212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
#9302Method of manufacturing circuit device
#9303Moisture-resistant electronic device package and methods of assembly
#9304Multi-band tunable resonant circuit
#9305Top layers of metal for high performance IC's
#9306Bonding method, bonding apparatus and sealing means
#9307Circuit device, manufacturing method thereof, and sheet-like board member
#9308Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9309Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9310Fine-pitch packaging substrate and a method of forming the same
#9311Substrate for solder joint
#9312Bump structure
#9313Double density method for wirebond interconnect
#9314Adhesive/spacer island structure for multiple die package
#9315Semiconductor device and method of manufacturing the same
#9316Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement
#9317Power composite integrated semiconductor device and manufacturing method thereof
#9318Method of manufacturing electronic part packaging structure
#9319Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding tool
#9320Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#9321Thermal interface adhesive and rework
#9322Void free solder arrangement for screen printing semiconductor wafers
#9323Method and resulting structure for manufacturing semiconductor substrates
#9324Chemical-enhanced package singulation process
#9325Methods for producing an electronic device having microscopically small contact areas
#9326Microelectronic devices and methods for packaging microelectronic devices
#9327Web fabrication of devices
#9328Method of attaching a leadframe to singulated semiconductor dice
#9329Method to build robust mechanical structures on substrate surfaces
#9330Multilayer substrate including components therein
#9331Method for testing using a universal wafer carrier for wafer level die burn-in
#9332Method for testing using a universal wafer carrier for wafer level die burn-in
#9333Semiconductor package and method for fabricating the same
#9334Vibration-assisted method for underfilling flip-chip electronic devices
#9335Semiconductor chip package and method for fabricating the same
#9336Universal interconnect die
#9337Flip chip package and process of forming the same
#9338Semiconductor device
#9339Semiconductor device and method of manufacturing the semiconductor device
#9340Method of manufacturing different bond pads on the same substrate of an integrated circuit package
#9341Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
#9342Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
#9343Semiconductor device and manufacturing method therefor
#9344Package design and method for electrically connecting die to package
#9345Semiconductor die attachment for high vacuum tubes
#9346Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
#9347Semiconductor package and method of fabricating the same
#9348Semiconductor device and manufacturing method of same
#9349Semiconductor micro device
#9350Semiconductor (LED) chip attachment
#9351Lead wire bonding method
#9352Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
#9353Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating
#9354Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions
#9355Semiconductor device and fabricating method thereof
#9356Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#9357Underfilling with acid-cleavable acetal and ketal epoxy oligomers
#9358Method for internal electrical insulation of a substrate for a power semiconductor module
#9359Method and apparatus for shielding integrated circuits
#9360Semiconductor chip arrangement and method
#9361Method of magnetic field assisted self-assembly
#9362Electronic device including chip parts and a method for manufacturing the same
#9363Semiconductor device
#9364Chip scale package with heat spreader
#9365Embedded chip semiconductor without wire bondings
#9366Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#9367Overhang support for a stacked semiconductor device, and method of forming thereof
#9368Electronic circuit package
#9369Array capacitors in interposers, and methods of using same
#9370Surface mount multichip devices
#9371Selectable decoupling capacitors for integrated circuits and associated methods
#9372Compositions for use in electronics devices
#9373Method for securing electronic components to a substrate
#9374Linear split axis wire bonder
#9375Method of manufacturing an electronic parts packaging structure
#9376Top layers of metal for high performance IC's
#9377Methods of forming solder bumps on exposed metal pads
#9378Single row bond pad arrangement
#9379Semiconductor device and manufacturing method thereof
#9380Method of fabricating a semiconductor device
#9381Shielded laminated structure with embedded chips
#9382Active matrix substrate with height control member
#9383Display device and manufacturing method of the same
#9384Electrode pad arrangement with open side for waste removal
#9385Semiconductor chip having pads with plural junctions for different assembly methods
#9386Integrated circuit die for wire bonding and flip-chip mounting
#9387FCBGA package structure
#9388Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#9389Semiconductor component having multiple stacked dice
#9390Structure of package
#9391Semiconductor chip package and method for manufacturing the same
#9392LOW-CAPACITANCE BONDING PAD FOR SEMICONDUCTOR DEVICE
#9393Semiconductor device
#9394Semiconductor structure integrated under a pad
#9395Test circuit under pad
#9396Flip chip bonding tool and ball placement capillary
#9397Method of fabricating a rat's nest RFID antenna
#9398Mounting machine and controller for the mounting machine
#9399Compliant multi-composition interconnects
#9400Method for producing a semiconductor element
#9401Method for producing a BGA chip module and BGA chip module
#9402Semiconductor assembly using dual-cure die attach adhesive
#9403Semiconductor device and its manufacturing process, electro-optical equipment, and electronic equipment
#9404Power module comprising at least two substrates and method for producing the same
#9405Method for testing using a universal wafer carrier for wafer level die burn-in
#9406Method for testing using a universal wafer carrier for wafer level die burn-in
#9407Method for testing using a universal wafer carrier for wafer level die burn-in
#9408Semiconductor chip having pads with plural junctions for different assembly methods
#9409Wire bonding system and method of use
#9410Semiconductor device in which semiconductor chip is mounted on lead frame
#9411Semiconductor device having improved solder joint and internal lead lifetimes
#9412Fan out type wafer level package structure and method of the same
#9413High-frequency amplification device
#9414Semiconductor device, producing method of semiconductor substrate, and producing method of semiconductor device
#9415Semiconductor device
#9416Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#9417Compliant interconnect assembly
#9418Method for manufacturing semiconductor device
#9419Bump structure for a semiconductor device and method of manufacture
#9420Method for manufacturing semiconductor device having solder layer
#9421Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system
#9422DEVICE TRANSFER METHOD AND DISPLAY APPARATUS
#9423Semiconductor device and a method of manufacturing the same
#9424Semiconductor device and manufacturing method of the same
#9425Semiconductor device
#9426Semiconductor device
#9427High power Doherty amplifier
#9428Led chip mounting structure and image reader having same
#9429Flip-chip type semiconductor devices and conductive elements thereof
#9430Semiconductor device
#9431Semiconductor device, magnetic sensor, and magnetic sensor unit
#9432Semiconductor device and multilayer substrate therefor
#9433Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
#9434NANO IC packaging
#9435Semiconductor packages, and methods of forming semiconductor packages
#9436Power semiconductor arrangement
#9437In-process semiconductor packages with leadframe grid arrays
#9438Power semiconductor module
#9439Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
#9440Semiconductor integrated circuit
#9441Semiconductor device
#9442High performance system-on-chip discrete components using post passivation process
#9443Semiconductor device having a refractory metal containing film and method for manufacturing the same
#9444Electronic component, mounted structure, electro-optical device, and electronic device
#9445Power semiconductor switching devices and power semiconductor devices
#9446Bonding structure and method for bonding members
#9447Thermally conductive compositions and methods of making thereof
#9448Programmable radio transceiver
#9449Method of migrating and fixing particles in a solution to bumps on a chip
#9450Method of connecting base materials
#9451Electronic component mounting method and apparatus and ultrasonic bonding head
#9452Packaging assembly utilizing flip chip and conductive plastic traces
#9453Electronic device and method of manufacture the same
#9454Method for fabricating encapsulated semiconductor components
#9455Packaging method for integrated circuits
#9456Method for depositing a solder material on a substrate
#9457Manufacture of microelectronic fold packages
#9458Method for manufacturing semiconductor device
#9459Dicing die bonding film
#9460Conductive material for integrated circuit fabrication
#9461Method for embedding a component in a base
#9462Heat curable adhesive composition, article, semiconductor apparatus and method
#9463Electronic component mounting method and apparatus
#9464Extension of fatigue life for C4 solder ball to chip connection
#9465Circuit device and method of manufacturing the circuit device
#9466Circuit board, device mounting structure, device mounting method, and electronic apparatus
#9467Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#9468Integrated circuit package and method having wire-bonded intra-die electrical connections
#9469Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#9470Electronic package with optimized lamination process
#9471Die with discrete spacers and die spacing method
#9472Semiconductor device and method of fabricating the same
#9473Method for maintaining solder thickness in flipchip attach packaging processes
#9474Semiconductor device and method for manufacturing same
#9475Circuit device
#9476Multi-part lead frame
#9477Lead frame having a tilt flap for locking molding compound and semiconductor device having the same
#9478Leadless semiconductor package and manufacturing method thereof
#9479Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#9480Integrated circuit with intergrated capacitor and methods for making same
#9481Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
#9482Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
#9483Bonding an interconnect to a circuit device and related devices
#9484Semiconductor device comprising through-electrode interconnect
#9485Wafer support and release in wafer processing
#9486Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
#9487Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
#9488Jig for a semiconductor substrate
#9489Vacuum fixing jig for semiconductor device
#9490Self-coplanarity bumping shape for flip-chip
#9491Carrier substrates and conductive elements thereof
#9492Circuitry module
#9493Semiconductor device with electrode pads for test probe
#9494Circuit support for a semiconductor chip and component
#9495Capillary underfill channel
#9496Semiconductor device
#9497Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
#9498Semiconductor flip-chip package and method for the fabrication thereof
#9499Self-coplanarity bumping shape for flip chip
#9500Die down semiconductor package
#9501Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
#9502Use of palladium in IC manufacturing with conductive polymer bump
#9503Semiconductor device
#9504Through electrode, spacer provided with the through electrode, and method of manufacturing the same
#9505Microelectronic assembly having encapsulated wire bonding leads
#9506Semiconductor device, a method of manufacturing the same and an electronic device
#9507Interposer including adhesive tape
#9508Semiconductor device with non-overlapping chip mounting sections
#9509Power semiconductor module
#9510Underfill fluxing curative
#9511Fabrication method and structure of PCB assembly, and tool for assembly thereof
#9512Process for producing integrated circuits including reduction using gaseous organic compounds
#9513Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#9514Methods of forming bumps using barrier layers as etch masks
#9515Low fabrication cost, high performance, high reliability chip scale package
#9516Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
#9517Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9518Semiconductor device assembly method and semiconductor device assembly apparatus
#9519Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
#9520Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#9521Full-color flexible light source device
#9522Programmable radio transceiver
#9523Motor driving system having power semiconductor module life detection function
#9524Adhesion by plasma conditioning of semiconductor chip surfaces
#9525Semiconductor device and manufacturing metthod thereof
#9526Semiconductor apparatus with improved yield
#9527Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
#9528Electric wave readable data carrier manufacturing method, substrate, and electronic component module
#9529Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment
#9530Semiconductor package with build-up structure and method for fabricating the same
#9531Semiconductor device and method of manufacturing the same
#9532Electrical component
#9533Semiconductor device
#9534Semiconductor device with plate-shaped component
#9535HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#9536Circuit device
#9537Vertically stacked semiconductor device
#9538Semiconductor chip package
#9539Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor device
#9540Semiconductor device and method of manufacturing the same
#9541Lead on chip semiconductor package
#9542Surface-mountable semiconductor component and method for producing it
#9543Semiconductor apparatus and method of fabricating the apparatus
#9544Solid state imaging device having electromagnetic wave absorber attached to a mounting board
#9545Electronic parts packaging structure and method of manufacturing the same
#9546Method of microelectrode connection and connected structure of use threof
#9547High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
#9548Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet
#9549Top layers of metal for high performance IC's
#9550Solder bump structure and method for forming a solder bump
#9551Methods for forming electrical connections and resulting devices
#9552Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#9553Dicing die-bonding film
#9554Semiconductor device and manufacturing method of the same
#9555Thin flip-chip method
#9556Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof
#9557Method of producing an electronic component with flexible bonding
#9558Die to substrate attach using printed adhesive
#9559Manufacturing method for semiconductor device and determination method for position of semiconductor element
#9560Semiconductor device and method of manufacturing the same
#9561Chip module
#9562Stress and force management techniques for a semiconductor die
#9563Method for manufacturing wiring board and semiconductor device
#9564Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#9565Wire bonding method and semiconductor device
#9566Semiconductor device with recessed post electrode
#9567Die package with higher useable die contact pad area
#9568Stacked electronic part
#9569Thin semiconductor package including stacked dies
#9570Methods and apparatus for packaging integrated circuit devices
#9571Circuit device and manufacturing method thereof
#9572Semiconductor package having step type die and method for manufacturing the same
#9573Board-on-chip packages
#9574Connector
#9575Method of fabricating a wire bond with multiple stitch bonds
#9576Process for producing optical semiconductor device
#9577Manufacturing method of a tray, a socket for inspection, and a semiconductor device
#9578Thin-film semiconductor device and method of manufacturing the same
#9579Semiconductor chip capable of implementing wire bonding over active circuits
#9580Memory component with asymmetrical contact row
#9581Apparatus and method for attaching a heat sink to an integrated circuit module
#9582Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#9583Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts
#9584Top layers of metal for high performance IC's
#9585Semiconductor device and manufacturing method thereof
#9586Semiconductor device and method for manufacturing the same
#9587Bump and fabricating process thereof
#9588Package structure with two solder arrays
#9589Solderable top metalization and passivation for source mounted package
#9590Semiconductor component assemblies having interconnects
#9591Two solder array structure with two high melting solder joints
#9592Semiconductor device and manufacturing method thereof
#9593Semiconductor device and electronic device
#9594Electronic component having an integrated passive electronic component and associated production method
#9595Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
#9596Wire bonding apparatus having actuated flame-off wand
#9597Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
#9598Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
#9599Semiconductor device and method of manufacturing the same
#9600Device mounting method and device transport apparatus