212006 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier Not covered by any one of groups , and
Top metal pads as local interconnectors of vertical transistors
#2402Semiconductor package with embedded capacitor and methods of manufacturing same
#2403Thin-film transistor device and display device using same
#2404Method for stacking core and uncore dies having landing slots
#2405Electrically conductive interconnect including via having increased contact surface area
#2406Interconnects through dielectric vias
#2407Semiconductor package structure and method for forming the same
#2408Semiconductor apparatus
#2409Substrate sprayer
#2410Semiconductor device with self-heat reducing layers
#2411Guard rings including semiconductor fins and regrown regions
#2412Methods for forming a semiconductor arrangement with multiple-height fins and substrate trenches
#2413Methods for forming a device having a capped through-substrate via structure
#2414Semiconductor package structure having first and second guard ring regions of different conductivity types and method for forming the same
#2415Seam healing of metal interconnects
#2416Semiconductor device having interconnect layer that includes dielectric segments interleaved with metal components
#2417Method of forming metal interconnection
#2418Trench formation using horn shaped spacer
#2419Semiconductor device structures comprising polycrystalline CVD diamond with improved near-substrate thermal conductivity
#2420X-ray obscuration film and related techniques
#2421Thermally conductive silicone composition and electrical/electronic apparatus
#2422Gas enclosure assembly and system
#2423Use of electrical power multiplication for power smoothing in power distribution
#2424Segmented power transistor
#2425Stacked semiconductor chip RGBZ sensor
#2426Optical devices and opto-electronic modules and methods for manufacturing the same
#2427Semiconductor integrated circuit device and a method of manufacturing the same
#2428Optoelectronic component
#2429Semiconductor component, lighting device and method for producing a semiconductor component
#2430Semiconductor device with separated main terminals
#2431Mixed lithography approach for E-beam and optical exposure using HSQ
#2432Semiconductor device and method of manufacturing the same
#2433Metal on both sides with clock gated-power and signal routing underneath
#2434Semiconductor device
#2435Mobile terminal
#2436Semiconductor device and method for manufacturing the same
#2437System to detect wafer arcing in semiconductor manufacturing equipment
#2438Stair step formation using at least two masks
#2439Semiconductor devices and methods of fabricating the same
#2440Semiconductor devices having an air gap
#2441Arrangement and method for manufacturing the same
#2442Method of fabricating III-nitride semiconductor dies
#2443Reliability testing method
#2444Radiating fin formed of aluminum alloy and method for producing the same
#2445Curable polysilsesquioxane compound, production method thereof, curable composition, cured product and use method of curable composition
#2446Lighting assembly
#2447Array cameras incorporating independently aligned lens stacks
#2448Thin film transistor substrate
#2449Method of forming body contact layouts for semiconductor structures
#2450Metal thin film resistor and process
#2451Inductor device
#2452Light-emitting device
#2453Detector, detector with lock-in amplifier, substrate, and method for manufacturing a detector
#2454Nonvolatile memory devices having single-layered gates
#2455Commutation cell
#2456Semiconductor device, manufacturing method for semiconductor device, and electronic device
#2457Method for direct integration of memory die to logic die without use of thru silicon vias (TSV)
#2458Multi-device flexible electronics system on a chip (SOC) process integration
#2459Resin molded body with RFIC package incorporated therein and method for manufacturing same
#2460Foil composite card
#2461Method of preventing pattern collapse
#2462Apparatus and method for placing stressors within an integrated circuit device to manage electromigration failures
#2463Integrated circuitry and methods for manufacturing same
#2464Electronic component housing package and electronic device
#2465Low-cost packaging for fluidic and device co-integration
#2466Monitor structures and methods of formation thereof
#2467Formation of nickel silicon and nickel germanium structure at staggered times
#2468Integrated circuit with a sidewall layer and an ultra-thick metal layer and method of making
#2469Via formation for cross-point memory
#2470Multilayer body and method for producing same
#2471Modular heat-transfer systems
#2472Wavelength conversion element, light-emitting semiconductor component including a wavelength conversion element, method for producing a wavelength conversion element and method for producing a light-emitting semiconductor component including a wavelength conversion element
#2473Method for manufacturing an optical unit and electronic apparatus
#2474Enhanced light extraction
#2475Substrate resistor and method of making same
#2476Thin-film transistor device and display device using same
#2477Semiconductor device having ESD protection structure
#2478Via placement within an integrated circuit
#2479Semiconductor device having air gap structures and method of fabricating thereof
#2480Semiconductor device
#2481Method for forming fuse pad and bond pad of integrated circuit
#2482Semiconductor device and method of manufacturing the same
#2483High quality electrical contacts between integrated circuit chips
#2484One-time programmable memory devices using FinFET technology
#2485Addressable test circuit and test method for key parameters of transistors
#2486Curable polysilsesquioxane compound, production method therefor, curable composition, cured product and use method of curable composition
#2487Thermosiphon systems for electronic devices
#2488Liquid-cooling heat dissipation device
#2489Intelligent voltage regulator
#2490Grounding system
#2491Lighting device with color scattering layer and method for producing a lighting device
#2492Electrocaloric device
#2493Semiconductor device and method of manufacturing semiconductor device
#2494Semiconductor device
#2495Vertical meander inductor for small core voltage regulators
#2496Thin film transistor array panel and method for manufacturing the same
#2497One-time programmable memory and method for making the same
#2498Double-side process silicon MOS and passive devices for RF front-end modules
#2499Electro-migration barrier for Cu interconnect
#2500Heat spreader with flexible tolerance mechanism
#2501Power-module substrate unit and power module
#2502Highly oriented graphite
#2503Etching apparatus
#2504Hermetically-sealed MEMS device and its fabrication
#2505Light emitting device and LED light bulb
#2506Incremental deployment of stand-alone and hierarchical adaptive cooling and energy harvesting arrangements for information technology
#2507Thin film transistor substrate and method of fabricating the same
#2508Semiconductor device and manufacturing method thereof
#2509Semiconductor device and peeling off method and method of manufacturing semiconductor device
#2510Device having an inter-layer via (ILV), and method of making same
#2511Semiconductor integrated circuit device
#2512Method of fabricating chip package with laser
#2513Invisible dummy features and method for forming the same
#2514Mitigating electromigration, in-rush current effects, IR-voltage drop, and jitter through metal line and via matrix insertion
#2515Gate tie-down enablement with inner spacer
#2516Methods for producing interconnects in semiconductor devices
#2517Self-aligned back end of line cut
#2518Semiconductor device having insulating layers containing oxygen and a barrier layer containing manganese
#2519One-time programmable device with integrated heat sink
#2520Passivated nanoparticles
#2521Aluminum-diamond composite, and heat dissipating component using same
#2522Liquid cooling block with shunt design and heat dissipating structure thereof
#2523Polyisocyanate cured product, and method for producing polyisocyanate cured product
#2524Process for producing bonded body and process for producing power module substrate
#2525Continuous boron nitride nanotube fibers
#2526Heat pipe embedded heat sink with integrated posts
#2527Voltage swing uniformity in radio-frequency switches
#2528Device for switching a semiconductor-based switch and sensor for detecting a current change velocity at a semiconductor-based switch
#2529Extended drain non-planar MOSFETs for electrostatic discharge (ESD) protection
#2530Color-converting substrate of light-emitting diode and method for producing same
#2531Light emitting diode device
#2532Forming silicide regions and resulting MOS devices
#2533Thin film transistor array substrate and method of manufacturing the same
#2534AVD hardmask for damascene patterning
#2535Semiconductor device and a method of increasing a resistance value of an electric fuse
#2536Integrated circuit having slot via and method of forming the same
#2537Semiconductor device including source/drain contact having height below gate stack
#2538Through-body-via isolated coaxial capacitor and techniques for forming same
#2539Pad structures and wiring structures in a vertical type semiconductor device
#2540Method of manufacturing a flexible substrate with carbon nanotube vias and corresponding flexible substrate
#2541Power converter and method for manufacturing power converter
#2542Self-aligned contacts
#2543Magnetic trap for cylindrical diamagnetic materials
#2544Method of manufacturing semiconductor device including copper interconnections
#2545Removal of particles on back side of wafer
#2546Periodic patterns and technique to control misalignment between two layers
#2547Resin-impregnated boron nitride sintered body and use for same
#2548MEMS device
#2549Electronic component-use package and piezoelectric device
#2550Printed electronics
#2551Resin multilayer substrate and method of manufacturing the same
#2552Light-emitting device
#2553Sensor package with cooling feature
#2554Metal oxide TFT with improved source/drain contacts and reliability
#2555Turn-off power semiconductor device with improved centering and fixing of a gate ring, and method for manufacturing the same
#2556Metal line connection for improved RRAM reliability, semiconductor arrangement comprising the same, and manufacture thereof
#2557Solid-state imaging device, method for manufacturing same, and electronic device
#2558Method of making a sensor package with cooling feature
#2559Capacitors in integrated circuits and methods of fabrication thereof
#2560Semiconductor chip for protecting against electrostatic discharges
#2561Interconnection structure
#2562Interconnect arrangement with stress-reducing structure and method of fabricating the same
#2563Method of manufacturing a semiconductor device having groove-shaped via-hole
#2564Cobalt CVD
#2565Semiconductor chip arrangement and method thereof
#2566Method of manufacture for a semiconductor device
#2567Stacked chip layout having overlapped regions
#2568Hybrid computing module
#2569Hybrid computing module
#2570Hybrid computing module
#2571Active cooling debris bypass fin pack
#2572Semiconductor device and display device
#2573Thermal ground plane
#2574Semiconductor device and busbar
#2575Semiconductor constructions and memory arrays
#2576Optoelectronic semiconductor component
#2577Light-emitting semiconductor chip
#2578Electrode connecting structure including adhesion layer and electronic device including the same
#2579Localized strain relief for an integrated circuit
#2580Display device
#2581Light emitting structure and mount
#2582Semiconductor device, electrical device system, and method of producing semiconductor device
#2583Conductive line patterning
#2584Device for prevention of integrated circuit chip counterfeiting
#2585Self-destructing chip
#2586Apparatuses including stair-step structures and methods of forming the same
#2587Lead frame, semiconductor device, method for manufacturing lead frame, and method for manufacturing semiconductor device
#2588Electronic component cooler
#2589Contact plug without seam hole and methods of forming the same
#2590Lighting device having plural light-sources and light guide with wavelength converting means and out coupling means
#2591Epoxy resin composition, semiconductor sealing agent, and semiconductor device
#2592Silicone gel composition
#2593Planar cavity MEMS and related structures, methods of manufacture and design structures
#2594LED display and manufacturing method thereof
#2595Transmission line for 3D integrated circuit
#2596Semiconductor device
#2597Through-body via liner deposition
#2598Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#2599Tungsten alloys in semiconductor devices
#2600Necked interconnect fuse structure for integrated circuits
#2601Method of semiconductor integrated circuit fabrication
#2602Interconnect structure for semiconductor devices
#2603Compressible thermal interface materials
#2604Semiconductor device
#2605Die packages and methods of manufacture thereof
#2606Stacked semiconductor device assembly in computer system
#2607Integrated biosensor
#2608Circuit module
#2609Method for manufacturing silicon carbide semiconductor device
#2610Systems and methods for integrating different channel materials into a CMOS circuit by using a semiconductor structure having multiple transistor layers
#2611Semiconductor device
#2612Guard ring method for semiconductor devices
#2613Semiconductor device and method of producing semiconductor device
#2614Methods of manufacturing a semiconductor device by forming a separation trench
#2615Semiconductor interconnect structures
#2616Thickened stress relief and power distribution layer
#2617Semiconductor device having backside interconnect structure on through substrate via and method of forming the same
#2618Electronic device
#2619Wafer level package solder barrier used as vacuum getter
#2620Silicon-on-insulator device and intermetallic dielectric layer structure thereof and manufacturing method
#2621Chip with protection function and method for producing same
#2622Resin composition, resin film, and semiconductor device and method for manufacturing same
#2623Exfoliated graphite materials and composite materials and devices for thermal management
#2624Flexible substrate with conductive layer for mounting LED arrays
#2625Optoelectronic packaging assemblies
#2626Charge compensation device and manufacturing therefor
#2627Light emitting diode chip
#2628Semiconductor device and manufacturing method thereof
#2629Light emitting device
#2630Wafer backside interconnect structure connected to TSVs
#2631Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
#2632Nanoparticle thermal interface agents for reducing thermal conductance resistance
#2633Method of fabricating double sided Si(Ge)/Sapphire/III-nitride hybrid structure
#2634Enable input buffer coupling enable pad, functional circuitry, test circuit
#2635Chemical sensor package for highly pressured environment
#2636Lighting source using solid state emitter and phosphor materials
#2637Heat transfer device
#2638Manufacturing process for thermosiphon heat exchanger
#2639Semiconductor device, related manufacturing method, and related electronic device
#2640Method for producing an LED module and LED module
#2641Illumination method and light-emitting device
#2642Epitaxial structure and method for making the same
#2643Vertical semiconductor device and manufacturing method thereof
#2644Semiconductor device
#2645Light emitting device
#2646Multi-wafer stacking by Ox-Ox bonding
#2647Self aligned via in integrated circuit
#2648Optimized wires for resistance or electromigration
#2649Cooler and semiconductor module using same
#2650Optimized wires for resistance or electromigration
#2651Method for forming interconnect structure
#2652Array structure of single-ploy nonvolatile memory
#2653Fluid heat exchange systems
#2654Spiral LED filament and light bulb using spiral LED filament
#2655Three-dimensional multiple-layer microfluidic micro-droplet arrays for chemical and biochemical microreactors, miniature bioreactors, heat transfer, and other applications
#2656Cooling methods for electronic components
#2657Optoelectronic semiconductor device
#2658Contact techniques and configurations for reducing parasitic resistance in nanowire transistors
#2659CMOS compatible thermopile with low impedance contact
#2660Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods
#2661Semiconductor device having an effective use of the conductive layer formed in the same process as one electrode
#2662Static random access memory (SRAM) device
#2663Integrated circuits and manufacturing methods thereof
#2664Back-to-back solid state lighting devices and associated methods
#2665Through silicon via device having low stress, thin film gaps and methods for forming the same
#2666Additional etching to increase via contact area
#2667Integrated package design with wire leads for package-on-package product
#2668Multilayer heat-conductive sheet, and manufacturing method for multilayer heat-conductive sheet
#2669Semiconductor package including substrates spaced by at least one electrical connecting element
#2670Method for forming interconnects
#2671Interconnects having sealing structures to enable selective metal capping layers
#2672Polyimide resin, resin composition using same, and laminated film
#2673Overlay and semiconductor process control using a wafer geometry metric
#2674Interposer with lattice construction and embedded conductive metal structures
#2675Method of reducing residual contamination in singulated semiconductor die
#2676Methods of forming staircase-shaped connection structures of three-dimensional semiconductor devices
#2677Semiconductor memory system
#2678Electronic device for heating an integrated structure, for example an MOS transistor
#2679Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board
#2680Process for producing package for mounting a semiconductor element and mold release film
#2681Electronic system for a system for neural applications
#2682Method of manufacturing a package for embedding one or more electronic components
#2683Light emitting module, a lamp, a luminaire and a method of illuminating an object
#2684Light emitting device
#2685Wafer-level light emitting diode and wafer-level light emitting diode package
#2686Semiconductor integrated circuit device
#2687Stacked bit line dual word line nonvolatile memory
#2688Lighting device
#2689Cooler
#2690Staggered via redistribution layer (RDL) for a package and a method for forming the same
#2691Stacked semiconductor device
#2692Semiconductor device having antenna and sensor elements
#2693Resin composition for sealing electronic device, and electronic device
#2694Assembly architecture employing organic support for compact and improved assembly throughput
#2695Mask plate for coating glass cement and coating method using the same
#2696Compound semiconductor device and method of manufacturing the same
#2697Gateless switch with capacitively-coupled contacts
#2698Semiconductor device
#2699Lateral bipolar transistor
#2700Capacitors in integrated circuits and methods of fabrication thereof