Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Embedded chip package

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Stacked chip package structure with leadframe having inner leads with transfer pad

Semiconductor package and method of forming wire loop of semiconductor package

Semiconductor device and a method of manufacturing the same

Stacked chip packaging with heat sink structure

Semiconductor device, method of manufacturing the same

Micropad for bonding and a method therefor

Array quad flat no-lead package and method of forming same

Semiconductor integrated circuit and method for manufacturing the same

Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same

Method for mounting electronic component on substrate and method for forming solder surface

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INCLUDING A CONNECTION CONTACT ON A SEMICONDUCTOR BODY

Flip chip metallization method and devices

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

INTEGRATED CIRCUIT DIE/PACKAGE INTERCONNECT

Sawn power package and method of fabricating same

Stacked die with a recess in a die BGA package

Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates

Low profile ball grid array (BGA) package with exposed die and method of making same

Apparatus and method for connecting components

METHODS FOR FORMING PATTERNS OF A FILLED DIELECTRIC MATERIAL ON SUBSTRATES

Single chip USB packages with swivel cover

Electronics module and method for manufacturing the same

Three dimensional device integration method and integrated device

High performance system-on-chip using post passivation process

SEMICONDUCTOR DEVICE

Semiconductor module arrangement

Metallised film for sheet contacting

Stackable micropackages and stacked modules

Single chip USB packages with contact-pins cover

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device with recess portion over pad electrode

Semiconductor Device and Method of Fabricating the Same

Probe arrays and method for making

Wire bonding and wire bonding method

Electronic device handler for a bonding apparatus

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Microelectronic packages fabricated at the wafer level and methods therefor

Process for fabricating electronic components using liquid injection molding

Semiconductor device manufacturing method and manufacturing apparatus

Manufacturing device of semiconductor package and manufacturing method of semiconductor package

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

Method for fabricating conformal electrodes using non-wettable surface and liquid metal

Dicing die-bonding film

Circuit board assembly

Semiconductor device and method for manufacturing the same

ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE

Semiconductor device with bonding pad support structure

Structure and manufacturing method of a chip scale package

Stacked semiconductor package having fan-out structure through wire bonding

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

Semiconductor device and wire bonding method therefor

Device having several contact areas

Semiconductor integrated circuit device having reduced terminals and I/O area

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

FLEXIBLE FILM SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor apparatus

Semiconductor device having recessed connector portions

Bumping electronic components using transfer substrates

RESONATOR, ULTRASONIC DIE BONDING HEAD, AND ULTRASONIC DIE BONDING APPARATUS

Two-stage die-bonding method for simultaneous die-bonding of multiple dies

Light emitting device package and manufacture method of light emitting device package

Semiconductor device and an information management system therefor

Gold-Tin Solder Joints Having Reduced Embrittlement

Bonding and probing pad structures

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device

Edge connect wafer level stacking with leads extending along edges

Stacked structures and methods of fabricating stacked structures

Light emitting device

SEMICONDUCTOR DEVICE

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Processes and packaging for high voltage integrated circuits, electronic devices, and circuits

Device transfer method and display apparatus

Manufacturing Method of Semiconductor Apparatus

Wiring board and semiconductor device

Electronic device including a nickel-palladium alloy layer

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Method of making a light emitting device having a molded encapsulant

METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMANCE OF SEMICONDUCTOR DEVICES BY SURFACE MODIFICATION

Semiconductor element comprising a supporting structure and production method

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Semiconductor-embedded substrate and manufacturing method thereof

Power semiconductor arrangement

Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON

Process of forming an electronic device including an inductor

Sensor-type package and fabrication method thereof

Arrangement for cooling a power semiconductor module

Method of assembling carbon nanotube reinforced solder caps

Copper bonding or superfine wire with improved bonding and corrosion properties

Manufacturing method of a semiconductor device having a package dicing

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Manufacturing method of semiconductor device

Nanoscopic Assurance Coating for Lead-Free Solders

Wire Bump Material

Methods of connecting an antenna to a transponder chip

MOULD HAVING NANO-SCALED HOLES

Semiconductor device and manufacturing method thereof

INTEGRATED CIRCUIT INTERCONNECTION DEVICES AND METHODS

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Electronic device and method for production

Wire pad of semiconductor device

Semiconductor device and method of manufacturing the same

Circuit substrate for preventing warpage and package using the same

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

SEMICONDUCTOR PACKAGE COMPRISING ALIGNMENT MEMBERS

ELECTRONIC DEVICE AND PRODUCTION METHOD

Pressure-contact semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Multi-part capillary

Methods and apparatus to dispense adhesive for semiconductor packaging

LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD FOR MODULE USING THE LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING APPARATUS

Method of forming an inlay substrate having an antenna wire

Method of actuating implanted medical device

Method for fabricating resin-molded semiconductor device having posts with bumps

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

Optical semiconductor device and method of manufacturing thereof

Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage

Semiconductor apparatus and method of producing the same

Pad over active circuit system and method with meshed support structure

Bonding pad for contacting a device

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Castellation wafer level packaging of integrated circuit chips

Semiconductor device and method for fabricating the same

Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same

Wafer level chip package and a method of fabricating thereof

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaged microelectronic components with terminals exposed through encapsulant

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Chip Comprising at Least One Test Contact Configuration

Printed circuit board for package and manufacturing method thereof

Process for manufacturing semiconductor devices

Process of fabricating a semiconductor package

Adhesive film for circuit connection, and circuit connection structure

Circuit-connecting material and circuit terminal connected structure and connecting method

Flip chip packaging method that protects the sensing area of an image sensor from contamination

METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER

Extendable connector and network

Method for low temperature bonding and bonded structure

Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package

Bonding wire and bond using a bonding wire

Copper alloy bonding wire for semiconductor device

Structure of mounting electronic component

Methods and substrates to connect an electrical member to a substrate to form a bonded structure

Power semiconductor module

Stacked chip package structure with leadframe having bus bar

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Mounting structure for IC tag and IC chip for mounting

Method of producing a semiconductor package

Chip-stacked package structure having leadframe with multi-piece bus bar

Chip-stacked package structure for lead frame having bus bars with transfer pads

Electronic device having wiring substrate and lead frame

Semiconductor device package and manufacturing method

Packaged stacked semiconductor device and method for manufacturing the same

Stacked dual MOSFET package

Semiconductor device

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

Circuit-connecting material and circuit terminal connected structure and connecting method

Method of manufacturing a combined multilayer circuit board having embedded chips

Method of manufacturing a semiconductor device

Lead pin for mounting semiconductor and printed wiring board

Printed circuit board

Component embedded printed circuit board

Compact impedance transformation circuit

Semiconductor memory device and semiconductor device

IC package with a protective encapsulant and a stiffening encapsulant

Semiconductor device, relay chip, and method for producing relay chip

Distributed semiconductor device methods, apparatus, and systems

Semiconductor device and method of producing the same

Semiconductor apparatus and manufacturing method of semiconductor apparatus

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Low fabrication cost, fine pitch and high reliability solder bump

Electronic device and method of manufacturing the same

MICROELECTRONIC DEVICE HAVING A PLURALITY OF STACKED MICROELECTRONIC DIES AND METHODS FOR MANUFACTURING SUCH MICROELECTRONIC ASSEMBLIES

SEMICONDUCTOR COMPONENT WITH COOLING APPARATUS

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Wire bonding method, wire bonding apparatus and semiconductor device

SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR

Semiconductor device and manufacturing method thereof

Power electronic package having two substrates with multiple electronic components

Semiconductor device

Semiconductor die package including stacked dice and heat sink structures

POWER SEMICONDUCTION DEVICE AND CIRCUIT MODULE HAVING SUCH POWER SEMICONDUCTION DEVICE

POWER MODULE WITH LAMINAR INTERCONNECT

COMPOSITIONS FOR USE IN ELECTRONICS DEVICES

Circuit-connecting material and circuit terminal connected structure and connecting method

Wire bonders and methods of wire-bonding

Method for low temperature bonding and bonded structure

Method of manufacturing a component-embedded printed circuit board

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Low fabrication cost, fine pitch and high reliability solder bump

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Adhesion by plasma conditioning of semiconductor chip

Method for producing semiconductor device

Semiconductor device

Thin flip-chip method

Semiconductor device including through electrode and method of manufacturing the same

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Implantable microelectronic device and method of manufacture

Top layers of metal for high performance IC's

Chip structure and process for forming the same

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN AND METHOD OF MANUFACTURING THE SAME

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Electric component with a flip-chip construction

Packaged microdevices and methods for manufacturing packaged microdevices

Semiconductor device, substrate for producing semiconductor device and method of producing them

LED with phosphor tile and overmolded phosphor in lens

Process of forming an electronic device including a barrier layer

Resonator, ultrasonic head, and ultrasonic bonder using the same

Resonator, ultrasonic head, and ultrasonic bonder using the same

Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution

Semiconductor device and method for manufacturing same

Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Manufacturing method for resin sealed semiconductor device

Semiconductor die package using leadframe and clip and method of manufacturing

Electronic module

Plastic overmolded packages with molded lid attachments

Semiconductor device package and manufacturing method

Circuit substrate and semiconductor device

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

High performance system-on-chip using post passivation process

Semiconductor chip structure

High performance system-on-chip using post passivation process

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Microelectronic package

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip

Power semiconductor component

Component-embedded multilayer printed wiring board and manufacturing method thereof

Diamond heat sink

Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film

METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED

Interconnect for improved die to substrate electrical coupling

Semiconductor bonding and layer transfer method

Chip package and method for fabricating the same

Method of manufacturing semiconductor device

High performance system-on-chip using post passivation process

Process for packaging components, and packaged components

Solder elements with columnar structures and methods of making the same

Method for producing a component and device having a component

SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN

Method for embedding a component in a base

Semiconductor integrated circuit device

Web process interconnect in electronic assemblies

Interconnection structure of integrated circuit chip

Conductive connection structure formed on the surface of circuit board and manufacturing method thereof

WIREBOND-LESS SEMICONDUCTOR PACKAGE

High density electronic packages

Bond Wireless Package

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Package structure with leadframe on offset chip-stacked structure

Electronic device and method for producing a device

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Mounting device for electrical component

Acceleration sensor

Ball transferring method and apparatus

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

SEMICONDUCTOR MEMORY DEVICE

Semiconductor device and method of manufacturing same

Structure and method of making sealed capped chips

Method of manufacturing a semiconductor device

Chip scale package and method for manufacturing the same

Method of fabricating a stacked die having a recess in a die BGA package

Method of fabricating microelectronic devices

Method of assembling displays on substrates

Multiplexed RF isolator

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

Semiconductor switching module and method

Chip-stacked package structure