212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Semiconductor device, electrode member and electrode member fabrication method
#8402Embedded chip printed circuit board and method of manufacturing the same
#8403Semiconductor device package, method of manufacturing the same, and semiconductor device
#8404Electrical contact
#8405Encapsulation of circuit components to reduce thermal cycling stress
#8406Microfeature devices and methods for manufacturing microfeature devices
#8407Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#8408Dual metal stud bumping for flip chip applications
#8409Method of manufacturing semiconductor device and semiconductor device
#8410Method for integrating an electronic component or similar into a substrate
#8411Method of manufacturing an electronic device
#8412Microfeature systems including adhered microfeature workpieces and support members
#8413Method of manufacturing semiconductor device
#8414Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates
#8415Method of manufacturing an ink-jet assembly
#8416Bonding apparatus
#8417Resin sealing method for electronic part and mold used for the method
#8418Semiconductor device with a number of bonding leads and method for producing the same
#8419Semiconductor device and manufacturing method thereof
#8420Method and system for bonding a semiconductor chip onto a carrier using micro-pins
#8421Method to create flexible connections for integrated circuits
#8422Chip scale package with heat spreader
#8423High frequency arrangement
#8424Semiconductor device
#8425Semiconductor device and its writing method
#8426Semiconductor device and unit equipped with the same
#8427Semiconductor package having improved adhesiveness and ground bonding
#8428Semiconductor device with semiconductor chip mounted in package
#8429Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#8430Semiconductor device
#8431Ball mounting method
#8432Apparatus and method for bonding wires
#8433Wire bonding method
#8434Semiconductor device with micro connecting elements and method for producing the same
#8435Semiconductor component sealed on five sides by polymer sealing layer
#8436Methods for patterning dielectric material, and methods for aligning semiconductor fabrication molds and semiconductor substrates
#8437METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER
#8438Method of forming a wear-resistant dielectric layer
#8439Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
#8440Semiconductor device and manufacturing method of the same
#8441Component arrangement for series terminal for high-voltage applications
#8442Substrate for an FBGA semiconductor component
#8443Semiconductor chip having solder bumps and dummy bumps
#8444Contact structure and method for manufacturing the same
#8445Semiconductor device and method of manufacturing the same
#8446Ground arch for wirebond ball grid arrays
#8447Semiconductor device and process for fabrication thereof
#8448Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion
#8449Thin-film semiconductor component and production method for said component
#8450Method and system for transferring dies between surfaces
#8451Multilayer printed wiring board and method of manufacturing the same
#8452Implantable, tissue conforming drug delivery device
#8453Methods of adhering microfeature workpieces, including a chip, to a support member
#8454Manufacturing method of semiconductor device
#8455Package or pre-applied foamable underfill for lead-free process
#8456Semiconductor device and process for producing the same
#8457Semiconductor module for making electrical contact with a connection device via a rewiring device
#8458Semiconductor apparatus
#8459Semiconductor device and method of making the same
#8460Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner
#8461Semiconductor device
#8462Integrated circuits and interconnect structure for integrated circuits
#8463Dissociated fabrication of packages and chips of integrated circuits
#8464Semiconductor device and method of manufacturing the same
#8465Semiconductor device
#8466Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof
#8467Semiconductor device and fabrication method thereof
#8468Smart card, smart card module, and a method for production of a smart card module
#8469Wire bonding method
#8470Antenna designs for radio frequency identification tags
#8471Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
#8472Fabrication of stacked microelectronic devices
#8473Method and system for 3D alignment in wafer scale integration
#8474Method of embedding semiconductor element in carrier and embedded structure thereof
#8475Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
#8476Device packages having stable wirebonds
#8477Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system
#8478Semiconductor device and method of manufacturing thereof
#8479Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area
#8480Chip scale package and method for manufacturing the same
#8481Electronic device and method for fabricating the same
#8482Semiconductor device and method of manufacturing the same
#8483Circuit board and semiconductor device
#8484Semiconductor device
#8485Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus
#8486Apparatus and method for filling a ball grid array template
#8487Molding tool and a method of forming an electronic device package
#8488Electronic device manufacture
#8489Semiconductor manufacturing method for die bonding
#8490Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
#8491Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line
#8492Manufacturing method of semiconductor device
#8493Integrated circuit die connection methods and apparatus
#8494Thermal enhanced package for block mold assembly
#8495High-density inter-die interconnect structure
#8496Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
#8497Light emitting device
#8498Rotating rectifier assembly with inner mounted diodes
#8499Structure and manufacturing method of a chip scale package
#8500Semiconductor device and method for manufacturing semiconductor device
#8501Semiconductor device
#8502Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement
#8503Semiconductor device
#8504Bilayer aluminum last metal for interconnects and wirebond pads
#8505Chip on board leadframe for semiconductor components having area array
#8506Semiconductor device and method of manufacturing the same
#8507Method and apparatus for forming a low profile wire loop
#8508Ribbon bonding tool and process
#8509System-in-package wireless communication device comprising prepackaged power amplifier
#8510Method of making a compliant interconnect assembly
#8511Method of manufacturing semiconductor device and method of treating electrical connection section
#8512Semiconductor device and manufacturing method thereof
#8513Methods relating to forming interconnects
#8514Method for producing an anisotropic conductive film on a substrate
#8515Fabrication of stacked microelectronic devices
#8516Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same
#8517Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof
#8518Electronic component, electro-optical device, and electronic apparatus
#8519Semiconductor substrate with conductive bumps having a stress relief buffer layer formed of an electrically insulating organic material
#8520Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor
#8521Electronic device package and method of manufacturing the same
#8522Semiconductor device and method for producing the same
#8523Semiconductor device including multiple rows of peripheral circuit units
#8524Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof
#8525Structure for joining a semiconductor package to a substrate using a solder column
#8526Multi-surface IC packaging structures and methods for their manufacture
#8527Fabrication method for chip size package and non-chip size package semiconductor devices
#8528Low profile ball-grid array package for high power
#8529Semiconductor package using flexible film and method of manufacturing the same
#8530Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframe
#8531Semiconductor integrated circuit and method of manufacturing the same
#8532Light emitting device
#8533Apparatus of clamping semiconductor devices using sliding finger supports
#8534Printed-circuit board and circuit unit incorporating the circuit board
#8535Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus
#8536Method for fabricating semiconductor component with thinned substrate having pin contacts
#8537Thin array plastic package without die attach pad and process for fabricating the same
#8538Wafer-processing tape and method of producing the same
#8539Semiconductor apparatus and manufacturing method
#8540Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
#8541Semiconductor device having a particular electrode structure
#8542High temperature, stable SiC device interconnects and packages having low thermal resistance
#8543Support device for monolithically integrated circuits
#8544Multi-function card device
#8545Wire loop, semiconductor device having same and wire bonding method
#8546Wire clamping plate
#8547Semiconductor device and manufacturing method therefor
#8548Method of metal sputtering for integrated circuit metal routing
#8549Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#8550Integrated die bumping process
#8551Method for cutting semiconductor substrate
#8552Assembly comprising functional devices and method of making same
#8553Dicing/die-bonding film, method of fixing chipped work and semiconductor device
#8554Method of manufacturing a cavity package
#8555Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus
#8556Semiconductor device fabricating apparatus and semiconductor device fabricating method
#8557Semiconductor device package and manufacturing method thereof
#8558Electronic parts packaging structure
#8559Semiconductor interconnect having dome shaped conductive spring contacts
#8560BGA package substrate and method of fabricating same
#8561BGA package having half-etched bonding pad and cut plating line and method of fabricating same
#8562Mounting pad structure for wire-bonding type lead frame packages
#8563Method for manufacturing semiconductor device having a pair of heat sinks
#8564Printed circuit board including embedded chips and method of fabricating the same using plating
#8565NANO IC packaging
#8566Circuit device and portable device with symmetrical arrangement
#8567DFN semiconductor package having reduced electrical resistance
#8568Semiconductor package device having reduced mounting height and method for manufacturing the same
#8569Dual flat non-leaded semiconductor package
#8570On-chip circuit pad structure
#8571Organic semiconductor device and its manufacturing method
#8572Coupler resource module
#8573Electrical contact
#8574Interconnection device and system
#8575Electrical contact and connector and method of manufacture
#8576Method and system for 3D alignment in wafer scale integration
#8577Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate
#8578Method of manufacturing a semiconductor device
#8579Bare die socket
#8580Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby
#8581Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors
#8582Chip support of a leadframe for an integrated circuit package
#8583Solder structures for out of plane connections
#8584Method of forming a bonding pad structure
#8585Semiconductor device and fabrication method thereof
#8586Semiconductor device having exposed heat dissipating metal plate
#8587Micromechanical getter anchor
#8588Power semiconductor device
#8589Semiconductor device
#8590Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
#8591Semiconductor integrated circuit device and method of manufacturing the same
#8592IC substrate with over voltage protection function
#8593IC substrate with over voltage protection function
#8594Ball grid array IC substrate with over voltage protection function
#8595IC substrate with over voltage protection function
#8596IC substrate with over voltage protection function
#8597Method for attaching chips in a flip-chip arrangement
#8598Semiconductor device and manufacturing method of the same
#8599Semiconductor device and radio communication device
#8600Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component
#8601Semiconductor device and manufacturing method therefor
#8602Electronic device including a substrate structure and a process for forming the same
#8603Method for constructing contact formations
#8604Hot-Melt Underfill Composition and Methos of Application
#8605Manufacturing method of semiconductor device
#8606Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same
#8607Methods of forming semiconductor packages
#8608Thermally controlled fluidic self-assembly
#8609Semiconductor package with a controlled impedance bus
#8610Light-emitting device with spherical photoelectric converting element
#8611Module
#8612Resin casting mold and method of casting resin
#8613Bonding pad structure
#8614Ball limiting metallurgy split into segments
#8615Circuit device with circuit board and semiconductor chip mounted thereon
#8616Semiconductor device and manufacturing method therefor
#8617Package for a high-frequency electronic device
#8618Repairable three-dimensional semiconductor subsystem
#8619System for implementing a configurable integrated circuit
#8620Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
#8621Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate
#8622Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film
#8623RFID tag and method of manufacturing the same
#8624RFID tag and method of manufacturing the same
#8625Method of manufacturing a semiconductor device
#8626PCB, manufacturing method thereof and semiconductor package implementing the same
#8627Semiconductor device and manufacturing method thereof
#8628Methods for fabricating thin complaint spring contacts
#8629Microelectronic devices having underfill materials with improved fluxing agents
#8630Method for re-routing lithography-free microelectronic devices
#8631Semiconductor device package
#8632Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method
#8633Method of manufacturing semiconductor device and support structure for semiconductor substrate
#8634Electrical or electronic component and method of producing same
#8635Electronic component with a housing package
#8636Protection of an integrated capacitor
#8637Display, method of manufacturing display and apparatus for manufacturing display
#8638B-stageable underfill encapsulant and method for its application
#8639Semiconductor device having a bonding pad structure including an annular contact
#8640Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#8641Apparatus and method for manufacturing semiconductor device
#8642Test system for semiconductor components having conductive spring contacts
#8643Method for fabricating semiconductor components with conductive spring contacts
#8644Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#8645Semiconductor device and manufacturing method thereof
#8646Metallization structure over passivation layer for IC chip
#8647High density package interconnect wire bond strip line and method therefor
#8648Semiconductor device
#8649Circuit boards, electronic devices, and methods of manufacturing thereof
#8650Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
#8651Integrated circuit with stacked-die configuration utilizing substrate conduction
#8652Multi-part lead frame with dissimilar materials
#8653Semiconductor device and a method of manufacturing the same
#8654Semiconductor package having improved adhesion and solderability
#8655Electronic component and a panel
#8656Micro-C-4 semiconductor die and method for depositing connection sites thereon
#8657Electronic parts packaging structure and method of manufacturing the same
#8658Method of manufacturing a device-incorporated substrate
#8659Wireless communication system
#8660Bonding structure and fabrication thereof
#8661Methods for fabricating stiffeners for flexible substrates
#8662Methods and apparatus for addition of electrical conductors to previously fabricated device
#8663Method for die attaching
#8664Semiconductor memory device and defect remedying method thereof
#8665Liquid metal thermal interface material system
#8666Coolant cooled type semiconductor device
#8667Printed circuit board having a bond wire shield structure for a signal transmission line
#8668Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip
#8669Semiconductor device, its manufacturing method, and radio communication device
#8670Semiconductor device and fabrication method for the same
#8671Semiconductor device and the method of producing the same
#8672Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts
#8673Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device
#8674Semiconductor device and method of fabricating the same
#8675Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method
#8676Semiconductor package, memory card including the same, and mold for fabricating the memory card
#8677Liquid metal thermal interface material system
#8678MSD raised metal interface features
#8679Solder interconnect structure and method using injection molded solder
#8680Method for mounting a semiconductor chip onto a substrate
#8681Epoxy-solder thermally conductive structure for an integrated circuit
#8682Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
#8683Attachment of flip chips to substrates
#8684Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials
#8685Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material
#8686Semiconductor component having plate and stacked dice
#8687Reinforced solder bump structure and method for forming a reinforced solder bump
#8688Microelectronic packages with solder interconnections
#8689Substrate package structure and packaging method thereof
#8690Wire bond interconnection
#8691Semiconductor device
#8692Semiconductor die attachment for high vacuum tubes
#8693Microelectronic assemblies incorporating inductors
#8694Methods for aligning semiconductor fabrication molds and semiconductor substrates
#8695Method and device for mounting electric component
#8696Ultrasonic head
#8697Resonator, ultrasonic head, and ultrasonic bonder using the same
#8698Plating apparatus
#8699Method of forming external electrode
#8700Package for a semiconductor device