyte Monitoring Device and Methods of Use
#21914Analyte Monitoring Device and Methods of Use
#21915Lock and key structure for three-dimensional chip connection and process thereof
#21916Methods for evaluating and manufacturing semiconductor wafer
#21917Interconnect structure and method of fabricating the same
#21918THERMAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME
#21919Adhesion promotion
#21920Signal transmission system and semiconductor integrated circuit device
#21921Integrated circuit
#21922Heat sink
#21923HEAT SINK COMPONENT AND A METHOD OF PRODUCING A HEAT SINK COMPONENT
#21924Electronic apparatus
#21925Positioning device for heatsink
#21926Sectional modular heat sink
#21927Cooling device
#21928Electrostatic Discharge Protection Using an Intrinsic Inductive Shunt
#21929Semiconductor device
#21930Method for recovering an on-state forward voltage and, shrinking stacking faults in bipolar semiconductor devices, and the bipolar semiconductor devices
#21931Light emission device and method utilizing multiple emitters
#21932Piezoelectric device with irradiation damage preventing seal
#21933Embedded die package on package (POP) with pre-molded leadframe
#21934Pass through via technology for use during the manufacture of a semiconductor device
#21935Data line structure in lead region
#21936Semiconductor device and manufacturing method thereof
#21937HIGH PURITY Cu STRUCTURE FOR INTERCONNECT APPLICATIONS
#21938Heat transfer device
#21939Crack stops for semiconductor devices
#21940Fully Cu-metallized III-V group compound semiconductor device with palladium/germanium/copper ohmic contact system
#21941Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
#21942Method for MEMS threshold sensor packaging
#21943CMOS integrated circuit devices having stressed NMOS and PMOS channel regions therein
#21944Structure for making a top-side contact to a substrate
#21945Backside illuminated imaging sensor having a carrier substrate and a redistribution layer
#21946Light source module with wavelength converting structure and the method of forming the same
#21947Vertical system integration
#21948Method for producing a card-type data carrier, and data carrier produced according to this method
#21949METHODS AND MECHANISMS FOR THERMAL SEMI CONDUCTION
#21950Cooling apparatus for graphic cards
#21951COOLER DEVICE
#21952Heat dissipation device for LED lamp
#21953Sectional modular heat sink
#21954HEAT DISSIPATION MODULE AND SUPPORTING ELEMENT THEREOF
#21955Heat-dissipating element and heat sink having the same
#21956Semiconductor device and method of manufacturing semiconductor device
#21957Shielding mesh design for an integrated circuit device
#21958Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
#21959Shelding mesh design for an integrated circuit device
#21960Voltage margin testing for proximity communication
#21961Power mesh management method
#21962Method, apparatus, and computer readable medium for evaluating a sampling inspection
#21963Process controller for semiconductor manufacturing, utilizing dangerous pattern identification and process capability determination
#21964Analyte Monitoring Device and Methods of Use
#21965Analyte Monitoring Device and Methods of Use
#21966Analyte Monitoring Device and Methods of Use
#21967Analyte Monitoring Device and Methods of Use
#21968Analyte Monitoring Device and Methods of Use
#21969Analyte Monitoring Device and Methods of Use
#21970Analyte Monitoring Device and Methods of Use
#21971Analyte Monitoring Device and Methods of Use
#21972Analyte Monitoring Device and Methods of Use
#21973Analyte Monitoring Device and Methods of Use
#21974Analyte monitoring device and methods of use
#21975Analyte Monitoring Device and Methods of Use
#21976Aligned nanotube bearing composite material
#21977Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
#21978Method of forming a shielded gate field effect transistor
#21979Method for manufacturing IC tag inlet
#21980Method of manufacturing stacked-type semiconductor device
#21981Memory devices, stylus-shaped structures, electronic apparatuses, and methods for fabricating the same
#21982METHOD FOR EDGE SEALING BARRIER FILMS
#21983Film-Deposition Apparatus and Film-Deposition Method
#21984Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof
#21985LED ILLUMINATION APPARATUS
#21986Thermal module
#21987Heat transfer film, semiconductor device, and electronic apparatus
#21988Method and apparatus for inverted vortex generator for enhanced cooling
#21989COOLING DEVICE FOR MEMORY MODULE
#21990Method, apparatus and computer system for vortex generator enhanced cooling
#21991Electronic element, variable capacitor, micro switch, method for driving micro switch, and MEMS type electronic element
#21992Circuit that facilitates proximity communication
#21993Semiconductor wafer having a multitude of sensor elements and method for measuring sensor elements on a semiconductor wafer
#21994Laminated interconnects for organic opto-electronic device modules and method
#21995Light-emitting device with suppressed influence of voltage drop
#21996Integrated circuit including a power MOS transistor
#21997Sealing film and a semiconductor device using the same
#21998METHOD OF FORMING A PROBE PAD LAYOUT/DESIGN, AND RELATED DEVICE
#21999Large area integration of quartz resonators with electronics
#22000Noble metal cap for interconnect structures
#22001Fine pitch solder bump structure with built-in stress buffer
#22002ON CHIP THERMOCOUPLE AND/OR POWER SUPPLY AND A DESIGN STRUCTURE FOR SAME
#22003Semiconductor device having a reductant layer and manufacturing method thereof
#22004Semiconductor device
#22005Multiphase synchronous buck converter
#22006Manufacturing process of semiconductor device and semiconductor device
#22007Semiconductor device including metal-insulator-metal capacitor and method of manufacturing same
#22008SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#22009SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#22010Semiconductor chip with seal ring and sacrificial corner pattern
#22011Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
#22012Using floating fill metal to reduce power use for proximity communication
#22013SEMICONDUCTOR DEVICE WITH AT LEAST ONE FIELD PLATE
#22014Semiconductor device having hermitically sealed active area and electrodes
#22015Solid-state imaging device and imaging apparatus
#22016Programmable nanotube interconnect
#22017III-nitride semiconductor device with stepped gate trench and process for its manufacture
#22018Semiconductor-on-diamond devices and associated methods
#22019Integrated RF ESD protection for high frequency circuits
#22020Light-emitting diode package
#22021Side view type light emitting diode package
#22022Device for measuring or inspecting substrates of the semiconductor industry
#22023SUPERCONFORMAL ELECTRODEPOSITION OF NICKEL IRON AND COBALT MAGNETIC ALLOYS
#22024Plating method
#22025Printed wiring board and method for producing the same
#22026Method and apparatus for manufacture of via disk
#22027Inorganic powder, resin composition filled with the powder and use thereof
#22028Heat Sink
#22029MICRO HEAT PIPE WITH POLIGONAL CROSS-SECTION MANUFACTURED VIA EXTRUSION OR DRAWING
#22030Method for attaching a flexible structure to a device
#22031Method and apparatus to design an interconnection device in a multi-layer shielding mesh
#22032Temperature regulating method, thermal processing system and semiconductor device manufacturing method
#22033Analyte Monitoring Device and Methods of Use
#22034Analyte Monitoring Device and Methods of Use
#22035Analyte Monitoring Device and Methods of Use
#22036Analyte Monitoring Device and Methods of Use
#22037Analyte Monitoring Device and Methods of Use
#22038Analyte monitoring device and methods of use
#22039Analyte Monitoring Device and Methods of Use
#22040Analyte monitoring device and methods of use
#22041Method of forming capping structures on one or more material layer surfaces
#22042Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor device
#22043Method for manufacturing semiconductor device
#22044Method of forming metal wiring of nonvolatile memory device
#22045Test patterns for detecting misalignment of through-wafer vias
#22046Reticle, and method of laying out wirings and vias
#22047Semiconductor memory device and method of forming the same
#22048Mounting apparatus for heat sink
#22049Water-cooling radiator for a computer chip
#22050Avalanche diode having an enhanced defect concentration level and method of making the same
#22051Printing cartridge for a printer
#22052Analog signal processing device for phased array antennas
#22053Semiconductor integrated circuit and switch arranging and wiring method
#22054Organic light emitting display device with an outer circumferentially array of flexible printed circuit board and coupling pads
#22055Integrated circuit comprising conductive lines and contact structures and method of manufacturing an integrated circuit
#22056Conductive line structure and the method of forming the same
#22057Low resistance and inductance backside through vias and methods of fabricating same
#22058METHOD FOR FORMING METAL LINE OF SEMICONDUCTOR DEVICE WITHOUT PRODUCTION OF SIDEWALL OXIDE IN METAL LINE FORMING REGION
#22059Semiconductor device with high reliability and manufacturing method thereof
#22060Polyol photosensitizers, carrier gas UV laser ablation sensitizers, and other additives and methods for making and using same
#22061Manufacturing method of a semiconductor device
#22062Package structure
#22063METHOD OF FABRICATING A SHALLOW TRENCH ISOLATION STRUCTURE INCLUDING FORMING A SECOND LINER COVERING THE CORNER OF THE TRENCH AND FIRST LINER.
#22064Via gouging methods and related semiconductor structure
#22065Semiconductor devices having fuses and methods of forming the same
#22066Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
#22067Optical semiconductor package with compressible adjustment means
#22068Array of mutually isolated, geiger-mode, avalanche photodiodes and manufacturing method thereof
#22069Semiconductor device and method of manufacturing the same
#22070Semiconductor device and method for manufacturing same
#22071ELECTROCONDUCTIVE FILM-FORMING METHOD, A THIN FILM TRANSISTOR, A THIN FILM TRANSISTOR-PROVIDED PANEL AND A THIN FILM TRANSISTOR-PRODUCING METHOD
#22072Nanowire placement by electrodeposition
#22073Control of light emitting and receiving elements of optical module based on property data associated with elements as stored on memory circuit of optical module
#22074SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME
#22075Printed wiring board and method for producing the same
#22076MULTILAYER FILM FOR WIRING AND WIRING CIRCUIT
#22077Wiring Boards and Processes for Manufacturing the Same
#22078Cooling duct and electronic apparatus
#22079Connecting Structure for Connecting Heat Radiation Fins
#22080Heat transfer apparatus and methods including hydrofluorocarbonates
#22081Design structure for semiconductor on-chip repair scheme for negative bias temperature instability
#22082Analyte monitoring device and methods of use
#22083Analyte Monitoring Device and Methods of Use
#22084Analyte Monitoring Device and Methods of Use
#22085Analyte monitoring device and methods of use
#22086Connector with wipe
#22087Integrated circuit system employing multiple exposure dummy patterning technology
#22088Film forming method, film forming apparatus and storage medium
#22089METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#22090Fabrication of Compact Semiconductor Packages
#22091Assembly Method For Reworkable Chip Stacking With Conductive Film
#22092Method of fabricating an inductor structure
#22093Heat-dissipating module having a dust removing mechanism, and assembly of an electronic device and the heat-dissipating module
#22094Electronic assembly and heat sink
#22095PEAK-LOAD COOLING OF ELECTRONIC COMPONENTS BY PHASE-CHANGE MATERIALS
#22096De-coupling capacitors produced by utilizing dummy conductive structures integrated circuits
#22097Defect inspection method and defect inspection system
#22098Fuse circuit for use in a semiconductor integrated apparatus
#22099Semiconductor on-chip repair scheme for negative bias temperature instability
#22100Contacting multilayer piezo actuators or sensors
#22101Apparatus for facilitating proximity communication between chips
#22102Solder contacts and methods of forming same
#22103Integrated circuit insulators and related methods
#22104Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
#22105Method of manufacturing semiconductor devices having metal lines
#22106BARRIER SEQUENCE FOR USE IN COPPER INTERCONNECT METALLIZATION
#22107Semiconductor component and method for producing the same
#22108PROGRAMMABLE ELECTRONIC FUSE
#22109FUSE HAVING CUTTING REGIONS AND FUSE SET STRUCTURE HAVING THE SAME
#22110Trench sidewall protection by a carbon-rich layer in a semiconductor device
#22111Functional device with functional structure of a microelectromechanical system disposed in a cavity of a substrate, and manufacturing method thereof
#22112Semiconductor device and method for manufacturing the same
#22113Semiconductor device and a method of manufacturing the same
#22114Ohmic contact on p-type GaN
#22115Laser chalcogenide phase change device
#22116Process for producing air gaps in microstructures
#22117Electromagnetic-wave suppressing radiator sheet and electronic apparatus
#22118Process of fabricating a circuit board
#22119Sliced electromagnetic cage for inductors
#22120Manufacturing method for a radiator and a structure thereof
#22121Method for manufacturing heat sink having heat-dissipating fins and structure of the same
#22122Liquid-cooled-type cooling device
#22123SEMICONDUCTOR COOLING STRUCTURE
#22124Cooler module without base panel
#22125Heat exchanger and a method of manufacturing it
#22126COOLING DEVICE
#22127REAL-TIME MONITORING DEVICE AND OPERATION METHOD THEREOF
#22128Analyte Monitoring Device and Methods of Use
#22129Analyte Monitoring Device and Methods of Use
#22130Analyte monitoring device and methods of use
#22131Analyte Monitoring Device and Methods of Use
#22132Analyte Monitoring Device and Methods of Use
#22133Analyte Monitoring Device and Methods of Use
#22134Analyte Monitoring Device and Methods of Use
#22135Analyte Monitoring Device and Methods of Use
#22136Analyte Monitoring Device and Methods of Use
#22137Analyte monitoring device and methods of use
#22138Analyte Monitoring Device and Methods of Use
#22139Analyte Monitoring Device and Methods of Use
#22140Analyte monitoring device and methods of use
#22141OPTIMIZED SiCN CAPPING LAYER
#22142Semiconductor device having a refractory metal containing film and method for manufacturing the same
#22143Semiconductor device preventing electrical short and method of manufacturing the same
#22144Monitor pattern of semiconductor device and method of manufacturing semiconductor device
#22145Method of manufacturing semiconductor device
#22146Method for encapsulating a substrate and method for fabricating a light emitting diode device
#22147Bonding pad structure and semiconductor device including the bonding pad structure
#22148MULTI-LAYER PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
#22149CLIP FOR ATTACHING PANELS
#22150Assembled circuit and electronic component
#22151HONEYCOMB HEAT DISSIPATING APPARATUS
#22152Support, in Particular for an Electronic Power Component, a Power Module Including the Support, an Assembly Including the Module, and an Electrical Member Controlled by the Module
#22153Systems and methods for cooling electronic devices using airflow dividers
#22154Piezoelectric air jet augmented cooling for electronic devices
#22155MIGFET circuit with ESD protection
#22156Multi-system module having functional substrate
#22157Semiconductor device with fault detection function
#22158Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same
#22159PLATED PILLAR PACKAGE FORMATION
#22160Simultaneous grain modulation for BEOL applications
#22161Semiconductor device
#22162SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD FOR MANUFACTURING THE SAME
#22163Airgap-containing interconnect structure with patternable low-k material and method of fabricating
#22164Encapsulation techniques for leadless semiconductor packages
#22165ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
#22166Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack
#22167Ultraviolet blocking structure and method for semiconductor device
#22168Sacrificial pillar dielectric platform
#22169Semiconductor device and method of fabricating the same
#22170Fuse in a Semiconductor Device and Method for Forming the Same
#22171Integrated circuit including isolation regions substantially through substrate
#22172Semiconductor device having guard ring
#22173Semiconductor device
#22174LED semiconductor body and use of an LED semiconductor body
#22175CONTACT FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE
#22176Method for forming conductive film, thin-film transistor, panel with thin-film transistor, and method for manufacturing thin-film transistor
#22177Methods of Making, Positioning and Orienting Nanostructures, Nanostructure Arrays and Nanostructure Devices
#22178Analyte monitoring device and methods of use
#22179PRINTED WIRING BOARD AND PRINTED SUBSTRATE UNIT
#22180NANOTUBES AS MICROWAVE FREQUENCY INTERCONNECTS
#22181Heat dissipating apparatus extended laterally from heat pipe
#22182Multilayered circuitized substrate with P-aramid dielectric layers and method of making same
#22183Method, system, and computer program product for implementing a direct measurement model for an electronic circuit design
#22184Analyte monitoring device and methods of use
#22185Thermosetting resin composition, sealant for optical device, and cured product
#22186Dielectric nanostructure and method for its manufacture
#22187Method for Manufacturing Semiconductor Device
#22188Method for forming metal line of semiconductor device
#22189Method of manufacturing semiconductor device
#22190Compound semiconductor device and method for fabricating the same
#22191Stacked Integrated Circuit Module
#22192Method of manufacturing electronic device
#22193Forming electroplated inductor structures for integrated circuits
#22194Method of manufacturing a package substrate
#22195Pulsed growth of catalyst-free growth of GaN nanowires and application in group III nitride semiconductor bulk material
#22196Foil composite card
#22197FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME
#22198METHOD OF FORMING A THERMO PYROLYTIC GRAPHITE-EMBEDDED HEATSINK
#22199Light-emitting element assembly and method for manufacturing the same
#22200Light emitting diode illuminating device