212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#3602Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow
#3603Electronic device, method of producing the same, and semiconductor device
#3604Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same
#3605FORMING GAS KIT DESIGN FOR COPPER BONDING
#3606Method of electrically connecting a microelectronic component
#3607Method for making semiconductor electrodes
#3608Method and apparatus for mounting electric component
#3609Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus used in said method
#3610Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
#3611Manufacturing process for embedded semiconductor device
#3612Method for packaging semiconductor dies having through-silicon vias
#3613Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
#3614Stackable packages for three-dimensional packaging of semiconductor dice
#3615Electronic component module and method of manufacturing the electronic component module
#3616Method of making a thin film device
#3617Semiconductor device and manufacturing method of the same
#3618Semiconductor device and method of manufacturing the same
#3619Post bump and method of forming the same
#3620METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT
#3621Packaged semiconductor chips
#3622Air cavity package with copper heat sink and ceramic window frame
#3623Semiconductor package having discrete components and system containing the package
#3624Semiconductor device and method of fabrication
#3625Leadframe having delamination resistant die pad
#3626Multi-Connect Lead
#3627Barrier Layer On Polymer Passivation For Integrated Circuit Packaging
#3628Multi-die DC-DC buck power converter with efficient packaging
#3629BONDING APPARATUS AND BONDING METHOD
#3630Semiconductor device and method of manufacturing the same
#3631Electrical conductor
#3632Bonding wire for semiconductor devices
#3633Copper alloy bonding wire for semiconductor device
#3634Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds
#3635Method for exposing and cleaning insulating coats from metal contact surfaces
#3636Near chip scale package integration process
#3637METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#3638RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
#3639Reconstituted wafer stack packaging with after-applied pad extensions
#3640Structures and methods to improve lead-free C4 interconnect reliability
#3641Solder interconnect pads with current spreading layers
#3642Semiconductor device
#3643Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device
#3644Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other
#3645Semiconductor device and method of manufacturing semiconductor device
#3646Structure and method for forming pillar bump structure having sidewall protection
#3647Solder interconnect by addition of copper
#3648Substrate for semiconductor package, semiconductor package including the same, and stack package using the semiconductor package
#3649Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
#3650NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES
#3651Chip package and manufacturing method thereof
#3652Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
#3653Method for manufacturing electronic component module
#3654STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE PACKAGE
#3655Ribbon connecting electrical components
#3656Board having connection terminal
#3657Method of manufacturing a semiconductor device
#3658SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING
#3659Three-dimensional integrated circuit structure
#3660Method of making an integrated circuit package with shielding via ring structure
#3661Flip chip MLP with folded heat sink
#3662Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
#3663Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
#3664Semiconductor optical interconnection device and semiconductor optical interconnection method
#3665Die-to-die electrical isolation in a semiconductor package
#3666Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump
#3667SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#3668SEMICONDUCTOR DEVICE INCLUDING SEALING FILM FOR ENCAPSULATING SEMICONDUCTOR CHIP AND PROJECTION ELECTRODES AND MANUFACTURING METHOD THEREOF
#3669Method for producing a power semiconductor module, and power semiconductor module comprising a connection device
#3670Semiconductor device
#3671Compound semiconductor device and connectors
#3672Chip scale module package in BGA semiconductor package
#3673Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#3674Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element
#3675Semiconductor device and a method of manufacturing the same
#3676Stacked semiconductor device and fabrication method for same
#3677Semiconductor device and fabrication method thereof
#3678Semiconductor device mounted structure with an underfill sealing-bonding resin with voids
#3679Flip-chip module and method for the production thereof
#3680Semiconductor device and manufacturing method of the same
#3681Semiconductor Chip Secured to Leadframe by Friction
#3682SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3683Lead frame routed chip pads for semiconductor packages
#3684Method of assembling a multi-component electronic package
#3685Semiconductor device and semiconductor device manufacturing method
#3686THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
#3687Power converter integrated circuit floor plan and package
#3688Wire payout measurement and calibration techniques for a wire bonding machine
#3689Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages
#3690SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME
#3691Formation of TSV backside interconnects by modifying carrier wafers
#3692Manufacturing method of semiconductor device including Au bump on seed film
#3693Interconnects for packaged semiconductor devices and methods for manufacturing such devices
#3694Process for producing a semiconductor device
#3695Methods for producing an ultrathin semiconductor circuit
#3696Three-dimensional integrated circuits with protection layers
#3697Method of manufacturing semiconductor device
#3698Semiconductor device and method for producing the same
#3699Adhesive, method of connecting wiring terminals and wiring structure
#3700Printed circuit board
#3701METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELECTRONIC SUBASSEMBLY
#3702Layered chip package
#3703Stacked structures and methods of fabricating stacked structures
#3704Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
#3705Electrical interconnect for die stacked in zig-zag configuration
#3706SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
#3707Semiconductor device bonding wire and wire bonding method
#3708Package and the Method for Making the Same, and a Stacked Package
#37093-D semiconductor die structure with containing feature and method
#3710Semiconductor package and method of forming the same
#3711Near chip scale semiconductor packages
#3712Wiring board and semiconductor device using the wiring board
#3713SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3714Package manufacturing method and semiconductor device
#3715Semiconductor chip package and method of manufacturing the same
#3716Multi-chip package and method of providing die-to-die interconnects in same
#3717Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
#3718IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE
#3719Semiconductor device with embedded interconnect pad
#3720Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#3721Integrated circuit package system using heat slug
#3722Electrical property altering, planar member with solder element in IC chip package
#3723Semiconductor chip
#3724Circuit board having semiconductor chip
#3725METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF
#3726Method for forming integrated circuit assembly
#3727ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
#3728Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
#3729Semiconductor device and manufacturing method thereof
#3730Fabrication method of semiconductor device having conductive bumps
#3731Circuit Device and Method of Manufacturing Thereof
#3732Process for manufacturing a composite substrate
#3733ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
#3734Integrated circuit device
#3735Pressure-Sensitive Adhesive Tape
#3736Multilayer printed wiring board
#3737SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#3738Die package including encapsulated die and method of manufacturing the same
#3739SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3740Adhesive film for semiconductor and semiconductor device using the adhesive film
#3741Semiconductor device
#3742Semiconductor package with substrate having single metal layer and manufacturing methods thereof
#3743Surface depressions for die-to-die interconnects and associated systems
#3744Die stacking apparatus and method
#3745SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#3746Wafer level stack structure for system-in-package and method thereof
#3747Method for fabricating a semiconductor package
#3748Semiconductor device with reinforcement plate and method of forming same
#3749SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3750Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#3751Laminated body of semiconductor chips including pads mutually connected to conductive member
#3752Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure
#3753Die-warpage compensation structures for thinned-die devices, and methods of assembling same
#3754Thru silicon enabled die stacking scheme
#3755Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof
#3756Standing chip scale package
#3757METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE
#3758Method for manufacturing semiconductor device
#3759Lead frame design to improve reliability
#3760PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
#3761Manufacturing method for composite alloy bonding wire
#3762Applying chiplets to substrates
#3763MULTIFUNCTIONAL DIE ATTACHMENT FILM AND SEMICONDUCTOR PACKAGING USING THE SAME
#3764Semiconductor device and method for manufacturing the same
#3765Semiconductor device and method of forming conductive vias with trench in saw street
#3766Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers
#3767Semiconductor device that suppresses malfunctions due to noise generated in internal circuit
#3768SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
#3769Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof
#3770Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection
#3771SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3772Interconnect structures having lead-free solder bumps
#3773Chip packaging method and structure thereof
#3774Electronic device package and method of manufacture
#3775Package-on-package technology for fan-out wafer-level packaging
#3776Processes and structures for IC fabrication
#3777Methods for interconnecting bonding pads between components
#3778Stacked chip package structure with leadframe having inner leads with transfer pad
#3779Processes and structures for IC fabrication
#3780Processes and structures for beveled slope integrated circuits for interconnect fabrication
#3781High-voltage semiconductor device
#3782Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same
#3783SEMICONDUCTOR DEVICE
#3784Method for manufacturing tight pitch, flip chip integrated circuit packages
#3785Substrate for flip chip bonding and method of fabricating the same
#3786AU ALLOY WIRE FOR BALL BONDING
#3787Electrical connection and method of manufacturing the same
#3788Processes for IC fabrication
#3789Processes and structures for IC fabrication
#3790Radio frequency unit analog level detector and feedback control system
#3791METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#3792Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
#3793MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#3794Method for producing display device
#3795Method and apparatus for no lead semiconductor package
#3796Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#3797Semiconductor device
#3798Metallic electrode forming method and semiconductor device having metallic electrode
#3799In-package microelectronic apparatus, and methods of using same
#3800INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP
#3801Semiconductor device and method for manufacturing the same
#3802Method for making an electrically conducting mechanical interconnection member
#3803Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#3804Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#3805Semiconductor integrated circuit device
#3806Semiconductor apparatus and manufacturing method of the same
#3807Method for manufacturing hetero-bonded wafer
#3808Power semiconductor device package and fabrication method
#3809Electronic module with feed through conductor between wiring patterns
#3810SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD THEREOF
#3811Semiconductor Device and Method of Manufacturing the Same
#3812Method of manufacturing an electronic device
#3813Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support
#3814Semiconductor device, semiconductor wafer and manufacturing method of the same
#3815CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME
#3816UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
#3817Processed wafer via
#3818Method of forming a bond pad
#3819Method of manufacturing semiconductor device including exposing a dicing line on a wafer
#3820Semiconductor die attachment method using non-conductive screen print and dispense adhesive
#3821Method of manufacturing layered chip package
#3822METHOD OF MANUFACTURING DICING DIE-BONDING FILM
#3823Thermal interface material and method of using the same and electronic assembly having the same
#3824Source driver, method for manufacturing same, and liquid crystal module
#3825Structure and method for power field effect transistor
#3826Packaged electronic devices having die attach regions with selective thin dielectric layer
#3827Semiconductor device
#3828Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
#3829Joint structure and electronic component
#3830Stacked package and method for forming stacked package
#3831Semiconductor device package structure and method for the same
#3832Electronic component and method of connecting with multi-profile bumps
#3833SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3834WIREBOND STRUCTURES
#3835Semiconductor device
#3836Lead frame, lead frame fabrication, and semiconductor device
#3837METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
#3838WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME
#3839THIN FILM DEVICE, FLEXIBLE CIRCUIT BOARD INCLUDING THIN FILM DEVICE, AND METHOD FOR MANUFACTURING THIN FILM DEVICE
#3840SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING AN ELECTRICAL CHARACTERISTIC OF A SEMICONDUCTOR DEVICE
#3841Bonding apparatus and bonding stage height adjustment method for the bonding apparatus
#3842Aluminum bond pads with enhanced wire bond stability
#3843Wiring board and method for manufacturing the same
#3844Wiring board and method for manufacturing the same
#3845Composite multi-layer substrate and module using the substrate
#3846Method of manufacturing electronic component device
#3847Components packaging method
#3848Method for providing a redistribution metal layer in an integrated circuit
#3849Method of fabricating stacked semiconductor chips
#3850Electronic system modules and method of fabrication
#3851Semiconductor package with position member
#3852Method for stacking serially-connected integrated circuits and multi-chip device made from same
#3853Method for producing electric contacts on a semiconductor component
#3854Semiconductor device having a semiconductor chip, and method for the production thereof
#3855Semiconductor device and method for fabricating the same
#3856WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
#3857Semiconductor chip package with post electrodes
#3858SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT
#3859Wafer level chip scale package
#3860Wiring substrate and semiconductor device having connection pads formed in non-solder mask defined structure
#3861Power electronic device
#3862Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate
#3863Semiconductor device and method of forming the same
#3864Semiconductor package
#3865Stress-engineered interconnect packages with activator-assisted molds
#3866Airgap micro-spring interconnect with bonded underfill seal
#3867Semiconductor device
#3868Semiconductor device having surface protective films on bond pad
#3869Semiconductor device
#3870Electronic component mounted structure
#3871Bonding wire for semiconductor devices
#3872Bonding apparatus and wire bonding method
#3873SEMICONDUCTOR PACKAGE
#3874Patterned die attach and packaging method using the same
#3875Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same
#3876METHOD FOR MANUFACTURING NITRIDE BASED SINGLE CRYSTAL SUBSTRATE AND METHOD FOR MANUFACTURING NITRIDE BASED SEMICONDUCTOR DEVICE
#3877ADHESIVE FILM
#3878Semiconductor package, lead frame, and wiring board with the same
#3879Semiconductor device and display apparatus
#3880System-in packages
#3881Lens support and wirebond protector
#3882Adhesive film, dicing die bonding film and semiconductor device using the same
#3883Multi chip semiconductor device
#3884Semiconductor power module
#38853D integration structure and method using bonded metal planes
#3886Semiconductor device
#3887Semiconductor package and manufacturing method of the semiconductor package
#3888Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
#3889COPPER PLATE BONDING FOR HIGH PERFORMANCE SEMICONDUCTOR PACKAGING
#3890Semiconductor device
#3891Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame
#3892Light emitting device and method for manufacturing same
#3893ELEMENT MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME, CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME, AND MOBILE APPLIANCE ( as amended
#3894Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
#3895ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOLING MEMBER AND METHOD OF MANUFACTURING THE SAME
#3896ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE
#3897Method and apparatus for mounting electric component
#3898Wireless communication system
#3899Method for fabricating QFN semiconductor package
#3900Die down ball grid array packages and method for making same