Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof

Method for removing resin mask layer and method for manufacturing solder bumped substrate

Semiconductor device, and method for manufacturing the same

Electronic device and manufacturing method of the same

Ultra-thin semiconductor package device and method for manufacturing the same

Film adhesive and semiconductor package using the same

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Transponder incorporated into an electronic device

Semiconductor device, method and apparatus for fabricating the same

Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode

Integrated circuit package and assembly thereof

Power module, and phase leg assembly

Probe arrays and method for making

Multi-chip package and method of fabricating the same

Encapsulated electronic device structure

Die bonded device and method for transistor packages

Semiconductor device and method of fabricating the same

ESD protection apparatus for an electrical device

Integrated circuit component and mounting method thereof

Structure of electronic package and method for fabricating the same

Circuit board with embedded component and method of manufacturing same

Semiconductor chip package having an adhesive tape attached on bonding wires

Method of fabricating a high Q factor integrated circuit inductor

Method for mounting an electronic element on a wiring board

Power amplifier module

Methods and systems for rise-time improvements in differential signal outputs

Module substrate and disk apparatus

Flip chip system with organic/inorganic hybrid underfill composition

Electronic component unit

Heater for annealing trapped charge in a semiconductor device

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Semiconductor packages with asymmetric connection configurations

Electronic device package and electronic equipment

Flip-chip component

Multi-chip semiconductor package

Liquid metal droplet generator

Adhesion apparatus

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin

Method of forming a multi-layer semiconductor structure having a seam-less bonding interface

Injection molded metal bonding tray for integrated circuit device fabrication

Fabricating surface mountable semiconductor components with leadframe strips

High density direct connect loc assembly

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Flip-chip semiconductor device utilizing an elongated tip bump

Semiconductor device

Semiconductor package device and method for fabricating the same

Integration type semiconductor device and method for manufacturing the same

Semiconductor package with conductive molding compound and manufacturing method thereof

No-flow underfill materials for flip chips

Method and structure to reduce risk of gold embrittlement in solder joints

Semiconductor device with crack-resistant multilayer copper wiring

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Semiconductor wafer with electrically connected contact and test areas

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Multi chip package

Electronic device package and electronic equipment

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

Semiconductor device having through electrode and method of manufacturing the same

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

Microcomputer chip with function capable of supporting emulation

Integrated circuit die with logically equivalent bonding pads

Structured semiconductor element for reducing charging effects

Electrical contact and connector and method of manufacture

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Fabrication method of a wafer structure

Method for reducing semiconductor die warpage

In-place bonding of microstructures

Method for fabricating semiconductor components

Structure of mounting electronic component

Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

Bond pad structure for integrated circuit chip

LED with self aligned bond pad

Electronic component comprising external surface contacts and a method for producing the same

Method of mounting an electronic part to a substrate

Wiring board and method for producing same

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Semiconductor device, circuit board, electro-optic device, electronic device

Semiconductor device and method of fabricating the same

Bond pad structure with stress-buffering layer capping interconnection metal layer

Semiconductor device and a method for manufacturing of the same

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Fan out type wafer level package structure and method of the same

Semiconductor device and manufacturing process thereof

Manufacturing method of solid-state image sensing device

Method of mounting electronic component

Method of ultrasonic-mounting electronic component and ultrasonic mounting machine

Method for flip chip bonding by utilizing an interposer with embedded bumps

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Using an interposer to facilate capacitive communication between face-to-face chips

Oblique parts or surfaces

Semiconductor device and method of manufacturing the same

UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE

Audio amplifier assembly

Functional coating of the SCFM preform

Multi-layer integrated semiconductor structure having an electrical shielding portion

IC substrate and manufacturing method thereof and semiconductor element package thereby

Solderable top metal for SiC device

Method and apparatus for placing conductive balls

Thermal management of systems having localized regions of elevated heat flux

Iridium oxide nanowires and method for forming same

Device for bonding a metal on a surface of a substrate

Semiconductor device and method of manufacturing the same

Method for making electronic packages

Plating method, semiconductor device fabrication method and circuit board fabrication method

Methods of making microelectronic packages with conductive elastomeric posts

Packaging method for an electronic element

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Semiconductor device having aluminum electrode and metallic electrode

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Structure of polymer-matrix conductive film and method for fabricating the same

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Method and process of contact to a heat softened solder ball array

Plating apparatus and plating method

Manufacturing method of a semiconductor device

Semiconductor device and its manufacturing method

Method of manufacturing electric device

Semiconductor device and manufacturing method for the same

Method for manufacturing wafer level chip scale package using redistribution substrate

Method for temporarily engaging electronic component for test

Inspection method of bonded status of ball in wire bonding

Transparent member, optical device using transparent member and method of manufacturing optical device

Multi-layer electronic component aggregate board and multi-layer electronic component fabricating method

Folded substrate with interposer package for integrated circuit devices

Bonding structure, actuator device and liquid-jet head

Stacked die module

Method for manufacturing an electronic module, and an electronic module

Non-Circular via holes for bumping pads and related structures

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Resist sidewall spacer for C4 BLM undercut control

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

3D interconnect with protruding contacts

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus

Flip chip bonding tool

Method and apparatus for mounting and removing an electronic component

Joining method and apparatus

Electronic flame-off electrode with ball-shaped tip

Method of forming bump that may reduce possibility of losing contact pad material

Redistribution layer of wafer and the fabricating method thereof

Method for forming an electrode

Semiconductor device and method of manufacturing thereof

Electronic parts packaging structure and method of manufacturing the same

Semiconductor electrical connection structure and method of fabricating the same

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Method for producing microsystems

Inverter and vehicle drive unit using the same

Structure and method for fabricating a bond pad structure

Semiconductor device and fabrication method thereof

Semiconductor device and method of manufacturing semiconductor device

Methods to deposit metal alloy barrier layers

Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device

Semiconductor device carrier unit and semiconductor socket provided therewith

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Method of forming a stacked semiconductor package

Semiconductor device

Film substrate of a semiconductor package and a manufacturing method

Semiconductor device having power semiconductor elements

Process for manufacture of novel, inexpensive radio frequency identification devices

Underfill compositions and methods for use thereof

Semiconductor substrate thinning method for manufacturing thinned die

Method of forming electrode for semiconductor device

Semiconductor device manufacturing method

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method

Nano-sized metals and alloys, and methods of assembling packages containing same

Low melting-point solders, articles made thereby, and processes of making same

Thermally conductive composite and uses for microelectronic packaging

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Production method of anisotropic conductive sheet

Semiconductor device

Semiconductor element including a wet prevention film

Die down ball grid array package

Apparatus for singulating and bonding semiconductor chips, and method for the same

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

COF flexible printed wiring board and method of producing the wiring board

Bonding tool for ultrasonic bonding and method of ultrasonic bonding

Self-reflowing printed circuit board and application methods

Circuit device and manufacturing method thereof

Bonding apparatus

Circuit-connecting material and circuit terminal connected structure and connecting method

Aluminum cap for reducing scratch and wire-bond bridging of bond pads

Wafer scale integration packaging and method of making and using the same

Semiconductor package having a heat slug and manufacturing method thereof

Solder foil, semiconductor device and electronic device

High performance amine based no-flow underfill materials for flip chip applications

Semiconductor device packaged into chip size and manufacturing method thereof

Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus

Interconnection structure of integrated circuit chip

Electronic circuit including circuit-connecting material

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Pad structure to prompt excellent bondability for low-k intermetal dielectric layers

Semiconductor device having a switch circuit

Chip structure

Semiconductor device

Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components

Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device

Motion control device for wire bonder bondhead

Microelectronic packaging and components

Method of stacking thin substrates by transfer bonding

Semiconductor device and fabrication process thereof

Wire bond pads

Method for producing bumps on an electrical component

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

Wafer stacking package method

Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages

Method for forming a redistribution layer in a wafer structure

Method of forming a surface mountable IC and its assembly

Thermally controlled fluidic self-assembly

Flexible device, flexible pressure sensor, and fabrication method thereof

Semiconductor package having flash-free contacts and techniques for manufacturing the same

Sensor device having stopper for limitting displacement

Semiconductor device and a method of assembling a semiconductor device

Semiconductor equipment having a pair of heat radiation plates

Method of making a solder ball

Semiconductor packages

Bonding wire and bonded connection

Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip

Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Methods of forming semiconductor packages

Packaging with metal studs formed on solder pads

Robust power semiconductor package

Semiconductor packages

Bonded SOI substrate, and method for manufacturing the same

Light emitting device and method of producing same

Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit

Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment

Method for supplying solder

Methods for forming conductive bumps and wire loops

Method of measuring thickness of bonded ball in wire bonding

Joining apparatus

Surface mount saw device manufacturing method

Top layers of metal for high performance IC's

Semiconductor device manufacturing method and electronic equipment using same

Microprobe tips and methods for making

Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology

Method of manufacturing a semiconductor device

Technique for attaching die to leads

Thermally controlled fluidic self-assembly method and support

Electronic device provided with a magnetic screening

Chip module

Flip chip metal bonding to plastic leadframe

Semiconductor chip stack structure and method for forming the same

Electronic device and method of manufacturing the same

Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Semiconductor device having tin-based solder layer and method for manufacturing the same

Semiconductor device mounting structure for reducing thermal stress and warpage

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device with reduced contact resistance

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device, lead frame, and methods for manufacturing the same

High density interconnect power and ground strap and method therefor

Method of manufacturing a semiconductor device

Methods of making microelectronic assemblies including compliant interfaces

Semiconductor device and method for fabricating the same

Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication

Method for connecting a chip and a substrate

Method for assembling micro-components to binding sites

Manufacturing method of stack-type semiconductor device

Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby

Methods for packaging a plurality of semiconductor dice using a flowable dielectric material

Method of manufacturing semiconductor device

Dial module, manufacturing method thereof, led display element, display module, movement module, connector module and meter using them

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Semiconductor chip, electrically connections therefor

Surface-mounting semiconductor device and method of making the same

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device

Semiconductor device having laminated structure

Semiconductor device

High-reliable semiconductor device using hermetic sealing of electrodes

Top layers of metal for high performance IC's

Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus

Apparatus for applying semiconductor chip to substrates comprising a moveable curing device and method of use thereof

Semiconductor device having a heat-dissipation member

Semiconductor and method for producing a semiconductor

Method of making a semiconductor device adapted to remove noise from a signal

Semiconductor device and process for manufacturing the same

Electronic component with multilayered rewiring plate and method for producing the same

Semiconductor device with simplified constitution

Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

Interposers for chip-scale packages and intermediates thereof

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Electronic devices at the wafer level having front side and edge protection material and systems including the devices

Dense intermetallic compound layer

Method of bonding and bonding apparatus for a semiconductor chip

Method of manufacturing printed wiring board

Method of electrically connecting a microelectronic component

Method for transferring a semiconductor body from a growth substrate to a support material

Semiconductor device substrate, semiconductor device, and manufacturing method thereof

Current detection equipment and semiconductor device

Methods for forming molds

Conductive adhesive agent with ultrafine particles

Thermal fatigue resistant tin-lead-silver solder

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device