Method for forming a redistribution layer in a wafer structure

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof

Electronic devices including solder bumps on compliant dielectric layers

Semiconductor device having through contact blocks with external contact areas

Semiconductor device

Module part

Semiconductor device package and methods for producing same

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Bare chip embedded PCB

Semiconductor device and manufacturing method thereof

Semiconductor device with visible indicator and method of fabricating the same

Capacitor and manufacturing method thereof

Electronic module with stacked semiconductors

Method of reeling a series of RFID tags and RFID tag roll

Magnetic alignment of integrated circuits to each other

Method for setting capillary contact position data and wire bonding apparatus using the same

Component mounting method and component mounting apparatus

Ground shields for semiconductors

Use of a hotmelt adhesive, pasty fixation compound for micro devices and detector for detecting ionizing radiation

Solder composition and method of bump formation therewith

Direct write# system

Interconnect substrate, semiconductor device, and method of manufacturing the same

Method for manufacturing a surface mount device

Fabrication of an integrated circuit package

Composite interconnect structure using injection molded solder technique

Hybrid multilayer substrate and method for manufacturing the same

Micromechanical Getter Anchor

Probe For Semiconductor Devices

Semiconductor device and method of manufacturing thereof

Low temperature co-fired ceramic module and method of manufacturing the same

Semiconductor device having tin-based solder layer and method for manufacturing the same

Solder wall structure in flip-chip technologies

Aluminum leadframes for semiconductor QFN/SON devices

Warpage-reducing packaging design

Electrical component on a substrate and method for production thereof

Method for mounting electronic components on a support

Method of manufacturing semiconductor device

Method for manufacturing electronic device using thin film transistor with protective cap over flexible substrate

Methods for fabricating stiffeners for flexible substrates

Tooling for coupling multiple electronic chips

Method for making flip chip on leadframe package

Semiconductor apparatus manufacturing method

Methods for fabricating fences on interposer substrates

Hybrid mounted device and method of manufacturing the same

Semiconductor device and manufacturing method of them

Semiconductor device sealed with electrical insulation sealing member

Flip-attached and underfilled stacked semiconductor devices

Semiconductor device and method for fabricating the same

Wafer level stack structure for system-in-package and method thereof

Semiconductor device, interposer chip and manufacturing method of semiconductor device

Semiconductor memory card

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Padless die support integrated circuit package system

Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings

Semiconductor integrated circuit device and test method thereof

Triaxial through-chip connection

Method for fabricating circuit component

Method for fabricating last level copper-to-C4 connection with interfacial cap structure

Microelectronic interconnect device comprising localised conductive pins

Semiconductor device, method of manufacturing the same, and camera module

Method for manufacturing an electronic module in an installation base

Electronic component and method for its assembly

Glass material for radio-frequency applications

Dicing/die bonding film and method of manufacturing the same

Interconnection pattern design

Semiconductor package and fabricating method thereof

Substrate and semiconductor device

Semiconductor device, dicing saw and method for manufacturing the semiconductor device

Semiconductor package

Semiconductor package with integrated heatsink and electromagnetic shield

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Method and device for contacting semiconductor chips

Strip for integrated circuit packages having a maximized usable area

Stacked module and manufacturing method thereof

Back-to-front via process

Semiconductor device package and method for manufacturing same

Manufacturing method for electronic device

Method for fabricating a flip chip system in package

Packaged semiconductor device with dual exposed surfaces and method of manufacturing

Adhesion method using gray-scale photolithography

Printed circuit board and method of manufacturing semiconductor package using the same

Arrangement and method impedance matching

Semiconductor component and apparatus for production of a semiconductor component

Power semiconductor module

Semiconductor device having a plurality of semiconductor constructs

Semiconductor-element mounting substrate, semiconductor device, and electronic equipment

Method for manufacturing mold type semiconductor device

Thermally balanced via

Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same

Semiconductor device

Circuit module

Connecting module having passive components

Semiconductor device and a method of manufacturing the same

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Contact spring application to semiconductor devices

Electronic circuit package

BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

Interconnected IC packages with vertical SMT pads

Circuit board and electronic assembly

Semiconductor device

Semiconductor light-emitting device and method for manufacturing the device

Semiconductor light-emitting device and method for manufacturing the device

SEMICONDUCTOR DEVICE

Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel

Heater, reflow apparatus, and solder bump forming method and apparatus

Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps

Microchannel heat sink manufactured from graphite materials

Method for gluing a circuit component to a circuit substrate

Interconnect circuitry, multichip module, and methods of manufacturing thereof

Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design

Manufacturing method for semiconductor device and semiconductor device

PACKAGE WARPAGE CONTROL

Clipless and wireless semiconductor die package and method for making the same

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Wafer-level processing of chip-packaging compositions including bis-maleimides

Face down type semiconductor device and manufacturing process of face down type semiconductor device

Methods including fluxless chip attach processes

Super high-density module with integrated wafer level packages

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Electrical ground method for ball stack package

Light emitting diode

Test pads on flash memory cards

Electronic part mounting method

Method for fabricating a chip scale package using wafer level processing

Common drain dual semiconductor chip scale package and method of fabricating same

Compliant terminal mountings with vented spaces and methods

Low temperature bumping process

System to wirebond power signals to flip-chip core

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Conductive particles for anisotropic conductive interconnection

Semiconductor device and method of manufacturing the same

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Semiconductor device having a metal plate conductor

Power Semiconductor Circuit And Method Of Manufacturing A Power Semiconductor Circuit

Semiconductor device and method for producing the same

Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency

Semiconductor device

Sequential fabrication of vertical conductive interconnects in capped chips

Super high-density module with integrated wafer level packages

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Flip-chip mounting substrate and flip-chip mounting method

Microelectronic elements with compliant terminal mountings and methods for making the same

STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device having semiconductor element, insulation substrate and metal electrode

Compliant terminal mountings with vented spaces and methods

Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device

Three-dimensional integrated circuit structure

Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas

Carbon nanotubes solder composite for high performance interconnect

Miniaturized Contact Spring

Methods of fabricating interconnects for semiconductor components

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Method for manufacturing IC-embedded substrate

Ribbon bonding in an electronic package

Wire bonding system and method of use

Method of manufacturing semiconductor device

Three dimensional microstructures and methods for making three dimensional microstructures

Method of producing a semiconductor device, and wafer-processing tape

Pressure-contact type rectifier with contact friction reducer

Current sensor with reset circuit

Integrated current sensor package

Peel strength simulating apparatus, peel strength simulating program storage medium, and peel strength simulating method

Package for high power density devices

Semiconductor device

Semiconductor device and manufacturing method of the same

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Semiconductor device with thermoplastic resin to reduce warpage

Semiconductor device and manufacturing method of the same

Semiconductor package structure and method of manufacture

Coaxial through chip connection

Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof

External electrode forming method

Adhesive for bonding circuit members, circuit board and process for its production

Dicing die-bonding film, method of fixing chipped work and semiconductor device

DIE BONDING APPARATUS AND METHOD OF OPERATING THE SAME

Paste coater and PoP automatic mounting apparatus employing the same

Telemetry system for use with microstimulator

Wireless communication system

Inhibiting underfill flow using nanoparticles

Package using array capacitor core

Method for mounting bumps on an under metallurgy layer

Space-efficient package for laterally conducting device

Method for embedding dies

Chip module and method for producing a chip module

Die-attaching paste composition and method for hardening the same

Electronic member fabricating method and ic chip with adhesive material

Printed circuit board having embedded electronic components and manufacturing method thereof

Semiconductor device and mold for resin-molding semiconductor device

Electrical microfilament to circuit interface

Semiconductor component having plate, stacked dice and conductive vias

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

Projected contact structures for engaging bumped semiconductor devices

Microelectronic devices having a curved surface and methods for manufacturing the same

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Flip chip MLP with conductive ink

High temperature package flip-chip bonding to ceramic

Structure and method for thin single or multichip semiconductor QFN packages

DEVICE AND METHOD FOR ASSEMBLING A TOP AND BOTTOM EXPOSED PACKAGED SEMICONDUCTOR

Substrate panel with plating bar structured to allow minimum kerf width

Radio frequency device

Method for the planar joining of components of semiconductor devices and a diffusion joining structure

Method for manufacturing an electronic module, and an electronic module

Method and apparatus for mounting conductive ball

Integrated Circuit With Dual Electrical Attachment Pad Configuration

Adhesion by plasma conditioning of semiconductor chip surfaces

Wafer street buffer layer

Method and system for increasing yield of vertically integrated devices

Method for bonding substrates and device for bonding substrates

Metal-base circuit board and its manufacturing method

Sensor component and panel used for the production thereof

Method for packaging microelectronic devices

Electronic circuit device and method of manufacturing the same

Liquid metal thermal interface material system

Die bonding adhesive tape

Semiconductor device with a wiring substrate and method for producing the same

Microelectronic packaging and components

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Chip package structure

Leadless semiconductor package and method of manufacture

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing same, and semiconductor wafer

CAPILLARY FOR A BONDING TOOL

High-temperature solder, high-temperature solder paste and power semiconductor using same

CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTURING APPARATUSES, METHODS FOR MANUFACTURING CIRCUIT SUBSTRATES, AND METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Interconnect assemblies and methods

Conductive ball arraying apparatus

Semiconductor device having high frequency components and manufacturing method thereof

Method for forming solder balls with a stable oxide layer by controlling the reflow ambient

Individualized low parasitic power distribution lines deposited over active integrated circuits

Method of making semiconductor package having exposed heat spreader

Bonding structure with buffer layer and method of forming the same

Protection for an integrated circuit chip containing confidential data

Dicing and die bonding adhesive tape

Flip chip hermetic seal using pre-formed material

Intermediate connection for flip chip in packages

Semiconductor device

Semiconductor packages having leadframe-based connection arrays

Interposer and stacked chip package

Pin-type chip tooling

Circuit substrate and method of manufacture

Semiconductor integrated circuit

Method and apparatus that provides differential connections with improved ESD protection and routing

Two-step high bottleneck type capillary for wire bonding device

Power module

Wiring board, electronic component mounting structure, and electronic component mounting method

THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS

Multilayer circuit board and method for manufacturing the same

Head assembly for chip mounter

Inductive Heating of Microelectronic Components

Method for the interconnection of active and passive components and resulting thin heterogeneous component

Structure of bumps forming on an under metallurgy layer and method for making the same

Semiconductor device having align mark layer and method of fabricating the same

Methods for fabricating protective layers on semiconductor device components

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

Method of making a semiconductor device with improved heat dissipation

Integrated heat spreader with intermetallic layer and method for making

Semiconductor Device with Improved Stud Bump

Flip-chip semiconductor device manufacturing method

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Low Profile Stacking System and Method

Method of manufacturing optical module

Liquid epoxy resin composition

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Apparatuses and methods for forming wireless RF labels

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Output amplifier structure with bias compensation

Method of manufacturing surface mount type crystal oscillator

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE

Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing

Power semiconductor circuit with busbar system

Interconnecting element between semiconductor chip and circuit support and method

Rotary chip attach

Low Profile Stacking System and Method

Semiconductor devices including voltage switchable materials for over-voltage protection

SEMICONDUCTOR DEVICE

Flip-chip light emitting diode device without sub-mount

Optical module and method of manufacturing the same

Semiconductor die package using leadframe and clip and method of manufacturing

Circuit board and its manufacturing method

Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof

Method and device for connecting chips

Method for producing and cleaning surface-mountable bases with external contacts

Damascene patterning of barrier layer metal for C4 solder bumps

Wafer redistribution structure with metallic pillar and method for fabricating the same

Bonding method of semiconductor substrate and sheet, and manufacturing method of semiconductor chips using the same

Dispensing device and mounting system

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Manufacturing method of wiring board and manufacturing method of semiconductor device

Method of manufacturing a semiconductor device