Method for manufacturing wafer level chip scale package using redistribution substrate

Method for temporarily engaging electronic component for test

Inspection method of bonded status of ball in wire bonding

Transparent member, optical device using transparent member and method of manufacturing optical device

Multi-layer electronic component aggregate board and multi-layer electronic component fabricating method

Bonding structure, actuator device and liquid-jet head

Method for manufacturing an electronic module, and an electronic module

Non-Circular via holes for bumping pads and related structures

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus

Flip chip bonding tool

Method and apparatus for mounting and removing an electronic component

Joining method and apparatus

Electronic flame-off electrode with ball-shaped tip

Method of forming bump that may reduce possibility of losing contact pad material

Redistribution layer of wafer and the fabricating method thereof

Method for forming an electrode

Semiconductor device and method of manufacturing thereof

Electronic parts packaging structure and method of manufacturing the same

Semiconductor electrical connection structure and method of fabricating the same

Fabrication of stacked die and structures formed thereby

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Method for producing microsystems

Inverter and vehicle drive unit using the same

Structure and method for fabricating a bond pad structure

Semiconductor device and fabrication method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Methods to deposit metal alloy barrier layers

Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device

Semiconductor device carrier unit and semiconductor socket provided therewith

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Multi-chip package and method for manufacturing the same

Method of forming a stacked semiconductor package

Semiconductor device

Semiconductor device having power semiconductor elements

Integrated circuit with at least one bump

Process for manufacture of novel, inexpensive radio frequency identification devices

Wire bonder and method of operating the same

Chip interconnect and packaging deposition methods and structures

Underfill compositions and methods for use thereof

Semiconductor substrate thinning method for manufacturing thinned die

Method of forming electrode for semiconductor device

Semiconductor device manufacturing method

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method

Nano-sized metals and alloys, and methods of assembling packages containing same

Low melting-point solders, articles made thereby, and processes of making same

Thermally conductive composite and uses for microelectronic packaging

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process

Production method of anisotropic conductive sheet

Semiconductor device

Semiconductor element including a wet prevention film

Die down ball grid array package

Apparatus for singulating and bonding semiconductor chips, and method for the same

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

COF flexible printed wiring board and method of producing the wiring board

Bonding tool for ultrasonic bonding and method of ultrasonic bonding

Wire feed system for a wire bonding apparatus

Self-reflowing printed circuit board and application methods

Circuit device and manufacturing method thereof

Bonding apparatus

Top layers of metal for integrated circuits

Circuit-connecting material and circuit terminal connected structure and connecting method

Aluminum cap for reducing scratch and wire-bond bridging of bond pads

Method for attaching a semiconductor die to a substrate and heat spreader

Semiconductor package having a heat slug and manufacturing method thereof

PROCESS OF FABRICATING FLIP-CHIP PACKAGES

Solder foil, semiconductor device and electronic device

High performance amine based no-flow underfill materials for flip chip applications

Semiconductor device packaged into chip size and manufacturing method thereof

Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus

Radiant energy heating for die attach

Electronic circuit including circuit-connecting material

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Pad structure to prompt excellent bondability for low-k intermetal dielectric layers

Semiconductor device having a switch circuit

Semiconductor device

Materials, structures and methods for microelectronic packaging

Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components

Semiconductor device and semiconductor device unit

Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device

Motion control device for wire bonder bondhead

Microelectronic packaging and components

Method of stacking thin substrates by transfer bonding

Semiconductor device and fabrication process thereof

Wire bond pads

Method for producing bumps on an electrical component

Thin glass chip for an electronic component and manufacturing method

Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

Method for forming a redistribution layer in a wafer structure

Method of forming a surface mountable IC and its assembly

Thermally controlled fluidic self-assembly

Flexible device, flexible pressure sensor, and fabrication method thereof

Semiconductor module

Semiconductor package having flash-free contacts and techniques for manufacturing the same

Sensor device having stopper for limitting displacement

Semiconductor device and a method of assembling a semiconductor device

Method of making a solder ball

Bonding wire and bonded connection

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip

Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device

Bump structure

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Packaging with metal studs formed on solder pads

Bonded SOI substrate, and method for manufacturing the same

Light emitting device and method of producing same

Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit

Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment

Non-contact ID card and the like and method for manufacturing same

Method for supplying solder

Methods for forming conductive bumps and wire loops

Method of measuring thickness of bonded ball in wire bonding

Joining apparatus

Surface mount saw device manufacturing method

Top layers of metal for high performance IC's

Semiconductor device manufacturing method and electronic equipment using same

Microprobe tips and methods for making

Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology

Method of manufacturing a semiconductor device

Electronic assemblies having a low processing temperature

Technique for attaching die to leads

Method for manufacturing electronic component-mounted board

Chip assembly reinforcement

Thermally controlled fluidic self-assembly method and support

Chip module

Flip chip metal bonding to plastic leadframe

Semiconductor chip stack structure and method for forming the same

Electronic device and method of manufacturing the same

Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Semiconductor device having tin-based solder layer and method for manufacturing the same

Semiconductor device mounting structure for reducing thermal stress and warpage

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device with reduced contact resistance

Integrated semiconductor circuit and method for producing an integrated semiconductor circuit

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device, lead frame, and methods for manufacturing the same

Semiconductor device and wire bonding chip size package therefor

High density interconnect power and ground strap and method therefor

Method of manufacturing a semiconductor device

Methods of making microelectronic assemblies including compliant interfaces

Semiconductor device

Lead frame and semiconductor device having the lead frame

Semiconductor device and method for fabricating the same

Method for connecting a chip and a substrate

Method for assembling micro-components to binding sites

Manufacturing method of stack-type semiconductor device

Method for reducing lead precipitation during wafer processing

Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby

Method of manufacturing semiconductor device

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Semiconductor chip, electrically connections therefor

Surface-mounting semiconductor device and method of making the same

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Low stress conductive polymer bump

Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device

Semiconductor device having laminated structure

Semiconductor device

High-reliable semiconductor device using hermetic sealing of electrodes

Low temperature PB-free processing for semiconductor devices

Top layers of metal for high performance IC's

Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus

Semiconductor device having a heat-dissipation member

Semiconductor and method for producing a semiconductor

Method of making a semiconductor device adapted to remove noise from a signal

Semiconductor device and process for manufacturing the same

Electronic component with multilayered rewiring plate and method for producing the same

Semiconductor device with simplified constitution

Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

Interposers for chip-scale packages and intermediates thereof

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Electronic devices at the wafer level having front side and edge protection material and systems including the devices

Dense intermetallic compound layer

Method of bonding and bonding apparatus for a semiconductor chip

Method of manufacturing printed wiring board

Compressible films surrounding solder connectors

Method of electrically connecting a microelectronic component

Method for transferring a semiconductor body from a growth substrate to a support material

Manufacturing method of an electronic part built-in substrate

Semiconductor device substrate, semiconductor device, and manufacturing method thereof

Methods for forming molds

Conductive adhesive agent with ultrafine particles

Thermal fatigue resistant tin-lead-silver solder

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Electrode structure of a semiconductor device and method of manufacturing the same

Integrated inductors and compliant interconnects for semiconductor packaging

Substrate for producing semiconductor packages

Submember mounted on a chip of electrical device for electrical connection

Methods and systems for attaching die in stacked-die packages

Method and apparatus for manufacturing stacked-type semiconductor device

QFN package and method therefor

Semiconductor device and resin structure therefor

Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages

Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body

High frequency module and manufacturing method thereof

Semiconductor element

Fluxless solder transfer and reflow process

Process and lead frame for making leadless semiconductor packages

Thermal protection for electronic components during processing

Semiconductor attachment method

Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components

Anisotropic conductive adhesive for fine pitch and COG packaged LCD module

Stacked packages

Semiconductor device and manufacturing method of the same

Multilayered anisotropic conductive adhesive for fine pitch

Wafer level package, multi-package stack, and method of manufacturing the same

Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication

Systems and methods for wafer bonding by localized induction heating

Semiconductor device with sidewall wiring

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods and systems for attaching die in stacked-die packages

Electronic component packaging

Process and lead frame for making leadless semiconductor packages

Metal-metal bonding of compliant interconnect

Substrate for light emitting diodes

Wire bond with improved shear strength

Apparatus and method for printing micro metal structures

Concave face wire bond capillary and method

System and method for low temperature plasma-enhanced bonding

Serial thermal processor arrangement

Methods of forming a contact array in situ on a substrate

Circuit device manufacturing method

Programmable radio transceiver

Transmission-line spring structure

Packaged microelectronic devices and methods for packaging microelectronic devices

Selectively coating bond pads

Methods of forming lead free solder bumps

Apparatus for dividing an adhesive film mounted on a wafer

Method of fabricating semiconductor device

Method for fabricating semiconductor package with circuit side polymer layer

Semiconductor device

Manufacturing method of semiconductor device

Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components

Method for processing a base that includes connecting a first base to a second base with an insulating film

Intermetallic spring structure

Apparatus and methods for constructing antennas using wire bonds as radiating elements

Method for processing base

Semiconductor device with semiconductor components connected to one another

Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints

Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits

Pressure-contact type semiconductor device

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Snap lid camera module

Method and apparatus for forming metal contacts on a substrate

Method for forming metal contacts on a substrate

Bonding structure, wire bonding method, actuator device and liquid jet head

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

No-flow underfill composition and method

Interconnect assemblies and methods

Method of manufacturing semiconductor device with two-step etching of layer

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

Chip package structure

Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera

Semiconductor device

Semiconductor device with signal line having decreased characteristic impedance

Front-end processing of nickel plated bond pads

Semiconductor device and method for manufacturing the same, package for LCD driver

Electrical conducting structure and liquid crystal display device comprising the same

Semiconductor component having a CSP housing

Hermetic chip in wafer form

Microelectronic packages including solder bumps and AC-coupled interconnect elements

Semiconductor chip-embedded substrate and method of manufacturing same

Semiconductor device and method of manufacturing same

Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device

Semiconductor device and manufacturing method thereof

LOC semiconductor assembled with room temperature adhesive

Chip structure with redistribution traces

Semiconductor device and a manufacturing method of the same

Image sensor packaging structure

System and method for assembly of semiconductor dies to flexible circuits

Metal bond pad for integrated circuits allowing improved probing ability of small pads

Apparatus and method for printing micro metal structures

Electronic component embedded substrate and method for manufacturing the same

Die bonding apparatus

Electronic device and angular velocity detector

Wafer-leveled chip packaging structure and method thereof

GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF

Method for fabricating pad redistribution layer

Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Method for forming microelectronic spring structures on a substrate

Substrates including alignment fences

Microelectronic component assemblies with recessed wire bonds and methods of making same

Collars, support structures, and forms for protruding conductive structures

Semiconductor device

Device having contact pad with a conductive layer and a conductive passivation layer

Semiconductor package having protective layer for re-routing lines and method of manufacturing the same

Semiconductor device and method of manufacturing a semiconductor device

Method for mounting a chip on a base and arrangement produced by this method

Interconnections of semiconductor device and method of forming the same