212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Three-dimensional system-in-package architecture
#902Protection layer for adhesive material at wafer edge
#903Ta—TaN selective removal process for integrated device fabrication
#904Passivated copper chip pads
#905Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
#906Method for chip package
#907Magnetic attachment structure
#908Production method of high-density SIM card package
#909Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#910High density sensor array without wells
#911Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#912Misalignment detection devices
#913Package-in-package using through-hole via die on saw streets
#914Method for producing at least one optoelectronic semiconductor component
#915Printed wiring board and method for manufacturing the same
#916Core-jacket bonding wire
#917Manufcaturing method for room-temperature substrate bonding
#918Methods and apparatus for measuring analytes using large scale FET arrays
#919Multilayer printed wiring board
#920Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#921Package manufacturing method and semiconductor device
#922Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate
#923Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC)
#924Packaged microdevices and methods for manufacturing packaged microdevices
#925Processes and structures for IC fabrication
#926Light emitter packages and devices having improved wire bonding and related methods
#927Semiconductor device
#928System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
#929Semiconductor device and method of manufacturing the same
#930Method of manufacturing a wiring board having pads highly resistant to peeling
#931Molding method for COB-EUSB devices and metal housing package
#932Bump pad structure
#933Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate
#934Electronic component mounting apparatus and the same method thereof
#935Bonding structure of multilayer copper bonding wire
#936Power semiconductor device with reduced contact resistance
#937Light emitting device package and method of fabricating the same
#938Semiconductor device and method for manufacturing the same
#939Method of fabricating a packaged semiconductor
#940Alloy wire and methods for manufacturing the same
#941ESD protection device
#942Super integrated circuit chip semiconductor device
#943Precious metal paste for bonding semiconductor element
#944Method of manufacturing printed wiring board
#945Production apparatus of composite silver nanoparticle
#946COMPOSITE ALLOY BONDING WIRE
#947High efficiency module
#948Wafer-to-wafer stack with supporting post
#949MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE
#950Semiconductor package including flip chip controller at bottom of die stack
#951Chip on wafer bonder
#952Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
#953Electrically bonded arrays of transfer printed active components
#954Semiconductor device having a chip mounting portion on which a separated plated layer is disposed
#955Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#956Substrate with embedded stacked through-silicon via die
#957Semiconductor device and method of forming insulating layer around semiconductor die
#958Semiconductor package having internal shunt and solder stop dimples
#959Method for forming a reliable solderable contact
#960Semiconductor device including a protective film
#961Solderable contact and passivation for semiconductor dies
#962Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die
#963Monolithic semiconductor switches and method for manufacturing
#964Alloyed 2N copper wires for bonding in microelectronics devices
#965Anisotropic conductive material and method for manufacturing same
#966Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
#967Bonding material for semiconductor devices
#968Package-on-package (PoP) structure including stud bulbs and method
#969Microelectronic package with self-heating interconnect
#970Semiconductor device and methods of manufacturing semiconductor devices
#971Semiconductor device including cladded base plate
#972Wafer level chip scale package
#973Metallization structure for high power microelectronic devices
#974Solder in cavity interconnection structures
#975Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#976Semiconductor device and manufacturing method thereof
#977Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#978Wire loops, methods of forming wire loops, and related processes
#979Flexible interconnect pattern on semiconductor package
#980Die power structure
#981Semiconductor device with wireless communication
#982Method for developing a custom device
#983Misalignment correction for embedded microelectronic die applications
#984Resin paste composition
#985Semiconductor device
#986Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package
#987Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#988Sensor device manufacturing method and sensor device
#989Resin composition and semiconductor device produced by using the same
#990Compact wirebonded power quad flat no-lead (PQFN) package
#991Support mounted electrically interconnected die assembly
#992ESD protection device
#993Semiconductor device
#994Semiconductor device with flip chip structure and fabrication method of the semiconductor device
#995Multilayer adhesive sheet and method for manufacturing electronic component
#996Electrical device with protruding contact elements and overhang regions over a cavity
#997Electrochemical deposition apparatus
#998METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
#999Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding
#1000Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant
#1001Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus
#1002Tape attaching device and tape attaching method
#1003Method of sealing and contacting substrates using laser light and electronics module
#1004Semiconductor device
#1005Device including a semiconductor chip and metal foils
#1006Method of manufacturing an electronic device package
#1007Chips having rear contacts connected by through vias to front contacts
#1008Manufacturing method of semiconductor device
#1009Method for producing chip stacks, and a carrier for carrying out the method
#1010Mounting method for semiconductor light emitter using resist with openings of different sizes
#1011Semiconductor integrated circuit device and method of manufacturing same
#1012Multi-chip packages providing reduced signal skew and related methods of operation
#1013Semiconductor structure and method for making same
#1014System and method for 3D integrated circuit stacking
#1015Semiconductor device including cladded base plate
#1016Semiconductor device
#1017Power module and power converter containing power module
#1018Semiconductor device and method of manufacturing the same
#1019Method for manufacturing a package-on-package type semiconductor device
#1020Electronic component and method for producing same
#1021Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#1022Pillar structure having a non-planar surface for semiconductor devices
#1023ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
#1024Inductive loop formed by through silicon via interconnection
#1025Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board
#1026DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME
#1027Method for manufacturing a circuit device
#1028Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
#1029FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE
#1030Semiconductor chip device with solder diffusion protection
#1031STACKED INTEGRATED CIRCUIT PACKAGES THAT INCLUDE MONOLITHIC CONDUCTIVE VIAS
#1032Light-reflective anisotropic conductive adhesive agent, and light emitting device
#1033Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
#1034Method and apparatus for fabricating integrated circuit device using self-organizing function
#1035Semiconductor device including a recess formed above a semiconductor chip
#1036METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENTS
#1037Method for permanent connection of two metal surfaces
#1038Fabrication method of packaging substrate having through-holed interposer embedded therein
#1039Semiconductor device and method of manufacturing the same
#1040LEAD FRAME, AND LIGHT EMITTING DIODE MODULE HAVING THE SAME
#1041Light emitting device and method for manufacturing light emitting device
#1042Method of Forming a Bonded Structure
#1043Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface
#1044Structure and method for power field effect transistor
#1045Multilayer printed circuit board
#1046Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
#1047Semiconductor device comprising through-electrode interconnect
#1048Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
#1049Microelectronic package with terminals on dielectric mass
#1050Method and system for forming conductive bumping with copper interconnection
#1051TCE compensation for package substrates for reduced die warpage assembly
#1052Method for manufacturing wafer-bonded semiconductor device
#1053Semiconductor device
#1054Wafer-level chip scale package
#1055Semiconductor element-embedded wiring substrate
#1056Flip chip interconnection having narrow interconnection sites on the substrate
#1057PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE
#1058Semiconductor device
#1059Dual metal for a backside package of backside illuminated image sensor
#1060Copper column
#1061Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#1062Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
#1063SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE
#1064Semiconductor device
#1065Semiconductor device
#1066Contact pad
#1067Interconnect pillars with directed compliance geometry
#1068Method for Making a Stackable Package
#1069Semiconductor device and a method of manufacturing the same
#1070Semiconductor device
#1071Semiconductor device and method of manufacturing the same
#1072Method of manufacturing a semiconductor device
#1073SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE
#1074Void-Free Implantable Hermetically Sealed Structures
#1075Methods and apparatus for measuring analytes using large scale FET arrays
#1076METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
#1077Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#1078RF transistor packages with high frequency stabilization features and methods of forming RF transistor packages with high frequency stabilization features
#1079Memory module in a package
#1080Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking
#1081Solder bump with inner core pillar in semiconductor package
#1082Semiconductor device with solder bump formed on high topography plated Cu pads
#1083Bump I/O contact for semiconductor device
#1084Method of forming an inductor on a semiconductor wafer
#1085Methods and apparatus for measuring analytes using large scale FET arrays
#1086Methods and apparatus for measuring analytes using large scale FET arrays
#1087PLATING APPARATUS AND PLATING METHOD
#1088Electrical barrier layers
#1089Stackable semiconductor assemblies and methods of manufacturing such assemblies
#1090Thermal enhanced package
#1091Laminate electronic device
#1092Carrier structures for microelectronic elements
#1093Power module and method for manufacturing the same
#1094Circuit board and process for producing the same
#1095Semiconductor element-embedded substrate, and method of manufacturing the substrate
#1096SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
#1097SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
#1098Oblique parts or surfaces
#1099Ball-limiting-metallurgy layers in solder ball structures
#1100Method of manufacturing a circuit substrate
#1101Methods of forming a metal pattern
#1102METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A HEAT SPREADER
#1103Method of manufacturing semiconductor device
#1104Semiconductor device and method for manufacturing the same
#1105Four MOSFET full bridge module
#1106Semiconductor device and manufacturing method thereof
#1107Semiconductor constructions
#1108Semiconductor device
#1109Multi-component integrated circuit contacts
#1110Copper wire receiving pad
#1111Conductive connecting member and manufacturing method of same
#1112Electrically conductive paste, and electrically conducive connection member produced using the paste
#1113Semiconductor device and a method of manufacturing the same
#1114Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die
#1115Method of manufacturing an electronic system
#1116Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die
#1117LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
#1118Stacked semiconductor device and fabrication method for same
#1119METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK
#1120MICRO PIN HYBRID INTERCONNECT ARRAY
#1121Die attached to a support member by a plurality of adhesive members
#1122PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
#1123Connecting film, and joined structure and method for producing the same
#1124Method for Predetermined Component Placement to a Target Platform
#1125Method for Predetermined Component Placement to a Target Platform
#1126Method for manufacturing a through hole electrode substrate
#1127Method of cutting semiconductor substrate
#1128Through wafer vias and method of making same
#1129Semiconductor die package and method for making the same
#1130Fabrication method of semiconductor integrated circuit device
#1131Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance
#1132Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
#1133Secondary device integration into coreless microelectronic device packages
#1134Bonding area design for transient liquid phase bonding process
#1135Reliable wire structure and method
#1136Semiconductor device and manufacturing of the semiconductor device
#1137Semiconductor device with heat spreader
#1138Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#1139Method for wafer level packaging of electronic devices
#1140SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
#1141Manufacturing method including deformation of supporting board to accommodate semiconductor device
#1142Method of producing a radiation-emitting optoelectronic component
#1143Methods and apparatus for measuring analytes using large scale FET arrays
#1144BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
#1145Conductor structure element and method for producing a conductor structure element
#1146Module substrate, module-substrate manufacturing method, and terminal connection substrate
#1147Antenna device and wireless apparatus
#1148Semiconductor device and manufacturing method
#1149Method for fabricating a semiconductor and semiconductor package
#1150Electrical connection for multichip modules
#1151Semiconductor device and bonding material for semiconductor device
#1152Semiconductor device with heat spreader
#1153Flip chip interconnect solder mask
#1154Flip chip interconnect solder mask
#1155Enhanced bump pitch scaling
#1156CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#1157Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof
#1158Semiconductor device with heat spreader
#1159Semiconductor storage device and manufacturing method thereof
#1160Wiring board with built-in semiconductor element
#1161Method of Manufacturing a semiconductor module and device for the same
#1162Electronic device and method for producing electronic device
#1163Electronic device and manufacturing thereof
#1164CHIP BONDING APPARATUS
#1165METHOD FOR PRODUCING RECONSTITUTED WAFERS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES
#1166Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same
#1167Semiconductor device having through silicon vias and manufacturing method thereof
#1168Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material
#1169Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
#1170Bonded semiconductor structures and methods of forming same
#1171Wiring substrate, semiconductor device and manufacturing method thereof
#1172Chip package structure and method of making the same
#1173LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#1174Module including a sintered joint bonding a semiconductor chip to a copper surface
#1175Multilayer pillar for reduced stress interconnect and method of making same
#1176HIGH STRENGTH AND HIGH ELONGATION RATIO OF AU ALLOY BONDING WIRE
#1177Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates
#1178CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME
#1179Implantable microelectronic device and method of manufacture
#1180Semiconductor device and method of manufacturing same
#1181Power converter, semiconductor device, and method for manufacturing power converter
#1182Semiconductor device and method of manufacturing the same
#1183Curing low-k dielectrics for improving mechanical strength
#1184Conductive pads defined by embedded traces
#1185Semiconductor device
#1186Wafer-level package device
#1187HIGH-FREQUENCY MODULE MANUFACTURING METHOD
#1188Semiconductor device, semiconductor package, and electronic device
#1189Semiconductor device including Schottky barrier diode
#1190Power semiconductor device
#1191Electronic component module
#1192MODULE MANUFACTURING METHOD
#1193Semiconductor device including semiconductor chips with different thickness
#1194Distributed semiconductor device methods, apparatus, and systems
#1195Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip
#1196Connecting and bonding adjacent layers with nanostructures
#1197Memory device and fabricating method thereof
#1198Integrated circuit apparatus, systems, and methods
#1199Copper bonding wire for semiconductor device and bonding structure thereof
#1200Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area