212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Carrier board structure with embedded semiconductor chip and fabrication method thereof
#6602METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
#6603Solder Interconnect Joints For A Semiconductor Package
#6604Electronic device including a conductive stud over a bonding pad region
#6605METHOD FOR SEPARATING PACKAGE OF WLP
#6606Plate structure having chip embedded therein and the manufacturing method of the same
#6607Interposer and semiconductor package with reduced contact area
#6608Semiconductor package device
#6609Electrical through contact
#6610Method for placing material onto a target board by means of a transfer board
#6611Electronic system modules and method of fabrication
#6612SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD
#6613Film splicer
#6614Multiplexed RF isolator circuit
#6615Image alignment method for binocular eyewear displays
#6616Multi-die DC-DC buck power converter with efficient packaging
#6617Methods for providing and using grid array packages
#6618Microelectronic device connection structure
#6619Semiconductor device and its wiring method
#6620Semiconductor device and its wiring method
#6621Semiconductor device
#6622Semiconductor device with interface peeling preventing rewiring layer
#6623Solder bumps in flip-chip technologies
#6624Semiconductor device and manufacturing method for the same
#6625Substrate and process for semiconductor flip chip package
#6626BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME
#6627Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture
#6628Array-Processed Stacked Semiconductor Packages
#6629Semiconductor device
#6630Fabrication method and structure of PCB assembly, and tool for assembly thereof
#6631Bonding apparatus
#6632Method for self-assembling microstructures
#6633Bonding apparatus and method for cleaning tip of a bonding tool
#6634ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS
#6635Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit
#6636Single chip USB packages by various assembly methods
#6637Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle
#6638Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
#6639Method to build robust mechanical structures on substrate surfaces
#6640Electronic component module and radio comunications equipment
#6641Flip chip mounting process and flip chip assembly
#6642Semiconductor device and method of manufacturing the same
#6643SEMICONDUCTOR CHIP
#6644Semiconductor integrated circuit device
#6645Semiconductor device with reduced contact resistance
#6646BLM structure for application to copper pad
#6647Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device
#6648Chip having two groups of chip contacts
#6649Semiconductor device and manufacturing method therefor
#6650Electronic circuit in a package-on-package configuration and method for producing the same
#6651Pillar Bump Package Technology
#6652Surface mount multichip devices
#6653Interconnect structure for semiconductor package
#6654Semiconductor module with a power semiconductor chip and a passive component and method for producing the same
#6655Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device
#6656Semiconductor device and an information management system therefor
#6657Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package
#6658Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
#6659Automatic level adjustment for die bonder
#6660Conductive adhesive rework method
#6661Method and apparatus for microstructure assembly
#6662Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
#6663Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein
#6664System and method of attenuating electromagnetic interference with a grounded top film
#6665Diffusion soldered semiconductor device
#6666CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME
#6667Transformer coils for providing voltage isolation
#6668ESD protection circuit for semiconductor device
#6669Component and method for producing a component
#6670Chip structure
#6671Method for producing chip packages, and chip package produced in this way
#6672Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction
#6673Semiconductor device and method of producing the same
#6674Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween
#6675Semiconductor device, electro-optical device, and method for manufacturing semiconductor device
#6676Method of manufacturing semiconductor device
#6677Methods and apparatus for packaging integrated circuit devices
#6678Semiconductor device, electronic card and pad rearrangement substrate
#6679EMI ABSORBING GAP FILLING MATERIAL
#6680Semiconductor Package Having Improved Adhesion and Solderability
#6681Semiconductor with reduced pad pitch
#6682Semiconductor device and method of manufacturing the same
#6683Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#6684Wire bonding apparatus
#6685Electronic parts packaging structure and method of manufacturing the same
#6686Sheet Peeling Apparatus and Peeling Method
#6687Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film
#6688Methods and systems for laser assisted wirebonding
#6689Arrangement for solder bump formation on wafers
#6690Structure of high performance combo chip and processing method
#6691Integrated circuit package, panel and methods of manufacturing the same
#6692Semiconductor device with electrode pad having probe mark
#6693Electronic device with EMI screen and packing process thereof
#6694Multilayer printed circuit board
#6695Package board integrated with power supply
#6696Thermally conductive composite and uses for microelectronic packaging
#6697Misalignment detection devices
#6698Copper bonding compatible bond pad structure and method
#6699Solderability Improvement Method for Leaded Semiconductor Package
#6700Composite multi-layer substrate and module using the substrate
#6701Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
#6702Thermal release adhesive-backed carrier tapes
#6703Multi-chip semiconductor connector assemblies
#6704Method of Manufacturing a Semiconductor Device
#6705Semiconductor device and method for manufacturing semiconductor device
#6706Semiconductor device with back surface electrode including a stress relaxation film
#6707Method and apparatus for measuring oscillation amplitude of an ultrasonic device
#6708Nickel tin bonding system for semiconductor wafers and devices
#6709Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices
#6710Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture
#6711Semiconductor device and method of manufacturing the semiconductor device
#6712Fine pitch microcontacts and method for forming thereof
#6713IC chip, antenna, and manufacturing method of the IC chip and the antenna
#6714Semiconductor package having optimal interval between bond fingers for reduced substrate size
#6715Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
#6716Electronic package and semiconductor device using the same
#6717System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System
#6718Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same
#6719Ball forming device in a bonding apparatus and ball forming method
#6720Printed circuit board and method of manufacturing the same
#6721Circuit-connecting material and circuit terminal connected structure and connecting method
#6722Capping of metal interconnects in integrated circuit electronic devices
#6723Die configurations and methods of manufacture
#6724Method for applying solder to redistribution lines
#6725Method of manufacturing a semiconductor device
#6726Method for bonding semiconductor chip
#6727Au bonding wire for semiconductor device
#6728BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
#6729Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
#6730Die package and probe card structures and fabrication methods
#6731Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#6732Semiconductor Module Having Low Thermal Load
#6733Semiconductor apparatus with decoupling capacitor
#6734Semiconductor device, and life prediction circuit and life prediction method for semiconductor device
#6735Micro universal serial bus (USB) memory package
#6736Semiconductor device, manufacturing method and apparatus for the same
#6737Molding methods to manufacture single-chip chip-on-board USB device
#6738Top layers of metal for high performance IC's
#6739Top layers of metal for high performance IC's
#6740Manufacturing method of semiconductor device
#6741Interposer containing bypass capacitors for reducing voltage noise in an IC device
#6742Micro power converter and method of manufacturing same
#6743Integrated circuit (IC) package stacking and IC packages formed by same
#6744Multilayer bonding ribbon
#6745Resin Paste For Die Bonding And Its Use
#6746Top layers of metal for high performance IC's
#6747Embedded chip package structure
#6748INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING
#6749Via layout with via groups placed in interlocked arrangement
#6750Top layers of metal for high performance IC's
#6751Top layers of metal for high performance IC's
#6752Top layers of metal for high performance IC's
#6753Top layers of metal for high performance IC's
#6754Top layers of metal for high performance IC's
#6755Top layers of metal for high performance IC's
#6756Top layers of metal for high performance IC's
#6757Top layers of metal for high performance IC's
#6758Top layers of metal for high performance IC's
#6759Top layers of metal for high performance IC's
#6760Top layers of metal for high performance IC's
#6761Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#6762CHIP STRUCTURE
#6763Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
#6764Electrically conductive connection, electronic component and method for their production
#6765Semiconductor package having dimpled plate interconnections
#6766Stacking structure of chip package
#6767Thermal improvement for hotspots on dies in integrated circuit packages
#6768IC chip package, and image display apparatus using same
#6769Multi-chip stacked package with reduced thickness
#6770Method of wafer plating
#6771Top layers of metal for high performance IC's
#6772Semiconductor device capable of suppressing current concentration in pad and its manufacture method
#6773Fabrication method of semiconductor integrated circuit device
#6774Electronic device and production method thereof
#6775MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#6776Method of manufacturing an integrated circuit
#6777Method of fixing curved circuit board and wire bonding apparatus
#6778Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
#6779Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag
#6780Electronics package and associated method
#6781Electronic circuit arrangement
#6782Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#6783Top layers of metal for high performance IC's
#6784Top layers of metal for high performance IC's
#6785Top layers of metal for high performance IC's
#6786Top layers of metal for high performance IC's
#6787Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#6788Semiconductor device having improved contacts
#6789Top layers of metal for high performance IC's
#6790Wiring board and method for manufacturing the same, and semiconductor device
#6791Semiconductor Device
#6792Method of making thermally enhanced substrate-base package
#6793Mounting integrated circuit dies for high frequency signal isolation
#6794Semiconductor device package utilizing proud interconnect material
#6795Power semiconductor device connected in distinct layers of plastic
#6796Electronic Part And Method Of Producing The Same
#6797Semiconductor device
#6798Interconnections resistant to wicking
#6799Semiconductor device having a bonding pad and fuse and method for forming the same
#6800SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#6801INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE
#6802Wire bonding method for forming low-loop profiles
#6803SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
#6804Assembly and method of assembling by soldering an object and a support
#6805HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#6806Resonating conductive traces and methods of using same for bonding components
#6807Top layers of metal for high performance IC's
#6808Top layers of metal for high performance IC's
#6809Semiconductor device and method for fabricating the same
#6810Top layers of metal for high performance IC's
#6811Top layers of metal for high performance IC's
#6812Method and system for fabricating a semiconductor device
#6813METHOD OF FORMING A TRACE EMBEDDED PACKAGE
#6814Semiconductor device encapsulated with resin composition
#6815METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#6816Encapsulated electronic device
#6817Semiconductor device
#6818Top layers of metal for high performance IC's
#6819Top layers of metal for high performance IC's
#6820Top layers of metal for high performance IC's
#6821Top layers of metal for high performance IC's
#6822Top layers of metal for high performance IC's
#6823Top layers of metal for high performance IC's
#6824Top layers of metal for high performance IC's
#6825Top layers of metal for high performance IC's
#6826Interlayer dielectric and pre-applied die attach adhesive materials
#6827Top layers of metal for high performance IC's
#6828Semiconductor device and method for fabricating the same
#6829System and method to reduce metal series resistance of bumped chip
#6830POWER SEMICONDUCTOR ARRANGEMENT WITH SOLDERED CLIP CONNECTION AND METHOD
#6831Semiconductor circuit arrangement
#6832Modular bonding pad structure and method
#6833Electronic assemblies and systems with filled no-flow underfill
#6834Producing thin integrated semiconductor devices
#6835Semiconductor integrated circuit device
#6836Semiconductor device having a bonding wire and method for manufacturing the same
#6837Side stacking apparatus and method
#6838Lead frame and method of manufacturing the same and semiconductor device
#6839Leadframe IC packages having top and bottom integrated heat spreaders
#6840Semiconductor device and method for manufacturing the same
#6841Light-emitting device manufacturing method and light-emitting device
#6842Method for producing a chip-substrate connection
#6843Spring connector for making electrical contact at semiconductor scales
#6844Barrier layer for fine-pitch mask-based substrate bumping
#6845Fabrication method of semiconductor device
#6846Separation method of semiconductor device
#6847Electronic Component Mounting Structure
#6848Semiconductor component with connecting elements and method for producing the same
#6849Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
#6850Top layers of metal for high performance IC's
#6851Top layers of metal for high performance IC's
#6852Top layers of metal for high performance IC's
#6853Top layers of metal for high performance IC's
#6854Top layers of metal for high performance IC's
#6855Top layers of metal for high performance IC's
#6856Top layers of metal for high performance IC's
#6857Top layers of metal for high performance IC's
#6858Top layers of metal for high performance IC's
#6859Top layers of metal for high performance IC's
#6860Device Comprising Circuit Elements Connected By Bonding Bump Structure
#6861Integrated circuit package having exposed thermally conducting body
#6862Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate
#6863Semiconductor device
#6864SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#6865METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNECTION
#6866Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
#6867System and Method for Low Temperature Plasma Enhanced Bonding
#6868Conductive adhesive composition
#6869Electronic components with plurality of contoured microelectronic spring contacts
#6870Apparatus For Aligning Microchips On Substrate And Method For The Same
#6871Stub-tuned wirebond package
#6872Integrated circuit package and multi-layer lead frame utilized
#6873Integrated circuit having pads and input/output (I/O) cells
#6874Metallization layer for a power semiconductor device
#6875INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
#6876Manufacturing a bump electrode with roughened face
#6877Semiconductor device and method of manufacturing the same
#6878Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
#6879No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#6880Wafer level semiconductor chip packages and methods of making the same
#6881Flip chip MLP with folded heat sink
#6882Copper straps
#6883Top layers of metal for high performance IC's
#6884Multilayer electronic component, electronic device, and method for manufacturing multilayer electronic component
#6885Method for manufacturing an electronics module
#6886Method of producing an electronic component
#6887Method for forming a semiconductor on insulator structure
#6888Micro-package, multi-stack micro-package, and manufacturing method therefor
#6889Method of manufacturing a semiconductor device
#6890Super high density module with integrated wafer level packages
#6891Module With Built-In Semiconductor And Method For Manufacturing The Module
#6892Method for fabricating semiconductor package with multi-layer die contact and external contact
#6893SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#6894Semiconductor device having a chip stack on a rewiring plate
#6895Semiconductor device
#6896Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
#6897Semiconductor device and method of producing the same
#6898Top layers of metal for high performance IC's
#6899Top layers of metal for high performance IC's
#6900Top layers of metal for high performance IC's