212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Light Emission Device and Light Emitter Using the Same
#22202Light-emitting module and light-emitting system
#22203Heat dissipating device
#22204PRINTED CIRCUIT BOARD ASSEMBLY
#22205Clamp for electrical devices
#22206HEAT SINK
#22207Memory module assembly with heat dissipation device
#22208Heat sink assembly for multiple electronic components
#22209Thermally and electrically conductive interconnect structures
#22210Heat dissipation module and fan thereof
#22211Heat dissipation device with a fan holder
#22212Heat sink assembly having supporting clip
#22213High density component assembly method and apparatus
#22214THERMAL DEVICE WITH ELECTROKINETIC AIR FLOW
#22215COOLING DEVICE AND ELECTRONIC DEVICE COMPRISING SUCH A COOLING DEVICE
#22216Electronic apparatus
#22217ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT
#22218Array substrate for liquid crystal display device
#22219FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME
#22220Temperature detection for a semiconductor component
#22221Semiconductor integrated circuit device which has first chip and second chip accessed via the first chip and test method thereof
#22222Controlled impedance structures for high density interconnections
#22223AC light emitting diode and AC LED drive methods and apparatus
#22224Lighting device having illumination, backlighting and display applications
#22225Micro-electro-mechanical transducer having embedded springs
#22226Method of creating an alignment mark on a substrate and substrate
#22227SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#22228Air-gap ILD with unlanded vias
#22229Semiconductor Device and Method of Fabricating the Same
#22230Semiconductor Device and Method of Fabricating the Same
#22231Metal line of semiconductor device and method for forming the same
#22232Semiconductor device and method of forming metal interconnection layer thereof
#22233Semiconductor devices including metal interconnections and methods of fabricating the same
#22234METAL INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES
#22235Manufacturable reliable diffusion-barrier
#22236METHOD TO PREVENT COPPER MIGRATION IN A SEMICONDUCTOR PACKAGE
#22237Semiconductor device and method of manufacturing the same
#22238Semiconductor Device
#22239Thermal interface with non-tacky surface
#22240Semiconductor chip having conductive member for reducing localized voltage drop
#22241Integrated circuit package system with extended corner leads
#22242Mechanical isolation for MEMS devices
#22243Extreme low-k dielectric film scheme for advanced interconnect
#22244Semiconductor device and manufacturing method thereof
#22245Semiconductor Device Crack-Deflecting Structure and Method
#22246Forming inductor and transformer structures with magnetic materials using damascene processing for integrated circuits
#22247Semiconductor device with fuse and method for fabricating the same
#22248SEMICONDUCTOR DEVICE WITH FUSE AND METHOD FOR FABRICATING THE SAME
#22249Fuse of semiconductor device and method for manufacturing the same
#22250High-voltage integrated circuit device including high-voltage resistant diode
#22251Device comprising a sensor module
#22252Semiconductor device and manufacturing method thereof
#22253Semiconductor device
#22254Reduced mask configuration for power MOSFETs with electrostatic discharge (ESD) circuit protection
#22255Semiconductor device with dynamical avalanche breakdown characteristics and method for manufacturing a semiconductor device
#22256Methods and apparatus for forming memory lines and vias in three dimensional memory arrays using dual damascene process and imprint lithography
#22257MOS transistor and semiconductor device
#22258Semiconductor device
#22259Light-emitting diode packaging structure and light-emitting diode module
#22260Lead frame for LED
#22261Light-emitting diode structure
#22262Light-emitting device with inorganic housing
#22263Copper wire, method for fabricating the same, and thin film transistor substrate with the same
#22264Image sensor and method for manufacturing the same
#22265Resistance-based etch depth determination for SGT technology
#22266TEST PATTERN OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#22267Integrated circuit and method for operating
#22268METHODS FOR MONITORING IMPLANTER PERFORMANCE
#22269Image sensor module having electric component and fabrication method thereof
#22270FULL-WAFER BACKSIDE MARKING PROCESS
#22271Package for electronic component and method for manufacturing the same
#22272Microstructure and method of manufacturing the same
#22273PRINTED CIRCUIT BOARD ASSEMBLY
#22274Heat sink and method of forming a heatsink using a wedge-lock system
#22275Heat Sink and Electronic Device with Fragrance
#22276Enabling an aluminum heat exchanger with a working fluid
#22277HEAT DISSIPATION DEVICE HAVING A MOUNTING BRACKET
#22278Heat dissipation device having a fan holder
#22279Heat dissipation device having heat pipes for supporting heat sink thereon
#22280HEAT SPREADER WITH VAPOR CHAMBER
#22281HEAT DISSIPATION DEVICE WITH A HEAT PIPE
#22282HEAT DISSIPATION DEVICE
#22283VAPOR CHAMBER
#22284Heat spreader with vapor chamber
#22285Heat sink with heat pipes
#22286HEAT SINK
#22287HEAT DISSIPATION DEVICE
#22288HEAT SINK
#22289RETICULATED HEAT DISSIPATION WITH COOLANT
#22290Refrigeration Condenser for Electronics Cooling and Manufacture Thereof
#22291METHOD OF FORMING A HEATSINK
#22292Structures including integrated circuits for reducing electromigration effect
#22293Analyte monitoring device and methods of use
#22294Analyte Monitoring Device and Methods of Use
#22295Analyte Monitoring Device And Methods Of Use
#22296Scalable radio receiver architecture providing three-dimensional packaging of multiple receivers
#22297Methods for forming all tungsten contacts and lines
#22298Method for Manufacturing Semiconductor Device
#22299METHOD OF FABRICATING A SEMICONDUCTOR DEVICE INCLUDING METAL GATE ELECTRODE AND ELECTRONIC FUSE
#22300Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program
#22301Method for Forming Tantalum Nitride Film
#22302Nanoscale metal paste for interconnect and method of use
#22303Resin-Sealing and Molding Apparatus with Sealing Mechanism and Method of dismounting Contitiuent Part of Die Assembly Fitted Therein
#22304Resin Sealing/Molding Apparatus
#22305Hermetically sealing member having optical transmission means, optoelectronic apparatus, and optical transmission method
#22306Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
#22307Method for testing a heat pipe and corresponding test device
#22308Lighting emitting diode lamp
#22309Mounting apparatus for securing heat dissipation module to circuit board
#22310Heat dissipation device with fan holder
#22311Heat dissipating apparatus with heat pipe
#22312Heat dissipation device having a fan holder for attachment of a fan
#22313Top mount surface airflow heatsink and top mount heatsink component device
#22314Busbar assembly with integrated cooling
#22315Hybrid capacitor
#22316Arrangements for energy conditioning
#22317Helical core on-chip power inductor
#22318Semiconductor device with reduced layout area having shared metal line between pads
#22319Method for regulating temperature
#22320LIGHTING EMITTING DIODE LAMP
#22321SOLID-STATE ILLUMINATING APPARATUS
#22322MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#22323Semiconductor device
#22324Semiconductor devices and methods of manufacturing thereof
#22325Semiconductor device having improved adhesion and reduced blistering between etch stop layer and dielectric layer
#22326Semiconductor device and method of manufacturing the same
#22327SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#22328IC solder reflow method and materials
#22329Semiconductor chip, method of fabricating the same and semiconductor chip stack package
#22330Semiconductor device employing wafer level chip size package technology
#22331Substrate package structure
#22332Mesa semiconductor device and method of manufacturing the same
#22333Methods for forming through wafer interconnects and structures resulting therefrom
#22334Scribe Seal Structure for Improved Noise Isolation
#22335Corona prevention in high power MMICs
#22336Moisture barrier capacitors in semiconductor components
#22337SEMICONDUCTOR CAPACITOR
#22338Spiral planar inductor and manufacturing method thereof
#22339Semiconductor device heat dissipation structure
#22340Semiconductor array and method for manufacturing a semiconductor array
#22341Wafer level package structure and production method therefor
#22342Integrated circuit system with contact integration
#22343Image sensor and method for manufacturing the same
#22344Semiconductor device
#22345Light-emitting diode package and method for fabricating the same
#22346TEST PATTERN FOR SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE TEST PATTERN
#22347SUBSTRATE TEMPERATURE ADJUSTING-FIXING DEVICES
#22348INTEGRATED DEVICE TECHNOLOGY USING A BURIED POWER BUSS FOR MAJOR DEVICE AND CIRCUIT ADVANTAGES
#22349Method for forming tantalum nitride film
#22350Resin ejection nozzle, resin encapsulation method, and electronic part assembly
#22351HEAT SINK ASSEMBLY AND METHOD OF FABRICATING
#22352HEAT SINK HAVING BUMPS FOR POSITIONING HEAT PIPES THEREIN
#22353Heat dissipation device having a fan holder
#22354Water-cooled cold plate with integrated pump
#22355Cooling system for contact cooled electronic modules
#22356MOBILE COOLING STRUCTURE AND MACHINE CASE HAVING THE SAME
#22357SPACER ELEMENT AND METHOD FOR MANUFACTURING A SPACER ELEMENT
#22358System and method for controlling the cooling of variable heat loads in heat generating devices
#22359Method for forming Ta-Ru liner layer for Cu wiring
#22360Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement
#22361Terminal pad structures and methods of fabricating same
#22362Manufacturing method of a semiconductor device and method for creating a layout thereof
#22363Method of fabricating a non-floating body device with enhanced performance
#22364Luminescent ceramic element for a light emitting device
#22365Method for packaging LED device
#22366ELECTRONIC DEVICE PACKAGE AND METHOD OF FORMATION
#22367Wiring Pattern Inspection Method and Inspection Apparatus for Flexible Printed Wiring Board
#22368NAND flash memory devices having wiring with integrally-formed contact pads and dummy lines and methods of manufacturing the same
#22369High speed OTP sensing scheme
#22370LED LAMP WITH A HEAT SINK
#22371Illumination Device Including Collimating Optics
#22372Micro-sensor and manufacturing method thereof
#22373RETICULATED HEAT DISSIPATION
#22374Heat sink assembly for multiple electronic components
#22375HEAT SINK ASSEMBLY
#22376Clip and heat dissipation assembly using the same
#22377One-dimensional hierarchical nested channel design for continuous feed manufacturing processes
#22378Heat dissipation system and related method
#22379Heat dissipation device and a method for manufacturing the same
#22380Heat dissipation device
#22381Heat dissipation device
#22382Heat dissipating assembly
#22383Heat dissipating assembly having a fan duct
#22384Heat-dissipating device having air-guiding cover
#22385ESD Protection Circuit
#22386Liquid crystal display having a chip on film structure with a plurality of input pads comprising a thin extending portion that extends to a cutting edge
#22387SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRIC DEVICE
#22388METHOD AND SYSTEM FOR A CONFIGURABLE TRANSFORMER INTEGRATED ON CHIP
#22389Method for Signal Transmission between Semiconductor Substrates, and Semiconductor Component Comprising Such Semiconductor Substrates
#22390STRUCTURE FOR IMPROVING FUSE STATE DETECTION AND YIELD IN SEMICONDUCTOR APPLICATIONS
#22391Semiconductor device
#22392White light emitting device and producing method thereof
#22393Airtight terminal
#22394Power managers for an integrated circuit
#22395ROUTING LAYER FOR A MICROELECTRONIC DEVICE, MICROELECTRONIC PACKAGE CONTAINING SAME, AND METHOD OF FORMING A MULTI-THICKNESS CONDUCTOR IN SAME FOR A MICROELECTRONIC DEVICE
#22396Semiconductor device and method of fabricating the same
#22397Super-self-aligned contacts and method for making the same
#22398Deep contacts of integrated electronic devices based on regions implanted through trenches
#22399Semiconductor device and method of manufacturing the same
#22400Semiconductor apparatus
#22401METAL LINE OF SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#22402Thick metal interconnect with metal pad caps at selective sites and process for making the same
#22403IC interconnect for high current
#22404Interconnect structure and method of making same
#22405Synergy effect of alloying materials in interconnect structures
#22406Semiconductor package having redistribution layer
#22407Multilayer chip scale package
#22408INTEGRATED CIRCUIT ASSEMBLY INCLUDING THERMAL INTERFACE MATERIAL COMPRISED OF OIL OR WAX
#22409Packaging apparatus for optical-electronic semiconductors
#22410RECTIFICATION CHIP TERMINAL STRUCTURE
#22411Semiconductor components having through interconnects and backside redistribution conductors
#22412Integrated matching networks and RF devices that include an integrated matching network
#22413Semiconductor chip substrate with multi-capacitor footprint
#22414Integrated circuit package for high-speed signals
#22415Film forming method for dielectric film
#22416Capacitor of semiconductor device and method for manufacturing the same
#22417Semiconductor device including a guard ring surrounding an inductor
#22418Semiconductor with active component and method for manufacture
#22419Micro-sensor and manufacturing method thereof
#22420Method of manufacturing MISFET with low contact resistance
#22421Semiconductor memory device and method for manufacturing
#22422Latchup robust array I/O using through wafer via
#22423High yield, high density on-chip capacitor design
#22424Semiconductor device and method for manufacturing the same
#22425Structure for a latchup robust array I/O using through wafer via
#22426Textured encapsulant surface in LED packages
#22427LED MODULE WITH REDUCED OPERATING TEMPERATURE
#22428Antifuse memory device
#22429System, structure and method of providing dynamic optimization of integrated circuits using a non-contact method of selection, and a design structure
#22430Semiconductor apparatus and fabrication method of the same
#22431Thick metal interconnect with metal pad caps at selective sites and process for making the same
#22432CIRCUIT BOARD
#22433Package for semiconductor device and method of manufacturing the same
#22434FORMATION AND INTEGRATION OF PASSIVE STRUCTURES USING SILICON AND PACKAGE SUBSTRATE
#22435Multilayer wiring board and method of making the same
#22436Gap free anchored conductor and dielectric structure and method for fabrication thereof
#22437Thermal ground planes, thermal ground plane structures, and methods of heat management
#22438HEAT SINK HAVING LOCKING DEVICE
#22439Heat-Dissipating Unit
#22440COMPLIANT THERMAL INTERFACE DESIGN AND ASSEMBLY METHOD
#22441HEAT SINK WITH VAPOR CHAMBER
#22442HEAT SINK WITH VAPOR CHAMBER
#22443Fin and Heat Sink
#22444HEAT SINK
#22445Cooling apparatus
#22446HEAT SINK
#22447HEAT DISSIPATION DEVICE
#22448HEAT DISSIPATION DEVICE
#22449HEAT DISSIPATION DEVICE
#22450HIGH PERFORMANCE COMPLIANT THERMAL INTERFACE COOLING STRUCTURES
#22451Heat sink mechanism
#22452Manufacturing method for a dual interface card
#22453Method of making a semiconductor device with residual amine group free multilayer interconnection
#22454PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#22455Method of fabricating semiconductor device having three-dimensional stacked structure
#22456Spray dispensing method for applying liquid metal
#22457METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#22458Method for fabricating a semiconductor device
#22459Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
#22460Manufacturing method of contact structure
#22461Method of forming a crack stop laser fuse with fixed passivation layer coverage
#22462Method for fabricating a nitride FET including passivation layers
#22463Method of manufacturing a system in package
#22464Method for high pressure gas annealing
#22465Method of manufacturing metal wiring and method of manufacturing semiconductor device
#22466LED lamp with a heat sink
#22467LED lamp with improved heat dissipating structure
#22468ELECTRONIC DEVICE
#22469Heat sink and electronic apparatus using the same
#22470HEAT DISSIPATION APPARATUS
#22471Heat sink fan
#22472Circuit board apparatus with induced air flow for heat dissipation
#22473Heat dissipation device having a fan mounted thereon
#22474Heat dissipation module
#22475Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire
#22476Method of aligning a substrate
#22477Remote control apparatus
#22478Wireless IC device
#22479Semiconductor integrated circuit
#22480Micro power converter
#22481Switching element, variable inductor, and electronic circuit device having circuit configuration incorporating the switching element and the variable inductor
#22482Method and structures for indexing dice
#22483Alignment for backside illumination sensor
#22484Phenoxyphenyl polysiloxane composition and method for making and using same
#22485RESIN FOR OPTICAL-SEMICONDUCTOR-ELEMENT ENCAPSULATION CONTAINING POLYALUMINOSILOXANE AND OPTICAL SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME
#22486Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
#22487INTERCONNECT STRUCTURE
#22488Semiconductor device and manufacturing method thereof
#22489Semiconductor device and method of manufacturing the same
#22490Nitride semiconductor device
#22491Semiconductor device with epitaxial C49-titanium silicide (TiSi) layer and method for fabricating the same
#22492CARBON NANOTUBE INTEGRATED CIRCUIT DEVICES AND METHODS OF FABRICATION THEREFOR USING PROTECTED CATALYST LAYERS
#22493Method for manufacturing semiconductor device
#22494GASKET SYSTEM FOR LIQUID-METAL THERMAL INTERFACE
#22495Flow distribution module and a stack of flow distribution modules
#22496Semiconductor packages
#22497Integrated circuit packages including sinuous lead frames
#22498Method for forming a tapered via of a semiconductor device
#22499Semiconductor wafer including cracking stopper structure and method of forming the same
#22500Capacitor and semiconductor device including the same