212012 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Boron [B]
Method and apparatus for joining semiconductor
#9602Element arrangement method
#9603Apparatuses and methods for forming assemblies
#9604Wire bonding method and liquid-jet head
#9605Driver chip and display apparatus having the same
#9606Circuit component with bump formed over chip
#9607Semiconductor device manufacturing method and manufacturing apparatus
#9608Submount and semiconductor device
#9609Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
#9610Semiconductor device and manufacturing method for the same
#9611Method for mounting semiconductor chips and corresponding semiconductor chip system
#9612Resin-molded semiconductor device having posts with bumps and method for fabricating the same
#9613Electrical connection materials and electrical connection methods
#9614Multi-chip package including at least one semiconductor device enclosed therein
#9615High frequency semiconductor device
#9616Semiconductor device and manufacturing method of the same
#9617Semiconductor package free of substrate and fabrication method thereof
#9618Semiconductor package free of substrate and fabrication method thereof
#9619Semiconductor package free of substrate and fabrication method thereof
#9620Semiconductor device
#9621Transferring semiconductor crystal from a substrate to a resin
#9622Flip-chip light emitting diode device without sub-mount
#9623Light emitting device
#9624Semiconductor devices and manufacturing method therefor
#9625Ultrasonic bonding apparatus and method
#9626Bump bonding apparatus and bump bonding method
#9627Electrical contact
#9628Multiple-ball wire bonds
#9629Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9630Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9631Methods of fabrication of package assemblies for optically interactive electronic devices
#9632Via structure of packages for high frequency semiconductor devices
#9633Electronic component, method of manufacturing the electronic component, and electronic apparatus
#9634Test head assembly having paired contact structures
#9635Semiconductor device assembly process
#9636Low fabrication cost, high performance, high reliability chip scale package
#9637LSI package, LSI element testing method, and semiconductor device manufacturing method
#9638Packaged die on PCB with heat sink encapsulant and methods
#9639Semiconductor device and manufacturing method thereof
#9640Method of surface mounting a semiconductor device
#9641Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
#9642Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
#9643Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles
#9644Manufacturing method for semiconductor device and semiconductor device
#9645Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components
#9646Transferring semiconductor crystal from a substrate to a resin
#9647Process for producing semiconductor chips having a protective film on the back surface
#9648Method and apparatus for fabricating self-assembling microstructures
#9649Method of manufacturing semiconductor device
#9650Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
#9651Intrinsic thermal enhancement for FBGA package
#9652Semiconductor device manufacturing method and manufacturing apparatus
#9653spliced film carrier tape
#9654Actuator and bonding apparatus
#9655Semiconductor integrated circuit device
#9656Sheet to form a protective film for chips
#9657Method and structure for interfacing electronic devices
#9658Electrode package for semiconductor device
#9659Semiconductor device
#9660Optimized power delivery to high speed, high pin-count devices
#9661Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#9662Semiconductor device and method of manufacturing the same
#9663Electronic device configured as a multichip module, leadframe and panel with leadframe positions
#9664Semiconductor device and fabrication method for the same
#9665Circuit carrier
#9666High density lead arrangement package structure
#9667High performance system-on-chip using post passivation process
#9668Laser cleaning system for a wire bonding machine
#9669Wire bonding method and apparatus
#9670Wire bonding apparatus
#9671Manufacturing method and manufacturing apparatus for semiconductor device
#9672Alloying method using laser irradiation for a light emitting device
#9673Method for alloying a wiring portion for a image display device
#9674Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method
#9675Method of manufacturing a display panel
#9676Microelectronic packages and methods therefor
#9677Single mask via method and device
#9678Wafer level semiconductor component having thinned, encapsulated dice and polymer dam
#9679Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9680Semiconductor copper bond pad surface protection
#9681Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9682Semiconductor device and method of manufacturing the same
#9683Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9684Thermal head and bonding connection method therefor
#9685Semiconductor integrated circuit device
#9686Lateral conduction Schottky diode with plural mesas
#9687Semiconductor memory device and defect remedying method thereof
#9688System semiconductor device and method of manufacturing the same
#9689Method for preparing integrated circuit modules for attachment to printed circuit substrates
#9690Adhesive, method of connecting wiring terminals and wiring structure
#9691Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles
#9692Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
#9693Alloy method using laser irradiation
#9694Method for manufacturing semiconductor device
#9695Ball transferring method and apparatus
#9696Method of manufacturing hybrid integrated circuit device
#9697Manufacturing method of a semiconductor device utilizing a flexible adhesive tape
#9698High-frequency power amplifier module
#9699Electronic component and fabricating method
#9700Optically interactive device package array
#9701Method of manufacturing a sensor device with binding material having a foaming agent
#9702Wafer-level package and method for production thereof
#9703Electronic component and fabricating method
#9704Semiconductor device having bonding pad above low-k dielectric film
#9705Electrode pad section for external connection
#9706Semiconductor device and method of manufacturing the same
#9707Electronic component and fabricating method
#9708Microelectronic assembly having array including passive elements and interconnects
#9709Connector assembly
#9710Wire-bonding method and semiconductor package using the same
#9711Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
#9712Method for assembling a ball grid array package with two substrates
#9713Trench-gate semiconductor devices
#9714Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9715System and method for automated wire bonding
#9716Dies bonding apparatus and dies bonding method
#9717Reworkable thermosetting resin compositions
#9718High performance system-on-chip discrete components using post passivation process
#9719Semiconductor device and method for fabricating the device
#9720Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9721Conductive bond for through-wafer interconnect
#9722Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#9723Fabrication method of semiconductor package with photosensitive chip
#9724Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9725Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9726Method for making a micromechanical device by using a sacrificial substrate
#9727Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#9728Resin compositions and methods of use thereof
#9729Resin-encapsulation semiconductor device and method for fabricating the same
#9730Flip-chip adaptor package for bare die
#9731DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
#9732Semiconductor device including semiconductor element mounted on another semiconductor element
#9733Bumped IC, display device and electronic device using the same
#9734Semiconductor device and method for manufacturing the same
#9735Semiconductor device and method of fabricating the same
#9736Partially etched dielectric film with conductive features
#9737Bumpless wafer scale device and board assembly
#9738Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#9739Semiconductor device having radiation structure
#9740Method of making microelectronic packages including electrically and/or thermally conductive element
#9741Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device
#9742Film substrate, fabrication method thereof, and image display substrate
#9743Semiconductor device
#9744Semiconductor device and method of manufacturing same
#9745Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
#9746Integrated circuit package with transparent encapsulant and method for making thereof
#9747Surface mountable hermetically sealed package
#9748High Q factor integrated circuit inductor
#9749Active matrix substrate, method of manufacturing the same, and display device
#9750Active matrix substrate display device
#9751METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION
#9752Bonding method, bonding apparatus and bonding program
#9753Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program
#9754Interconnection device and system
#9755Method and system for batch forming spring elements in three dimensions
#9756High performance interposer for a chip package using deformable button contacts
#9757Selective passivation of exposed silicon
#9758Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#9759Method of fabricating a pad over active circuit I.C. with meshed support structure
#9760Method of forming solder bump with reduced surface defects
#9761Method for fabricating a chip scale package using wafer level processing
#9762Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same
#9763Direct writeTM system
#9764Semiconductor device and manufacturing method of them
#9765Driver chip and display apparatus having the same
#9766Chip and multi-chip semiconductor device using thereof and method for manufacturing same
#9767Adhesion by plasma conditioning of semiconductor chip
#9768Package structure having semiconductor device embedded within wiring board
#9769Method and structure to reduce risk of gold embrittlement in solder joints
#9770Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
#9771Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#9772Semiconductor device with a solder creep-up prevention zone
#9773Semiconductor device having conducting portion of upper and lower conductive layers
#9774Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#9775Room temperature metal direct bonding
#9776Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
#9777Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
#9778Junction member comprising junction pads arranged in matrix and multichip package using same
#9779Semiconductor device
#9780HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
#9781Method of making wireless semiconductor device, and leadframe used therefor
#9782Interconnect structure for power transistors
#9783Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
#9784ULTRA-FINE CONTACT ALIGNMENT
#9785Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale
#9786Method and resulting structure for manufacturing semiconductor substrates
#9787Method of manufacturing high performance copper inductors with bond pads
#9788Method of forming segmented ball limiting metallurgy
#9789Hermetic passivation structure with low capacitance
#9790Manufacturing method for resin sealed semiconductor device
#9791Device transferring method
#9792Device transferring method
#9793Device transferring method
#9794Process of fabricating polymer sustained microelectrodes
#9795Resin composition for encapsulating semiconductor
#9796Structure and method for temporarily holding integrated circuit chips in accurate alignment
#9797Method for manufacturing optical module, optical communication device, and electronic device
#9798Printed circuit board and method for manufacturing printed circuit board
#9799Electronic device and production method thereof
#9800Driver chip and display apparatus including the same
#9801Polymer sustained microelectrodes
#9802Display unit
#9803Damascene interconnection and semiconductor device
#9804Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
#9805Colored conductive wires for a semiconductor package
#9806Method for manufacturing connection construction
#9807Process for producing a semiconductor device
#9808Self-supporting connecting element for a semiconductor chip
#9809Semiconductor integrated circuit device
#9810Semiconductor device including semiconductor elements mounted on base plate
#9811Reduced size semiconductor package with stacked dies
#9812Flipchip QFN package
#9813Integrated circuit packages with sandwiched capacitors
#9814Semiconductor device
#9815Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance
#9816Semiconductor device using LED chip
#9817Test assembly including a test die for testing a semiconductor product die
#9818Mounting board and electronic device using same
#9819Electronic component mounting method and apparatus
#9820Device transferring method, and device arraying method and image display unit fabricating method using the same
#9821Methods of making microelectronic assemblies
#9822Method for compensating for CTE mismatch using phase change lead-free super plastic solders
#9823Method for manufacturing semiconductor device with plural semiconductor chips
#9824Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof
#9825Interconnect circuitry, multichip module, and methods for making them
#9826Method of embedding components in multi-layer circuit boards
#9827Stacked IC device having functions for selecting and counting IC chips
#9828Cooling devices and methods of using them
#9829Adhesive film for circuit connection, and circuit connection structure
#9830Semiconductor device and method of manufacturing the same
#9831Semiconductor device
#9832Mounting substrate and electronic component using the same
#9833Semiconductor device and manufacturing method thereof
#9834Semiconductor device and manufacturing method for the same
#9835Electronic device having wiring substrate and lead frame
#9836LED substrate
#9837Semiconductor device, optoelectronic board, and production methods therefor
#9838Bumping electronic components using transfer substrates
#9839Arrangement for wire bonding and method for producing a bonding connection
#9840Electronic device and method for producing the same
#9841Lithographic contact elements
#9842Semiconductor device and manufacturing method thereof
#9843Encapsulated semiconductor components and methods of fabrication
#9844Method of manufacturing an electronic device, and electronic device
#9845Capacitor device and method of manufacturing the same
#9846Method of manufacturing semiconductor device
#9847Micro lead frame package having transparent encapsulant
#9848Semiconductor chip with external connecting terminal
#9849Semiconductor chip with external connecting terminal
#9850Wafer stacking with anisotropic conductive adhesive
#9851Semiconductor device and semiconductor module
#9852Method for fabricating a semiconductor interconnect having conductive spring contacts
#9853Method of forming a bonding pad structure
#9854Semiconductor chip with external connecting terminal
#9855Low profile stacking system and method
#9856Semiconductor element having protruded bump electrodes
#9857Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
#9858Semiconductor device
#9859Multi-part lead frame with dissimilar materials
#9860Semiconductor device
#9861Surface mount package
#9862Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
#9863Apparatus and methods for an underfilled integrated circuit package
#9864Method for preparing arylphosphonite antioxidant
#9865Method of forming bump pad of flip chip and structure thereof
#9866Method of manufacturing a semiconductor device by using a matrix frame
#9867Semiconductor device with intermediate connector
#9868Dual band power amplifier module for wireless communication devices
#9869Fabrication methods for electronic system modules
#9870Semiconductor device, manufacturing method thereof and electronic equipment
#9871Method of manufacturing a semiconductor device
#9872Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
#9873Semiconductor device and method of fabricating the same
#9874Method and apparatus for applying body bias to integrated circuit die
#9875Thermal intermediate apparatus, systems, and methods
#9876Methods of making microelectronic assemblies including compliant interfaces
#9877Semiconductor chip package and multichip package
#9878Method of manufacturing a semiconductor device
#9879High-frequency device
#9880Dicing die-bonding film
#9881Semiconductor package with increased number of input and output pins
#9882Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates
#9883Package structure for semiconductor
#9884Nanotube modified solder thermal intermediate structure, systems, and methods
#9885Wire bonder for ball bonding insulated wire and method of using same
#9886Mounting device and method thereof
#9887Method to remove fluorine residue from bond pads
#9888Methods of providing solder structures for out plane connections
#9889Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
#9890Method for manufacturing metal structure having different heights
#9891Plastic lead frames utilizing reel-to-reel processing
#9892Chip packaging compositions, packages and systems made therewith, and methods of making same
#9893Various structure/height bumps for wafer level-chip scale package
#9894Semiconductor module with a semiconductor stack, and methods for its production
#9895Wire bonding package
#9896Method of assembling a ball grid array package with patterned stiffener layer
#9897Microelectronic assemblies with composite conductive elements
#9898Manufacturing method of a semiconductor device
#9899Lead frame structure with aperture or groove for flip chip in a leaded molded package
#9900Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions