212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Wafer backside interconnect structure connected to TSVs
#602Semiconductor device and a method of manufacturing the same
#603Semiconductor element, semiconductor device and method for manufacturing semiconductor element
#604Materials, structures and methods for microelectronic packaging
#605Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus
#606Semiconductor packages and methods of fabricating the same
#607Resin-sealed semiconductor device and associated wiring and support structure
#608Passivated copper chip pads
#609Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
#610Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#611Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components
#612Solder joint flip chip interconnection
#613Carrier tape for tab-package and manufacturing method thereof
#614Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same
#615System and method of sensing current in a power semiconductor device
#616Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
#617Semiconductor device, method for manufacturing the same, and electronic device
#618Pb-free solder bumps with improved mechanical properties
#619Method of manufacturing semiconductor device
#620Power module having stacked flip-chip and method for fabricating the power module
#621Three-dimensional semiconductor architecture
#622Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#623Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect
#624Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate
#625Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#626Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#627Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#628Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure
#629Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
#630Semiconductor device with a semiconductor chip connected in a flip chip manner
#631Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#632Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#633Leadframe, semiconductor device, and method of manufacturing the same
#634Solder in cavity interconnection technology
#635Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#636Bumpless build-up layer package with pre-stacked microelectronic devices
#637Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
#638Semiconductor device with a connection pad in a substrate and method for production thereof
#639Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#640Window ball grid array (BGA) semiconductor packages
#641Semiconductor device
#642Bonded structure with enhanced adhesion strength
#643Semiconductor device including a plurality of magnetic shields
#644Wafer level chip scale package and process of manufacture
#645Semiconductor package and method of forming the same
#6463D semiconductor device
#647Semiconductor constructions, semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers
#648Apparatus for lead free solder interconnections for integrated circuits
#649Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
#650Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function
#651Isolation structure for stacked dies
#652Semiconductor module system having encapsulated through wire interconnect (TWI)
#653Structure and method of forming a pad structure having enhanced reliability
#654Semiconductor packages and methods of packaging semiconductor devices
#655Semiconductor device, semiconductor package, and electronic device
#656Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure
#657Semiconductor device and method of forming conductive vias with trench in saw street
#658Wafer leveled chip packaging structure and method thereof
#659Flow underfill for microelectronic packages
#660Semiconductor device
#661Bonding apparatus and bonding method
#662Semiconductor die mount by conformal die coating
#663Pre-soldered leadless package
#664Circuit module and method of manufacturing the same
#665Method for low temperature bonding and bonded structure
#666Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
#667Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
#668Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#669Method of forming wafer-level molded structure for package assembly
#670Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core
#671Interconnection designs and materials having improved strength and fatigue life
#672Extended redistribution layers bumped wafer
#673Methods of fabricating package stack structure and method of mounting package stack structure on system board
#674Fixture to constrain laminate and method of assembly
#675Sonotrode with cutting mechanism
#676Methods and apparatus for detecting molecular interactions using FET arrays
#677Methods and apparatus for detecting molecular interactions using FET arrays
#678Method of manufacturing semiconductor device
#679External storage device and method of manufacturing external storage device
#6803D IC method and device
#681Semiconductor device including passivation layer encapsulant
#682Three-dimensional structure in which wiring is provided on its surface
#683Waterfall wire bonding
#684Semiconductor device with through silicon via and alignment mark
#685Three-dimensional structure for wiring formation
#686Polymer matrices for polymer solder hybrid materials
#687System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
#688Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
#689Semiconductor device and method of manufacturing the same
#690Dicing tape-integrated film for semiconductor back surface
#691Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die
#692Substrate contact opening
#693Microelectronic package with terminals on dielectric mass
#694Semiconductor device
#695Semiconductor die package and method for making the same
#696Method for top-side cooled semiconductor package with stacked interconnection plates
#697Methods for attachment and devices produced using the methods
#698Semiconductor device
#699Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package
#700Method of manufacturing a semiconductor device using markings on both lead frame and sealing body
#701Electronic component device
#702Semiconductor device and production method therefor
#703Packaged microelectronic components
#704Semiconductor device and semiconductor package containing the same
#705Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#706Semiconductor device with copper-tin compound on copper connector
#707Semiconductor device having conductive pads and a method of manufacturing the same
#708Plasma treatment for semiconductor devices
#709Semiconductor packages utilizing leadframe panels with grooves in connecting bars
#710Method of manufacturing semiconductor device
#711Method for fabricating a semiconductor and semiconductor package
#712Embedded semiconductor die package and method of making the same using metal frame carrier
#713Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values
#714Semiconductor package having multi-phase power inverter with internal temperature sensor
#715Microelectronic assembly with impedance controlled wirebond and reference wirebond
#716Laminate electronic device
#717Semiconductor device and manufacturing method thereof
#718Semiconductor device and manufacturing method thereof
#719Semiconductor device having electrode pads arranged between groups of external electrodes
#720Control and driver circuits on a power quad flat no-lead (PQFN) leadframe
#721Power quad flat no-lead (PQFN) package having control and driver circuits
#722Semiconductor device and method of confining conductive bump material with solder mask patch
#723Active area bonding compatible high current structures
#724Semiconductor device and method for manufacturing thereof
#725Bonding material comprising coated silver nanoparticles and bonded object produced using same
#726Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support
#727Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
#728Wire bondable surface for microelectronic devices
#729Routing layer for mitigating stress in a semiconductor die
#730Semiconductor device and a method of manufacturing the same
#731Semiconductor device and production method therefor
#732Cylindrical embedded capacitors
#733Structures embedded within core material and methods of manufacturing thereof
#734Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
#735Semiconductor device and a method of manufacturing the same
#736Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)
#737Semiconductor chip device with polymeric filler trench
#738Microelectronic assembly with impedance controlled wirebond and conductive reference element
#739Semiconductor device
#740Techniques for packaging multiple device components
#741Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#742Open source power quad flat no-lead (PQFN) package
#743Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#744Semiconductor device with stacked semiconductor chips
#745Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter
#746Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#747Method of fabricating a wafer level chip scale package without an encapsulated via
#748Forming functionalized carrier structures with coreless packages
#749Semiconductor device
#750Semiconductor device including semiconductor chip mounted on lead frame
#751Semiconductor chip and film and tab package comprising the chip and film
#752Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer
#753Methods and apparatus for detecting molecular interactions using FET arrays
#754Semiconductor packaging method using connecting plate for internal connection
#755Method for producing semiconductor device
#756Compliant printed circuit semiconductor package
#757Integrated circuit device
#758Solder interconnect with non-wettable sidewall pillars and methods of manufacture
#759Microelectronic packages with nanoparticle joining
#760Semiconductor device and lead frame used for the same
#761Semiconductor device and method for manufacturing thereof
#762Semiconductor device with protective layer over exposed surfaces of semiconductor die
#763Semiconductor device having low dielectric insulating film and manufacturing method of the same
#764Chip package and manufacturing method thereof
#765Electronic substrate, semiconductor device, and electronic device
#766Semiconductor device and semiconductor assembly with lead-free solder
#767Semiconductor package with connecting plate for internal connection
#768Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
#769Power quad flat no-lead (PQFN) package
#770Electronic system modules and method of fabrication
#771Method for manufacturing a circuit board structure
#772Dicing die bond film
#773Semiconductor device with copper wirebond sites and methods of making same
#774Method of manufacturing semiconductor device
#775Stacked dual chip package having leveling projections
#776Method for fabricating a heat sink, and a heat sink
#777Method of fabricating a package substrate
#778CMOS-compatible gold-free contacts
#779Mounted structure and manufacturing method of mounted structure
#780Conductive lines and pads and method of manufacturing thereof
#781Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
#782Semiconductor package for high power devices
#783Semiconductor device and method of manufacturing the same
#784Apparatus, system, and method for wireless connection in integrated circuit packages
#785Semiconductor structures comprising a dielectric material having a curvilinear profile
#786Microelectronic devices and methods for manufacturing microelectronic devices
#787Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#788Semiconductor device and programming method
#789Semiconductor device stack with bonding layer and wire retaining member
#790Semiconductor device and method of manufacturing the same
#791Embedded package security tamper mesh
#792Semiconductor device and manufacturing method thereof
#793Routing method for flip chip package and apparatus using the same
#794Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices
#795Semiconductor device with embedded interconnect pad
#796Semiconductor package with single sided substrate design and manufacturing methods thereof
#797Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#798Multilayer ceramic electronic device and method for manufacturing the same
#799Backside processing of semiconductor devices
#800Method of packaging a die
#801Stacked fan-out semiconductor chip
#802Semiconductor device including cooler
#803Method for manufacturing semiconductor package
#804Copper or copper alloy, bonding wire, method of producing the copper, method of producing the copper alloy, and method of producing the bonding wire
#805Semiconductor device and method of forming bump-on-lead interconnection
#806Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
#807Mount board and electronic device
#808Semiconductor device capable of switching operation modes and operation mode setting method therefor
#809Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#810Package-in-packages and methods of formation thereof
#811Semiconductor structure with thin film resistor and terminal bond pad
#812Insulated gate semiconductor device
#813Assembly and production of an assembly
#814Stacked packaging improvements
#815Reconstituted wafer stack packaging with after-applied pad extensions
#816Electronic assembly with detachable components
#817Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#818Semiconductor device with output circuit and pad
#819Methods and apparatus for measuring analytes using large scale FET arrays
#820Apparatus, system, and method for wireless connection in integrated circuit packages
#821Bumpless build-up layer package design with an interposer
#822Method of making a stacked microelectronic package
#823Electronic modules
#824Die edge contacts for semiconductor devices
#825Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#826Embedded semiconductive chips in reconstituted wafers, and systems containing same
#827Electronic device and method for production
#828Short and low loop wire bonding
#829Bump-on-lead flip chip interconnection
#830Power semiconductor device and method therefor
#831Semiconductor device and a method of manufacturing the same
#832Bonding material and bonding body, and bonding method
#833Power electronic devices
#834Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects
#835Component leg arrangement
#836Semiconductor power module and method of manufacturing the same
#837Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
#838Integrated chip package structure using ceramic substrate and method of manufacturing the same
#839Multi-chip package with offset die stacking and method of making same
#840Integrated circuit apparatus, systems, and methods
#841Bonding wire for semiconductor
#842Methods of forming bonded semiconductor structures
#843Bump structure for stacked dies
#844Protected solder ball joints in wafer level chip-scale packaging
#845Semiconductor device and method of forming through vias with reflowed conductive material
#846Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
#847Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV
#848Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure
#849Lead structures with vertical offsets
#850Cu pillar bump with electrolytic metal sidewall protection
#851Thermally enhanced electronic package
#852Method for the wafer-level integration of shape memory alloy wires
#853Method for housing an electronic component in a device package and an electronic component housed in the device package
#854Semiconductor package with embedded die
#855Stacked semiconductor packages
#856Printed wiring board and method for manufacturing printed wiring board
#857Method of manufacturing leadless integrated circuit packages having electrically routed contacts
#858Interconnection element with posts formed by plating
#859Circuit device
#860Circuit device
#861Circuit device
#862Circuit device and method for manufacturing same
#863Semiconductor module with a semiconductor chip and a passive component and method for producing the same
#864Method for chip packaging
#865Semiconductor device fabrication method capable of scribing chips with high yield
#866Method for producing a component and device comprising a component
#867Chip pad resistant to antenna effect and method
#868Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection
#869SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION
#870Methods of adjusting ultrasonic bonding energy on wire bonding machines
#871Method to realize flux free indium bumping
#872Off-chip vias in stacked chips
#873Leadless array plastic package with various IC packaging configurations
#8743D packaging with low-force thermocompression bonding of oxidizable materials
#875Process for direct bonding two elements comprising copper portions and portions of dielectric materials
#876Etching solution for copper or copper alloy
#877Indium compositions
#878Semiconductor packages and methods of fabricating the same
#879Semiconductor device and method of manufacturing the semiconductor device
#880Material for thermal bonding, coating material for thermal bonding, coating, and electronic component bonding method
#881Semiconductor device and method of forming the same
#882Wireless communication system
#883Deformable network structure
#884Bonded processed semiconductor structures and carriers
#885Semiconductor device
#886Semiconductor device
#887Chip package and manufacturing method thereof
#888Junction material, manufacturing method thereof, and manufacturing method of junction structure
#889Method of cutting semiconductor substrate
#890Method of manufacturing a semiconductor device
#891Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#892Microelectronic package
#893Method of manufacturing a semiconductor component
#894Molded leadframe substrate semiconductor package
#895Integrated circuit chip using top post-passivation technology and bottom structure technology
#896Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die
#897Wiring board and semiconductor device
#898Semiconductor component that includes a protective structure
#899Semiconductor device including a stress buffer material formed above a low-k metallization system
#900Room temperature metal direct bonding