212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Integrated inductors and compliant interconnects for semiconductor packaging
#9002Substrate for producing semiconductor packages
#9003Submember mounted on a chip of electrical device for electrical connection
#9004Methods and systems for attaching die in stacked-die packages
#9005Method and apparatus for manufacturing stacked-type semiconductor device
#9006Electronic packages with dice landed on wire bonds
#9007Semiconductor device and resin structure therefor
#9008Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages
#9009Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body
#9010High frequency module and manufacturing method thereof
#9011Semiconductor element
#9012Method and resulting structure for manufacturing semiconductor substrates
#9013Thermal protection for electronic components during processing
#9014Semiconductor attachment method
#9015Probe for semiconductor devices
#9016Stacked packages
#9017Semiconductor device and manufacturing method of the same
#9018Wafer level package, multi-package stack, and method of manufacturing the same
#9019Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication
#9020Systems and methods for wafer bonding by localized induction heating
#9021Semiconductor device with sidewall wiring
#9022Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#9023Methods and systems for attaching die in stacked-die packages
#9024Electronic component packaging
#9025Process and lead frame for making leadless semiconductor packages
#9026Substrate for light emitting diodes
#9027Wire bond with improved shear strength
#9028Concave face wire bond capillary and method
#9029System and method for low temperature plasma-enhanced bonding
#9030Methods of forming a contact array in situ on a substrate
#9031Circuit device manufacturing method
#9032Programmable radio transceiver
#9033Transmission-line spring structure
#9034Packaged microelectronic devices and methods for packaging microelectronic devices
#9035Selectively coating bond pads
#9036Apparatus for dividing an adhesive film mounted on a wafer
#9037Method of fabricating semiconductor device
#9038Semiconductor device and fabricating method thereof
#9039Semiconductor device and fabricating method thereof
#9040Method for fabricating semiconductor package with circuit side polymer layer
#9041Semiconductor device
#9042Manufacturing method of semiconductor device
#9043Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components
#9044Method for processing a base that includes connecting a first base to a second base with an insulating film
#9045Intermetallic spring structure
#9046Method of creating electrostatic discharge protection in a microelectronic module
#9047Apparatus and methods for constructing antennas using wire bonds as radiating elements
#9048Method for processing base
#9049Semiconductor device with semiconductor components connected to one another
#9050Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits
#9051Pressure-contact type semiconductor device
#9052Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
#9053Method and apparatus for stacked die packaging
#9054Snap lid camera module
#9055Method for forming metal contacts on a substrate
#9056Bonding structure, wire bonding method, actuator device and liquid jet head
#9057Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
#9058No-flow underfill composition and method
#9059Interconnect assemblies and methods
#9060Method of manufacturing semiconductor device with two-step etching of layer
#9061Chip package structure
#9062Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
#9063Semiconductor device with signal line having decreased characteristic impedance
#9064Hermetic chip in wafer form
#9065Semiconductor chip-embedded substrate and method of manufacturing same
#9066Semiconductor device and method of manufacturing same
#9067Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
#9068Semiconductor device and manufacturing method thereof
#9069LOC semiconductor assembled with room temperature adhesive
#9070Semiconductor device and a manufacturing method of the same
#9071Image sensor packaging structure
#9072System and method for assembly of semiconductor dies to flexible circuits
#9073Metal bond pad for integrated circuits allowing improved probing ability of small pads
#9074Electronic component embedded substrate and method for manufacturing the same
#9075Die bonding apparatus
#9076Wafer-leveled chip packaging structure and method thereof
#9077Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby
#9078Semiconductor device with improved heat dissipation, and a method of making semiconductor device
#9079Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
#9080Method for forming microelectronic spring structures on a substrate
#9081Substrates including alignment fences
#9082Microelectronic component assemblies with recessed wire bonds and methods of making same
#9083Collars, support structures, and forms for protruding conductive structures
#9084Semiconductor device
#9085Die and die-package interface metallization and bump design and arrangement
#9086Device having contact pad with a conductive layer and a conductive passivation layer
#9087Semiconductor device and method of manufacturing a semiconductor device
#9088Method for mounting a chip on a base and arrangement produced by this method
#9089Interconnections of semiconductor device and method of forming the same
#9090BGA package board and method for manufacturing the same
#9091Substrate-based BGA package, in particular FBGA package
#9092Semiconductor device and its manufacturing method
#9093Bonding configurations for lead-frame-based and substrate-based semiconductor packages
#9094Power semiconductor package
#9095Electronic part-containing elements, electronic devices and production methods
#9096Electronic module with layer of adhesive and process for producing it
#9097Damascene patterning of barrier layer metal for C4 solder bumps
#9098Wirebonding method and apparatus
#9099Manufacturing method of a semiconductor device, and paste applicator
#9100Circuit-connecting material and circuit terminal connected structure and connecting method
#9101Methods and apparatuses relating to block configurations and fluidic self-assembly processes
#9102Method of manufacturing semiconductor device
#9103Castellation wafer level packaging of integrated circuit chips
#9104Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts
#9105Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal
#9106Substrate for mounting IC chip
#9107Method for manufacturing surface acoustic wave device
#9108Top layers of metal for high performance IC's
#9109Connection between a semiconductor chip and a circuit component with a large contact area
#9110Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#9111Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
#9112Methods of bonding two semiconductor devices
#9113Semiconductor device and manufacturing method therefor
#9114Semiconductor chip assembly with metal containment wall and solder terminal
#9115Wafer-level assembly method for semiconductor devices
#9116Semiconductor device and method of manufacturing the same
#9117Radiofrequency power semiconductor module with cavity housing, and method for producing it
#9118Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
#9119IMPROVED DECAL SOLDER TRANSFER METHOD
#9120Method of fabricating a semiconductor device and mounting equipment
#9121Formation of a wire bond with enhanced pull
#9122Method of manufacturing a wiring board
#9123High thermal cycle conductor system
#9124Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#9125Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
#9126Stacked semiconductor chips
#9127Castellation wafer level packaging of integrated circuit chips
#9128Substrate having built-in semiconductor apparatus and manufacturing method thereof
#9129Mounting semiconductor chips
#9130Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device
#9131Manufacturing method for magnetic sensor and lead frame therefor
#9132Method for manufacturing surface acoustic wave device
#9133Electronic device package
#9134Substrate based unmolded package
#9135Semiconductor device and a method of manufacturing the semiconductor device
#9136Method of forming a micro solder ball for use in C4 bonding process
#9137BGA package with concave shaped bonding pads
#9138Microelectronic devices
#9139Flip-chip without bumps and polymer for board assembly
#9140Bonding pad and chip structure
#9141Thermal interposer for cooled electrical packages
#9142Semiconductor component and assembly having female conductive members
#9143Castellation wafer level packaging of integrated circuit chips
#9144Stacked semiconductor device and semiconductor memory module
#9145Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers
#9146Semiconductor device and method of manufacturing same
#9147Image sensor package and method of manufacturing the same
#9148Semiconductor integrated circuit device
#9149Highly compliant plate for wafer bonding
#9150Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods
#9151Substrate based unmolded package
#9152In-line wire bonding on a package, and method of assembling same
#9153Electrode contact structure
#9154Castellation wafer level packaging of integrated circuit chips
#9155Castellation wafer level packaging of integrated circuit chips
#9156Electronic package and semiconductor device using the same
#9157Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
#9158Taped lead frames and methods of making and using the same in semiconductor packaging
#9159Semiconductor device, optoelectronic board, and production methods therefor
#9160Method of manufacturing active matrix substrate with height control member
#9161Circular wire-bond pad, package made therewith, and method of assembling same
#9162Co-curable compositions
#9163Modular board device, high frequency module, and method of manufacturing same
#9164Heat sink formed of multiple metal layers on backside of integrated circuit die
#9165Method of stacking wafers with anisotropic conductive adhesive
#9166Method for fabricating semiconductor packages
#9167Leadless semiconductor package and method for manufacturing the same
#9168Semiconductor chip package manufacturing method including screen printing process
#9169Electronic device package
#9170Method and apparatus for mapping a position of a capillary tool tip using a prism
#9171Pad-limited integrated circuit
#9172Method and structure for manufacturing improved yield semiconductor packaged devices
#9173Semiconductor device with magnetically permeable heat sink
#9174Encapsulated device with heat isolating structure
#9175Multi-chip semiconductor connector assemblies
#9176Method of embedding semiconductor element in carrier and embedded structure thereof
#9177Method for manufacturing a semiconductor device
#9178Semiconductor package including a semiconductor device, and method of manufacturing the same
#9179Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#9180Method for producing a semiconductor circuit, and corresponding semiconductor circuit
#9181Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement
#9182Circuit apparatus provided with asperities on substrate surface
#9183Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
#9184Method of soldering electronic component having solder bumps to substrate
#9185In-situ alloyed solders, articles made thereby, and processes of making same
#9186Die attach area cut-on-fly method and apparatus
#9187Ball bonding method and ball bonding apparatus
#9188Apparatus and method for indexing of substrates and lead frames
#9189Capillary for wire bonding
#9190Sensor equipment having sensing portion and method for manufacturing the same
#9191Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device
#9192Stud bump socket
#9193Semiconductor layer structure and method of making the same
#9194Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly
#9195Semiconductor device and manufacturing method thereof
#9196Method for manufacturing semiconductor substrate and semiconductor substrate
#9197Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#9198Prefabricated semiconductor chip carrier
#9199Semiconductor device with base support structure
#9200Semiconductor bonding and layer transfer method
#9201Semiconductor memory device
#9202Semiconductor device
#9203Interposer containing bypass capacitors for reducing voltage noise in an IC device
#9204Electronic assembly having an indium wetting layer on a thermally conductive body
#9205Multiple device package
#9206Printed wiring board
#9207Co-packaged control circuit, transistor and inverted diode
#9208Semiconductor assembly having substrate with electroplated contact pads
#9209Vertical memory device structures
#9210Wafer bonding method
#9211Semiconductor, electrooptic apparatus and electronic apparatus
#9212Semiconductor device
#9213Semiconductor device, manufacturing method and apparatus for the same
#9214Wire bonding wedge
#9215Bondhead for wire bonding apparatus
#9216Method of forming a lead-free bump and a plating apparatus therefor
#9217Compliant spring contact structures
#9218Field weldable connections
#9219Optoelectronic apparatus with a shielding cage, and methods for production of an optoelectronic apparatus with a shielding cage.
#9220Method for fabricating chip structure
#9221Compliant interconnect and method of formation
#9222Microfeature devices and methods for manufacturing microfeature devices
#9223Compound semiconductor device and manufacturing method thereof
#9224Method for forming bump on electrode pad with use of double-layered film
#9225Method for fastening microtool components to objects
#9226Underfill and encapsulation of semiconductor assemblies with materials having differing properties
#9227High density flip chip interconnections
#9228Heat-decaying materials, transfer sheet using the same, and patterning method
#9229Manufacturing method of semiconductor device
#9230Reconstructed semiconductor wafers including alignment droplets contacting alignment vias
#9231Semiconductor device and semiconductor apparatus
#9232Capping of metal interconnects in integrated circuit electronic devices
#9233Semiconductor apparatus and method of manufacturing semiconductor apparatus
#9234Semiconductor device mounted on and electrically connected to circuit board
#9235High density multilayer circuit module
#9236Vertical conduction power electronic device package and corresponding assembling method
#9237Embedded chip semiconductor having dual electronic connection faces
#9238High density chip scale leadframe package and method of manufacturing the package
#9239Semiconductor device having inductor
#9240Separately strained N-channel and P-channel transistors
#9241Compound semiconductor device and manufacturing method thereof
#9242Lead-free bonding systems
#9243Spread spectrum isolator
#9244Method and apparatus for cleaning mounting nozzle, and mounting machine
#9245Semiconductor device with reduced contact resistance
#9246Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus
#9247Method of manufacturing semiconductor device
#9248Method for forming interconnects on thin wafers
#9249RF isolator for isolating voltage sensing and gate drivers
#9250Methods for making electronic devices with small functional elements supported on a carriers
#9251Electronic devices with small functional elements supported on a carrier
#9252Method of making photolithographically-patterned out-of-plane coil structures
#9253Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same
#9254Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates
#9255Apparatus and method for wire bonding and die attaching
#9256Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell
#9257Semiconductor device and method capable of scribing chips with high yield
#9258Semiconductor component and system having thinned, encapsulated dice
#9259Semiconductor device having adhesion increasing film to prevent peeling
#9260Semiconductor device that improves electrical connection reliability
#9261Ribbon bonding in an electronic package
#9262Stacked semiconductor package having adhesive/spacer structure and insulation
#9263Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing
#9264Semiconductor package including redistribution pattern and method of manufacturing the same
#9265Component built-in module and method for producing the same
#9266System-in-package (SIP) structure and fabrication thereof
#9267Preparation of front contact for surface mounting
#9268Adhesive/spacer island structure for stacking over wire bonded die
#9269Semiconductor equipment having multiple semiconductor devices and multiple lead frames
#9270Semiconductor device
#9271Soldering method and solder joints formed therein
#9272Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#9273Novel aqueous based metal etchant
#9274Wire-bonding method for chips with copper interconnects by introducing a thin layer
#9275Manufacturing method of semiconductor device
#9276Semiconductor device and method of manufacturing the same
#9277Plasma processing method and method for fabricating electronic component module using the same
#9278Integrated circuit packages with reduced stress on die and associated methods
#9279Top layers of metal for high performance IC's
#9280Method of fabricating a built-in chip type substrate
#9281Package warpage control
#9282Refractory solid, adhesive composition, and device, and associated method
#9283Optical modulator module
#9284Circuit device and manufacturing method thereof
#9285Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
#9286Method of manufacturing semiconductor device and support structure for semiconductor substrate
#9287Semiconductor device
#9288Semiconductor device and method of manufacturing the same
#9289Circuit device and manufacturing method thereof
#9290Cold weld hermetic MEMS package and method of manufacture
#9291Laminated radiation member, power semiconductor apparatus, and method for producing the same
#9292Interposer substrate, semiconductor package and semiconductor device, and their producing methods
#9293Semiconductor device and manufacturing process therefor
#9294Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#9295Semiconductor device and a method of manufacturing the same
#9296Semiconductor device and method for manufacturing the same
#9297Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#9298Semiconductor device
#9299Wire bonding method and apparatus for integrated circuit
#9300Semiconductor device with a floating gate electrode that includes a plurality of particles