212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Top layers of metal for high performance IC's
#6902Top layers of metal for high performance IC's
#6903Top layers of metal for high performance IC's
#6904Electronic component built-in substrate and method of manufacturing the same
#6905Circuit board, method for manufacturing the same, and semiconductor device
#6906Stacked bump structure and manufacturing method thereof
#6907COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
#6908Method of fabricating microelectronic devices
#6909INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS
#6910Integrated circuit device with semiconductor device components embedded in plastic housing composition
#6911Semiconductor device having shifted stacked chips
#6912Lead frame and semiconductor device using the same
#6913Component mounting apparatus and component mounting method
#6914Method and system for fabricating a semiconductor device
#6915Process for fabricating chip package structure
#6916Printed circuit board
#6917Increased interconnect density electronic package and method of fabrication
#6918Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips
#6919Semiconductor device including a buffer layer structure for reducing stress
#6920Process for forming bumps and solder bump
#6921Test pads on flash memory cards
#6922Wafer level stack structure for system-in-package and method thereof
#6923Arrangement for welding workpieces by means of an ultrasonic device
#6924CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD
#6925Method of making a radio frequency identification (RFID) tag
#6926Systems and methods for high density multi-component modules
#6927Method of forming stackable package
#69283D interconnect with protruding contacts
#6929Oriented self-location of microstructures with alignment structures
#6930INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME
#6931Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#6932Semiconductor device having a smaller electrostatic capacitance electrode
#6933Bump structure, method of forming bump structure, and semiconductor apparatus using the same
#6934Circuit apparatus and method of fabricating the apparatus
#6935Packaging of integrated circuits to lead frames
#6936Semiconductor device
#6937Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
#6938Polymer matrices for polymer solder hybrid materials
#6939Semiconductor device with via hole of uneven width
#6940Method of manufacturing semiconductor apparatus
#6941Method of dividing an adhesive film bonded to a wafer
#6942Method for fabricating semiconductor package free of substrate
#6943Method for fabricating multi-chip semiconductor package
#6944Semiconductor device and method of manufacturing the semiconductor device
#6945Semiconductor die package including multiple dies and a common node structure
#6946Surface mounting electronic component and manufacturing method thereof
#6947Inductor element and method for production thereof, and semiconductor module with inductor element
#6948Filter device substrate and filter device
#6949Semiconductor device
#6950Power semiconductor component, power semiconductor device as well as methods for their production
#6951Semiconductor power module including epoxy resin coating
#6952Semiconductor device and method of manufacturing the same
#6953Semiconductor components having encapsulated through wire interconnects (TWI)
#6954Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component
#6955Package for optical device and method of manufacturing the same
#6956MULTI-DIE INDUCTOR
#6957Semiconductor device using semiconductor chip
#6958Fill head for injection molding of solder
#6959Universal mold for injection molding of solder
#6960Tail wire cutting method and bonding apparatus
#6961Method for Electroplating and Contact Projection Arrangement
#6962Fabrication method for electronic system modules
#6963Method of manufacturing a through electrode
#6964POP Semiconductor Device Manufacturing Method
#6965Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
#6966Flip-chip mounting method and bump formation method
#6967Semiconductor memory device and defect remedying method thereof
#6968Solder joint flip chip interconnection having relief structure
#6969Wiring board, semiconductor device using the same, and method for manufacturing wiring board
#6970Conductive structures including titanium-tungsten base layers
#6971Semiconductor device, substrate for producing semiconductor device and method of producing them
#6972Overmolded semiconductor package with a wirebond cage for EMI shielding
#6973Stacked semiconductor device
#6974Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
#6975Optical display package and the method thereof
#6976Adhesive sheet, semiconductor device, and process for producing semiconductor device
#6977Alternative flip chip in leaded molded package design and method for manufacture
#6978Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes
#6979Semiconductor light emitting device with first and second leads
#6980PROCESS FOR PRODUCING POWER SEMICONDUCTOR COMPONENTS USING A MARKER
#6981Semiconductor device and method of producing the same
#6982Method for bonding a semiconductor substrate to a metal substrate
#6983Apparatus and method for signal bus line layout in semiconductor device
#6984Bilayer Laminated Film for Bump Formation and Method of Bump Formation
#6985Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same
#6986Bonding Wire and Integrated Circuit Device Using the Same
#6987Semiconductor die packages using thin dies and metal substrates
#6988Chip with power and signal pads connected to power and signal lines on substrate
#6989Space transformer having multi-layer pad structures
#6990High frequency IC package and method for fabricating the same
#6991Hybrid flip-chip and wire-bond connection package system
#6992ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#6993Electronic device with selective nickel palladium gold plated leadframe and method of making the same
#6994Power semiconductor module and fabrication method
#6995Chip scale surface mount package for semiconductor device and process of fabricating the same
#6996Semiconductor device and method of manufacturing the same
#6997Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangement
#6998Electronic device substrate and its fabrication method, and electronic device and its fabrication method
#6999Devices with microjetted polymer standoffs
#7000Semiconductor device having adhesion increasing film to prevent peeling
#7001Semiconductor device and manufacturing method thereof
#7002Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#7003Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#7004Methods and materials useful for chip stacking, chip and wafer bonding
#7005Singulating surface-mountable semiconductor devices and fitting external contacts to said devices
#7006Room temperature metal direct bonding
#7007Semiconductor device fabricating method
#7008Semiconductor device manufacturing method
#7009Process for fabricating a semiconductor package
#7010Method for making a wedge wedge wire loop
#7011Method of manufacturing semiconductor device
#7012Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
#7013Barrier for use in 3-D integration of circuits
#7014Fabrication method of semiconductor integrated circuit device
#7015Article and assembly for magnetically directed self assembly
#7016Method of correcting bonding coordinates using reference bond pads
#7017Adjustable thickness thermal interposer and electronic package utilizing same
#7018Stacked integrated circuit package system with connection protection
#7019Piezoelectric device and method for manufacturing the same
#7020Isolating chip-to-chip contact
#7021Semiconductor device with guard rings that are formed in each of the plural wiring layers
#7022Semiconductor device that improves electrical connection reliability
#7023Power semiconductor component with a power semiconductor chip and method for producing the same
#7024Semiconductor chip having fine pitch bumps and bumps thereon
#7025Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
#7026Method for fabricating chip package structure
#7027Semiconductor device including a DC-DC converter
#7028Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader
#7029Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#7030Method and arrangement for forming a microelectronic package
#7031Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#7032Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
#7033Solder layer and electronic device bonding substrate and submount using the same
#7034Connecting device for electronic components
#7035Multilayer printed circuit board
#7036Heat conduction from an embedded component
#7037HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#7038SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO PCB
#7039Resin Paste for Die Bonding
#7040Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip
#7041PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#7042Separation method for cutting semiconductor package assemblage for separation into semiconductor packages
#7043Die bonding
#7044Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
#7045Method of manufacturing display device using LED chips formed in a porous template
#7046Conductor composition, a mounting substrate and a mounting structure utilizing the composition
#7047Semiconductor device
#7048SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
#7049Thermal paste containment for semiconductor modules
#7050Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
#7051Semiconductor components with through wire interconnects
#7052Electronic component having exposed surfaces
#7053Semiconductor devices and electrical parts manufacturing using metal coated wires
#7054Semiconductor device and manufacturing method of a semiconductor device
#7055Semiconductor integrated circuit device
#7056Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry
#7057Electronic component and its manufacturing method
#7058Accelerated B-Stage curing process for thermosetting resins and FBGA assembly process utilizing the accelerated B-Stage curing process
#7059Power transistor and power semiconductor device
#7060Method for manufacturing bump of wafer level package
#7061Manufacturing method of a semiconductor device
#7062Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
#7063Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument
#7064Method for producing semiconductor package
#7065Plating apparatus, plating method and manufacturing method for semiconductor device
#7066Manufacturing method of semiconductor device
#7067Microelectronic devices and methods for manufacturing microelectronic devices
#7068Memory card structure and method for manufacturing the same
#7069Flip-chip type semiconductor device
#7070Semiconductor device
#7071Device having a contacting structure
#7072Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same
#7073METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES
#7074Multichip module with improved system carrier
#7075Semiconductor device
#7076Semiconductor package containing multi-layered semiconductor chips
#7077Semiconductor device
#7078Chip-scale package
#7079Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink
#7080Chip package and wafer treating method for making adhesive chips
#7081Semiconductor chip assembly
#7082Vertical semiconductor power switch, electronic component and methods of producing the same
#7083Method of self-assembly on a surface
#7084Resin composition and semiconductor device produced by using the same
#7085Method for planarizing vias formed in a substrate
#7086In-place bonding of microstructures
#7087Method for manufacturing semiconductor device
#7088Silicone Adhesive
#7089Method for manufacturing semiconductor device
#7090Perforated embedded plane package and method
#7091Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
#7092Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof
#7093MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
#7094SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#7095Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
#7096Semiconductor device
#7097Semiconductor device and method of manufacturing the same
#7098Combined board level EMI shielding and thermal management
#7099Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#7100Electronic component with high density, low cost attachment
#7101Wafer bonding of damascene-patterned metal/adhesive redistribution layers
#7102FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#7103Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
#7104Optical device and method for manufacturing the same
#7105Method for embedding a component in a base
#7106Electronic substrate, semiconductor device, and electronic device
#7107Layer between interfaces of different components in semiconductor devices
#7108Solder bump structure for flip chip package and method for manufacturing the same
#7109SEMICONDUCTOR DEVICE WITH BATTERY
#7110Bond pad structure for wire bonding
#7111PACKAGE WARPAGE CONTROL
#7112Adhesive compositions containing cyclic siloxanes and methods for use thereof
#7113Method for diffusion soldering
#7114Horn-holder pivot type bonding apparatus
#7115TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS
#7116MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#7117Semiconductor packaging method
#7118Semiconductor package
#7119Method for manufacturing semiconductor device
#7120Method for fabricating stacked semiconductor components with through wire interconnects
#7121Semiconductor device and method of manufacturing semiconductor device
#7122Semiconductor device
#7123Semiconductor device with semiconductor device components embedded in plastic package compound
#7124System for fabricating semiconductor components with through wire interconnects
#7125Chip package
#7126Semiconductor apparatus
#7127Semiconductor device, electronic device and fabrication method of the same
#7128Redistribution connecting structure of solder balls
#7129Chip underfill in flip-chip technologies
#7130Power semiconductor arrangement
#7131Semiconductor device and semiconductor module therewith
#7132INTEGRATED CIRCUIT CHIP AND PACKAGE
#7133Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages
#7134Multi-row lead frame
#7135Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device
#7136Image pickup apparatus, camera module, electronic device, and fabrication method for image pickup apparatus
#7137Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
#7138Entire encapsulation of Cu interconnects using self-aligned CuSiN film
#7139Wafer-leveled chip packaging structure and method thereof
#7140Manufacturing method of semiconductor module including solid-liquid diffusion joining steps
#7141Semiconductor device and manufacturing method for the same
#7142Processed wafer via
#7143Flip chip in package using flexible and removable leadframe
#7144Method of resin sealing electronic part
#7145Manufacturing method of semiconductor device
#7146Semiconductor device and manufacturing the same
#7147Stacked chip-based system and method
#7148Film bonding method, film bonding apparatus, and semiconductor device manufacturing method
#7149DC/DC converter
#7150Semiconductor device and a manufacturing method thereof
#7151Method for manufacturing semiconductor package capable of potting thermosetting resin while being heated
#7152Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor package
#7153Semiconductor device and manufacturing method for the same
#7154SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#7155Pressure contact power semiconductor module
#7156Stacked integrated circuit package-in-package system with recessed spacer
#7157Semiconductor package having an optical device and a method of making the same
#7158Semiconductor apparatus containing multi-chip package structures
#7159Bonding method and apparatus
#7160RF module including control IC without the aid of a relay pad
#7161Printed board with a pin for mounting a component
#7162Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow
#7163Electronic device and method of manufacturing the same
#7164Semiconductor chip package having an adhesive tape attached on bonding wires
#7165METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER
#7166Image sensor packaging structure and method of manufacturing the same
#7167Positively radiation-sensitive resin composition
#7168LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module
#7169DRIVE IC AND DISPLAY DEVICE HAVING THE SAME
#7170Power composite integrated semiconductor device and manufacturing method thereof
#7171PAD STRUCTURE FOR BONDING PAD AND PROBE PAD AND MANUFACTURING METHOD THEREOF
#7172Connection structure and method for fabricating the same
#7173Method of fabricating semiconductor memory device and semiconductor memory device driver
#7174Semiconductor device with signal line having decreased characteristic impedance
#7175Semiconductor device
#7176Power semiconductor modules and method for producing them
#7177Semiconductor component with semiconductor chip and adhesive film, and method for its production
#7178Customizable power and ground pins
#7179Multi-chip module for battery power control
#7180COL-TSOP with nonconductive material for reducing package capacitance
#7181Semiconductor device and method of manufacturing the same
#7182Wire bond and redistribution layer process
#7183Method of producing a semiconductor device by forming an oxide film on a resin layer
#7184Wire bonding apparatus, record medium storing bonding control program, and bonding method
#7185Method for forming a stud bump
#7186Component mounting method, component mounting apparatus, and ultrasonic bonding head
#7187Wire bonding apparatus, record medium storing bonding control program, and bonding method
#7188Semiconductor device
#7189Methods of forming metal layers using multi-layer lift-off patterns
#7190Method for producing a surface-mountable semiconductor component
#7191Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
#7192Method for fabricating semiconductor package
#7193Method of flip-chip mounting
#7194Method of fabrication on high coplanarity of copper pillar for flip chip packaging application
#7195Nanoscale metal paste for interconnect and method of use
#7196SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS
#7197Semiconductor device
#7198CHIP CONNECTOR
#7199Semiconductor device having a bump formed over an electrode pad
#7200Plurality of devices attached by solder bumps